CN107189721A - A kind of conductive pressure sensitive glue composition and its application in production thickening bondline conductive tape - Google Patents
A kind of conductive pressure sensitive glue composition and its application in production thickening bondline conductive tape Download PDFInfo
- Publication number
- CN107189721A CN107189721A CN201710383317.1A CN201710383317A CN107189721A CN 107189721 A CN107189721 A CN 107189721A CN 201710383317 A CN201710383317 A CN 201710383317A CN 107189721 A CN107189721 A CN 107189721A
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- Prior art keywords
- conductive
- parts
- pressure sensitive
- sensitive glue
- glue composition
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0862—Nickel
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
A kind of application the invention discloses conductive pressure sensitive glue composition and its in production thickening bondline conductive tape, the composition is made up of the component of following mass parts：100 parts of acrylate polymer, 1 ~ 10 part of conductive particle, 5 ~ 15 parts of tackifying resin, 0.01 ~ 0.1 part of curing agent, 10 ~ 30 parts of solvent, wherein described conductive particle is that the mass ratio of nickel powder and conductive glass in the mixture of nickel powder and conductive glass, the conductive particle is（20~5）:1.Acrylate polymer, conductive particle and tackifying resin are dissolved using solvent and mixed, stir 15 30 minutes, then curing agent is added to stir 15 minutes, the coating film forming on mould release membrance, then toasted under the conditions of 100 110 degree 5 10 minutes, then transfer lamination is on base material, and the conductive tape being made is when bondline thickness is more than 20 microns, viscosity can be with >=20N/inch, and electric conductivity is good.
Description
Technical field
The invention belongs to conductive tape technical field, and in particular to a kind of conductive pressure sensitive glue composition and its in the thick glue of production
Application in layer conductive tape.
Technical background
Conductive tape is widely used to all kinds of transformers, mobile phone, PDA, LED display, notebook computer, duplicator
The place being electromagnetically shielded etc. various electronic products domestic demand, can eliminate electromagnetic interference, injury of the isolating electromagnetic to human body, simultaneously
Interference voltage and electric current can be avoided to influence product function.Current this kind of conductive tape typically has base material：Metal foil（Copper foil, aluminium
Paper tinsel）Or cloth（Non-woven fabrics, conductive fabric）One layer of conductive pressure sensitive adhesive composition of coating, because the electric conductivity of base material is preferable, pressure sensitive adhesive
Electric conductivity directly determines the electric conductivity of final conductive tape.And in the electric conductivity and glue of pressure sensitive adhesive conductive particle consumption
There is very big relation with film thickness, the caking property of pressure sensitive adhesive can decline when filler addition is big, the thicker conduction of glued membrane
Property is relatively poorer.In the application of the high binding of some requirements, when high to tack requirements（>=20N/inch）, it has to increase glued membrane
Thickness is to improve viscosity, and this has been likely to decrease electric conductivity.Therefore, in the case of thickening bondline（>=20 microns）, good leads
Conductive tape electrical and with high viscosity, is still the problem of needing to solve at present.
The content of the invention
It is an object of the invention to provide a kind of conductive pressure sensitive glue composition and its in production thickening bondline conductive tape
Using the conductive tape being made is when bondline thickness is more than 20 microns, and viscosity can be with >=20N/inch, and electric conductivity is good.
To achieve the above object, the technical solution adopted by the present invention is：
A kind of conductive pressure sensitive glue composition, is made up of the component of following mass parts：100 parts of acrylate polymer, conductive particle
1 ~ 10 part, 5 ~ 15 parts of tackifying resin, 0.01 ~ 0.1 part of curing agent, 10 ~ 30 parts of solvent, wherein the conductive particle be nickel powder and
The mixture of conductive glass.
The mass ratio of nickel powder and conductive glass is in the conductive particle（20~5）:1.
Tackifying resin includes all kinds of rosin resins, all kinds of terpene resins.
The nickel powder is pure nickel powder, at least one of nickel coated graphite powder or nickel bag glass dust.
The draw ratio of the conductive glass is less than 30:1.
