CN104231965B - Homeotropic orientation conductive adhesive film and preparation method thereof - Google Patents
Homeotropic orientation conductive adhesive film and preparation method thereof Download PDFInfo
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- CN104231965B CN104231965B CN201410482642.XA CN201410482642A CN104231965B CN 104231965 B CN104231965 B CN 104231965B CN 201410482642 A CN201410482642 A CN 201410482642A CN 104231965 B CN104231965 B CN 104231965B
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Abstract
The present invention relates to a kind of homeotropic orientation conductive adhesive film and preparation method thereof, described homeotropic orientation conductive adhesive film is made up of the raw material of following parts by weight: 83 parts of conducting particless, 8-20 part solid epoxy solution, 15 parts of organic solvents, 3-7 part liquid epoxies, 1-4 part solidifying agent, 0-4 part modified epoxy and 0.5 part of silane coupling agent.The scheme that homeotropic orientation conductive adhesive film of the present invention adopts solid and liquid resin mutually to arrange in pairs or groups makes liquid glue energy film forming smoothly after solvent evaporates, and homeotropic orientation conductive adhesive film of the present invention adopts epoxy systems resin as starting material, the high and excellent heat resistance of its stable mechanical performance, bonding strength.
Description
Technical field
The present invention relates to the conductive resin of used in electronic industry, particularly relate to homeotropic orientation conductive adhesive film and preparation method thereof.
Background technology
Along with the development of electronic industry, Electronic Assemblies is more and more microminiaturized, densification, and a lot of conductive attachment no longer relies on the traditional ways such as welding or grafting, but is realized by conductive adhesive film.
Same sex conductive adhesive film is the compound formed in tackiness agent insulating resin by disperse conductive particles, uses it for the bonding of components and parts, solidifies under the condition of heating and pressurizing, thus realizes energising and binding function.Same sex conductive adhesive film is mainly made up of resin, solidifying agent, silver powder, and wherein resin is generally solid resin and liquid resin.Solid resin is mainly used in Procuring film forming, its main body cementability of liquid resin, is reacting cohesive action with solidifying agent by under hot pressing function.Solid resin can be thermoplastic also can be heat cured.But existing homeotropic orientation conductive adhesive film, after hot-press solidifying, ubiquity bonding strength is low, the technical problems such as poor heat resistance.
Summary of the invention
The object of the invention is to solve above-mentioned prior art Problems existing and deficiency, the homeotropic orientation conductive adhesive film of a kind of bonding strength height and excellent heat resistance is provided.
For realizing above-mentioned purpose of the present invention, the invention provides a kind of homeotropic orientation conductive adhesive film, it is made up of the raw material of following parts by weight: 83 parts of conducting particless, 8-20 part solid epoxy solution, 15 parts of organic solvents, 3-7 part liquid epoxies, 1-4 part solidifying agent, 0-4 part modified epoxy, 0.5 part of silane coupling agent.
In a preferred version, described conducting particles is 6-9um flake silver powder.
In a preferred version, the solid content of described solid epoxy solution is 50%.
In a preferred version, described organic solvent is butylacetate.
In a preferred version, described liquid epoxies is liquid bisphenol A epoxy resin, and the epoxy equivalent (weight) of described liquid epoxies is 190-250g/eq.
In a preferred version, described solidifying agent is one or more in amine curing agent, hydrazides class solidifying agent, organic urine class solidifying agent, imidazole curing agent.
In a preferred version, described modified epoxy is polyurethane modified epoxy resin or rubber modified epoxy resin, and the epoxy equivalent (weight) of described modified epoxy is 1000-1500g/eq.
In a preferred version, described silane coupling agent is γ-(2,3-epoxy third oxygen) propyl trimethoxy silicane.
The present invention also proposes a kind of preparation method of homeotropic orientation conductive adhesive film, comprise the following steps: take out following raw material: 83 parts of conducting particless, 8-20 part solid epoxy solution, 15 parts of organic solvents, 3-7 part liquid epoxies, 1-4 part solidifying agent, 0-4 part modified epoxy and 0.5 part of silane coupling agent, above-mentioned raw materials is stirred and makes glue, by made described glue-coating on PET release film, after baking, become described homeotropic orientation conductive adhesive film; Wherein, storing temperature is 60-80 DEG C, and baking time is 10-30 minute.
