CN111621244A - Conductive adhesive tape, electromagnetic shielding adhesive tape and preparation method of electromagnetic shielding adhesive tape - Google Patents
Conductive adhesive tape, electromagnetic shielding adhesive tape and preparation method of electromagnetic shielding adhesive tape Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
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- C08K3/08—Metals
- C08K2003/0862—Nickel
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/004—Additives being defined by their length
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/26—Presence of textile or fabric
- C09J2400/263—Presence of textile or fabric in the substrate
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Abstract
The invention discloses a conductive adhesive tape, an electromagnetic shielding adhesive tape and a preparation method of the electromagnetic shielding adhesive tape. The conductive adhesive tape comprises a base material layer and conductive adhesive layers arranged on two sides of the base material layer, the conductive adhesive adopted by the conductive adhesive layers comprises a pressure-sensitive adhesive and a conductive filler, the conductive filler comprises conductive nickel powder and conductive fibers, the particle size of the conductive nickel powder is 1-10 mu m, the diameter of the conductive fibers is 5-30 mu m, and the length of the conductive fibers is 0.1-1.0 mm. The electromagnetic shielding adhesive tape comprises a metal foil layer, a conductive adhesive tape layer and a release material layer which are sequentially stacked from top to bottom. The electromagnetic shielding adhesive tape prepared by the invention has better shielding efficiency in the application scene of pasting narrow areas of components and can meet the application requirement of smaller pasting size.
Description
Technical Field
The invention relates to the technical field of electromagnetic shielding of electronic product components, in particular to a conductive adhesive tape, an electromagnetic shielding adhesive tape and a preparation method of the electromagnetic shielding adhesive tape.
Background
The consumer electronics products are used more and more frequently in daily life, along with the popularization of the 5G technology, the consumer electronics products are more and more intelligent and thinner, and the requirements on components inside the products are higher and higher. On the one hand, the intellectualization of consumer electronics requires electronic components to operate under higher frequency electromagnetic waves, and the interference of high frequency electromagnetic waves to the components is very serious, so that higher requirements are put forward on the shielding effectiveness of shielding materials. On the other hand, the thinning of consumer electronics requires the miniaturization of electronic components, and the pasting space for the shielding material becomes smaller, for example, the pasting size of some high-end models is reduced from 1mm to 0.5mm or even smaller at present, and the increasingly smaller pasting area size puts higher requirements on the viscosity and shielding effectiveness of the electromagnetic shielding.
The existing common electromagnetic shielding adhesive tape can achieve better viscosity and shielding effectiveness for the adhering area of more than 1mm, but can not achieve the use requirement for the adhering area of less than 1mm, so that a new electromagnetic shielding adhesive tape material needs to be developed to meet the requirement of small-size adhesion.
Disclosure of Invention
In order to overcome the defects in the prior art, the embodiment of the invention provides a conductive adhesive tape, an electromagnetic shielding adhesive tape and a preparation method of the electromagnetic shielding adhesive tape.
The invention discloses a conductive adhesive tape, which comprises a substrate layer and conductive adhesive layers arranged on two sides of the substrate layer, wherein the conductive adhesive adopted by the conductive adhesive layer comprises a pressure-sensitive adhesive and a conductive filler, the conductive filler comprises conductive nickel powder and conductive fibers, the particle size of the conductive nickel powder is 1-10 mu m, the diameter of the conductive fibers is 5-30 mu m, and the length of the conductive fibers is 0.1-1.0 mm.
Preferably, the ratio of the parts by weight of the pressure-sensitive adhesive to the parts by weight of the conductive filler in the conductive adhesive is 1: 0.05-1: 0.5.
Preferably, the ratio of the mass parts of the conductive nickel powder and the conductive fibers in the conductive filler is 0.1: 1-10: 1.
The invention also discloses an electromagnetic shielding adhesive tape, which comprises a metal foil layer, a conductive adhesive tape layer and a release material layer which are sequentially stacked from top to bottom, wherein the conductive adhesive tape layer adopts the conductive adhesive tape of any one of claims 1 to 3.
Preferably, the metal foil layer is made of copper foil or aluminum foil, and the thickness of the metal foil layer is 5-20 μm.
Preferably, the thickness of the conductive adhesive tape layer is 20 to 60 μm.