The composition is preferably made up of the component of following mass parts：100 parts of acrylate polymer, 5 parts of pure nickel powder,
Conductive 0.7 part of glass, 10 parts of tackifying resin, 0.05 part of curing agent, 20 parts of solvent.
Application of the described conductive pressure sensitive glue composition in production thickening bondline conductive tape.Using solvent by acrylate
Polymer, conductive particle and tackifying resin dissolving mixing, stir 15-30 minute, then add curing agent stirring 15 minutes, from
Coating film forming on type film, is then toasted 5-10 minutes, then transfer lamination is on base material, to apply under the conditions of 100-110 degree
Need to control dry glue thickness at 25-50 microns.
The base material includes copper foil, aluminium foil, conductive fabric or conductive non-woven fabrics.
The curing agent is isocyanates or nitrogen pyridines curing agent such as aziridine crosslinker CX-100, and isocyanates is handed over
Join agent PX2300A
The solvent is ethyl acetate or toluene
The tackifying resin is terpenes, rosin or modified rosin class, such as ArizoneSylvilate RE100L, Sylvares
TP105 etc..
Beneficial effect：Filler addition is few in the conductive pressure sensitive glue composition that the present invention is provided, by nickel powder and conductive glass
Mixing as conductive particle, conduct electricity very well, conductive tape bondline thickness be more than 20 microns when, viscosity can be with >=20N/
Inch, and electric conductivity is good.
Embodiment
In following examples, the raw material sources and its model are as follows：
Acrylic polymer, Kunshan stone plum, model PS8231
Embodiment 1
A kind of conductive pressure sensitive glue composition, is made up of the component of following mass parts：100 parts of acrylate polymer, pure nickel powder 5
Part, draw ratio are 13:1 0.5 part of conductive glass, 10 parts of tackifying resin ArizoneSylvilate RE100L, curing agent
PX2300A0.05 parts, 20 parts of ethyl acetate solvent.
Acrylate polymer, conductive particle and tackifying resin are dissolved using solvent and mixed, stirring 15-30 minutes, so
Add curing agent afterwards to stir 15 minutes, then the coating film forming on mould release membrance toasts 5-10 minutes under the conditions of 100-110 degree,
Then transfer lamination is on copper foil, and dry glue thickness is 25 microns.
Embodiment 2
A kind of conductive pressure sensitive glue composition, is made up of the component of following mass parts：100 parts of acrylate polymer, pure nickel powder 5
Part, draw ratio are 13:1 0.7 part of conductive glass, 10 parts of tackifying resin ArizoneSylvilate RE100L, curing agent
0.05 part of PX2300A, 20 parts of ethyl acetate.
Acrylate polymer, conductive particle and tackifying resin are dissolved using solvent and mixed, stirring 15-30 minutes, so
Add curing agent afterwards to stir 15 minutes, then the coating film forming on mould release membrance toasts 5-10 minutes under the conditions of 100-110 degree,
Then transfer lamination is on copper foil, and dry glue thickness is 30 microns.
Embodiment 3
A kind of conductive pressure sensitive glue composition, is made up of the component of following mass parts：100 parts of acrylate polymer, pure nickel powder 5
Part, draw ratio are 13:1 0.7 part of conductive glass, 10 parts of tackifying resin RE100L, 0.05 part of curing agent PX2300A, solvent
20 parts of ethyl acetate.
Acrylate polymer, conductive particle and tackifying resin are dissolved using solvent and mixed, stirring 15-30 minutes, so
Add curing agent afterwards to stir 15 minutes, then the coating film forming on mould release membrance toasts 5-10 minutes under the conditions of 100-110 degree,
Then transfer lamination is on copper foil, and dry glue thickness is 35 microns.
Embodiment 4
A kind of conductive pressure sensitive glue composition, is made up of the component of following mass parts：100 parts of acrylate polymer, pure nickel powder 5
Part, 10 parts of tackifying resin RE100L, 0.05 part of curing agent PX2300A, 20 parts of solvent ethyl acetate.
