CN107973934A - Flame-proof heat-resistant copper-clad plate filler and preparation method thereof - Google Patents

Flame-proof heat-resistant copper-clad plate filler and preparation method thereof Download PDF

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Publication number
CN107973934A
CN107973934A CN201711164020.2A CN201711164020A CN107973934A CN 107973934 A CN107973934 A CN 107973934A CN 201711164020 A CN201711164020 A CN 201711164020A CN 107973934 A CN107973934 A CN 107973934A
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China
Prior art keywords
flame
clad plate
proof heat
resistant copper
filler
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彭代信
宋晓静
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SUZHOU YIKETAI ELECTRONIC MATERIAL CO Ltd
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SUZHOU YIKETAI ELECTRONIC MATERIAL CO Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/03—3 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/102—Oxide or hydroxide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2270/00—Resin or rubber layer containing a blend of at least two different polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation

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  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

The present invention relates to a kind of flame-proof heat-resistant copper-clad plate filler and preparation method thereof, comprise the following steps, filler is obtained as raw material using nanometer titanium dioxide silicon foam, dodecyl benzene sulfonic acid, five water bismuth nitrates and methyl trichlorosilane, Tween-80；Use it for preparing flame-proof heat-resistant copper-clad plate, there is excellent fire resistance, heat resistance, meet the development and application of flame-proof heat-resistant copper-clad plate.

Description

Flame-proof heat-resistant copper-clad plate filler and preparation method thereof
It is 201510551973.9 the invention belongs to number of patent application, patent application day is September in 2015 2 days, proprietary term The referred to as divisional application of the preparation method of flame-proof heat-resistant copper-clad plate, belongs to product section technical solution.
Technical field
The invention belongs to electronics technical field of composite materials, and in particular to a kind of flame-proof heat-resistant copper-clad plate filler and its system Preparation Method, obtained product can be used for aerospace, signal transmission, telecommunications field.
Background technology
With the continuous development of scientific technology, the application of polymer-based composite is more and more extensive.Meanwhile each application Field also accordingly proposes different materials the requirement of higher.The most advanced branches of science skill particularly as aerospace industry Art field, it is more harsh to the performance requirement of material, such as they require composite material will have high specific strength, high specific stiffness, The performances such as high temperature resistant, resistance to ablation.Composite material, is by two or more material of different nature, by physically or chemically Method, material of the composition with new capability on macroscopical (microcosmic).A variety of materials makes up for each other's deficiencies and learn from each other in performance, produces association Same effect, makes the comprehensive performance of composite material be better than former composition material and meet a variety of requirements.
Printed wiring board is to be formed by copper-clad plate after circuit makes, and copper-clad plate is by glass cloth and is attached to the glass Resin bed on cloth is obtained with conductor layer hot pressing, therefore the main performance of pcb board, as long as particularly signal transmission performance has CCL Determine, while the performance of CCL and resin matrix relation are very big.With electronic product to light, thin, small, high density, multifunction send out Exhibition, element packing density and integrated level are higher and higher, and transmission signal frequency is higher and higher, act the circuit interlayer for transmitting signal function Away from less and less, line width is more and more narrow, this proposes base electronic material the requirement of higher, predominantly high-fire resistance, excellent Dielectric properties, high-insulativity, suitable mechanical performance and processability, particularly dielectric properties.The opposite dielectric system of material Number is smaller, and the transmission speed of signal is faster；Dielectric loss factor is smaller, and loss power of the signal in transmitting procedure keeps certain When, it is allowed to the frequency of transmission is higher, i.e., in the case where signal frequency is identical, dielectric loss value is smaller, distortion in signals transmission Rate is lower.
