CN108300344A - Conductive tape and preparation method thereof - Google Patents
Conductive tape and preparation method thereof Download PDFInfo
- Publication number
- CN108300344A CN108300344A CN201610830977.5A CN201610830977A CN108300344A CN 108300344 A CN108300344 A CN 108300344A CN 201610830977 A CN201610830977 A CN 201610830977A CN 108300344 A CN108300344 A CN 108300344A
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- Prior art keywords
- conductive
- protective layer
- organic matter
- release
- glue
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention is related a kind of conductive tape and preparation method thereof; its conductive tape; a release protective layer, an inorganic matter and organic matter composite conductive layers, an adhesive and a conductive base layer is sequentially laminated in it; the adhesive mixes in glue contains several conducting particles; and enable the inorganic matter that there is through-hole array with organic matter composite conductive layers, and partially electronically conductive particle is caused to enter in the through-hole array with glue.Whereby, to solve the problems, such as that prior art electric conductivity is unstable, and conductive the effect of capable of stablizing promotion.
Description
Technical field
The present invention is related a kind of conductive tape and preparation method thereof, and espespecially a kind of increase and the conduction object that is stuck directly connect
Tactile inorganic matter and organic matter composite conductive layers, and inorganic matter has through-hole array with organic matter composite conductive layers, and cause to glue
Sticking adhesive layer has the design that partially electronically conductive particle enters with glue in through-hole array.
Background technology
With the development of the consumer electronics industry, consumption electronic product increasingly shows miniaturization, lightweight, slimming
Feature, under this trend, the integrated level of electronic product is higher and higher, volume is smaller and smaller, power is more and more stronger；Therefore, high
The narrow trend in power, high integration, application space just brings a series of conductive, radiation interference for consumption electronic product
The problems such as；However, traditional is conductively connected scheme, such as metal spring leaf, electric wire are online, connector, because volume is larger,
It needs space more, cannot be satisfied consumption electronic product lightweight and uses the demand in small space.
Secondary person, conductive tape because it is light-weight, thickness is thin, has certain cementability and corresponding electric conductivity,
It is widely used in consumer electronics industry, to realize the needs of electronic product internal electrostatic ground connection and electromagnetic shielding；But,
Since the conductive mode of conductive tape is that conductive particle is blended in non-conductive pressure sensitive adhesive, and when non-conductive pressure sensitive adhesive with
After being bonded by conductive material, realized by the electric current tunnel-effect between conductive particle and the contact and conductive particle by conductive material；So
And there is randomness due to the conductive particle on surface and by the contact probability between conductive material in existing conductive tape, causes existing
The electric conductivity of conductive tape is unstable, and can be effectively conductive with using the reduction (integrated level is high) of (bonding) area to cause
Conductive particle existing probability reduce, constrain existing conductive tape makes in high integration, high power consumption electronic product
With.
Invention content
To solve the problems, such as that prior art electric conductivity is unstable, a kind of conductive tape of present invention offer and its preparation side
Method, it is conductive to stablize the effect of being promoted；With preparing quick effect.
The technical solution adopted by the present invention to solve the technical problems is：
A release protective layer, an inorganic matter and organic matter composite conductive layers, a glue is sequentially laminated in a kind of conductive tape
Layer and a conductive base layer, the adhesive in glue mix contain several conducting particles, and enable the inorganic matter with it is organic
Object composite conductive layers have through-hole array, and partially electronically conductive particle is caused to enter in the through-hole array with glue.
In addition, the inorganic matter and organic matter composite conductive layers be silver paste, copper slurry, aluminum paste, copper glue, tin indium oxide slurry,
Tin-antiomony oxide slurry, graphite glue, graphite slurry, graphene glue or graphene slurries are formed in the release guarantor using intaglio printing
Sheath surface, thickness are 2-6 microns.The adhesive is polyacrylate pressure-sensitive layer, and thickness is 20-60 microns, the conduction
Particle is conductive particle and/or conductive fiber.The conductive particle is selected from pure nickel powder, nickel bag graphite powder, nickel packet mica powder, silver
Powder, silvered mica, silver-plated tiny balloon, graphite composite powder, graphene or conductive black；The conductive fiber is selected from nano-silver thread, stone
Black fiber, graphene fiber, carbon fiber, silvered glass fiber, nickel packet carbon fiber or silver-plated carbon fiber.The conductive base layer is pure
Times of metal foil, metallic particles, metal micro line, metal nanometer line, graphene or the porous fibrous material with the coat of metal
One or combination, thickness be 10-200 microns.The through-hole array is circular through hole array, ellipse hole array, diamond shape through-hole battle array
Row, square through hole array or star-shaped through hole array.The release protective layer be surface be coated with mould release PET film or surface be coated with from
The paper wood of type agent, thickness are 30-150 microns.
