CN208623969U - Electromagnetic shielding film and wiring board - Google Patents

Abstract

The utility model embodiment provides a kind of electromagnetic shielding film and wiring board, wherein electromagnetic shielding film includes first screen layer, secondary shielding layer, adhesive film and several convex particles；The first screen layer includes opposite first surface and second surface, and the second surface is the non-smooth surface to rise and fall；Several convex particles are attached on the second surface of the first screen layer；The secondary shielding layer configuration is on the second surface of the first screen layer, and cover several convex particles, to form protrusion in the position corresponding with the convex particle of the outer surface of the secondary shielding layer, and recess portion is formed in other positions, the waviness of the outer surface of the secondary shielding layer is greater than the waviness of the second surface；The adhesive film configuration is on the outer surface of the secondary shielding layer.

Description

Electromagnetic shielding film and wiring board

Technical field

The utility model relates to electronic field more particularly to a kind of electromagnetic shielding films and wiring board.

Background technique

With the rapid development of electronics industry, electronic product is further to miniaturization, lightweight, assembling densification hair Exhibition greatly pushes the development of flexible electric circuit board, to realize component arrangement and conducting wire connecting integration.Flexible electric circuit board can be wide It is general to be applied to the industries such as mobile phone, liquid crystal display, communication and space flight.

Under the promotion of international market, function flexible electric circuit board is occupied an leading position in flexible electric circuit board market, and is evaluated One important indicator of function flexible electric circuit board performance is electromagnetic shielding ((Electromagnetic Interference Shielding, abbreviation EMI Shielding).With the integration of the communication apparatus function such as mobile phone, internal component sharply high frequency High speed.Such as: for cell-phone function other than original audio communication function, camera function has become necessary function, and WLAN (Wireless Local Area Networks, WLAN), GPS (Global Positioning System, the whole world Positioning system) and function of surfing the Net popularized, along with the integration of following sensing component, sharply high-frequency high-speed becomes component Gesture is more inevitable.The component internal and the electromagnetic interference of outside, signal caused under the driving of high frequency and high speed exists Decaying and insertion loss and jitter problem are gradually serious in transmission.

Currently, the common screened film of existing line plate includes shielded layer and conductive adhesive layer, by conductive adhesive layer by shielded layer It is connect with wiring board stratum, and then interference charge is imported into wiring board stratum, realize shielding.In the prior art, another normal Method is the conducting particles removed in adhesive film, and the surface of certain roughness is formed on smooth shielded layer, is then led to The rough surface for crossing shielded layer pierces through adhesive film, so that the stratum of shielded layer and wiring board connects, but this side There are charging capacity is small and the insufficient defect of puncture dynamics for case.

Summary of the invention

The purpose of the utility model embodiment is to provide a kind of electromagnetic shielding film and wiring board, can effectively solve the prior art Charging capacity is insufficient and is easy to cause high temperature plate bursting phenomenon, and puncture dynamics is strong, and peel strength is high, avoids the generation of plate bursting phenomenon.

To achieve the above object, the utility model embodiment provides a kind of electromagnetic shielding film, including first screen layer, Two shielded layers, adhesive film and several convex particles；The first screen layer includes opposite first surface and second surface, described Second surface is the non-smooth surface to rise and fall；Several convex particles are attached on the second surface of the first screen layer； The secondary shielding layer configuration covers several convex particles on the second surface of the first screen layer, thus The position corresponding with the convex particle of the outer surface of the secondary shielding layer forms protrusion, and is formed in other positions recessed Portion, the waviness of the outer surface of the secondary shielding layer are greater than the waviness of the second surface；The adhesive film configuration is in institute It states on the outer surface of secondary shielding layer.

As an improvement of the above scheme, the convex particle includes conductive particles, semiconductor grain, insulator particle and packet Cover the one or more of composite particles.

As an improvement of the above scheme, the height of the convex particle is 0.1 μm -30 μm.

As an improvement of the above scheme, several conductive bumps are also formed on the outer surface of the secondary shielding layer.

As an improvement of the above scheme, the conductive bumps integrated distribution is on the protrusion.

As an improvement of the above scheme, the adhesive film includes the adhesion layer containing conducting particles.

As an improvement of the above scheme, the adhesive film includes the adhesion layer without conducting particles.

As an improvement of the above scheme, the first screen layer and secondary shielding layer include metal screen layer, carbon nanotube One of shielded layer, ferrite shielded layer and graphene shielded layer are a variety of.