With fire-retardant attention, it is desirable to which product has fire resistance, fire-retardant to have class requirement, is respectively UL94 V- 2nd, UL94 V-1 and UL94 V-0 ranks, wherein UL94 V-0 ranks are the whether fire-retardant international standard of existing judgement material. Equalization point is found between fire prevention and environmental protection, is the important node of following flame retardant products development.Fire retardant is in modern society Importance can not be ignored, but as a series of environmental protection policies in Europe are put into effect, its development and application is restricted to some extent.Such as While where support personnel and property are from fire threat, and fire retardant can be made to drop potential hazard existing for human body and environment To minimum, be domestic fire retardant manufacturing enterprise, research institution and downstream electronic electrically, building materials, the industry such as traffic and furniture it is common Focus of attention.The introducing of phosphorus-containing compound in the resin matrix of copper-clad plate is prepared, becomes the main skill of copper-clad plate halogen-free flameproof Art route.At present, reactive phosphorus flame retardant widely used on copper-clad plate field is mainly DOPO class compounds, with phosphorous ring Based on oxygen tree fat, phosphorus containing phenolic resin, phosphorus content is between 2-10%, however, being found in practical application, DOPO classes compound tool There are larger water absorption rate and higher dielectric constant, and the humidity resistance of its manufactured plate is low.Simple resin cannot Meet the application of copper-clad plate, even if the preferable cyanate ester resin of heat resistance, it is with excellent dielectric properties (dielectric coefficient： 2.8~3.2；Dielectric loss factor：0.002~0.003), high-fire resistance (glass transition temperature：280~295 DEG C), at the same time Cyanate ester resin also has a low-shrinkage, excellent mechanical property and adhesive property etc., and also because curing, deficiency, brittleness are big etc. to be lacked Fall into and fail to widely apply in copper-clad plate field.So using complex technique, the advantages of being not only to integrate organic-inorganic material, go back The organic component that compatibility is different is wanted, is hopeful to prepare the copper-clad plate for meeting commercial Application.
The content of the invention
The object of the present invention is to provide a kind of preparation method of flame-proof heat-resistant copper-clad plate, the flame-proof heat-resistant copper-clad plate of preparation has There are excellent dielectric properties, excellent heat resistance, anti-flammability, can be used as electronic signal transmission materials application.
To achieve the above object of the invention, the technical solution adopted by the present invention is：A kind of preparation side of flame-proof heat-resistant copper-clad plate Method, comprises the following steps：
(1) by nano silicon dioxide foam dispersion in deionized water, dodecyl benzene sulfonic acid, five water nitric acid are then added Bismuth and methyl trichlorosilane；Then when hydro-thermal reaction 2 is small at 150 DEG C；Then filtering reacting liquid, filter cake are added in ethanol, point Tween-80 is added after dissipating uniformly, when 60 DEG C of stirrings 2 are small, finally drying obtains filler；
(2) DOPO and bisphenol A cyanate monomer are mixed, 95 DEG C of stirrings add phenolic compounds after 25 minutes, continue stirring 30 Minute；Then m-nitrobenzene sulfonic acid pyridiniujm, 2,3- epoxy group cyclopenta ring amyl ethers are added, continues stirring 20 minutes；Add Dimethylphosphite, is stirred 30 minutes in 100 DEG C；Obtain resin prepolymer；
(3) filler is added in o-phthalic acid diglycidyl ester, when 125 DEG C of stirrings 1 are small, obtains active filler；Will Resin prepolymer is mixed with benzazolyl compounds, is stirred 30 minutes in 120 DEG C；Then active filler is added, 30 points are stirred in 130 DEG C Clock；Then isomery undecyl alcohol polyoxyethylene ether phosphate sylvite is added, compound system is obtained within 50 minutes in 140 DEG C of stirrings；
(4) glue is made in the dissolving of above-mentioned compound system solvent, then reinforcing material is immersed in above-mentioned glue；Leaching After the heated drying of reinforcing material after stain, prepreg is obtained；Prepreg is cut out into burr removing；Take the preimpregnation of 2~5 sanction burr removings Bed of material poststack is two-sided to be covered with metal foil, hot forming, you can obtains the flame-proof heat-resistant copper-clad plate；In the prepreg, enhancing The mass fraction of material is 20~22%；
The chemical structural formula of the phenolic compounds is：
The chemical structural formula of the benzazolyl compounds is：
Wherein R1For hydrogen or methyl, R2For methyl or methyl formate base, R3For amino or cyanogen Base.