In a preferred version, the epoxy equivalent (weight) of described modified epoxy is 1000-1500g/eq, and the epoxy equivalent (weight) of described liquid epoxies is 190-250g/eq, and the solid content of described solid epoxy solution is 50%.
Compared with prior art, homeotropic orientation conductive adhesive film of the present invention and preparation method thereof has following advantage:
1. homeotropic orientation conductive adhesive film of the present invention adopts the scheme that solid and liquid resin are arranged in pairs or groups mutually, makes liquid glue energy film forming smoothly after solvent evaporates.
2. homeotropic orientation conductive adhesive film of the present invention adopts epoxy systems resin as starting material, its mechanical energy is stable, bonding strength is high and excellent heat resistance, specifically, bonding strength is maximum reaches 30MPa, and after crossing 270 DEG C of wave solderings 10 times, its cementability is substantially unchanged.
3. homeotropic orientation conductive adhesive film of the present invention is when the hot-press solidifying of preparation process, and gummosis controllability is good, and at room temperature tack is little, directly can contact glued membrane, and non-volatile thing during solidification, non-environmental-pollution.
4. the good toughness of homeotropic orientation conductive adhesive film of the present invention, facilitates machine-shaping, substantially increases the production efficiency of product.
5. homeotropic orientation conductive adhesive film of the present invention adds raw material according to a definite sequence in preparation process, thus is conducive to resin, conducting particles Homogeneous phase mixing, guarantees the stability in storage of solidifying agent in glue simultaneously.
Embodiment
Below in conjunction with embodiment, elaboration is further given to homeotropic orientation conductive adhesive film of the present invention and preparation method thereof.
The embodiment of the present invention 1 ~ 11 provides a kind of homeotropic orientation conductive adhesive film to be made up of the raw material of following parts by weight: 83 parts of flake silver powders (diameter 6-9um), the solid epoxy of 8-20 part 50% solid content, 15 parts of butylacetates, 0.5 part of γ-(2,3-epoxy third oxygen) propyl trimethoxy silicane, 3-7 part liquid epoxies, 1-4 part solidifying agent and 0-4 part modified epoxy.
The preparation method of above-mentioned homeotropic orientation conductive adhesive film possesses following steps:
(1) glue is prepared
By the solid epoxy of 3-7 part liquid epoxies, 8-20 part 50% solid content, 0-4 part modified epoxy and 0.5 part of γ-(2,3-epoxy third oxygen) propyl trimethoxy silicane mixes, then 15 parts of butylacetates are added, add 83 parts of flake silver powders (diameter 6-9um) again, the even said mixture of high speed dispersion, finally add 1-4 part solidifying agent, stir, make glue.
(2) coating film forming
Be coated on PET release film by the glue in above-described embodiment by coating machine, PET release film is cut into sheet after getting on by coating, puts into 60-80 DEG C of baking box baking 10-30 minute, has namely toasted the homeotropic orientation conductive adhesive film of the present embodiment.
With embodiment 1 ~ 11, homeotropic orientation conductive adhesive film of the present invention and preparation method thereof is illustrated below:
Embodiment 1
The homeotropic orientation conductive adhesive film of embodiment 1 is made up of the raw material of following parts by weight: the solid epoxy of 83 parts of flake silver powders (diameter 6-9um), 20 part of 50% solid content, 15 parts of butylacetates, 0.5 part of γ-(2,3-epoxy third oxygen) propyl trimethoxy silicane, 3 parts of liquid epoxiess, 4 parts of rubber modified epoxy resins, 1 part of amine curing agent, 0.4 part of imidazole curing agent.
The preparation method of above-mentioned homeotropic orientation conductive adhesive film possesses following steps:
(1) glue is prepared
First 4 parts of rubber-like modified epoxies are joined 3 parts of liquid epoxiess, add 0.5 part of γ-(2 again, 3-epoxy third oxygen) propyl trimethoxy silicane, heated and stirred mixes, cooling after dissolving, then the solid epoxy of 20 part of 50% solid content is added, add 15 parts of butylacetates again, be uniformly mixed, add 83 parts of flake silver powders (diameter 6-9um) again, be uniformly mixed, finally add 1 part of amine curing agent and 0.4 part of imidazole curing agent, stir and make glue.
