JP5816456B2 - Anisotropic conductive connection material, film laminate, connection method and connection structure - Google Patents

Description

  The present invention relates to an anisotropic conductive connection material used when mounting electronic components such as flexible printed wiring boards and semiconductor elements on a wiring board, and a film laminate in which an anisotropic conductive connection layer is formed on a release film. The present invention relates to a connection method for connecting an electronic component and a wiring board using an anisotropic conductive connection layer, and a connection structure obtained by this connection method.

  In recent years, the size of liquid crystal screens has been increasing as represented by large screen television devices. Under these circumstances, when connecting electronic components and wiring boards with anisotropic conductive films, low-temperature curing to reduce the effects of thermal stress and shortening of tact time to improve productivity Is required. Currently, a low temperature and a short time can be realized up to 160 ° C.-4 sec. However, it is further required to lower the temperature to 140 ° C.-4 sec.

  In order to satisfy such requirements, acrylic anisotropy is used to connect electronic components and wiring boards by radically polymerizing acrylates with organic peroxides to adhere and connect the wiring boards and electronic components. A conductive film is used.

  The acrylic anisotropic conductive film mainly includes (meth) acrylate, which is a radical polymerizable substance that is a curing component, a polymer material that is a film component, an organic peroxide that is a curing catalyst, and conductive particles. And are contained. For example, there is an anisotropic conductive film containing an epoxy acrylate oligomer as a radical polymerizable substance, bisimidazoles that generate active radicals upon light irradiation, and conductive particles (see, for example, Patent Document 1). Such an acrylic anisotropic conductive film has a reaction different from that of an epoxy anisotropic conductive film, and does not generate a hydroxyl group that provides adhesiveness in the reaction process, resulting in a decrease in adhesiveness. Problems arise.

  Therefore, in an acrylic anisotropic conductive film, the adhesive strength is improved by adding a phosphate group-containing acrylate or urethane acrylate as a curing component (see, for example, Patent Document 2).

  However, when a phosphate group-containing acrylate is added, adhesion to polyimide and metal wiring is improved, but impurities and phosphoric acid generated by decomposition corrode the wiring. For this reason, in an acrylic anisotropic conductive film, only a small amount of phosphoric acid group-containing acrylate can be added, and a sufficient effect cannot be obtained in adhesion and electrical conductivity between the electronic component and the wiring board.

  In addition, when urethane acrylate is added, urethane acrylate that is usually used often uses urethane acrylate having a large molecular weight in consideration of stress relaxation properties. However, if the molecular weight is large, the viscosity increases.

  Usually, as shown in FIG. 5A, an anisotropic conductive film 42 is bonded onto a wiring board 41 on which terminals 40 are formed, and an electronic component 43 is mounted on the anisotropic conductive film 42. 5B, the electronic component 43 is heated and pressed to cure the anisotropic conductive film 42, and the terminals 40 of the wiring board 41 and the terminals of the electronic component 43 are interposed through the conductive particles 44. 45 can be electrically connected.

  On the other hand, in the anisotropic conductive film 46 to which urethane acrylate is added, as shown in FIG. 6, the adhesion and electrical conductivity between the wiring board 41 and the electronic component 43 become insufficient. As shown in FIG. 6A, an anisotropic conductive film 46 is bonded onto a wiring board 41 on which terminals 40 are formed, and an electronic component 43 is mounted on the anisotropic conductive film 46. When the electronic component 43 is heated and pressed against the terminal 41, the adhesive of the anisotropic conductive film 46 is solidified before electrical connection can be established between the terminal 40 of the wiring board 41 and the terminal 45 of the electronic component 43. This causes the problem of pre-curing. As a result, the adhesive is not excluded from between the terminal 40 of the wiring board 41 and the terminal 45 of the electronic component 43, and conduction between the terminals cannot be obtained. Therefore, when urethane acrylate having a small molecular weight is used, the adhesive force between the wiring board 41 and the electronic component 43 does not increase, and a sufficient effect cannot be obtained.

  Therefore, in the method of connecting the wiring board and the electronic component with an acrylic anisotropic conductive film that can achieve low temperature curing and productivity improvement, it is possible to make a connection with high connection strength and conduction reliability. There is a need for a method.