Furthermore conductive tape preparation method of the invention, includes the following steps：Step 1：It is applied in release protective layer
The composite electrically-conducting paint of cloth mixing inorganic matter and organic matter, and constitute the inorganic matter with through-hole array in release protective layer
Cause inorganic matter and organic matter composite guide after expelling the solvent in conductive coating using baking with organic matter composite conductive layers
Electric layer cures in release protective layer；Step 2：It is mixed containing several conducting particles in temporarily release protective layer coating
Glue, then after expelling by baking the solvent in glue, causes to paste adhesive curing and is formed in temporary release protective layer
Adhesive, then in adhesive, temporarily another surface of release protective layer is bonded conductive base layer relatively；And step 3：
Temporary release protective layer in two product of unloading step, then by another surface of the relatively temporary conductive base layer of adhesive with
The inorganic matter that step 1 is made with release protective layer is bonded with organic matter composite conductive layers.
Another person, inorganic matter are made with organic matter composite conductive layers using intaglio printing.Release protective layer with respect to inorganic matter with
The contact surface of organic matter composite conductive layers is pre-coated with mould release, and temporary release protective layer is advance with respect to the contact surface of adhesive
It is coated with mould release.
Whereby, due to the more existing conductive tape of the present invention increase with it is conductive be stuck inorganic matter that object is in direct contact with have
Machine object composite conductive layers, and the inorganic matter has through-hole array with organic matter composite conductive layers, and the adhesive is caused to have portion
Point conducting particles enters with glue in the through-hole array, conducting particles with it is conductive be stuck object by script plane contact type
State is evolved into three-dimensional contact kenel by the inorganic matter and organic matter composite conductive layers.
The invention has the advantages that its conductive the effect of capable of stablizing promotion；With preparing quick effect.
Description of the drawings
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1 is the structure cut-away view of the present invention.
Fig. 2 is the square through hole array schematic diagram of the inorganic matter and organic matter composite conductive layers of the present invention.
Fig. 3 is the circular through hole array schematic diagram of the inorganic matter and organic matter composite conductive layers of the present invention.
Figure label explanation：
10 release protective layers
20 inorganic matters and organic matter composite conductive layers
21 through-hole array
30 adhesives
31 conducting particles
40 conductive base layers
Specific implementation mode
First, please refer to Fig.1~Fig. 3 shown in, conductive tape of the invention, which is sequentially laminated, includes：One release protective layer
10, can be that surface is coated with the PET film of mould release or the paper wood of surface coating mould release, thickness is 30-150 microns；One inorganic matter
Can be silver paste, copper slurry, aluminum paste, copper glue, tin indium oxide slurry, tin-antiomony oxide slurry, graphite with organic matter composite conductive layers 20
Glue, graphite slurry, graphene glue or graphene slurry are formed and are had using intaglio printing in 10 surface of release protective layer
Through-hole array 21, thickness are 2-6 microns, which can be circular through hole array (as shown in Figure 3), ellipse hole battle array
Row, diamond shape through-hole array, square through hole array (as shown in Figure 2) or star-shaped through hole array；One adhesive 30, in glue
Mixed to contain several conducting particles 31, partially electronically conductive particle 31 enters with glue in the through-hole array 21, and the adhesive
30 can be polyacrylate pressure-sensitive layer, and thickness is 20-60 microns, which can be selected from pure nickel powder, nickel bag graphite
The conduction of powder, nickel packet mica powder, silver powder, silvered mica, silver-plated tiny balloon, graphite composite powder, graphene or conductive black
Particle and/or be selected from nano-silver thread, graphite fibre, graphene fiber, carbon fiber, silvered glass fiber, nickel packet carbon fiber or plating
The conductive fiber of silver-colored carbon fiber；And a conductive base layer 40, can be that simple metal foil, metallic particles, metal micro line, metal be received
Any or combination of rice noodles, graphene or the porous fibrous material with the coat of metal, thickness are 10-200 microns.