Acrylate polymer, pure nickel powder and tackifying resin are dissolved using solvent and mixed, stirring 15-30 minutes, then
Add curing agent to stir 15 minutes, the coating film forming on mould release membrance, then baking 5-10 minutes under the conditions of 100-110 degree, so
Transfer lamination is on copper foil afterwards, and dry glue thickness is 25 microns.
The performance parameter for the conductive tape that embodiment 1-4 is prepared is as shown in table 1.
Table 1：
Claims (9)
1. a kind of conductive pressure sensitive glue composition, it is characterised in that the composition is made up of the component of following mass parts：Acrylic acid
100 parts of ester polymer, 1 ~ 10 part of conductive particle, 5 ~ 15 parts of tackifying resin, 0.01 ~ 0.1 part of curing agent, 10 ~ 30 parts of solvent,
Wherein described conductive particle is the mixture of nickel powder and conductive glass.
2. a kind of conductive pressure sensitive glue composition according to claim 1, it is characterised in that in the conductive particle nickel powder and
The mass ratio of conductive glass is（20~5）:1.
3. a kind of conductive pressure sensitive glue composition according to claim 1, it is characterised in that the tackifying resin is rosin tree
Fat or terpene resin.
4. a kind of conductive pressure sensitive glue composition according to claim 1, it is characterised in that the nickel powder is pure nickel powder, nickel
At least one of bag graphite powder or nickel bag glass dust.
5. a kind of conductive pressure sensitive glue composition according to claim 1, it is characterised in that the draw ratio of the conductive glass
For less than 30:1.
6. a kind of conductive pressure sensitive glue composition according to claim 1, it is characterised in that the composition is by following quality
The component composition of part：100 parts of acrylate polymer, 5 parts of pure nickel powder, conductive 0.7 part of glass, 10 parts of tackifying resin, solidification
0.05 part of agent, 20 parts of solvent.
7. conductive pressure sensitive glue composition the answering in production thickening bondline conductive tape in claim 1 to 6 described in any one
With.
8. application according to claim 7, it is characterised in that using solvent by acrylate polymer, conductive particle and
Tackifying resin dissolving mixing, is stirred 15-30 minutes, is then added curing agent and is stirred 15 minutes, the coating film forming on mould release membrance, so
Toasted afterwards under the conditions of 100-110 degree 5-10 minutes, then transfer lamination is on base material, using needs dry glue can be controlled thick
Degree is at 25-50 microns.
9. application according to claim 7, it is characterised in that the base material includes copper foil, aluminium foil, conductive fabric or conduction
Non-woven fabrics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710383317.1A CN107189721B (en) | 2017-05-26 | 2017-05-26 | A kind of conductive pressure sensitive glue composition and its application in production thickening bondline conductive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710383317.1A CN107189721B (en) | 2017-05-26 | 2017-05-26 | A kind of conductive pressure sensitive glue composition and its application in production thickening bondline conductive tape |
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| Publication Number | Publication Date |
|---|---|
| CN107189721A true CN107189721A (en) | 2017-09-22 |
| CN107189721B CN107189721B (en) | 2019-02-26 |
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| CN201710383317.1A Active CN107189721B (en) | 2017-05-26 | 2017-05-26 | A kind of conductive pressure sensitive glue composition and its application in production thickening bondline conductive tape |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108753213A (en) * | 2018-04-13 | 2018-11-06 | 浙江孚泉材料科技有限公司 | A kind of conductive adhesive and its preparation method and application method |
| CN108913065A (en) * | 2018-05-03 | 2018-11-30 | 南通康尔乐复合材料有限公司 | A kind of conductive fabric glue and preparation method thereof |
