HK1181554A1 - Anisotropic conductive film, method for producing connected body, and connected body - Google Patents

Anisotropic conductive film, method for producing connected body, and connected body

Info

Publication number
HK1181554A1
HK1181554A1 HK13108543.0A HK13108543A HK1181554A1 HK 1181554 A1 HK1181554 A1 HK 1181554A1 HK 13108543 A HK13108543 A HK 13108543A HK 1181554 A1 HK1181554 A1 HK 1181554A1
Authority
HK
Hong Kong
Prior art keywords
connected body
conductive film
anisotropic conductive
producing
producing connected
Prior art date
Application number
HK13108543.0A
Other languages
Chinese (zh)
Inventor
大关裕樹
塚尾怜司
石松朋之
Original Assignee
迪睿合電子材料有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 迪睿合電子材料有限公司 filed Critical 迪睿合電子材料有限公司
Publication of HK1181554A1 publication Critical patent/HK1181554A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
HK13108543.0A 2011-04-06 2013-07-22 Anisotropic conductive film, method for producing connected body, and connected body HK1181554A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011084634A JP5685473B2 (en) 2011-04-06 2011-04-06 Anisotropic conductive film, method for manufacturing bonded body, and bonded body
PCT/JP2012/059031 WO2012137754A1 (en) 2011-04-06 2012-04-03 Anisotropic conductive film, method for producing connected body, and connected body

Publications (1)

Publication Number Publication Date
HK1181554A1 true HK1181554A1 (en) 2013-11-08

Family

ID=44685156

Family Applications (1)

Application Number Title Priority Date Filing Date
HK13108543.0A HK1181554A1 (en) 2011-04-06 2013-07-22 Anisotropic conductive film, method for producing connected body, and connected body

Country Status (5)

Country Link
JP (1) JP5685473B2 (en)
KR (1) KR101453179B1 (en)
CN (1) CN103069656B (en)
HK (1) HK1181554A1 (en)
WO (1) WO2012137754A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101987917B1 (en) * 2013-07-31 2019-06-11 데쿠세리아루즈 가부시키가이샤 Anisotropically conductive film and manufacturing method therefor
JP6307308B2 (en) * 2014-03-06 2018-04-04 デクセリアルズ株式会社 Manufacturing method of connection structure and circuit connection material
KR102430609B1 (en) * 2014-03-31 2022-08-08 데쿠세리아루즈 가부시키가이샤 Anisotropic conductive film and production method therefor
JP6431723B2 (en) * 2014-08-18 2018-11-28 デクセリアルズ株式会社 Method for manufacturing connection structure and anisotropic conductive adhesive film
TWI686999B (en) * 2014-10-28 2020-03-01 日商迪睿合股份有限公司 Anisotropic conductive film, its manufacturing method and connecting structure
KR102542797B1 (en) * 2015-01-13 2023-06-14 데쿠세리아루즈 가부시키가이샤 Anisotropic conductive film
JP6510846B2 (en) * 2015-03-24 2019-05-08 デクセリアルズ株式会社 Anisotropic conductive film, connection method, and joined body
KR20240010091A (en) * 2016-02-22 2024-01-23 데쿠세리아루즈 가부시키가이샤 Anisotropic conductive film
JP6776609B2 (en) * 2016-02-22 2020-10-28 デクセリアルズ株式会社 Anisotropic conductive film
TWI755470B (en) * 2018-01-16 2022-02-21 優顯科技股份有限公司 Conductive film, optoelectronic semiconductor device and manufacturing method of the same
WO2022067506A1 (en) * 2020-09-29 2022-04-07 重庆康佳光电技术研究院有限公司 Display panel and manufacturing method therefor

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3871083B2 (en) * 1997-03-28 2007-01-24 日立化成工業株式会社 Film adhesive and circuit board manufacturing method
KR100584222B1 (en) * 1999-03-09 2006-05-26 주식회사 새 한 Method for the preparation of the anisotropic conductive film
JP2005197032A (en) 2004-01-05 2005-07-21 Asahi Kasei Electronics Co Ltd Anisotropic conductive film
KR100713333B1 (en) * 2006-01-04 2007-05-04 엘에스전선 주식회사 Multi-layered anisotropic conductive film
JP4880533B2 (en) * 2007-07-03 2012-02-22 ソニーケミカル＆インフォメーションデバイス株式会社 Anisotropic conductive film, method for producing the same, and joined body
JP5823117B2 (en) * 2010-11-16 2015-11-25 デクセリアルズ株式会社 Anisotropic conductive film, bonded body, and manufacturing method of bonded body

Also Published As

Publication number Publication date
CN103069656B (en) 2015-09-02
CN103069656A (en) 2013-04-24
WO2012137754A1 (en) 2012-10-11
KR101453179B1 (en) 2014-10-22
JP2011171307A (en) 2011-09-01
KR20130048730A (en) 2013-05-10
JP5685473B2 (en) 2015-03-18

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