As an improvement of the above scheme, the metal screen layer includes monometallic shielded layer and/or alloy shielded layer；Its In, the monometallic shielded layer is made of any one material in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, described Alloy shielded layer is made of two or more any material in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold.

As an improvement of the above scheme, the electromagnetic shielding film further includes protective film layer, and the first of the first screen layer Surface is formed with the protective film layer.

Compared with prior art, the utility model embodiment discloses a kind of electromagnetic shielding film, several convex particles It is attached on the second surface of the first screen layer；Second surface of the secondary shielding layer configuration in the first screen layer On, and several convex particles are covered, thus in the corresponding with the convex particle of the outer surface of the secondary shielding layer Position forms lug boss, then the protrusion opposite with the convex particle on the outer surface of the secondary shielding layer is easier to pierce through Adhesive film is directly exported interference charge by shielded layer so that shielded layer and wiring board stratum are connected；In addition, described Gelatin substance can be expressed to the recess portion of the outer surface of the secondary shielding layer by the adhesive film of electromagnetic shielding film during the pressing process In, it can effectively solve prior art charging capacity deficiency and be easy to cause high temperature plate bursting phenomenon, peel strength is high, and plate bursting will not occur Phenomenon.

The utility model embodiment also correspondence provides a kind of wiring board, including printed circuit board and above-mentioned any one institute The electromagnetic shielding film stated, the electromagnetic shielding film are mutually pressed by its adhesive film with the printed wiring board；It pierces through the protrusion The adhesive film, and extend to the stratum of the printed wiring board.

Compared with prior art, wiring board provided by the utility model embodiment, by using any of the above-described institute The electromagnetic shielding film stated, the waviness of the outer surface of the secondary shielding layer are greater than the waviness of the second surface, then described Gelatin substance can be expressed to the recess portion of the outer surface of the secondary shielding layer by the adhesive film of electromagnetic shielding film during the pressing process In, charging capacity increases, it is not easy to plate bursting phenomenon occurs；Meanwhile the protrusion of the outer surface of the secondary shielding layer is easier to pierce through Adhesive film is directly exported interference charge by shielded layer so that shielded layer and wiring board stratum are connected.

Detailed description of the invention

Fig. 1 is a kind of structural schematic diagram of electromagnetic shielding film in the utility model embodiment 1.

Fig. 2 is a kind of structural schematic diagram of electromagnetic shielding film in the utility model embodiment 2.

Fig. 3 is a kind of structural schematic diagram of wiring board in the utility model embodiment 3.

Fig. 4 is a kind of structural schematic diagram of wiring board in the utility model embodiment 4.

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without creative efforts Every other embodiment obtained, fall within the protection scope of the utility model.

It is a kind of structural schematic diagram of electromagnetic shielding film in the utility model embodiment 1, as shown in Figure 1, institute referring to Fig. 1 Stating electromagnetic shielding film includes first screen layer 1, secondary shielding layer 2, adhesive film and several convex particles；The first screen layer 1 Including opposite first surface 11 and second surface, the second surface is non-smooth surface；Several convex particles 4 adhere to On the second surface 12 of the first screen layer 1；Second table of the configuration of secondary shielding layer 2 in the first screen layer 1 On face 12, and several convex particles 4 are covered, thus in the outer surface 21 of the secondary shielding layer 2 and the convex The corresponding position of grain 4 forms protrusion 212, and forms recess portion 211 in other positions, the outer surface 21 of the secondary shielding layer 2 Waviness is greater than the waviness of the second surface 12；The configuration of adhesive film 3 is in the outer surface 21 of the secondary shielding layer 2 On.

The first screen layer 1 and secondary shielding layer 2 all have conduction free electron function, used in material can phase Together can also be different, specifically include one in metal screen layer, carbon nanotube shielded layer, ferrite shielded layer and graphene shielded layer Kind is a variety of.Wherein, the metal screen layer includes monometallic shielded layer and/or alloy shielded layer；Wherein, the monometallic screen Layer is covered to be made of any one material in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, the alloy shielded layer by aluminium, Two or more any material in titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold is made.In addition, the adhesive film 3 Material therefor preferably is selected from following several: modified epoxy class, modified acrylic acid, modified rubber class, modified thermoplastic polyamides Imines, modified poly ester class.