In the present invention, in step (1), the nanometer titanium dioxide silicon foam, dodecyl benzene sulfonic acid, five water bismuth nitrates and first Base trichlorosilane, the mass ratio of Tween-80 are 1: 0.2: 0.2: 0.35: 0.05；The grain of the filler Footpath is 560~880nm.The dodecyl benzene sulfonic acid that first passes through of the invention is medium, is prepared for silicon bismuth complex, then It is handled using Tween-80, it is different from existing coupling agent surface treatment, what hydro-thermal reaction obtained Filter cake is directly used in that resin compounded system is improper per se with stronger reactive group, can influence the solidification process of resin, lead to On the one hand surface nature that Tween-80 adjusts filler is crossed, prevents it from producing partial polymerization mistake to resin Fast influence, it can in addition contain adjust crosslinked polymer network so that cured product crosslinking is reasonable, and it is excessive to be unlikely to brittleness.
In the present invention, in step (2), DOPO, bisphenol A cyanate monomer, phenolic compounds, m-nitrobenzene sulfonic acid pyridiniujm, 2,3- epoxy group cyclopenta ring amyl ethers, the mass ratio of dimethylphosphite are 0.05: 1: 0.2~0.3: 0.08~0.085: 0.58~0.63: 0.09~0.12.Fire resistance, most important or and resin system can be provided using organic phosphorus compound (cyanate, phenolic compounds and 2,3- epoxy group cyclopenta ring amyl ether) has preferable reactivity, can be by phosphorus-containing groups Polymer segment is substituted into, the flame retardant effect that otherwise more phosphorus has also been unable to reach again；System is anti-when preparing resin prepolymer at the same time Answering property is relatively low, ensures that organic matter does not form big strand before curing, is conducive to the infiltration of follow-up reinforcing material and glues Connect, and some micromolecular compounds start to react with macromolecular chain, reduce cyanate ester monomer, phenolic compounds, epoxy monomer Density, be conducive to uniformity during polymer polymerizing.Small molecule either prepolymer is changed into by chemistry by chemical reaction The macromolecular that key is bonded together will necessarily cause volume contraction, simultaneously because the fuel factor of solidification process can also cause resinite Volume contraction, can bring resin material bodies itself huge internal stress, crackle or interfacial adhesion can be triggered to destroy；Present invention choosing With the organic composite of shrinking percentage complementation, technique is prepared, effectively reduction material volume shrinking percentage, as low as 0.32%.
In the present invention, in step (3), filler, o-phthalic acid diglycidyl ester, resin prepolymer, benzazolyl compounds, The mass ratio of isomery undecyl alcohol polyoxyethylene ether phosphate sylvite is 0.32~0.45: 0.12~0.15: 1: 0.08~0.09: 0.01~0.015.Cyanate ester monomer is easily influenced when polymerizeing by other functional groups, this is that advantage also has bad place, if anti-with it The compound answered can retain the defects of its polymerization density can also improve its brittleness, reaction is too fast, then favorably, if instead and its Its extent of reaction of the material damage of reaction, then it is unfavorable；The present invention reduces filler reactivity first with epoxy monomer to filler processing While improve filler in organic matter, the particularly dispersiveness in high polymer, the active filler after processing adds resin prepolymer Polymer curing process is not interfered with during thing, improves the density of cross-linked network on the contrary, increases flexible points.Resin solidification includes solidifying Glue-curing-last handling process, heat release in the curing process, has close with the Physical and mechanical properties of curing degree and product Relation.High exothermic temperature is conducive to resin solidification, but excessive exothermic temperature is then harmful, resin volume can be caused to receive The increase of contracting and the appearance of micro-crack, thus cause the decline of material mechanical performance, particularly for there is the product of micro-crack meaning Taste the leakage of medium, causes corrosion resistance to decline；The addition of phenolic compounds, Tween-80 of the present invention Resin solidification highest exothermic peak can be effectively reduced, and gel time is not influenced at the same time.Pass through adding for small organic molecule Enter and the epoxidation of filler is handled, cyanate ester resin, phenolic compounds and epoxy resin cure technique tend in the present invention Unanimously, so as to obtain the excellent resin combination of heat resistance, mechanical performance, chemical resistance.Material structure of the present invention contains Even nanoscale hole, avoids adverse effect of the conventional fillers there are dangling bonds to dielectric properties, has good low dielectric Constant, can be used as high-frequency electronic material.Material can form finer and close protective layer in heated and burning, reach excellent heat Oxygen screen effect, so that assign adhesive joint between solid material excellent heat resistance and anti-flammability, while mechanical property, adhesive property are good It is good；Overcome the bonding that prior art filler fire retardant brings declines and reactive flame retardant is brought mechanical properties decrease, The problem of heat-resisting decline.