JP 2009-283985 A JP 2003-313533 A

  The present invention has been proposed in view of such a conventional situation, and an anisotropic conductive connection material and a release film that can improve connection strength and conduction reliability in connection between a substrate and an electronic component. To provide a film laminate having an anisotropic conductive connection layer formed thereon, a connection method for connecting an electronic component and a wiring board using the anisotropic conductive connection layer, and a connection structure obtained by this connection method With the goal.

The anisotropic conductive connection material according to the present invention that achieves the above-mentioned object is obtained by dispersing conductive particles in an adhesive, and the adhesive includes a film-forming material, an acrylic compound, an organic peroxide, The amine compound is an imidazole compound having a cyano group, and is contained in an amount of 0.1 to 5 parts by mass with respect to 30 parts by mass of the acrylic compound .

The film laminate according to the present invention that achieves the above-described object is formed by forming an anisotropic conductive connection layer in which conductive particles are dispersed in an adhesive on a release film, and the adhesive forms a film. A material, an acrylic compound, an organic peroxide, and an amine compound, and the amine compound is an imidazole compound having a cyano group, containing 0.1 to 5 parts by mass with respect to 30 parts by mass of the acrylic compound It is characterized by being.

A connection method according to the present invention that achieves the above-described object is a method of connecting a terminal of a substrate and a terminal of an electronic component by an anisotropic conductive connection layer, and conductive particles are contained in an adhesive on the substrate terminal. An adhesive layer forming step for forming an anisotropic conductive connection layer dispersed in the substrate and mounting the electronic component on the substrate so that the terminal of the electronic component faces the terminal of the substrate through the anisotropic conductive connection layer A mounting step, heating and pressing with a pressure head from the upper surface of the electronic component, pressurizing the mounted electronic component against the substrate, and connecting the terminal of the substrate and the terminal of the electronic component to the anisotropic conductive connection layer And an anisotropic conductive connection layer adhesive containing a film forming material, an acrylic compound, an organic peroxide, and an amine compound. The amine compound is an imidazole compound having a cyano group, and Of the acrylic compound 30 parts by weight, characterized in that it is contained 0.1 to 5 parts by weight.

The connection structure according to the present invention that achieves the above-described object is one in which an anisotropic conductive connection layer is interposed between a terminal of a substrate and a terminal of an electronic component to connect and connect the substrate and the electronic component. In the anisotropic conductive connection layer, conductive particles are dispersed in an adhesive, and the adhesive contains a film-forming material, an acrylic compound, an organic peroxide, and an amine compound, and an amine compound. Is an imidazole compound having a cyano group, and is contained in an amount of 0.1 to 5 parts by mass with respect to 30 parts by mass of the acrylic compound .

  According to the present invention, the adhesive of the anisotropic conductive connection material or the anisotropic conductive connection layer contains a film forming material, an acrylic resin, an organic peroxide, and an amine compound, and is cyclic as the amine compound. By containing the tertiary amine compound, the conduction resistance is not increased, and the adhesive force can be improved.

It is sectional drawing of the film laminated body to which this invention is applied. It is sectional drawing of the connection structure which connected the board | substrate and the IC chip with the anisotropic conductive film. It is a perspective view of the connection structure used when measuring the conduction resistance of an Example. It is a perspective view of the connection structure used for the adhesive strength test of an Example. It is sectional drawing explaining the method of connecting an electronic component and a wiring board with a general acrylic anisotropic conductive film, (A) mounts an electronic component on the anisotropic conductive film affixed on the wiring board. FIG. 2B is a cross-sectional view showing a state where heating and pressurization are performed, and FIG. It is sectional drawing explaining the method to connect an electronic component and a wiring board with the anisotropic conductive film containing urethane acrylate, (A) mounts an electronic component on the anisotropic conductive film affixed on the wiring board. FIG. 2B is a cross-sectional view showing a state where heating and pressurization are performed, and FIG. 3B is a cross-sectional view showing a state where the wiring board and the electronic component are not conducted with an anisotropic conductive film.