Preferably, a conductive layer is arranged on one surface of the metal foil layer, which is opposite to the conductive adhesive tape layer, the thickness of the conductive layer is 3-10 mu m, and the surface resistance is 105Omega is less than or equal to.
Preferably, an antistatic layer is arranged on one surface of the metal foil layer, which faces away from the conductive adhesive tape layer, the thickness of the antistatic layer is 5-15 micrometers, the antistatic layer is one of an antistatic thin film adhesive tape and antistatic ink, and the surface resistance of the antistatic layer formed by the antistatic ink is 105～9Ω。
Preferably, an insulating layer is arranged on one surface of the metal foil layer, which faces away from the conductive adhesive tape layer, the thickness of the insulating layer is 5-15 μm, one of an insulating film adhesive tape and insulating ink is adopted as the insulating layer, and the surface resistance of the insulating layer formed by the insulating ink is 109Omega or more.
The invention also discloses a preparation method of the electromagnetic shielding adhesive tape, which comprises the following steps:
respectively coating conductive adhesive on two surfaces of the substrate layer to obtain a conductive adhesive tape;
compounding the release section layer on the lower end surface of the conductive adhesive tape;
if the electromagnetic shielding adhesive tape comprises a metal foil layer, a conductive adhesive tape layer and a release material layer, compounding the metal foil layer on the upper end face of the conductive adhesive tape;
if the electromagnetic shielding adhesive tape also comprises a conductive layer, printing conductive ink on the surface of the metal foil, and compounding the surface of the metal foil, which is back to the conductive ink, on the upper end surface of the conductive adhesive tape;
if the electromagnetic shielding adhesive tape also comprises an antistatic layer, compounding the antistatic layer on the surface of the metal foil, and compounding the surface of the metal foil, which is back to the antistatic layer, on the upper end surface of the conductive adhesive tape;
if the electromagnetic shielding adhesive tape also comprises an insulating layer, compounding the insulating layer on the surface of the metal foil, and compounding the surface of the metal foil, which is back to the insulating layer, on the upper end surface of the conductive adhesive tape;
and after the metal foil and the release material layer are respectively compounded on the upper end surface and the lower end surface of the conductive adhesive tape, placing the conductive adhesive tape in an oven for curing to obtain a finished product.
The invention has the following beneficial effects:
according to the invention, the conductive filler compounded by the conductive nickel powder and the conductive fibers is added into the pressure-sensitive adhesive, the conductive nickel powder can be relatively independently dispersed in the adhesive layer, and the conductive fibers can penetrate among uniformly dispersed conductive nickel powder particles in the adhesive layer due to the advantages of the length direction, so that the dispersed conductive nickel powder is connected together to form a compact conductive network structure, thereby enhancing the conductive performance of the conductive adhesive and enabling the prepared electromagnetic shielding adhesive tape to have good shielding efficiency. Even if the electromagnetic shielding adhesive tape is die-cut into a small size of less than 1mm, the tight connection structure of the conductive fiber and the conductive nickel powder in the local area of the electromagnetic shielding adhesive tape still exists, so that the excellent conductive performance under the condition of small size is ensured, and the electromagnetic shielding adhesive tape has good shielding efficiency.
In order to make the aforementioned and other objects, features and advantages of the invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural view of an electromagnetic shielding tape in embodiment 1 of the present invention;
reference numerals of the above figures: 1-an insulating layer; 2-copper foil; 3-conductive adhesive tape; 4-release material layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The pressure-sensitive adhesives in examples 1 to 6 and comparative example 1 were acrylate pressure-sensitive adhesives.
Example 1
Preparation of conductive adhesive
Uniformly mixing the pressure-sensitive adhesive and the conductive filler according to the mass part ratio of 1:0.3, wherein the conductive filler comprises conductive nickel powder and conductive fibers, and the mass part ratio of the conductive nickel powder to the conductive fibers is 1: 1. The particle size of the conductive nickel powder is 1-10 mu m. The diameter of the conductive fiber is 5-30 μm, and the length of the conductive fiber is 0.1-1.0 mm.
Preparation of electromagnetic shielding adhesive tape
The conductive adhesive is coated on both sides of the non-woven fabric, respectively, to form conductive adhesive layers on both sides of the non-woven fabric, thereby preparing the conductive adhesive tape 3, the total thickness of the conductive adhesive tape 3 being 60 μm.