(2) coating film forming
Be coated on PET release film by the glue made by above-mentioned steps () by coating machine, PET release film is cut into sheet, puts into 70 DEG C of baking boxes and toast 20 minutes, namely toasted the homeotropic orientation conductive adhesive film of the present embodiment 1 after getting on by coating.
Embodiment 2
The homeotropic orientation conductive adhesive film of embodiment 2 is made up of the raw material of following parts by weight: the solid epoxy of 83 parts of flake silver powders (diameter 6-9um), 16 part of 50% solid content, 15 parts of butylacetates, 0.5 part of γ-(2,3-epoxy third oxygen) propyl trimethoxy silicane, 5 parts of liquid epoxiess, 4 parts of rubber modified epoxy resins, 1 part of amine curing agent, 0.4 part of imidazole curing agent.
The preparation method of above-mentioned homeotropic orientation conductive adhesive film possesses following steps:
(1) glue is prepared
First 4 parts of rubber-like modified epoxies are joined 5 parts of liquid epoxiess, add 0.5 part of γ-(2 again, 3-epoxy third oxygen) propyl trimethoxy silicane, heated and stirred mixes, cooling after dissolving, then the solid epoxy of 16 part of 50% solid content is added, add 15 parts of butylacetates again, be uniformly mixed, add 83 parts of flake silver powders (diameter 6-9um) again, be uniformly mixed, finally add 1 part of amine curing agent and 0.4 part of imidazole curing agent, stir and make glue.
(2) coating film forming
Be coated on PET release film by the glue made by above-mentioned steps () by coating machine, PET release film is cut into sheet, puts into 80 DEG C of baking boxes and toast 10 minutes, namely toasted the homeotropic orientation conductive adhesive film of the present embodiment 2 after getting on by coating.
Embodiment 3
The homeotropic orientation conductive adhesive film of embodiment 3 is made up of the raw material of following parts by weight: the solid epoxy of 83 parts of flake silver powders (diameter 6-9um), 12 part of 50% solid content, 15 parts of butylacetates, 0.5 part of γ-(2,3-epoxy third oxygen) propyl trimethoxy silicane, 7 parts of liquid epoxiess, 4 parts of rubber modified epoxy resins, 1 part of amine curing agent, 0.4 part of imidazole curing agent.
The preparation method of above-mentioned homeotropic orientation conductive adhesive film possesses following steps:
(1) glue is prepared
First 4 parts of rubber-like modified epoxies are joined 7 parts of liquid epoxiess, add 0.5 part of γ-(2 again, 3-epoxy third oxygen) propyl trimethoxy silicane, heated and stirred mixes, cooling after dissolving, then the solid epoxy of 12 part of 50% solid content is added, add 15 parts of butylacetates again, be uniformly mixed, add 83 parts of flake silver powders (diameter 6-9um) again, be uniformly mixed, finally add 1 part of amine curing agent and 0.4 part of imidazole curing agent, stir and make glue.
(2) coating film forming
Be coated on PET release film by the glue made by above-mentioned steps () by coating machine, PET release film is cut into sheet, puts into 60 DEG C of baking boxes and toast 30 minutes, namely toasted the homeotropic orientation conductive adhesive film of the present embodiment 3 after getting on by coating.
Embodiment 4
The homeotropic orientation conductive adhesive film of embodiment 4 is made up of the raw material of following parts by weight: the solid epoxy of 83 parts of flake silver powders (diameter 6-9um), 18.4 part of 50% solid content, 15 parts of butylacetates, 0.5 part of γ-(2,3-epoxy third oxygen) propyl trimethoxy silicane, 5.8 parts of liquid epoxiess, 1 part of amine curing agent.