In the present invention, in step (4), solvent is butanone, the mixture of ethylene glycol monomethyl ether；The reinforcing material is electron level Glass fabric；The metal foil is prepared after etching by the rolled copper foil that thickness is 18~35 μm.Pressure during hot pressing Condition is 15~35kg/cm2, pressing-in temp is 180~230 DEG C, and pressing time is 170~200min；The piece of the prepreg Number is determined according to the thickness of copper-clad plate of actual requirement.The rolled copper foil that the present invention uses belongs to flaky crystal institutional framework, With excellent pliability；Its consistency is high, and surface has homogeneous flatness, and surface roughness is low, as signal transmitting layer, Electric current under high frequency condition can be overcome to pass through " skin effect " caused during conductive layer, the impedance of generation is reduced, be conducive to letter Number quick transmission.
In the present invention, organic-compound system is the primary bond component of resin matrix composite system, and rigid Nano filling can be It is dispersed in evenly in resin, improves the intensity and thermal level of its solidfied material；Particularly the invention avoids between compound interface There is hole, the formation of polymer interpenetration network will not be hindered, ensure the intensity of solidfied material.To organic-inorganic dielectric material Speech, organic matter are the short slabs of heat resistance, become very steady there are special big pi-conjugated electronics bond structure in material of the invention It is fixed, and there is extra high heat resistance.The inorganic material purity that includes of system of the present invention is high, ultra-fine, good fluidity, particle diameter point Cloth is narrow, and be particularly the invention adds dodecyl benzene sulfonic acid and polyoxyethylene when preparing compounded mix Alcohol acid anhydride monoleate, and it is pre-processed using epoxy monomer before resin prepolymer is added, reunite in resin matrix Phenomenon is few；Inorganic material external connection active reactive group can improve the compatibility between inorganic particulate and polymer, organic Group is connected to the very strong inorganic molecule of heat resistance so that polymer of the invention remains under the degradation temperature of general polymerization thing Keep original state constant thus sufficiently stable under the high temperature conditions；Initial pyrolyzation temperature is more than 400 DEG C, glass transition Temperature is more than 240 DEG C.
Since above-mentioned technical proposal is used, the present invention has following advantages compared with prior art：
Preparation method mesocomplex system composition provided by the invention is reasonable, then prepares technique, obtained copper-clad plate base Inorganic nanoparticles and hole have uniform dispersion degree in system in material, and preparation process belongs to chemical process, the nothing of formation Machine thing, which is combined power with the surface of interlaminar resin and is much stronger than the surface of traditional physical mechanical blending, combines power.The original that the present invention utilizes Material system composition is reasonable, and compatibility is good between each component, and flame-proof heat-resistant copper-clad plate has thus been prepared, and has good power The property learned, heat resistance, meet the development and application of flame-proof heat-resistant copper-clad plate；The advantages of comprehensive polymer, two component of inorganic particulate, change The shortcomings that kind two component, so as to improve to obtain the comprehensive performance of material；Solidification effect is good, and cross-linked structure is uniform, small molecule chemical combination On the one hand thing as the compatilizer of macromolecule organic, can increase the compatibility of system each component, on the other hand avoid hot pressing The defects of crosslinking is uneven is formed during curing, ensures that resin system forms stable structure, mechanical property is strong, particularly improves cyanic acid Still retain its heat-resisting, excellent dielectricity while the brittleness of ester resin, and after phosphorus-containing groups are introduced polymer segment, By reasonable reaction, the defects of existing reactive phosphor-containing flame-proof molecule is hygroscopic is successfully avoid, achieves unexpected effect Fruit.