An insulating polyurethane resin ink was printed on the surface of a copper foil 2 to form an insulating layer 1 on the surface of the copper foil, the copper foil 2 had a thickness of 20 μm, the printed thickness was 8 μm, and the surface resistance of the insulating layer 1 was 109And omega or above, compounding the surface of the copper foil 2, which is back to the insulating layer 1, on the upper end surface of the conductive adhesive tape 3, and compounding the parting material layer 4 on the lower end surface of the conductive adhesive tape.
After the copper foil 2 and the release material layer 4 are respectively compounded on the upper end surface and the lower end surface of the conductive adhesive tape 3, placing the conductive adhesive tape in an oven for curing to obtain a finished product.
Wherein, the release material layer 4 is a PET release film with single-sided release, the release force is 10gf/inch, and the thickness is 50 μm.
Example 2
Preparation of conductive adhesive
The pressure-sensitive adhesive and the conductive filler are uniformly mixed according to the mass part ratio of 1:0.1, wherein the conductive filler comprises conductive nickel powder and conductive fibers, and the mass part ratio of the conductive nickel powder to the conductive fibers is 5: 1. The particle size of the conductive nickel powder is 1-10 mu m. The diameter of the conductive fiber is 5-30 μm, and the length of the conductive fiber is 0.1-1.0 mm.
Preparation of electromagnetic shielding adhesive tape
And respectively coating conductive adhesives on the two sides of the non-woven fabric to form conductive adhesive layers so as to form the conductive adhesive layers on the two sides of the non-woven fabric, thereby preparing the conductive adhesive tape, wherein the total thickness of the conductive adhesive tape is 30 mu m.
Printing antistatic polyurethane resin ink on the surface of copper foil to form an antistatic layer on the surface of the copper foil, wherein the thickness of the copper foil is 12 μm, the printing thickness is 8 μm, and the surface resistance of the antistatic layer formed by the antistatic ink is 105～9And omega, compounding the surface of the copper foil, which is back to the antistatic layer, on the upper end surface of the conductive adhesive tape, and compounding the release profile layer on the lower end surface of the conductive adhesive tape.
And after the copper foil and the release material layer are respectively compounded on the upper end surface and the lower end surface of the conductive adhesive tape, placing the conductive adhesive tape in an oven for curing to obtain a finished product.
Wherein the release material layer is a PET release film with single-sided release, the release force is 10gf/inch, and the thickness is 36 μm.
Example 3
Preparation of conductive adhesive
Uniformly mixing the pressure-sensitive adhesive and the conductive filler according to the mass part ratio of 1:0.05, wherein the conductive filler comprises conductive nickel powder and conductive fibers, and the mass part ratio of the conductive nickel powder to the conductive fibers is 0.3: 1. The particle size of the conductive nickel powder is 1-10 mu m. The diameter of the conductive fiber is 5-30 μm, and the length of the conductive fiber is 0.1-1.0 mm.
Preparation of electromagnetic shielding adhesive tape
And respectively coating conductive adhesives on the two sides of the non-woven fabric to form conductive adhesive layers so as to form the conductive adhesive layers on the two sides of the non-woven fabric, thereby preparing the conductive adhesive tape, wherein the total thickness of the conductive adhesive tape is 20 mu m.
Printing conductive polyurethane resin ink on the surface of copper foil to form a conductive layer on the surface of the copper foil, wherein the thickness of the copper foil is 5 μm, the printing thickness is 5 μm, and the surface resistance of the conductive layer is 105Below omega, the surface of the copper foil, which is back to the conductive layer, is compounded on the upper end surface of the conductive adhesive tape, and the parting material layer is compounded on the lower end surface of the conductive adhesive tape.
And after the copper foil and the release material layer are respectively compounded on the upper end surface and the lower end surface of the conductive adhesive tape, placing the conductive adhesive tape in an oven for curing to obtain a finished product.
Wherein the release material layer is a PET release film with single-sided release, the release force is 5gf/inch, and the thickness is 36 μm.
Example 4
Preparation of conductive adhesive
The pressure-sensitive adhesive and the conductive filler are uniformly mixed according to the mass part ratio of 1:0.5, wherein the conductive filler comprises conductive nickel powder and conductive fibers, and the mass part ratio of the conductive nickel powder to the conductive fibers is 10: 1. The particle size of the conductive nickel powder is 1-10 mu m. The diameter of the conductive fiber is 5-30 μm, and the length of the conductive fiber is 0.1-1.0 mm.
