HK1189389A1 - Anisotropic conductive connection material, film laminate, connection method, and connection structure - Google Patents
Anisotropic conductive connection material, film laminate, connection method, and connection structureInfo
- Publication number
- HK1189389A1 HK1189389A1 HK14102534.3A HK14102534A HK1189389A1 HK 1189389 A1 HK1189389 A1 HK 1189389A1 HK 14102534 A HK14102534 A HK 14102534A HK 1189389 A1 HK1189389 A1 HK 1189389A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- connection
- anisotropic conductive
- film laminate
- connection structure
- connection method
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Non-Insulated Conductors (AREA)
- Conductive Materials (AREA)
- Laminated Bodies (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011107457A JP5816456B2 (en) | 2011-05-12 | 2011-05-12 | Anisotropic conductive connection material, film laminate, connection method and connection structure |
PCT/JP2012/062194 WO2012153849A1 (en) | 2011-05-12 | 2012-05-11 | Anisotropic conductive connection material, film laminate, connection method, and connection structure |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1189389A1 true HK1189389A1 (en) | 2014-06-06 |
Family
ID=44881092
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK14102534.3A HK1189389A1 (en) | 2011-05-12 | 2014-03-13 | Anisotropic conductive connection material, film laminate, connection method, and connection structure |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP5816456B2 (en) |
KR (1) | KR101973823B1 (en) |
CN (1) | CN103502379B (en) |
HK (1) | HK1189389A1 (en) |
TW (1) | TWI539470B (en) |
WO (1) | WO2012153849A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102541899B1 (en) * | 2014-02-04 | 2023-06-14 | 데쿠세리아루즈 가부시키가이샤 | Anisotropic conductive film and method for producing same |
JP6608147B2 (en) * | 2015-02-23 | 2019-11-20 | デクセリアルズ株式会社 | Multilayer adhesive film and connection structure |
JP7305957B2 (en) * | 2016-10-03 | 2023-07-11 | 株式会社レゾナック | Conductive film, wound body, connected structure, and method for manufacturing connected structure |
CN106371250A (en) * | 2016-10-21 | 2017-02-01 | 芜湖赋兴光电有限公司 | Anisotropic conductive film (ACF) adhesive hot-pressing process |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4736280B2 (en) * | 2001-08-30 | 2011-07-27 | 日立化成工業株式会社 | Adhesive for circuit connection and circuit connection structure using the same |
JP2003313533A (en) | 2002-04-23 | 2003-11-06 | Sumitomo Bakelite Co Ltd | Anisotropic conductive adhesive |
JP4466650B2 (en) * | 2004-06-09 | 2010-05-26 | 日立化成工業株式会社 | Film adhesive, film circuit connecting material, circuit member connecting method, and semiconductor device |
JP4381967B2 (en) * | 2004-12-07 | 2009-12-09 | 電気化学工業株式会社 | Adhesive composition, joined body using the same, and method for producing adhesive composition |
WO2007046189A1 (en) * | 2005-10-18 | 2007-04-26 | Hitachi Chemical Company, Ltd. | Adhesive composition, circuit connecting material, connection structure of circuit connenctor, and semiconductor devices |
JP5000695B2 (en) | 2009-09-01 | 2012-08-15 | 日立化成工業株式会社 | Circuit board device manufacturing method |
-
2011
- 2011-05-12 JP JP2011107457A patent/JP5816456B2/en active Active
-
2012
- 2012-05-11 KR KR1020137032613A patent/KR101973823B1/en active IP Right Grant
- 2012-05-11 CN CN201280022932.5A patent/CN103502379B/en active Active
- 2012-05-11 WO PCT/JP2012/062194 patent/WO2012153849A1/en active Application Filing
- 2012-05-11 TW TW101116759A patent/TWI539470B/en active
-
2014
- 2014-03-13 HK HK14102534.3A patent/HK1189389A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2012153849A1 (en) | 2012-11-15 |
JP2011204685A (en) | 2011-10-13 |
CN103502379B (en) | 2016-02-10 |
KR101973823B1 (en) | 2019-04-29 |
KR20140035391A (en) | 2014-03-21 |
TW201301300A (en) | 2013-01-01 |
TWI539470B (en) | 2016-06-21 |
JP5816456B2 (en) | 2015-11-18 |
CN103502379A (en) | 2014-01-08 |
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