Hereinafter, embodiments of anisotropic conductive connection materials, film laminates, connection methods, and connection structures to which the present invention is applied (hereinafter referred to as “this embodiment”) will be described in the following order with reference to the drawings. Will be described in detail.
1. 1. Anisotropic conductive connecting material / film laminate 2. Connection structure and connection method Example

<1. Anisotropic Conductive Connection Material / Film Laminate>
An anisotropic conductive connection material is interposed between the terminal of a board | substrate and the terminal of an electronic component, for example, connects a board | substrate and an electronic component, and makes it conduct | electrically_connect. Such an anisotropic conductive connecting material is a film-like anisotropic conductive adhesive film or a paste-like anisotropic conductive adhesive paste containing conductive particles. In the present application, the anisotropic conductive adhesive film or the anisotropic conductive adhesive paste is defined as “anisotropic conductive connecting material”. Below, an anisotropic conductive adhesive film is mentioned as an example and demonstrated.

  As shown in FIG. 1, the film laminate 1 is generally formed by laminating an anisotropic conductive film 3 serving as an anisotropic conductive connection layer on a release film 2 serving as a base material.

  The release film 2 is formed by, for example, applying a release agent such as silicone to PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methlpentene-1), PTFE (Polytetrafluoroethylene), or the like. . The shape of the anisotropic conductive film 3 is maintained by the release film 2.

  In the anisotropic conductive film 3, conductive particles 5 are dispersed in an adhesive (binder) 4 containing at least a film-forming material, an acrylic resin as a curing component, an organic peroxide as a curing agent, and an amine compound. It is a thing. The anisotropic conductive film 3 is formed on the release film 2 in a film shape.

  As the film-forming resin, a resin having an average molecular weight of about 10,000 to 80,000 is preferable. Examples of the film-forming resin include various resins such as phenoxy resin, polyester urethane resin, polyester resin, polyurethane resin, acrylic resin, polyimide resin, butyral tree. Among these, phenoxy resin is particularly preferable from the viewpoint of film formation state, connection reliability, and the like. Content of film formation resin is 30-80 mass parts normally with respect to 100 mass parts adhesive 4, Preferably it is 40-70 mass parts.

  As a hardening component, it is a radically polymerizable resin and an acrylic resin of a thermosetting resin is used. There is no restriction | limiting in particular as an acrylic resin, According to the objective, an acrylic compound, liquid acrylate, etc. can be selected suitably. For example, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, epoxy acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylolpropane triacrylate, dimethylol tricyclodecane diacrylate, tetramethylene glycol tetraacrylate, 2-hydroxy- 1,3-diacryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane, 2,2-bis [4- (acryloxyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclo Examples include decanyl acrylate, tris (acryloxyethyl) isocyanurate, urethane acrylate, and epoxy acrylate. In addition, what made acrylate the methacrylate can also be used.

  A hardening component may be used individually by 1 type, and may use 2 or more types together. Content of a hardening component is 10-60 mass parts normally with respect to 100 mass parts adhesive 4, Preferably it is 20-50 mass parts.

  Note that the adhesive 4 does not contain an epoxy resin as a curing component. Since the adhesive 4 contains an amine compound in order to increase the adhesive strength as will be described later, if the epoxy resin is contained, the epoxy reaction proceeds to increase the viscosity. This is because the electronic parts cannot be connected to each other, the adhesive strength is reduced, and the conduction resistance is increased.

  The curing agent is a radical-initiating polymerization agent, and an organic peroxide is used. Examples of the organic peroxide include lauroyl peroxide, butyl peroxide, benzyl peroxide, dilauroyl peroxide, dibutyl peroxide, benzyl peroxide, peroxydicarbonate, benzoyl peroxide, and the like. Content of a hardening | curing agent is 0.1-30 mass parts normally with respect to 100 mass parts adhesive 4, Preferably it is 1-20 mass parts.