Preparation of electromagnetic shielding adhesive tape
And respectively coating conductive adhesives on the two sides of the non-woven fabric to form conductive adhesive layers so as to form the conductive adhesive layers on the two sides of the non-woven fabric, thereby preparing the conductive adhesive tape, wherein the total thickness of the conductive adhesive tape is 60 mu m.
On copperThe surface of the foil was bonded with an insulating film tape to form an insulating layer on the surface of the copper foil, and the thickness of the insulating film tape was 8 μm. The insulating film adhesive tape is composed of a polyethylene film and an adhesive layer coated on one surface of the polyethylene film, and the adhesive layer is attached to the surface of the copper foil. The copper foil had a thickness of 12 μm, and the surface resistance of the insulating layer was 109And omega, compounding the surface of the copper foil, which is back to the insulating layer, on the upper end surface of the conductive adhesive tape, and compounding the release profile layer on the lower end surface of the conductive adhesive tape.
And after the copper foil and the release material layer are respectively compounded on the upper end surface and the lower end surface of the conductive adhesive tape, placing the conductive adhesive tape in an oven for curing to obtain a finished product.
Wherein the release material layer is a PET release film with single-sided release, the release force is 30gf/inch, and the thickness is 75 μm.
The insulating film adhesive tape is a film adhesive tape printed with insulating polyurethane resin ink.
Example 5
Preparation of conductive adhesive
Uniformly mixing the pressure-sensitive adhesive and the conductive filler according to the mass part ratio of 1:0.4, wherein the conductive filler comprises conductive nickel powder and conductive fibers, and the mass part ratio of the conductive nickel powder to the conductive fibers is 5: 1. The particle size of the conductive nickel powder is 1-10 mu m. The diameter of the conductive fiber is 5-30 μm, and the length of the conductive fiber is 0.1-1.0 mm.
Preparation of electromagnetic shielding adhesive tape
And respectively coating conductive adhesives on the two sides of the non-woven fabric to form conductive adhesive layers so as to form the conductive adhesive layers on the two sides of the non-woven fabric, thereby preparing the conductive adhesive tape, wherein the total thickness of the conductive adhesive tape is 60 mu m.
And attaching the antistatic film adhesive tape to the surface of the aluminum foil to form an antistatic layer on the surface of the aluminum foil, wherein the thickness of the aluminum foil is 20 micrometers, and the thickness of the antistatic film adhesive tape is 15 micrometers. The surface resistance of the antistatic layer was 105～9And omega, compounding the surface of the aluminum foil, which is back to the antistatic layer, on the upper end surface of the conductive adhesive tape, and compounding the release profile layer on the lower end surface of the conductive adhesive tape.
And after the aluminum foil and the release material layer are respectively compounded on the upper end surface and the lower end surface of the conductive adhesive tape, placing the conductive adhesive tape in an oven for curing to obtain a finished product.
Wherein the release material layer is a PET release film with single-sided release, the release force is 30gf/inch, and the thickness is 75 μm.
The antistatic film adhesive tape is a film adhesive tape printed with antistatic polyurethane resin ink.
Example 6
Preparation of conductive adhesive
Uniformly mixing the pressure-sensitive adhesive and the conductive filler according to the mass part ratio of 1:0.4, wherein the conductive filler comprises conductive nickel powder and conductive fibers, and the mass part ratio of the conductive nickel powder to the conductive fibers is 5: 1. The particle size of the conductive nickel powder is 1-10 mu m. The diameter of the conductive fiber is 5-30 μm, and the length of the conductive fiber is 0.1-1.0 mm.
Preparation of electromagnetic shielding adhesive tape
And respectively coating conductive adhesives on the two sides of the non-woven fabric to form conductive adhesive layers so as to form the conductive adhesive layers on the two sides of the non-woven fabric, thereby preparing the conductive adhesive tape, wherein the total thickness of the conductive adhesive tape is 30 mu m.
And compounding a copper foil on the upper end face of the conductive adhesive tape, and compounding a release profile layer on the lower end face of the conductive adhesive tape, wherein the thickness of the copper foil is 20 micrometers.