Embodiment
With reference to embodiment, the invention will be further described：
Raw materials used the present embodiment is all purchased in market, belongs to industrial goods；
The molecular structural formula of DOPO is：
The chemical structural formula of the phenolic compounds is：
The chemical structural formula of the benzazolyl compounds is：
Wherein R1For hydrogen or methyl, R2For methyl or methyl formate base, R3For amino or cyanogen Base.
The preparation of one filler of synthesis example
By 1Kg nano silicon dioxide foam dispersions in deionized water, 200g dodecyl benzene sulfonic acid, 200g are then added Five water bismuth nitrates and 350g methyl trichlorosilanes；Then when hydro-thermal reaction 2 is small at 150 DEG C；Then filtering reacting liquid, filter cake add Enter in ethanol, 50g Tween-80s are added after being uniformly dispersed, when 60 DEG C of stirrings 2 are small, finally dry Obtain filler (particle diameter is 560~880nm).
A kind of preparation method of flame-proof heat-resistant copper-clad plate of embodiment one, comprises the following steps：
Mix 5gDOPO and 100g bisphenol A cyanate monomers, 95 DEG C of stirrings add 20g phenolic compounds after 25 minutes, continue Stirring 30 minutes；Then 8g m-nitrobenzene sulfonic acids pyridiniujm, 58g2 are added, 3- epoxy group cyclopenta ring amyl ethers, continue to stir 20 minutes；9g dimethylphosphites are added, are stirred 30 minutes in 100 DEG C；Obtain resin prepolymer；It is adjacent that 32g fillers are added into 12g In phthalic acid 2-glycidyl ester, when 125 DEG C of stirrings 1 are small, active filler is obtained；By 100g resin prepolymers and 9g indoles Compound (R1For hydrogen, R2For methyl, R3For amino) mixing, 120 DEG C are stirred 30 minutes；Then active filler, 130 DEG C of stirrings are added 30 minutes；Then 1.5g isomery undecyl alcohol polyoxyethylene ether phosphate sylvite is added, 140 DEG C of stirrings obtain complex in 50 minutes System；Above-mentioned compound system butanone/ethylene glycol monomethyl ether is mixed into solvent dissolving glue is made, then impregnate E-glass cloth In above-mentioned glue, 2min is toasted under the conditions of 170 DEG C in an oven, prepares prepreg, the mass fraction of glass cloth is 22%；Will Prepreg cuts out burr removing；Take 5 lamella poststacks are two-sided to be covered with 1oz rolled copper foils, hot forming, can obtain the flame-proof heat-resistant and cover copper Plate；For hot pressing condition by the way of progressively heating up and boosting, 10min temperature is raised to 180 DEG C from 50 DEG C, keeps 30min, then 10min is raised to 200 DEG C of holding 90min, and then 5min is raised to 230 DEG C of holdings 80min, last 180min and is cooled to 50 DEG C.1min Pressure is from 0Kg/cm2It is raised to 15Kg/cm2, then pressurize 25min, then 1min be raised to 20Kg/cm2Pressurize 50min, last 1min It is raised to 35Kg/cm2, pressurize 120min.