The preparation method of above-mentioned homeotropic orientation conductive adhesive film possesses following steps:
(1) glue is prepared
First 5.8 parts of liquid epoxiess are added 0.5 part of γ-(2,3-epoxy third oxygen) propyl trimethoxy silicane, heated and stirred mixes, and after dissolving, cooling, then adds the solid epoxy of 18.4 part of 50% solid content, add 15 parts of butylacetates again, be uniformly mixed, then add 83 parts of flake silver powders (diameter 6-9um), be uniformly mixed, finally add 1 part of amine curing agent, stir and make glue.
(2) coating film forming
Be coated on PET release film by the glue made by above-mentioned steps () by coating machine, PET release film is cut into sheet, puts into 70 DEG C of baking boxes and toast 20 minutes, namely toasted the homeotropic orientation conductive adhesive film of the present embodiment 4 after getting on by coating.
Embodiment 5
The homeotropic orientation conductive adhesive film of embodiment 5 is made up of the raw material of following parts by weight: the solid epoxy of 83 parts of flake silver powders (diameter 6-9um), 16 part of 50% solid content, 15 parts of butylacetates, 0.5 part of γ-(2,3-epoxy third oxygen) propyl trimethoxy silicane, 5 parts of liquid epoxiess, 4 parts of rubber modified epoxy resins, 1 part of amine curing agent.
The preparation method of above-mentioned homeotropic orientation conductive adhesive film possesses following steps:
(1) glue is prepared
First 4 parts of rubber-like modified epoxies are joined 5 parts of liquid epoxiess, add 0.5 part of γ-(2,3-epoxy third oxygen) propyl trimethoxy silicane again, heated and stirred mixes, cooling after dissolving, then add the solid epoxy of 16 part of 50% solid content, then add 15 parts of butylacetates, be uniformly mixed, add 83 parts of flake silver powders (diameter 6-9um) again, be uniformly mixed, finally add 1 part of amine curing agent, stir and make glue.
(2) coating film forming
Be coated on PET release film by the glue made by above-mentioned steps () by coating machine, PET release film is cut into sheet, puts into 70 DEG C of baking boxes and toast 20 minutes, namely toasted the homeotropic orientation conductive adhesive film of the present embodiment 5 after getting on by coating.
Embodiment 6
The homeotropic orientation conductive adhesive film of embodiment 6 is made up of the raw material of following parts by weight: the solid epoxy of 83 parts of flake silver powders (diameter 6-9um), 16 part of 50% solid content, 15 parts of butylacetates, 0.5 part of γ-(2,3-epoxy third oxygen) propyl trimethoxy silicane, 5 parts of liquid epoxiess, 4 parts of polyurethanes modified epoxies, 1 part of amine curing agent.
The preparation method of above-mentioned homeotropic orientation conductive adhesive film possesses following steps:
(1) glue is prepared
First 4 parts of polyurethanes modified epoxies are joined 5 parts of liquid epoxiess, add 0.5 part of γ-(2,3-epoxy third oxygen) propyl trimethoxy silicane again, heated and stirred mixes, cooling after dissolving, then add the solid epoxy of 16 part of 50% solid content, then add 15 parts of butylacetates, be uniformly mixed, add 83 parts of flake silver powders (diameter 6-9um) again, be uniformly mixed, finally add 1 part of amine curing agent, stir and make glue.
(2) coating film forming
Be coated on PET release film by the glue made by above-mentioned steps () by coating machine, PET release film is cut into sheet, puts into 70 DEG C of baking boxes and toast 20 minutes, namely toasted the homeotropic orientation conductive adhesive film of the present embodiment 6 after getting on by coating.
Embodiment 7
The homeotropic orientation conductive adhesive film of embodiment 7 is made up of the raw material of following parts by weight: the solid epoxy of 83 parts of flake silver powders (diameter 6-9um), 16 part of 50% solid content, 15 parts of butylacetates, 0.5 part of γ-(2,3-epoxy third oxygen) propyl trimethoxy silicane, 5 parts of liquid epoxiess, 4 parts of polyurethanes modified epoxies, 1 part of amine curing agent and 0.4 part of organic urine class solidifying agent.