And after the copper foil and the release material layer are respectively compounded on the upper end surface and the lower end surface of the conductive adhesive tape, placing the conductive adhesive tape in an oven for curing to obtain a finished product.
Wherein the release material layer is a PET release film with single-sided release, the release force is 10gf/inch, and the thickness is 50 μm.
Comparative example 1
The difference between the comparative example and the example 1 is that only the conductive nickel powder is used in the conductive adhesive, and the specific details are as follows:
preparation of conductive adhesive
Uniformly mixing the pressure-sensitive adhesive and the conductive nickel powder according to the mass part ratio of 1: 0.3. The particle size of the conductive nickel powder is 1-10 mu m.
Preparation of electromagnetic shielding adhesive tape
And respectively coating conductive adhesives on the two sides of the non-woven fabric to form conductive adhesive layers so as to form the conductive adhesive layers on the two sides of the non-woven fabric, thereby preparing the conductive adhesive tape, wherein the total thickness of the conductive adhesive tape is 60 mu m.
Printing insulating polyurethane resin ink on the surface of copper foil to form an insulating layer on the surface of the copper foil, wherein the thickness of the copper foil is 20 μm, the printing thickness is 8 μm, and the surface resistance of the insulating layer is 109And omega, compounding the surface of the copper foil, which is back to the insulating layer, on the upper end surface of the conductive adhesive tape, and compounding the release profile layer on the lower end surface of the conductive adhesive tape.
And after the copper foil and the release material layer are respectively compounded on the upper end surface and the lower end surface of the conductive adhesive tape, placing the conductive adhesive tape in an oven for curing to obtain a finished product.
Wherein the release material layer is a PET release film with single-sided release, the release force is 10gf/inch, and the thickness is 50 μm.
The finished products prepared in examples 1 to 6 and comparative example 1 were subjected to a performance test:
1. peel force test, basic test conditions are shown in table 1:
TABLE 1
| Test board | SUS304 |
| Width of sample strip | 25mm |
| Rolling condition | 2kg of rubber roller, 600mm/min, 3 to-and-fro |
| Standing time | 20min |
| Reinforced film | 25 μm transparent PET |
| Speed of measurement | 300mm/min |
| Test environment | (23±2)℃，(50±10)％R.H. |
| Test unit | gf/inch |
2. The surface resistance of the rubber surface is tested, and the basic test conditions are shown in table 2:
TABLE 2
| Test fixture | Copper gilding |
| Weight of the jig | 500g |
| Area of test | 1inch*1inch |
| Aging environment | (23±2)℃，(50±10)％R.H. |
| Test unit | Ω/sq |
3. The shielding effectiveness, the basic test conditions are shown in table 3:
TABLE 3
| Test board | SUS304 |
| Sample size | 20mm*20mm |
| Sticking size | 0.5mm |
| Rolling condition | 2kg of rubber roller, 600mm/min, 3 to-and-fro |
| Standing time | 24hrs |
| Testing frequency | 500MHz～6GHz |
| Aging environment | 60℃/90％R.H./240hrs |
| Test unit | dB |
4. The results are summarized in Table 4:
TABLE 4
The test result shows that: the surface resistance and the shielding effectiveness of the samples in the embodiments 1 to 6 both show good effects, which shows that the electromagnetic shielding tape provided by the invention can meet the application requirement of smaller pasting size.
The conductive nickel powder and the conductive fibers are uniformly dispersed in the adhesive. After the conductive nickel powder is dispersed in the adhesive, certain tiny gaps can exist among particles of the conductive nickel powder, and the conductive nickel powder particles dispersed in the adhesive can be connected by adding the conductive fibers, so that a tightly connected conductive network is formed, and the conductivity of the conductive adhesive is enhanced.
When the electromagnetic shielding adhesive tape is die-cut into a small size of less than 1mm, gaps among the conductive nickel powder particles in the conductive adhesive tape are relatively enlarged, and the electromagnetic shielding effect of the electromagnetic shielding adhesive tape is weakened. In the invention, because of the existence of the conductive fiber, a tightly connected conductive network can exist in the conductive glue, and even if the electromagnetic shielding adhesive tape is die-cut into small size, the tight connection structure of the conductive fiber and the conductive nickel powder in the local area of the electromagnetic shielding adhesive tape still exists, thereby ensuring the excellent conductive performance under the condition of small size.