  The amine compound improves the adhesive strength of the adhesive 4. As the amine compound, one not modified with a silanol group or a vinyl group is used. Specifically, the amine compound is a cyclic tertiary amine compound, and examples thereof include an imidazole compound. As the cyclic tertiary amine compound, an imidazole compound is preferable, and among them, an imidazole compound having a cyano group is particularly preferable. Since an imidazole compound having a cyano group has higher polarity, the adhesive strength can be further increased. It is preferable that the compounding quantity of an amine compound shall be 0.1-5 mass parts with respect to 30 mass parts of acrylic resins, and when it is less than 0.1 mass part, the adhesive force of the anisotropic conductive film 3 However, if the amount is more than 5 parts by mass, the connection reliability is lowered. When the imidazole compound is used as the amine compound, the content of the imidazole compound can be increased by 0.5 to 5 parts by mass with respect to 30 parts by mass of the acrylic resin, so that the adhesive strength can be further increased. preferable.

  In the adhesive 4 having the above-described configuration, it is said that when an amine compound is added, the metal adhesion is usually increased due to its polarity. The steric hindrance is less likely to occur, the amine compound can be used effectively, and the adhesive strength of the anisotropic conductive film 1 can be increased.

  Further, in the adhesive 4, when an amine compound is used as a catalyst, for example, the reactivity is fast, the curing reaction proceeds, affects the storage stability of the adhesive 4 before use, and the product life is shortened. Even when 2-methylimidazole is used, it can be used without affecting the product life of the anisotropic conductive film 3.

  The adhesive 4 may contain a silane coupling agent. Although it does not specifically limit as a silane coupling agent, For example, an amino type, a mercapto sulfide type, a ureido type etc. can be mentioned. By adding a silane coupling agent, the adhesion at the interface between the organic material and the inorganic material can be improved.

  As the conductive particles 5 to be contained in the adhesive 4, any known conductive particles used in the anisotropic conductive film 3 can be exemplified. Examples of the conductive particles 5 include particles of various metals and metal alloys such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, gold, metal oxide, carbon, graphite, glass, ceramic, Examples thereof include those in which the surface of particles such as plastic is coated with metal, or those in which the surface of these particles is further coated with an insulating thin film. In addition, as the conductive particles 5, resin particles whose surfaces are coated with metal can be used. Examples of the resin particles include epoxy resins, phenol resins, acrylic resins, acrylonitrile / styrene (AS) resins, and benzoguanamine. Examples thereof include particles of resin, divinylbenzene resin, styrene resin, and the like.

From the viewpoint of connection reliability, the average particle diameter of the conductive particles 5 is preferably 1 to 20 μm, more preferably 2 to 10 μm. The average particle density of the conductive particles 5 in the adhesive 4, from the viewpoint of connection reliability and insulation reliability, preferably are 1,000 to 50,000 pieces / mm ^2, more preferably 3,000 to 30,000 pieces / mm ² .

  The film laminate 1 having such a structure is prepared by dissolving the above-described adhesive 4 in a solvent such as toluene or ethyl acetate to produce an adhesive solution in which the conductive particles 5 are dispersed. It can manufacture by apply | coating so that it may become desired thickness on the peeling film 2 which has peelability, drying, removing a solvent, and forming the anisotropic conductive film 3. FIG.

  In addition, the film laminated body 1 is not limited to the structure which formed the anisotropic conductive film 3 on such a peeling film 2, The insulating resin layer (only the adhesive 4 is formed on the anisotropic conductive film 3 ( NCF (Non Conductive Film layer) may be laminated.

  Moreover, the film laminated body 1 is good also as a structure which provides a peeling film also on the surface side opposite to the surface where the peeling film 2 of the anisotropic conductive film 3 was laminated | stacked.

  The anisotropic conductive film 3 of the film laminate 1 having the above-described configuration is a radical anisotropic conductive film, containing a phenoxy resin, a urethane resin, or the like as a film-forming resin, and an acrylic resin as a curing component. By containing an organic peroxide as a radical-initiating polymerization agent and an amine compound that improves the adhesive strength of the adhesive 4 together, high adhesive strength can be obtained without increasing resistance.

  Moreover, in the anisotropic conductive film 3 of the film laminate 1, the adhesive 4 does not contain an epoxy resin that undergoes anion polymerization with an amine compound such as an imidazole compound, and the amine compound is not used as a radical polymerization initiator. Therefore, it can be used to enhance the adhesive 4 and the effect of the amine compound can be exhibited.