In the present embodiment, the convex particle 4 is distributed on the second surface 12 of the first screened film that (second surface 12 is The non-smooth surface of fluctuating), function be so that the secondary shielding layer 2 of secondary shielding film outer surface 22 with the convex The corresponding position of grain 4 forms lug boss 212, and forms gentle portion 211, the outer surface of the secondary shielding layer 2 in other positions 22 waviness is greater than the waviness of the second surface 12, so that electromagnetic shielding film and printed wiring board bonding processes In, which can be easier to pierce through adhesive film 3, so that shielded layer and wiring board stratum connect, interference charge is passed through Shielded layer directly exports；In addition, the recess portion 221 can increase charging capacity, so that the peel strength of the electromagnetic shielding film increases, it will not Plate bursting phenomenon occurs.The convex particle 4 includes conductive particles, semiconductor grain, insulator particles coat composite particles (conductor Another insulator particle etc. of insulator particle or the insulator cladding of cladding) it is one or more, further include little particle Bulky grain made of reunion.In practical application, the convex particle 4 is diamond dust, titanium dioxide, Si powder, silicide powder, two Silicon oxide powder, aluminide powder, graphene powder, iron powder, nickel powder, copper powder, nickel plating diamond dust, plating metal inorganic particle etc.. It should be noted that the shape of the convex particle 4 in the utility model is not limited by illustrating, material is not also by above-mentioned material The limitation of material, as long as having so that the outer surface 22 of secondary shielding layer 2 forms the particle of the protrusion, in the utility model Protection scope within.

It is described convex in order to meet the protrusion 222 that the outer surface 22 of the secondary shielding layer 2 forms puncture adhesive film 3 enough The height of shape particle 4 is 0.1 μm -30 μm.In addition, the outer surface 22 of the thickness of the adhesive film 3 and the secondary shielding layer 2 It is preferred that waviness meets proportionate relationship are as follows: and 0.8~2, to guarantee enough puncture intensities and charging capacity, embody are as follows: a side Face prevent the thickness of adhesive film 3 too small relative to the waviness of the outer surface 22 of secondary shielding layer 2 and cause charging capacity deficiency into And lead to plate bursting phenomenon, on the other hand prevent the waviness of the outer surface 22 of secondary shielding layer 2 relative to the thickness mistake of adhesive film 3 It is small and cause puncture intensity insufficient and earthing failure phenomenon is caused to generate.It should be noted that the appearance of the secondary shielding layer 2 The waviness in face 22 is the distance of the highs and lows of the outer surface 22 of the secondary shielding layer 2.

Based on above structure, position corresponding with the convex particle is formed on the outer surface of the secondary shielding layer 2 Lug boss, and gentle portion is formed in other positions, the waviness of the outer surface 22 of the secondary shielding layer 2 is greater than second table The outer surface 22 of the waviness in face 12, the secondary shielding layer 2 is equipped with the adhesive film 3, the outer surface 22 of secondary shielding layer 2 Protrusion 222 guarantee that shielded layer smoothly pierces through adhesive film 3 during the pressing process, guarantee that interference charge normally exports, while recess portion 221 can increase the charging capacity in bonding processes again, so that the peel strength of the electromagnetic shielding film increases, it is existing that plate bursting will not occur As.

Preferably, the adhesive film 3 is the adhesion layer without conducting particles, reduces the insertion damage of wiring board in use process Consumption improves the bending of wiring board while improving shield effectiveness.

In another preferred embodiment, the adhesive film 3 is the adhesion layer with conducting particles, then the adhesive film 3 removes Have the function of bonding, binds the terminal plate and electromagnetic shielding film closely, also have the function of conduction, with described Two shielded layers 2 match, and interference electronics is imported rapidly in the stratum of the terminal plate.Wherein, the conducting particles can be The conducting particles being separated from each other, or bulky grain conducting particles made of reunion；When the conducting particles is to be separated from each other Conducting particles when, can further improve the area of electrical contact, improve the uniformity of electrical contact；And work as the conducting particles For bulky grain conducting particles made of reunion, puncture intensity can be increased.

Preferably, the electromagnetic shielding film further includes protective film layer, and the first surface 11 of the first screen layer 1 is formed with The protective film layer.The protective film layer plays insulating effect to guarantee the screen of the first screen layer 1 and secondary shielding layer 2 Cover efficiency.The protective film layer is PPS film layer, PEN film layer, laminated polyester film, polyimide film layer, Epoxy Resin Oil The film layer that is formed after the film layer that is formed, polyurethane ink are formed after solidifying after ink solidifies film layer, acrylic resin modified solidification, One of the film layer that polyimide resin is formed after solidifying.