Comparative example 1 is different from example 1 in that only conductive nickel powder is used as a conductive filler in comparative example 1. The total amount of the conductive filler in comparative example 1 and that in example 1 were the same. However, as can be seen from the test results, the samples of comparative example 1 exhibited less shielding effectiveness than the electromagnetic shielding tape of example 1. The main reason is that the dispersed conductive nickel powder is dissociated in the adhesive, and when the adhesive is pasted in a large size, as long as the content of the conductive nickel powder is enough, the conductivity of the adhesive is acceptable, and when the pasting size is further reduced, the relative dispersion distance of the dissociated conductive nickel powder is further increased, the conductivity of the free conductive nickel powder is obviously reduced, so that the poor shielding efficiency is shown.
The principle and the implementation mode of the invention are explained by applying specific embodiments in the invention, and the description of the embodiments is only used for helping to understand the method and the core idea of the invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. The conductive adhesive tape is characterized by comprising a base material layer and conductive adhesive layers arranged on two sides of the base material layer, wherein the conductive adhesive adopted by the conductive adhesive layers comprises a pressure-sensitive adhesive and a conductive filler, the conductive filler comprises conductive nickel powder and conductive fibers, the particle size of the conductive nickel powder is 1-10 mu m, the diameter of the conductive fibers is 5-30 mu m, and the length of the conductive fibers is 0.1-1.0 mm.
2. The conductive adhesive tape according to claim 1, wherein the ratio of the parts by weight of the pressure-sensitive adhesive to the conductive filler in the conductive adhesive is 1:0.05 to 1: 0.5.
3. The conductive adhesive tape according to claim 1, wherein the ratio of the conductive nickel powder to the conductive fiber in the conductive filler is 0.1:1 to 10:1 in parts by mass.
4. An electromagnetic shielding tape, comprising a metal foil layer, a conductive tape layer and a release material layer which are sequentially stacked from top to bottom, wherein the conductive tape layer is the conductive tape of any one of claims 1 to 3.
5. The electromagnetic shielding tape according to claim 4, wherein the metal foil layer is made of copper foil or aluminum foil, and the thickness of the metal foil layer is 5 μm to 20 μm.
6. The electromagnetic shielding tape according to claim 4, wherein the thickness of the conductive tape layer is 20 μm to 60 μm.
7. The electromagnetic shielding tape according to claim 4, wherein a conductive layer is disposed on a surface of the metal foil layer opposite to the conductive tape layer, the conductive layer has a thickness of 3 μm to 10 μm, and a surface resistance of 105Omega is less than or equal to.
8. According to claim4 electromagnetic shield sticky tape, its characterized in that, the metal foil layer dorsad the one side on electrically conductive sticky tape layer is equipped with antistatic layer, antistatic layer's thickness is 5 mu m ~ 15 mu m, antistatic layer adopts one of antistatic film sticky tape and antistatic printing ink, wherein, the surface resistance of antistatic layer that constitutes by antistatic printing ink is 105～9Ω。
9. The electromagnetic shielding tape according to claim 4, wherein an insulating layer is disposed on a surface of the metal foil layer opposite to the conductive tape layer, the insulating layer has a thickness of 5 μm to 15 μm, the insulating layer is one of an insulating film tape and an insulating ink, and a surface resistance of the insulating layer formed by the insulating ink is 109Omega or more.
10. The method for preparing an electromagnetic shielding tape according to claim 4, comprising the steps of:
respectively coating conductive adhesive on two surfaces of the substrate layer to obtain a conductive adhesive tape;
compounding the release section layer on the lower end surface of the conductive adhesive tape;
if the electromagnetic shielding adhesive tape comprises a metal foil layer, a conductive adhesive tape layer and a release material layer, compounding the metal foil layer on the upper end face of the conductive adhesive tape;
if the electromagnetic shielding adhesive tape also comprises a conductive layer, printing conductive ink on the surface of the metal foil, and compounding the surface of the metal foil, which is back to the conductive ink, on the upper end surface of the conductive adhesive tape;
if the electromagnetic shielding adhesive tape also comprises an antistatic layer, compounding the antistatic layer on the surface of the metal foil, and compounding the surface of the metal foil, which is back to the antistatic layer, on the upper end surface of the conductive adhesive tape;
if the electromagnetic shielding adhesive tape also comprises an insulating layer, compounding the insulating layer on the surface of the metal foil, and compounding the surface of the metal foil, which is back to the insulating layer, on the upper end surface of the conductive adhesive tape;
and after the metal foil and the release material layer are respectively compounded on the upper end surface and the lower end surface of the conductive adhesive tape, placing the conductive adhesive tape in an oven for curing to obtain a finished product.