| CN110194935A (en) * | 2019-07-04 | 2019-09-03 | 东莞市古川胶带有限公司 | A kind of conductive non-woven fabrics adhesive tape and preparation method thereof |
| CN111117505A (en) * | 2019-12-09 | 2020-05-08 | 深圳昌茂粘胶新材料有限公司 | Conductive copper foil adhesive tape and preparation method thereof |
| CN111534243A (en) * | 2020-05-08 | 2020-08-14 | 安徽格林开思茂光电科技股份有限公司 | Carbon-coated aluminum foil conductive adhesive tape for lithium battery and preparation method thereof |
| CN111621244A (en) * | 2020-05-26 | 2020-09-04 | 苏州德佑胶带技术有限公司 | Conductive adhesive tape, electromagnetic shielding adhesive tape and preparation method of electromagnetic shielding adhesive tape |
| CN112445035A (en) * | 2020-11-30 | 2021-03-05 | 深圳同兴达科技股份有限公司 | Conductive paste and liquid crystal display module |
| CN112680168A (en) * | 2020-12-28 | 2021-04-20 | 苏州德佑新材料科技股份有限公司 | Premixing method of conductive glue, conductive adhesive tape and preparation method thereof |
| CN112760065A (en) * | 2020-12-17 | 2021-05-07 | 深圳昌茂粘胶新材料有限公司 | Preparation method of non-glue heat-shrinkable heat-bonding general high-transparency protective film |
| WO2024040583A1 (en) * | 2022-08-26 | 2024-02-29 | 3M Innovative Properties Company | Electrically conductive pressure sensitive adhesives |
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| CN105542673A (en) * | 2015-12-22 | 2016-05-04 | 宁波大榭开发区综研化学有限公司 | Shading conductive adhesive and adhesive tape with strong shielding performance, and preparation methods thereof |
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| US20160333231A1 (en) * | 2015-05-15 | 2016-11-17 | Hyundai Motor Company | Conductive adhesive and bonding method of composite material using the conductive adhesive |
| CN105542673A (en) * | 2015-12-22 | 2016-05-04 | 宁波大榭开发区综研化学有限公司 | Shading conductive adhesive and adhesive tape with strong shielding performance, and preparation methods thereof |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108753213A (en) * | 2018-04-13 | 2018-11-06 | 浙江孚泉材料科技有限公司 | A kind of conductive adhesive and its preparation method and application method |
| CN108913065A (en) * | 2018-05-03 | 2018-11-30 | 南通康尔乐复合材料有限公司 | A kind of conductive fabric glue and preparation method thereof |
| CN110194935A (en) * | 2019-07-04 | 2019-09-03 | 东莞市古川胶带有限公司 | A kind of conductive non-woven fabrics adhesive tape and preparation method thereof |
| CN111117505A (en) * | 2019-12-09 | 2020-05-08 | 深圳昌茂粘胶新材料有限公司 | Conductive copper foil adhesive tape and preparation method thereof |
| CN111534243A (en) * | 2020-05-08 | 2020-08-14 | 安徽格林开思茂光电科技股份有限公司 | Carbon-coated aluminum foil conductive adhesive tape for lithium battery and preparation method thereof |
| CN111621244A (en) * | 2020-05-26 | 2020-09-04 | 苏州德佑胶带技术有限公司 | Conductive adhesive tape, electromagnetic shielding adhesive tape and preparation method of electromagnetic shielding adhesive tape |
| CN112445035A (en) * | 2020-11-30 | 2021-03-05 | 深圳同兴达科技股份有限公司 | Conductive paste and liquid crystal display module |
| CN112760065A (en) * | 2020-12-17 | 2021-05-07 | 深圳昌茂粘胶新材料有限公司 | Preparation method of non-glue heat-shrinkable heat-bonding general high-transparency protective film |
| CN112680168A (en) * | 2020-12-28 | 2021-04-20 | 苏州德佑新材料科技股份有限公司 | Premixing method of conductive glue, conductive adhesive tape and preparation method thereof |
| WO2024040583A1 (en) * | 2022-08-26 | 2024-02-29 | 3M Innovative Properties Company | Electrically conductive pressure sensitive adhesives |
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| Publication number | Publication date |
|---|---|
| CN107189721B (en) | 2019-02-26 |
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Address after: 224055 Residential Committee of Louwang Town, Yandu District, Yancheng City, Jiangsu Province (O) Patentee after: Jiangsu Srida Material Technology Co., Ltd. Address before: 224031 Louwang Industrial Zone, Yancheng City, Jiangsu Province Patentee before: JIANGSU SIRUIDA NEW MATERIAL TECHNOLOGY CO., LTD. |
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