The present invention is further described in detail below in conjunction with specific embodiment, but the scope of protection of present invention
It is not limited to the range that embodiment is stated, the ratio involved by embodiment is weight percentage, the conductive base of use,
High molecular weight acrylic resin, solvent, curing agent, conductive particle, conductive fiber, inorganic matter and organic matter composite electrically-conducting paint and
Release protection materials can also be other applicable materials other than the material referred to.
Embodiment 1
Step 1：Using conductive silver paste as the conductive coating of mixing inorganic matter and organic matter, by intaglio printing mode,
With line footpath it is 0.3mm, the printing ruler that square through hole is 3 microns for 1mm × 1mm and thickness by silver paste according to the array lines of Fig. 2
Very little, being printed on surface, silver paste is printed in the PET film surface of 75 microns of thickness, transmission with release silicone oil (off-type force 8-12g)
PET film (release protective layer) afterwards enters baking oven, and baking temperature is 120 DEG C, and baking speed is 200mm/sec, after baking
Then inorganic matter and organic matter composite conductive layers with through-hole array in the attachment of release PET film.
Step 2：Ethyl acetate, isocyanate hardener and several conductions are added based on high molecular weight acrylic resin
Particle constitutes mixture, and weight percent is：High molecular weight acrylic resin 30%-40%, ethyl acetate 44%-54%, isocyanide
Acid esters curing agent 0.5%-1%, conductive particle 5%-15% are stirred 30 minutes with 1000 revs/min of speed, are made containing several
The polyacrylate pressure-sensitive mixture of conductive particle, then the mixture is coated with 30 microns of thickness in 75 micron surface of thickness
Temporary PET release films with release silicone oil are sent into oven with the speed of 8m/min, several conductive particles are contained after baking
The solidification of polyacrylate pressure-sensitive mixture form polyacrylate pressure-sensitive layer in temporarily release protective layer, then in
The copper foil base material (conductive base layer) of 35 microns of polyacrylate pressure-sensitive layer coating thickness.
Step 3：Temporary release protective layer in two product of unloading step is then opposite by polyacrylate pressure-sensitive layer
The inorganic matter that another surface and the step 1 of copper foil base material are made with release protective layer is bonded with organic matter composite conductive layers, i.e.,
Constitute the conductive tape of the present embodiment.
Use universal meter testing example 1 and existing conductive tape (without inorganic matter and organic matter composite conductive layers)
Resistance value, test result is as follows：
According to ASTM D3330 standard testings embodiment 1 and existing conductive tape (without inorganic matter and organic matter composite guide
Electric layer) 180 degree stripping is executed, test result is as follows
Test result：Embodiment 1 effectively improves leading for conductive tape surface while ensureing that sticking strength is enough
Electrical characteristics.
Embodiment 2
Step 1：Using conductive copper paste as the conductive coating of mixing inorganic matter and organic matter, by intaglio printing mode,
With Circularhole diameter it is 3mm, circular hole spacing is printing that 1mm is 5 microns with print thickness by copper slurry according to the array lines of Fig. 3
Size, being printed on surface, silver is printed in the PET film surface of 75 microns of thickness, transmission with release silicone oil (off-type force 8-12g)
PET film (release protective layer) after slurry enters baking oven, and baking temperature is 120 DEG C, and baking speed is 200mm/sec, and baking finishes
Afterwards then in inorganic matter and organic matter composite conductive layers of the attachment of release PET film with through-hole array.
Step 2：Ethyl acetate, isocyanate hardener and several conductions are added based on high molecular weight acrylic resin
Particle constitutes mixture, and weight percent is：High molecular weight acrylic resin 30%-40%, ethyl acetate 44%-54%, isocyanide
Acid esters curing agent 0.5%-1%, conductive particle 5%-15% are stirred 30 minutes with 1000 revs/min of speed, are made containing several
The polyacrylate pressure-sensitive mixture of conductive particle, then the mixture is coated with 30 microns of thickness in 75 micron surface of thickness
Temporary PET release films with release silicone oil are sent into oven with the speed of 8m/min, several conductive particles are contained after baking
The solidification of polyacrylate pressure-sensitive mixture form polyacrylate pressure-sensitive layer in temporarily release protective layer, then in
The nickel plating conduction woven fabric (conductive base layer) of 55 microns of polyacrylate pressure-sensitive layer coating thickness.