The preparation method of above-mentioned homeotropic orientation conductive adhesive film possesses following steps:
(1) glue is prepared
First 4 parts of polyurethanes modified epoxies are joined 5 parts of liquid epoxiess, add 0.5 part of γ-(2 again, 3-epoxy third oxygen) propyl trimethoxy silicane, heated and stirred mixes, cooling after dissolving, then the solid epoxy of 16 part of 50% solid content is added, add 15 parts of butylacetates again, be uniformly mixed, add 83 parts of flake silver powders (diameter 6-9um) again, be uniformly mixed, finally add 1 part of amine curing agent and 0.4 part of organic urine class solidifying agent, stir and make glue.
(2) coating film forming
Be coated on PET release film by the glue made by above-mentioned steps () by coating machine, PET release film is cut into sheet, puts into 70 DEG C of baking boxes and toast 20 minutes, namely toasted the homeotropic orientation conductive adhesive film of the present embodiment 7 after getting on by coating.
Embodiment 8
The homeotropic orientation conductive adhesive film of embodiment 8 is made up of the raw material of following parts by weight: the solid epoxy of 83 parts of flake silver powders (diameter 6-9um), 16 part of 50% solid content, 15 parts of butylacetates, 0.5 part of γ-(2,3-epoxy third oxygen) propyl trimethoxy silicane, 5 parts of liquid epoxiess, 4 parts of rubber modified epoxy resins, 1 part of amine curing agent and 0.4 part of organic urine class solidifying agent.
The preparation method of above-mentioned homeotropic orientation conductive adhesive film possesses following steps:
(1) glue is prepared
First 4 parts of rubber-like modified epoxies are joined 5 parts of liquid epoxiess, add 0.5 part of γ-(2 again, 3-epoxy third oxygen) propyl trimethoxy silicane, heated and stirred mixes, cooling after dissolving, then the solid epoxy of 16 part of 50% solid content is added, add 15 parts of butylacetates again, be uniformly mixed, add 83 parts of flake silver powders (diameter 6-9um) again, be uniformly mixed, finally add 1 part of amine curing agent and 0.4 part of organic urine class solidifying agent, stir and make glue.
(2) coating film forming
Be coated on PET release film by the glue made by above-mentioned steps () by coating machine, PET release film is cut into sheet, puts into 70 DEG C of baking boxes and toast 20 minutes, namely toasted the homeotropic orientation conductive adhesive film of the present embodiment 8 after getting on by coating.
Embodiment 9
The homeotropic orientation conductive adhesive film of embodiment 9 is made up of the raw material of following parts by weight: the solid epoxy of 83 parts of flake silver powders (diameter 6-9um), 16 part of 50% solid content, 15 parts of butylacetates, 0.5 part of γ-(2,3-epoxy third oxygen) propyl trimethoxy silicane, 5 parts of liquid epoxiess, 4 parts of rubber modified epoxy resins, 3 parts of hydrazides class solidifying agent.
The preparation method of above-mentioned homeotropic orientation conductive adhesive film possesses following steps:
(1) glue is prepared
First 4 parts of rubber-like modified epoxies are joined 5 parts of liquid epoxiess, add 0.5 part of γ-(2,3-epoxy third oxygen) propyl trimethoxy silicane again, heated and stirred mixes, cooling after dissolving, then add the solid epoxy of 16 part of 50% solid content, then add 15 parts of butylacetates, be uniformly mixed, add 83 parts of flake silver powders (diameter 6-9um) again, be uniformly mixed, finally add 3 parts of hydrazides class solidifying agent, stir and make glue.
(2) coating film forming
Be coated on PET release film by the glue made by above-mentioned steps () by coating machine, PET release film is cut into sheet, puts into 70 DEG C of baking boxes and toast 20 minutes, namely toasted the homeotropic orientation conductive adhesive film of the present embodiment 9 after getting on by coating.
Embodiment 10
The homeotropic orientation conductive adhesive film of embodiment 10 is made up of the raw material of following parts by weight: the solid epoxy of 83 parts of flake silver powders (diameter 6-9um), 16 part of 50% solid content, 15 parts of butylacetates, 0.5 part of γ-(2,3-epoxy third oxygen) propyl trimethoxy silicane, 5 parts of liquid epoxiess, 4 parts of rubber modified epoxy resins, 3 parts of hydrazides class solidifying agent and 0.4 part of imidazole curing agent.