<2. Connection structure and connection method>
Next, a connection method for conducting and connecting the terminals of the substrate and the terminals of the electronic component using the anisotropic conductive film 3 and the connection structure manufactured thereby will be described.

  The connection structure 10 shown in FIG. 2 is obtained by mechanically and electrically connecting and fixing a rigid wiring board 11 as a substrate and an IC chip 12 as an electronic component with an anisotropic conductive film 3. In this connection structure 10, the terminal 13 of the rigid wiring board 11 and the terminal 14 of the IC chip 12 are electrically connected by the conductive particles 5.

  The manufacturing method of the connection structure 10 includes an adhesive layer forming step of attaching an anisotropic conductive film 3 serving as an anisotropic conductive connection layer on the terminal 13 of the rigid wiring board 11, and an anisotropic conductive film 3. Then, a mounting process for mounting the IC chip 12 on the rigid wiring board 11 so that the terminal 14 of the IC chip 12 faces the terminal 13 of the rigid wiring board 11, and the pressure head is heated from the upper surface of the IC chip 12. Then, the mounted IC chip 12 is pressurized while being heated with respect to the rigid wiring board 11, and the terminal 13 of the rigid wiring board 11 and the terminal 14 of the IC chip 12 are electrically conductive of the anisotropic conductive film 3. A connection step of electrically connecting through the particles 5.

  First, in the adhesive layer forming step, the anisotropic conductive film 3 of the film laminate 1 is on the terminal 13 side of the rigid wiring board 11 at a position where the terminal 13 on the rigid wiring board 11 is connected to the terminal 14 of the IC chip 12. Then, the release film 2 is peeled off to make only the anisotropic conductive film 3, and then the anisotropic conductive film 3 is attached to the terminal 13. This pasting is performed at a temperature at which the thermosetting resin component contained in the anisotropic conductive film 3 is not cured, for example, heating at a temperature of about 70 ° C. to 100 ° C. for about 0.5 seconds to about 2 seconds while slightly pressing. To do. Thereby, the anisotropic conductive film 3 is positioned and fixed on the terminal 13 of the rigid wiring board 11.

  Next, a mounting process for mounting the IC chip 12 on the anisotropic conductive film 3 is performed. In the mounting process, the alignment state of the anisotropic conductive film 3 is confirmed, and if there is no misalignment or the like, the terminals 14 of the IC chip 12 are positioned on the anisotropic conductive film 3, and the rigid wiring board The IC chip 12 is mounted on the rigid wiring 11 via the anisotropic conductive film 3 so that the terminal 13 of the terminal 11 and the terminal 14 of the IC chip 12 face each other.

  Next, a connecting step for mechanically and electrically connecting the rigid wiring board 11 and the IC chip 12 is performed. In the connecting step, the IC chip 12 is pressed against the rigid wiring board 11 from the upper surface of the IC chip 12 with a pressurizing head that can be heated and pressurized to cure the anisotropic conductive film 3, and the rigid wiring board. 11 terminal 13 and IC chip 12 terminal 14 are electrically connected via conductive particles 5, and rigid wiring board 1 and IC chip 12 are mechanically connected by anisotropic conductive film 3.

  The condition of this connection process is that the heating temperature is equal to or higher than the curing temperature of the thermosetting resin contained in the anisotropic conductive film 3, the adhesive 4 is excluded from between the terminals 13 and 14, and the conductive particles 5 are removed. Pressurize with pressure that can be pinched. Thereby, the rigid substrate 11 and the IC chip 12 are electrically and mechanically connected via the anisotropic conductive film 3. Specific conditions for temperature and pressurization are a temperature of about 130 ° C. to 150 ° C. and a pressure of about 1 MPa to 100 MPa.

  In the connection structure 10 manufactured as described above, the anisotropic conductive film 3 contains a phenoxy resin, a urethane resin, or the like as a film-forming resin, an acrylic resin as a curing component, and an organic peroxide as a radical-initiating polymerization agent. By containing an oxide and an amine compound that improves the adhesive strength of the adhesive 4 together, the adhesive strength of the anisotropic conductive film 3 is increased, and the mechanical strength of the rigid wiring board 11 and the IC chip 12 is increased. In addition to high connection strength, the electrical connection strength between the terminal 13 of the rigid substrate 11 and the terminal 14 of the IC chip 12 is also high.