It should be noted that the first screen layer 1 and secondary shielding layer 2 of the present embodiment attached drawing can be single layer structure, it can also Think multilayered structure.In addition, according to the needs of actual production and application, the first screen layer 1 and the second screen of the present embodiment attached drawing Covering layer 2 may be configured as latticed, foaming shape etc..

It referring to fig. 2, is a kind of structural schematic diagram of electromagnetic shielding film in the utility model embodiment 2, as shown in Figure 1, packet Include first screen layer 1, secondary shielding layer 2, adhesive film and several convex particles；The first screen layer 1 includes opposite first Surface 11 and second surface, the second surface are the non-smooth surface to rise and fall；Several convex particles are attached to described On the second surface of one shielded layer 1；The configuration of secondary shielding layer 2 is covered 12 on the second surface of the first screen layer 1 Several convex particles 4 are covered, thus in the position corresponding with the convex particle 4 of the outer surface 21 of the secondary shielding layer 2 It sets to form protrusion 212, and forms recess portion 211 in other positions, the waviness of the outer surface 21 of the secondary shielding layer 2 is greater than institute State the waviness of second surface 12；The configuration of adhesive film 3 is on the outer surface 21 of the secondary shielding layer 2；Second screen It covers and is also formed with several conductive bumps 5 on the outer surface of layer 2.

The conductive bumps 5 include one of metal bump, carbon nanotube protrusion and ferrite protrusion or a variety of.This Outside, the metal bump includes monometallic protrusion and/or alloy protrusion；Wherein, the monometallic protrusion by aluminium, titanium, zinc, iron, Any one material in nickel, chromium, cobalt, copper, silver and gold is made, the alloy protrusion by aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, Two or more any material in silver and gold is made.It should be noted that conductive bumps 5 can with first screen layer 1, the material of secondary shielding layer 2 is identical, can not also be identical.

The conductive bumps 5 are preferably integrated distribution on the protrusion 222, then the secondary shielding layer 2 was pressing It is easier puncture adhesive film 3 in journey and improves the quality of electromagnetic shielding to be grounded.

The first screen layer 1 and secondary shielding layer 2 all have conduction free electron function, used in material can phase Together can also be different, specifically include one in metal screen layer, carbon nanotube shielded layer, ferrite shielded layer and graphene shielded layer Kind is a variety of.Wherein, the metal screen layer includes monometallic shielded layer and/or alloy shielded layer；Wherein, the monometallic screen Layer is covered to be made of any one material in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, the alloy shielded layer by aluminium, Two or more any material in titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold is made.In addition, the adhesive film 3 Material therefor preferably is selected from following several: modified epoxy class, modified acrylic acid, modified rubber class, modified thermoplastic polyamides Imines, modified poly ester class.

In the present embodiment, the convex particle 4 is distributed on the second surface 12 of the first screened film that (second surface 12 is The non-smooth surface of fluctuating), function be so that the outer surface 21 of the secondary shielding layer 2 it is corresponding with the convex particle 4 Position form protrusion 212, and form recess portion 211 in other positions, the waviness of the outer surface 22 of the secondary shielding layer 2 is big In the waviness of the second surface 12, so that in electromagnetic shielding film and printed wiring board bonding processes, 222 energy of protrusion Adhesive film 3 is more easily pierced through, so that shielded layer and wiring board stratum connect, interference charge is directly led by shielded layer Out；In addition, the recess portion 221 can increase charging capacity, so that the peel strength of the electromagnetic shielding film increases, it is existing that plate bursting will not occur As.The convex particle 4 includes that (conductor coats exhausted for conductive particles, semiconductor grain, insulator particle and covered composite yarn particle Another insulator particle etc. of edge body particle or insulator cladding) it is one or more, further include that little particle is reunited Bulky grain.In practical application, the convex particle 4 is diamond dust, titanium dioxide, Si powder, silicide powder, silicon dioxide powder End, aluminide powder, graphene powder, iron powder, nickel powder, copper powder, nickel plating diamond dust, plating metal inorganic particle etc..It needs to illustrate , the shape of the convex particle 4 in the utility model do not limited by illustrating, and material is not also by the limit of above-mentioned material System, as long as having so that the outer surface 22 of secondary shielding layer 2 forms the particle of protrusion 222, in the protection of the utility model Within the scope of.