The preparation method of above-mentioned homeotropic orientation conductive adhesive film possesses following steps:
(1) glue is prepared
First 4 parts of rubber-like modified epoxies are joined 5 parts of liquid epoxiess, add 0.5 part of γ-(2 again, 3-epoxy third oxygen) propyl trimethoxy silicane, heated and stirred mixes, cooling after dissolving, then the solid epoxy of 16 part of 50% solid content is added, add 15 parts of butylacetates again, be uniformly mixed, add 83 parts of flake silver powders (diameter 6-9um) again, be uniformly mixed, finally add 3 parts of hydrazides class solidifying agent and 0.4 part of imidazole curing agent, stir and make glue.
(2) coating film forming
Glue during above-mentioned steps () is made is coated on PET release film by coating machine, after coating is got on, PET release film is cut into sheet, puts into 70 DEG C of baking boxes and toast 20 minutes, namely toasted the homeotropic orientation conductive adhesive film of the present embodiment 10.
Embodiment 11
The homeotropic orientation conductive adhesive film of embodiment 11 is made up of the raw material of following parts by weight: the solid epoxy of 83 parts of flake silver powders (diameter 6-9um), 16 part of 50% solid content, 15 parts of butylacetates, 0.5 part of γ-(2,3-epoxy third oxygen) propyl trimethoxy silicane, 5 parts of liquid epoxiess, 4 parts of rubber modified epoxy resins, 3 parts of hydrazides class solidifying agent and 0.4 part of organic urine class solidifying agent.
The preparation method of above-mentioned homeotropic orientation conductive adhesive film possesses following steps:
(1) glue is prepared
First 4 parts of rubber-like modified epoxies are joined 5 parts of liquid epoxiess, add 0.5 part of γ-(2 again, 3-epoxy third oxygen) propyl trimethoxy silicane, heated and stirred mixes, cooling after dissolving, then the solid epoxy of 16 part of 50% solid content is added, add 15 parts of butylacetates again, be uniformly mixed, add 83 parts of flake silver powders (diameter 6-9um) again, be uniformly mixed, finally add 3 parts of hydrazides class solidifying agent and 0.4 part of organic urine class solidifying agent, stir and make glue.
(2) coating film forming
Glue during above-mentioned steps () is made is coated on PET release film by coating machine, after coating is got on, PET release film is cut into sheet, puts into 70 DEG C of baking boxes and toast 20 minutes, namely toasted the homeotropic orientation conductive adhesive film of the present embodiment 11.
Performance test
Homeotropic orientation conductive adhesive film obtained in above-described embodiment is carried out volume specific resistance test, shearing resistance test, thermotolerance test and tack test.Wherein, the condition of shearing resistance test is: solidification value 160 degree, 30 minutes set times, solidifying pressure 3Kg/cm2; The condition of thermotolerance test is: test shearing resistance steel disc, crosses 270 degree of wave solderings, amounts to 10 times; Whether the condition of tack test is: glued membrane, after release film stripping, with the glued membrane being adjacent to this face of release film, contacts with each other, detect can be bonded together by have gentle hands pressure, and the fragility of glued membrane.
Following table is the test data of the homeotropic orientation conductive adhesive film of above-described embodiment.
Table one
Can find out from upper table:
1. when amine curing agent is used alone, the solidification value of homeotropic orientation conductive adhesive film is higher, simultaneously its cementability and thermotolerance all more excellent, along with adding of curing catalyst, its solidification value has and declines by a relatively large margin, and the cementability of product and thermotolerance have and significantly decline simultaneously.
2., when using hydrazides class solidifying agent, the solidification value of homeotropic orientation conductive adhesive film is lower than solidification value when using amine curing agent, but when its cementability and thermotolerance are all not so good as to use amine curing agent.
3. the adding of rubber modified epoxy resin and polyurethane modified epoxy resin, be conducive to the cementability improving homeotropic orientation conductive adhesive film.
4. the ratio of solid epoxy increases, and is conducive to homeotropic orientation conductive adhesive film film forming, but solid epoxy too high levels, the soft fragility of homeotropic orientation conductive adhesive film can be made.