  Further, in this connection structure 10, since the anisotropic conductive film 3 does not contain an epoxy resin, the anisotropic conductive film 13 does not thicken and is connected between the rigid wiring board 11 and the IC chip 12. The occurrence of defects can also be prevented. Therefore, the connection structure 10 has high connection strength between the rigid wiring board 11 and the IC chip 12 and high reliability of conduction.

  Further, the substrate of the connection structure 10 is not limited to the rigid wiring board 11 and may be any insulating substrate having a terminal, such as a glass substrate provided with a terminal, a plastic substrate, or a glass reinforced. An epoxy board | substrate etc. can be mentioned.

  Further, the electronic component is not limited to the IC chip 12 and may be another electronic component. For example, semiconductor chips other than IC chips such as LSI (Large Scale Integration) chips, semiconductor elements such as chip capacitors, flexible printed circuits (FPC), semiconductor mounting materials for driving liquid crystals (COF: Chip On Film), etc. Can be mentioned.

  As mentioned above, although this Embodiment was described, it cannot be overemphasized that this invention is not limited to the above-mentioned embodiment, A various change is possible in the range which does not deviate from the summary of this invention.

<3. Example>
Next, specific examples of the present invention will be described based on the results of experiments actually performed, but the present invention is not limited to these examples.

<Production of film laminate>
First, ethyl acetate and toluene are used as an organic solvent, and a film forming material, a curing component, an organic peroxide, and an amine compound having the composition shown in Tables 1 and 2 below are added to the organic solvent so as to have a solid content of 50%. A mixed solution was prepared. Next, this mixed solution was applied on a polyethylene terephthalate film having a thickness of 50 μm and dried at 70 ° C. for 5 minutes to prepare a film laminate sample formed in a film shape. The blending of the anisotropic conductive film materials in Examples 1 to 6 and Comparative Examples 1 to 3 was performed as shown in Tables 1 and 2. In addition, when performing evaluation shown below, what was adjusted so that thickness might be set to 20 micrometers was used.

  The anisotropic conductive films of Examples 1 to 6 and Comparative Examples 1 to 3 were subjected to conduction resistance measurement and adhesive strength test.

<Conduction resistance measurement>
In the test for measuring the conduction resistance, the connection structure 20 shown in FIG. 3 was produced as follows, and the conduction resistance was measured. First, an anisotropic conductive film 22 of each example and each comparative example is attached to ITO glass 21 obtained by attaching a transparent conductive film (ITO film) 21a to 0.7 mm thick glass, and a flexible wiring board (FPC) is formed thereon. ) 23. The flexible wiring board 23 was 20 mm × 40 mm × total thickness 46 μm, and used a characteristic evaluation element for measurement in which a conductive measurement wiring was formed with PI / Cu = 38 μm / 8 μm and a pitch of 50 μm. Next, the flexible printed circuit board 23 is heated to the ITO glass 21 side with a pressure head while applying pressure for 4 seconds under the conditions of a temperature of 160 ° C. and a pressure of 4 MPa to cure the anisotropic conductive film 22. A connection structure 20 in which the ITO glass 21 and the ITO glass 21 were made conductive was produced.

  And about the connection structure 20 of each of these Examples and Comparative Examples, the conduction resistance value after being left for 500 hours (after aging) in a 60 ° C./95% RH environment was evaluated. The conduction resistance value was measured using a digital multimeter when a current of 1 mA was passed by the four-terminal method. When the conduction resistance value after aging is 5Ω or less, the resistance is low.

<Adhesive strength test>
The adhesion strength test was performed by producing the connection structure 30 shown in FIG. For the connection structure 30, the ITO glass 31 and the flexible printed wiring board 32 having the same configuration as the above-described conduction resistance measurement were used. The anisotropic conductive film 33 of each Example and Comparative Example is interposed between the ITO glass 31 and the flexible printed wiring board 32, and the ITO glass and the flexible printed wiring board 32 are subjected to the same temperature and heating conditions as in the above-described conduction resistance measurement. Were connected mechanically and electrically to produce a connection structure 30. And about the connection structure 30 of each Example and Comparative Example, the central portion of the flexible printed wiring board 32 was cut out with a width of 10 mm, and the anisotropic conductive film 33 exposed from the cut-out portion was subjected to a tensile tester (Tensilon, (Orientec Co., Ltd.) was used, and the peeling strength was 50 mm / min and the pulling up was 90 degrees (Y-axis direction), and the adhesive strength was measured. When the adhesive strength is 4 N / cm or more, the adhesive strength is high.