Step 3：Temporary release protective layer in two product of unloading step is then opposite by polyacrylate pressure-sensitive adhesive layers
Another surface of nickel plating conduction woven fabric is made the inorganic matter with release protective layer with step 1 and is pasted with organic matter composite conductive layers
It closes, that is, constitutes the conductive tape of the present embodiment.
Use universal meter testing example 2 and existing conductive tape (without inorganic matter and organic matter composite conductive layers)
Resistance value, test result is as follows：
According to ASTM D3330 standard testings embodiment 1 and existing conductive tape (without inorganic matter and organic matter composite guide
Electric layer) 180 degree stripping is executed, test result is as follows
Test result：Embodiment 2 effectively improves leading for conductive tape surface while ensureing that sticking strength is enough
Electrical characteristics.
Based on above-mentioned composition, as long as can quickly be prepared via explainable three steps of the invention of both of the aforesaid embodiment
Complete, when the present invention is pasted onto need the conduction that is conductively connected be stuck object when, since the more existing conductive tape of the present invention increases
Add and be stuck inorganic matter that object is in direct contact and organic matter composite conductive layers 20 with conduction, and the inorganic matter and organic matter are compound
Conductive layer 20 has through-hole array 21, and the adhesive 30 is caused to have partially electronically conductive particle 31 to enter the through-hole with glue
In array 21, conducting particles 31, by the plane contact kenel of script, is answered with the conductive object that is stuck by the inorganic matter and organic matter
Close conductive layer 20 and be evolved into three-dimensional contact kenel, improve between conducting particles 31 and conductive adherend it is total contact (be in direct contact+
Pass through the inorganic matter and 20 mediate contact of organic matter composite conductive layers) area；Therefore conductive can stablize of the present invention is promoted
And prepare quick effect.
The above described is only a preferred embodiment of the present invention, be not intended to limit the present invention in any form, it is all
It is that any simple modification, equivalent change and modification made by above example are still fallen within according to the technical essence of the invention
In the range of technical solution of the present invention.
In conclusion the present invention in structure design, using on practicability and cost-effectiveness, complying fully with industry development institute
It needs, and revealed structure is also to have unprecedented innovative structure, there is novelty, creativeness, practicability, meet related
The regulation of patent of invention important document, therefore lift application in accordance with the law.
Claims (10)
1. a kind of conductive tape, which is characterized in that a release protective layer, an inorganic matter and organic matter composite conducting is sequentially laminated
Layer, an adhesive and a conductive base layer, which mixes in glue contains several conducting particles, and enables the nothing
Machine object has through-hole array with organic matter composite conductive layers, and partially electronically conductive particle is caused to enter the through-hole array with glue
It is interior.
2. conductive tape according to claim 1, which is characterized in that the inorganic matter is silver with organic matter composite conductive layers
Slurry, copper slurry, aluminum paste, copper glue, tin indium oxide slurry, tin-antiomony oxide slurry, graphite glue, graphite slurry, graphene glue or graphite
Alkene slurry is formed in the release protective layer using intaglio printing, and thickness is 2-6 microns.
3. conductive tape according to claim 1 or 2, which is characterized in that the adhesive is Polyacrylate Pressure Sensitive
Glue-line, thickness are 20-60 microns, which is conductive particle and/or conductive fiber.
4. conductive tape according to claim 3, which is characterized in that the conductive particle is selected from pure nickel powder, nickel bag graphite
Powder, nickel packet mica powder, silver powder, silvered mica, silver-plated tiny balloon, graphite composite powder, graphene or conductive black；The conduction
Fiber is selected from nano-silver thread, graphite fibre, graphene fiber, carbon fiber, silvered glass fiber, nickel packet carbon fiber or silver-plated carbon fiber
Dimension.
5. conductive tape according to claim 4, which is characterized in that the conductive base layer is simple metal foil, metal
Any or combination of grain, metal micro line, metal nanometer line, graphene or the porous fibrous material with the coat of metal, thickness
It is 10-200 microns.
6. conductive tape according to claim 4, which is characterized in that the through-hole array is circular through hole array, ellipse
Shape through-hole array, diamond shape through-hole array, square through hole array or star-shaped through hole array.
7. conductive tape according to claim 4, which is characterized in that the release protective layer is that surface is coated with mould release
The paper wood of PET film or surface coating mould release, thickness are 30-150 microns.