It is described convex in order to meet the protrusion 222 that the outer surface 22 of the secondary shielding layer 2 forms puncture adhesive film 3 enough The height of shape particle 4 is 0.1 μm -30 μm.In addition, the outer surface 22 of the thickness of the adhesive film 3 and the secondary shielding layer 2 It is preferably 0.8~2 that the sum of the height of waviness and the conductive bumps 5, which meets proportionate relationship, to guarantee enough puncture intensities And charging capacity, it embodies are as follows: on the one hand prevent the thickness of adhesive film 3 relative to the fluctuating of the outer surface 22 of secondary shielding layer 2 It spends with the height of the conductive bumps 5 and too small and causes charging capacity insufficient and then lead to plate bursting phenomenon, on the other hand prevent The sum of the height of the waviness and conductive bumps 5 of the outer surface 22 of secondary shielding layer 2 is too small relative to the thickness of adhesive film 3 And leads to puncture intensity deficiency and earthing failure phenomenon is caused to generate.It should be noted that the outer surface of the secondary shielding layer 2 22 waviness is the distance of the highs and lows of the outer surface 22 of the secondary shielding layer 2.

Position shape corresponding with the convex particle 4 based on above structure, in the outer surface 21 of the secondary shielding layer 2 At protrusion 212, and recess portion 211 is formed in other positions, the waviness of the outer surface 22 of the secondary shielding layer 2 is greater than described the The waviness on two surfaces 12, the outer surface 22 of the secondary shielding layer 2 is equipped with the adhesive film 3, and secondary shielding layer 2 is outer Several conductive bumps 5 are also formed on surface 22, then the protrusion 222 of the outer surface 22 of secondary shielding layer 2 and conductive stud thereon 5 mutually collaborations are played, function is pierced through in enhancing, guarantees that secondary shielding layer 2 smoothly pierces through adhesive film 3, so that it is guaranteed that interference charge is normal Export；Recess portion 221 can increase the charging capacity in bonding processes again simultaneously, so that the peel strength of the electromagnetic shielding film increases, no Plate bursting phenomenon can occur.

Preferably, the adhesive film 3 is the adhesion layer without conducting particles, reduces the insertion damage of wiring board in use process Consumption improves the bending of wiring board while improving shield effectiveness.

In another preferred embodiment, the adhesive film 3 is the adhesion layer with conducting particles, then the adhesive film 3 removes Have the function of bonding, binds the terminal plate and electromagnetic shielding film closely, also have the function of conduction, with described Two shielded layers 2 match, and interference electronics is imported rapidly in the stratum of the terminal plate.Wherein, the conducting particles can be The conducting particles being separated from each other, or bulky grain conducting particles made of reunion；When the conducting particles is to be separated from each other Conducting particles when, can further improve the area of electrical contact, improve the uniformity of electrical contact；And work as the conducting particles For bulky grain conducting particles made of reunion, puncture intensity can be increased.

Preferably, the electromagnetic shielding film further includes protective film layer, and the first surface 11 of the first screen layer 1 is formed with The protective film layer.The protective film layer plays insulating effect to guarantee the screen of the first screen layer 1 and secondary shielding layer 2 Cover efficiency.The protective film layer is PPS film layer, PEN film layer, laminated polyester film, polyimide film layer, Epoxy Resin Oil The film layer that is formed after the film layer that is formed, polyurethane ink are formed after solidifying after ink solidifies film layer, acrylic resin modified solidification, One of the film layer that polyimide resin is formed after solidifying.

In addition, the conductive bumps 5 are preferably integrated distribution in the protrusion 222, then the secondary shielding layer 2 is pressing It is easier puncture adhesive film 3 in the process and improves the quality of electromagnetic shielding to realize more reliable ground connection.

It should be noted that the first screen layer 1 and secondary shielding layer 2 of the present embodiment attached drawing can be single layer structure, it can also Think multilayered structure.In addition, according to the needs of actual production and application, the first screen layer 1 and the second screen of the present embodiment attached drawing Covering layer 2 may be configured as latticed, foaming shape etc..

Referring to Fig. 3, for a kind of structural schematic diagram for wiring board that the utility model embodiment 3 provides, the wiring board packet Printed wiring board and electromagnetic shielding film described in embodiment 1 are included, the electromagnetic shielding film passes through its adhesive film 3 and the track Road plate mutually presses；The adhesive film 3 is pierced through in the protrusion 222 of the outer surface 22 of the secondary shielding layer 2, and extends to the printing The stratum of wiring board.

In the present embodiment, it can refer to the description of above-described embodiment 1 about the implementation of electromagnetic shielding film, herein no longer It repeats.