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| CN202010454045.1A CN111621244A (en) | 2020-05-26 | 2020-05-26 | Conductive adhesive tape, electromagnetic shielding adhesive tape and preparation method of electromagnetic shielding adhesive tape |
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| CN202010454045.1A CN111621244A (en) | 2020-05-26 | 2020-05-26 | Conductive adhesive tape, electromagnetic shielding adhesive tape and preparation method of electromagnetic shielding adhesive tape |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112080240A (en) * | 2020-09-17 | 2020-12-15 | 镝普材料(深圳)有限公司 | Low-resistance conductive adhesive and manufacturing method of conductive adhesive tape |
| CN112672631A (en) * | 2021-01-12 | 2021-04-16 | 深圳市鑫诺诚科技有限公司 | 5G high-frequency special shielding efficiency composite material |
| CN113512369A (en) * | 2021-06-07 | 2021-10-19 | 深圳先进电子材料国际创新研究院 | Composite material of metal foil layer and conductive silica gel, preparation method thereof and application in SMT (surface mounting technology) |
| CN113604169A (en) * | 2021-09-15 | 2021-11-05 | 江苏晶华新材料科技有限公司 | Antistatic adhesive tape |
| CN113927992A (en) * | 2021-11-12 | 2022-01-14 | 凯仁精密材料(江苏)有限公司 | Conductive adhesive tape, electromagnetic shielding adhesive tape and preparation method of electromagnetic shielding adhesive tape |
| CN114801405A (en) * | 2022-05-16 | 2022-07-29 | 西北工业大学 | Multilayer digital geomembrane and preparation method thereof |
| CN114927260A (en) * | 2022-03-16 | 2022-08-19 | 苏州六材新材料科技有限公司 | Conductive film and preparation method thereof |
| CN115157794A (en) * | 2022-05-09 | 2022-10-11 | 吴江市毅洋金属材料科技有限公司 | Novel printed Mylar aluminum foil and preparation method thereof |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112080240A (en) * | 2020-09-17 | 2020-12-15 | 镝普材料(深圳)有限公司 | Low-resistance conductive adhesive and manufacturing method of conductive adhesive tape |
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| CN113512369A (en) * | 2021-06-07 | 2021-10-19 | 深圳先进电子材料国际创新研究院 | Composite material of metal foil layer and conductive silica gel, preparation method thereof and application in SMT (surface mounting technology) |
| CN113604169A (en) * | 2021-09-15 | 2021-11-05 | 江苏晶华新材料科技有限公司 | Antistatic adhesive tape |
| CN113927992A (en) * | 2021-11-12 | 2022-01-14 | 凯仁精密材料(江苏)有限公司 | Conductive adhesive tape, electromagnetic shielding adhesive tape and preparation method of electromagnetic shielding adhesive tape |
| CN114927260A (en) * | 2022-03-16 | 2022-08-19 | 苏州六材新材料科技有限公司 | Conductive film and preparation method thereof |
| CN115157794A (en) * | 2022-05-09 | 2022-10-11 | 吴江市毅洋金属材料科技有限公司 | Novel printed Mylar aluminum foil and preparation method thereof |
| CN114801405A (en) * | 2022-05-16 | 2022-07-29 | 西北工业大学 | Multilayer digital geomembrane and preparation method thereof |
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Address after: 215000 52 Caohu Avenue, Caohu street, Xiangcheng District, Suzhou City, Jiangsu Province Applicant after: Suzhou Deyou New Material Technology Co.,Ltd. Address before: 215144 No.5 standard workshop in Wan'an Industrial Park, No.2 Zhongshi Road, Caohu Industrial Park, Caohu street, Xiangcheng economic and Technological Development Zone, Suzhou City, Jiangsu Province Applicant before: SUZHOU DEYOU ADHESIVE TAPE TECHNOLOGY Co.,Ltd. |
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