A kind of preparation method of flame-proof heat-resistant copper-clad plate of embodiment two, comprises the following steps：
Mix 5gDOPO and 100g bisphenol A cyanate monomers, 95 DEG C of stirrings add 30g phenolic compounds after 25 minutes, continue Stirring 30 minutes；Then 8.2g m-nitrobenzene sulfonic acids pyridiniujm, 63g2 are added, 3- epoxy group cyclopenta ring amyl ethers, continue to stir Mix 20 minutes；12g dimethylphosphites are added, are stirred 30 minutes in 100 DEG C；Obtain resin prepolymer；45g fillers are added In 14g o-phthalic acid diglycidyl esters, when 125 DEG C of stirrings 1 are small, active filler is obtained；By 100g resin prepolymers with 8.5g benzazolyl compounds (R1For hydrogen, R2For methyl, R3For cyano group) mixing, stirred 30 minutes in 120 DEG C；Then activity is added to fill out Material, is stirred 30 minutes in 130 DEG C；Then 1.5g isomery undecyl alcohol polyoxyethylene ether phosphate sylvite is added, 50 are stirred in 140 DEG C Minute obtains compound system；Above-mentioned compound system butanone/ethylene glycol monomethyl ether is mixed into solvent dissolving glue is made, then by electricity Sub- level glass cloth is immersed in above-mentioned glue, is toasted 2min under the conditions of 170 DEG C in an oven, is prepared prepreg, the matter of glass cloth It is 21% to measure fraction；Prepreg is cut out into burr removing；Take 3 lamella poststacks are two-sided to be covered with 1oz rolled copper foils, hot forming, you can To the flame-proof heat-resistant copper-clad plate；For hot pressing condition by the way of progressively heating up and boosting, 10min temperature is raised to 180 from 50 DEG C DEG C, 40min is kept, then 10min is raised to 200 DEG C of holding 50min, and then 5min is raised to 230 DEG C of holding 90min, finally 180min is cooled to 50 DEG C.1min pressure is from 0Kg/cm2It is raised to 15Kg/cm2, then pressurize 20min, then 1min be raised to 20Kg/ cm2Pressurize 60min, last 1min are raised to 35Kg/cm2, pressurize 120min.
A kind of preparation method of flame-proof heat-resistant copper-clad plate of embodiment three, comprises the following steps：
Mix 5gDOPO and 100g bisphenol A cyanate monomers, 95 DEG C of stirrings add 25g phenolic compounds after 25 minutes, continue Stirring 30 minutes；Then 8.1g m-nitrobenzene sulfonic acids pyridiniujm, 60g2 are added, 3- epoxy group cyclopenta ring amyl ethers, continue to stir Mix 20 minutes；10g dimethylphosphites are added, are stirred 30 minutes in 100 DEG C；Obtain resin prepolymer；40g fillers are added In 15g o-phthalic acid diglycidyl esters, when 125 DEG C of stirrings 1 are small, active filler is obtained；By 100g resin prepolymers with 8.2g benzazolyl compounds (R1For methyl, R2For methyl formate base, R3For cyano group) mixing, stirred 30 minutes in 120 DEG C；Then plus Enter active filler, stirred 30 minutes in 130 DEG C；Then 1.2g isomery undecyl alcohol polyoxyethylene ether phosphate sylvite is added, in 140 DEG C stirring obtains compound system in 50 minutes；Above-mentioned compound system butanone/ethylene glycol monomethyl ether is mixed into solvent dissolving glue is made, Then E-glass cloth is immersed in above-mentioned glue, toasts 2min under the conditions of 170 DEG C in an oven, prepare prepreg, glass The mass fraction of glass cloth is 20%；Prepreg is cut out into burr removing；Take 5 lamella poststacks are two-sided to be covered with 0.5oz rolled copper foils, be hot pressed into Shape, you can obtain the flame-proof heat-resistant copper-clad plate；Hot pressing condition is by the way of progressively heating up and boosting, and 10min temperature is from 50 180 DEG C DEG C are raised to, keeps 20min, then 10min is raised to 200 DEG C of holding 100min, and then 5min is raised to 230 DEG C of holdings 60min, last 180min are cooled to 50 DEG C.1min pressure is from 0Kg/cm2It is raised to 15Kg/cm2, then pressurize 20min, then 1min is raised to 20Kg/cm2Pressurize 60min, last 1min are raised to 35Kg/cm2, pressurize 120min.