5. the homeotropic orientation conductive adhesive film use temperature of above-described embodiment is within the scope of 150-180 degree, set time 20-40 minute, shearing resistance can reach 30MPa, and stability in storage is good.
Foregoing; be only preferred embodiment of the present invention; not for limiting embodiment of the present invention; those of ordinary skill in the art are according to central scope of the present invention and spirit; can carry out corresponding flexible or amendment very easily, therefore protection scope of the present invention should be as the criterion with the protection domain required by claims.
Claims (6)
1. a homeotropic orientation conductive adhesive film, it is characterized in that, be made up of the raw material of following parts by weight: 83 parts of conducting particless, 8-20 part solid epoxy solution, 15 parts of organic solvents, 3-7 part liquid epoxies, 1-4 part solidifying agent, 0-4 part modified epoxy and 0.5 part of silane coupling agent; The solid content of described solid epoxy solution is 50%; Described liquid epoxies is liquid bisphenol A epoxy resin, and the epoxy equivalent (weight) of described liquid epoxies is 190-250g/eq; Described modified epoxy is polyurethane modified epoxy resin or rubber modified epoxy resin, and the epoxy equivalent (weight) of described modified epoxy is 1000-1500g/eq.
2. homeotropic orientation conductive adhesive film according to claim 1, is characterized in that, described conducting particles is 6-9 μm of flake silver powder.
3. homeotropic orientation conductive adhesive film according to claim 1, is characterized in that, described solidifying agent is one or more in amine curing agent, hydrazides class solidifying agent, organic ureas solidifying agent, imidazole curing agent.
4. homeotropic orientation conductive adhesive film according to claim 1, is characterized in that, described organic solvent is butylacetate.
5. homeotropic orientation conductive adhesive film according to claim 1, is characterized in that, described silane coupling agent is γ-(2,3-epoxy third oxygen) propyl trimethoxy silicane.
6. a preparation method for homeotropic orientation conductive adhesive film, is characterized in that, comprises the following steps:
Prepared by glue: first part by weight modified for 0-4 epoxy resin is joined 3-7 part by weight of liquid epoxy resin, add 0.5 weight part silane coupling agent again, heated and stirred mixes, after dissolving, cooling, then adds the solid epoxy solution of 8-20 weight part 50% solid content, then adds 15 weight parts organic solvent, be uniformly mixed, add the conducting particles of 83 weight parts again, be uniformly mixed, finally add 1-4 weight part solidifying agent and stir and make glue;
Coating film forming: by above-mentioned made glue-coating on PET release film, become described homeotropic orientation conductive adhesive film after baking; Wherein, storing temperature is 60-80 DEG C, and baking time is 10-30 minute;
Described liquid epoxies is liquid bisphenol A epoxy resin, and the epoxy equivalent (weight) of described liquid epoxies is 190-250g/eq; Described modified epoxy is polyurethane modified epoxy resin or rubber modified epoxy resin, and the epoxy equivalent (weight) of described modified epoxy is 1000-1500g/eq.
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| CN1560168A (en) * | 2004-03-11 | 2005-01-05 | 萍 刘 | Preparation precess of anisotropic conductive coating |
| CN101033379A (en) * | 2006-03-10 | 2007-09-12 | 国家淀粉及化学投资控股公司 | Anisotropic conductive adhesive |
| CN101638567A (en) * | 2009-08-20 | 2010-02-03 | 烟台德邦科技有限公司 | High-temperature curing high-strength solid epoxy adhesive toughened by butyronitrile and preparation method thereof |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1560168A (en) * | 2004-03-11 | 2005-01-05 | 萍 刘 | Preparation precess of anisotropic conductive coating |
| CN101033379A (en) * | 2006-03-10 | 2007-09-12 | 国家淀粉及化学投资控股公司 | Anisotropic conductive adhesive |
| CN101638567A (en) * | 2009-08-20 | 2010-02-03 | 烟台德邦科技有限公司 | High-temperature curing high-strength solid epoxy adhesive toughened by butyronitrile and preparation method thereof |
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