8. a kind of preparation method of conductive tape according to claim 1, which is characterized in that include the following steps：
Step 1：It is coated with the composite electrically-conducting paint of mixing inorganic matter and organic matter in release protective layer, and in release protection
Layer surface constitutes inorganic matter and organic matter composite conductive layers with through-hole array, is expelled using baking molten in conductive coating
After agent, inorganic matter is caused to cure in release protective layer with organic matter composite conductive layers；
Step 2：It is expelled in the temporarily release mixed glue containing several conducting particles of protective layer coating, then by toasting
After solvent in glue, cause to paste adhesive curing in temporarily release protective layer formation adhesive, then in glue
Temporarily another surface of release protective layer is bonded conductive base layer to layer relatively；And
Step 3：Temporary release protective layer in two product of unloading step, then by the relatively temporary conductive base layer of adhesive
Another surface be bonded with organic matter composite conductive layers with the inorganic matter that step 1 is made with release protective layer.
9. conductive tape preparation method according to claim 8, which is characterized in that the inorganic matter and organic matter composite guide
Electric layer is made using intaglio printing.
10. conductive tape preparation method according to claim 8 or claim 9, which is characterized in that the release protective layer is with respect to nothing
Machine object and the contact surface of organic matter composite conductive layers are pre-coated with mould release, contact of the temporary release protective layer with respect to adhesive
Face is pre-coated with mould release.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610830977.5A CN108300344A (en) | 2016-09-19 | 2016-09-19 | Conductive tape and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610830977.5A CN108300344A (en) | 2016-09-19 | 2016-09-19 | Conductive tape and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108300344A true CN108300344A (en) | 2018-07-20 |
Family
ID=62871696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610830977.5A Pending CN108300344A (en) | 2016-09-19 | 2016-09-19 | Conductive tape and preparation method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN108300344A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109371703A (en) * | 2018-10-31 | 2019-02-22 | 际华三五三七制鞋有限责任公司 | Conductive rubber overshoes sponge indsole fabric aqueous sheaing rubber cement and preparation method and application |
| CN110277186A (en) * | 2019-06-27 | 2019-09-24 | 陈先彬 | A kind of ACF and its processing method with fixed array |
| CN111276282A (en) * | 2020-01-06 | 2020-06-12 | 湖北平安电工股份有限公司 | Non-anti-sticking fire-resistant mica tape and preparation method thereof |
| CN111584154A (en) * | 2020-05-26 | 2020-08-25 | 中国电子科技集团公司第三十八研究所 | Preparation method of hole plugging silver paste for interconnection of any layers of multifunctional board and hole plugging silver paste |
| CN111844394A (en) * | 2019-10-31 | 2020-10-30 | 佛山裕德天智科技合伙企业(有限合伙) | Heating ceramic tile and preparation method thereof |
| CN111851936A (en) * | 2019-10-31 | 2020-10-30 | 佛山裕德天智科技合伙企业(有限合伙) | Heating ceramic tile and preparation method thereof |
| CN112300727A (en) * | 2019-07-23 | 2021-02-02 | 东莞爵士先进电子应用材料有限公司 | Self-adhesive composite conductive adhesive tape and preparation method thereof |
| CN116640522A (en) * | 2023-05-08 | 2023-08-25 | 极天羽技术股份有限公司 | Conductive aluminum foil adhesive tape and preparation method thereof |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109371703A (en) * | 2018-10-31 | 2019-02-22 | 际华三五三七制鞋有限责任公司 | Conductive rubber overshoes sponge indsole fabric aqueous sheaing rubber cement and preparation method and application |
| CN110277186A (en) * | 2019-06-27 | 2019-09-24 | 陈先彬 | A kind of ACF and its processing method with fixed array |
| CN112300727A (en) * | 2019-07-23 | 2021-02-02 | 东莞爵士先进电子应用材料有限公司 | Self-adhesive composite conductive adhesive tape and preparation method thereof |
| CN111844394A (en) * | 2019-10-31 | 2020-10-30 | 佛山裕德天智科技合伙企业(有限合伙) | Heating ceramic tile and preparation method thereof |
| CN111851936A (en) * | 2019-10-31 | 2020-10-30 | 佛山裕德天智科技合伙企业(有限合伙) | Heating ceramic tile and preparation method thereof |
| CN111276282A (en) * | 2020-01-06 | 2020-06-12 | 湖北平安电工股份有限公司 | Non-anti-sticking fire-resistant mica tape and preparation method thereof |
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Application publication date: 20180720 |