HK1189389A1 - Anisotropic conductive connection material, film laminate, connection method, and connection structure - Google Patents

Anisotropic conductive connection material, film laminate, connection method, and connection structure

Info

Publication number
HK1189389A1
HK1189389A1 HK14102534.3A HK14102534A HK1189389A1 HK 1189389 A1 HK1189389 A1 HK 1189389A1 HK 14102534 A HK14102534 A HK 14102534A HK 1189389 A1 HK1189389 A1 HK 1189389A1
Authority
HK
Hong Kong
Prior art keywords
connection
anisotropic conductive
film laminate
connection structure
connection method
Prior art date
Application number
HK14102534.3A
Other languages
Chinese (zh)
Inventor
阿久津恭志
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of HK1189389A1 publication Critical patent/HK1189389A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Laminated Bodies (AREA)
  • Wire Bonding (AREA)
HK14102534.3A 2011-05-12 2014-03-13 Anisotropic conductive connection material, film laminate, connection method, and connection structure HK1189389A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011107457A JP5816456B2 (en) 2011-05-12 2011-05-12 Anisotropic conductive connection material, film laminate, connection method and connection structure
PCT/JP2012/062194 WO2012153849A1 (en) 2011-05-12 2012-05-11 Anisotropic conductive connection material, film laminate, connection method, and connection structure

Publications (1)

Publication Number Publication Date
HK1189389A1 true HK1189389A1 (en) 2014-06-06

Family

ID=44881092

Family Applications (1)

Application Number Title Priority Date Filing Date
HK14102534.3A HK1189389A1 (en) 2011-05-12 2014-03-13 Anisotropic conductive connection material, film laminate, connection method, and connection structure

Country Status (6)

Country Link
JP (1) JP5816456B2 (en)
KR (1) KR101973823B1 (en)
CN (1) CN103502379B (en)
HK (1) HK1189389A1 (en)
TW (1) TWI539470B (en)
WO (1) WO2012153849A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102541899B1 (en) * 2014-02-04 2023-06-14 데쿠세리아루즈 가부시키가이샤 Anisotropic conductive film and method for producing same
JP6608147B2 (en) * 2015-02-23 2019-11-20 デクセリアルズ株式会社 Multilayer adhesive film and connection structure
JP7305957B2 (en) * 2016-10-03 2023-07-11 株式会社レゾナック Conductive film, wound body, connected structure, and method for manufacturing connected structure
CN106371250A (en) * 2016-10-21 2017-02-01 芜湖赋兴光电有限公司 Anisotropic conductive film (ACF) adhesive hot-pressing process

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4736280B2 (en) * 2001-08-30 2011-07-27 日立化成工業株式会社 Adhesive for circuit connection and circuit connection structure using the same
JP2003313533A (en) 2002-04-23 2003-11-06 Sumitomo Bakelite Co Ltd Anisotropic conductive adhesive
JP4466650B2 (en) * 2004-06-09 2010-05-26 日立化成工業株式会社 Film adhesive, film circuit connecting material, circuit member connecting method, and semiconductor device
JP4381967B2 (en) * 2004-12-07 2009-12-09 電気化学工業株式会社 Adhesive composition, joined body using the same, and method for producing adhesive composition
WO2007046189A1 (en) * 2005-10-18 2007-04-26 Hitachi Chemical Company, Ltd. Adhesive composition, circuit connecting material, connection structure of circuit connenctor, and semiconductor devices
JP5000695B2 (en) 2009-09-01 2012-08-15 日立化成工業株式会社 Circuit board device manufacturing method

Also Published As

Publication number Publication date
WO2012153849A1 (en) 2012-11-15
JP2011204685A (en) 2011-10-13
CN103502379B (en) 2016-02-10
KR101973823B1 (en) 2019-04-29
KR20140035391A (en) 2014-03-21
TW201301300A (en) 2013-01-01
TWI539470B (en) 2016-06-21
JP5816456B2 (en) 2015-11-18
CN103502379A (en) 2014-01-08

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