  From the results shown in Table 1, in Examples 1 to 6, where the anisotropic conductive film contains an imidazole compound, the adhesive strength of the anisotropic conductive film is increased by the polarity of imidazole, and ITO glass and flexible print The adhesion strength with the wiring board increased and the adhesive strength increased to 4 N / cm or more. Moreover, in Example 2 and Example 3 containing the imidazole compound which has a cyano group, adhesive strength is high, and as shown in Example 2, even if content of imidazole is as small as 0.5 weight part, adhesive strength is low. It became high.

  On the other hand, in Comparative Example 1, since the anisotropic conductive film contains an epoxy resin, the imidazole compound is consumed as a curing agent, the adhesive strength is reduced, and the resistance is increased. Since the bifunctional primary amine was used as the amine compound, the adhesive strength was not sufficiently improved and the resistance was increased. In Comparative Example 3, since a linear tertiary amine compound was used as the amine compound, the adhesive strength was not sufficiently improved.

  DESCRIPTION OF SYMBOLS 1 Film laminated body, 2 Release film, 3 Anisotropic conductive film, 4 Adhesive, 5 Conductive particle, 10 Connection structure, 11 Rigid wiring board, 12 IC chip, 13 terminal, 14 terminal

Claims (5)

In an anisotropic conductive connecting material in which conductive particles are dispersed in an adhesive,
The adhesive contains a film forming material, an acrylic compound, an organic peroxide, and an amine compound,
An anisotropic conductive connecting material, wherein the amine compound is an imidazole compound having a cyano group, and is contained in an amount of 0.1 to 5 parts by mass with respect to 30 parts by mass of the acrylic compound .   The anisotropic conductive connection material according to claim 1, wherein the anisotropic conductive connection material is formed in a film shape. In a film laminate in which an anisotropic conductive connection layer formed by dispersing conductive particles in an adhesive is formed on a release film,
The adhesive contains a film forming material, an acrylic compound, an organic peroxide, and an amine compound,
The said amine compound is an imidazole compound which has a cyano group, and 0.1-5 mass parts is contained with respect to 30 mass parts of said acrylic compounds , The film laminated body characterized by the above-mentioned. In the connection method of connecting the terminal of the substrate and the terminal of the electronic component by the anisotropic conductive connection layer,
An adhesive layer forming step of forming an anisotropic conductive connection layer in which conductive particles are dispersed in an adhesive on the terminal of the substrate;
A mounting step of mounting the electronic component on the substrate such that the terminal of the electronic component faces the terminal of the substrate via the anisotropic conductive connection layer;
The electronic component is heated and pressed from the upper surface of the electronic component with a pressure head to pressurize the mounted electronic component against the substrate, and the terminal of the substrate and the terminal of the electronic component are connected to the anisotropic conductive connection layer. A connection step of electrically connecting through the conductive particles,
The adhesive for the anisotropic conductive connection layer contains a film forming material, an acrylic compound, an organic peroxide, and an amine compound, and the amine compound is an imidazole compound having a cyano group, and the acrylic compound The connection method characterized by containing 0.1-5 mass parts with respect to 30 mass parts. In a connection structure in which an anisotropic conductive connection layer is interposed between a terminal of a substrate and a terminal of an electronic component, and the substrate and the electronic component are connected and conducted,
The anisotropic conductive connection layer is formed by dispersing conductive particles in an adhesive,
The adhesive contains a film forming material, an acrylic compound, an organic peroxide, and an amine compound,
The connection structure according to claim 1, wherein the amine compound is an imidazole compound having a cyano group and is contained in an amount of 0.1 to 5 parts by mass with respect to 30 parts by mass of the acrylic compound .

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