Preferably, the printed wiring board 3 is flexible single-side, flexibility double face, flexible multi-layer plate, one in rigid-flex combined board Kind.

By above structure, during the pressing process, adhesive film 3 is pierced through using the protrusion 222 of the secondary shielding layer 2, So that 22 at least part of outer surface of secondary shielding layer 2 is connect with the stratum of the printed circuit board 6, to realize the Interference charge in one shielded layer 1 and secondary shielding layer 2 imports in ground, avoids the accumulation of interference charge and forms interference source, Influence the normal work of wiring board；Gentle portion can reduce the insertion loss in use process again simultaneously, be suitable for hyperfrequency and transmit.

Referring to fig. 4, a kind of structural schematic diagram of the wiring board provided for the utility model embodiment 4, the wiring board packet Printed wiring board and electromagnetic shielding film as described in example 2 are included, the electromagnetic shielding film passes through its adhesive film 3 and the track Road plate mutually presses；The adhesive film 3 is pierced through in the protrusion 222 of the outer surface 22 of the secondary shielding layer 2, and extends to the printing The stratum of wiring board.

In the present embodiment, it can refer to the description of above-described embodiment 2 about the implementation of electromagnetic shielding film, herein no longer It repeats.

By above structure, during the pressing process, the protrusion 222 and thereon of the outer surface 22 of secondary shielding layer 2 is utilized The adhesive film 3 is pierced through in the mutually collaboration of conductive bumps 5, so that 22 at least part of outer surface of secondary shielding layer 2 and institute The stratum connection of printed circuit board 6 is stated, thus realize that the interference charge in first screen layer 1 and secondary shielding layer 2 imports in ground, It avoids the accumulation of interference charge and forms interference source, influence the normal work of wiring board；Meanwhile recess portion 221 can increase appearance again So that the peel strength of the electromagnetic shielding film increases plate bursting phenomenon will not occur for glue amount.

The above is preferred embodiments of the present invention, it is noted that for the ordinary skill of the art For personnel, without departing from the principle of this utility model, several improvements and modifications can also be made, these are improved and profit Decorations are also considered as the protection scope of the utility model.

Claims (10)

1. a kind of electromagnetic shielding film, which is characterized in that including first screen layer, secondary shielding layer, adhesive film and several convexs Grain；The first screen layer includes opposite first surface and second surface, and the second surface is the non-smooth surface to rise and fall； Several convex particles are attached on the second surface of the first screen layer；The secondary shielding layer configuration is described first On the second surface of shielded layer, and several convex particles are covered, thus in the outer surface of the secondary shielding layer and institute It states the corresponding position of convex particle and forms protrusion, and form recess portion in other positions, the outer surface of the secondary shielding layer is risen Fu Du is greater than the waviness of the second surface；The adhesive film configuration is on the outer surface of the secondary shielding layer.

2. electromagnetic shielding film as described in claim 1, which is characterized in that the convex particle includes conductive particles, semiconductor Particle, insulator particle and covered composite yarn particle it is one or more.

3. electromagnetic shielding film as claimed in claim 2, which is characterized in that the height of the convex particle is 0.1 μm -30 μm.

4. electromagnetic shielding film as described in claim 1, which is characterized in that be also formed on the outer surface of the secondary shielding layer Several conductive bumps.

5. electromagnetic shielding film as claimed in claim 4, which is characterized in that the conductive bumps integrated distribution is in the protrusion On.

6. electromagnetic shielding film as described in claim 1, which is characterized in that the adhesive film includes sticking together containing conducting particles Layer.

7. electromagnetic shielding film as described in claim 1, which is characterized in that the adhesive film includes sticking together without conducting particles Layer.

8. electromagnetic shielding film as described in claim 1, which is characterized in that the first screen layer and secondary shielding layer include gold Belong to one of shielded layer, carbon nanotube shielded layer, ferrite shielded layer and graphene shielded layer or a variety of.

9. electromagnetic shielding film as described in claim 1, which is characterized in that the electromagnetic shielding film further includes protective film layer, institute The first surface for stating first screen layer is formed with the protective film layer.

10. a kind of wiring board, which is characterized in that including electromagnetic screen described in printed wiring board and claim 1 to 9 any one Film is covered, the electromagnetic shielding film is mutually pressed by its adhesive film with the printed wiring board；The outer surface of the secondary shielding layer Protrusion pierce through the adhesive film, and extend to the stratum of the printed wiring board.