A kind of preparation method of flame-proof heat-resistant copper-clad plate of example IV, comprises the following steps：
Mix 5gDOPO and 100g bisphenol A cyanate monomers, 95 DEG C of stirrings add 24g phenolic compounds after 25 minutes, then stir Mix 30 minutes；Then 8.5g m-nitrobenzene sulfonic acids pyridiniujm, 62g2 are added, 3- epoxy group cyclopenta ring amyl ethers, continue to stir 20 minutes；11g dimethylphosphites are added, are stirred 30 minutes in 100 DEG C；Obtain resin prepolymer；38g fillers are added into 12g In o-phthalic acid diglycidyl ester, when 125 DEG C of stirrings 1 are small, active filler is obtained；By 100g resin prepolymers and 8.8g Yin Indole compound (R1For methyl, R2For methyl formate base, R3For amino) mixing, stirred 30 minutes in 120 DEG C；Then activity is added Filler, is stirred 30 minutes in 130 DEG C；Then 1g isomery undecyl alcohol polyoxyethylene ether phosphate sylvite is added, 50 are stirred in 140 DEG C Minute obtains compound system；Above-mentioned compound system butanone/ethylene glycol monomethyl ether is mixed into solvent dissolving glue is made, then by electricity Sub- level glass cloth is immersed in above-mentioned glue, is toasted 2min under the conditions of 170 DEG C in an oven, is prepared prepreg, the matter of glass cloth It is 22% to measure fraction；Prepreg is cut out into burr removing；Take 2 lamella poststacks are two-sided to be covered with 0.5oz rolled copper foils, hot forming, you can Obtain the flame-proof heat-resistant copper-clad plate；For hot pressing condition by the way of progressively increasing temperature and pressure, 10min temperature is raised to 180 from 50 DEG C DEG C, 60min is kept, then 10min is raised to 200 DEG C of holding 60min, and then 5min is raised to 230 DEG C of holding 50min, finally 180min is cooled to 50 DEG C.1min pressure is from 0Kg/cm2It is raised to 15Kg/cm2, then pressurize 80min, then 1min be raised to 20Kg/ cm2Pressurize 60min, last 1min are raised to 35Kg/cm2, pressurize 60min.
A kind of preparation method of flame-proof heat-resistant copper-clad plate of embodiment five, comprises the following steps：
Mix 5gDOPO and 100g bisphenol A cyanate monomers, 95 DEG C of stirrings add 26g phenolic compounds after 25 minutes, continue Stirring 30 minutes；Then 8.1g m-nitrobenzene sulfonic acids pyridiniujm, 59g2 are added, 3- epoxy group cyclopenta ring amyl ethers, continue to stir Mix 20 minutes；9.5g dimethylphosphites are added, are stirred 30 minutes in 100 DEG C；Obtain resin prepolymer；34g fillers are added In 15g o-phthalic acid diglycidyl esters, when 125 DEG C of stirrings 1 are small, active filler is obtained；By 100g resin prepolymers with 8.2g benzazolyl compounds (R1For hydrogen, R2For methyl formate base, R3For cyano group) mixing, stirred 30 minutes in 120 DEG C；Then add Active filler, is stirred 30 minutes in 130 DEG C；Then 1.3g isomery undecyl alcohol polyoxyethylene ether phosphate sylvite is added, in 140 DEG C Stirring obtains compound system in 50 minutes；Above-mentioned compound system butanone/ethylene glycol monomethyl ether is mixed into solvent dissolving glue is made, so E-glass cloth is immersed in above-mentioned glue afterwards, 2min is toasted under the conditions of 170 DEG C in an oven, prepares prepreg, glass The mass fraction of cloth is 22%；Prepreg is cut out into burr removing；Take 4 lamella poststacks are two-sided to be covered with 1oz rolled copper foils, hot forming, It can obtain the flame-proof heat-resistant copper-clad plate；By the way of progressively heating up and boosting, 10min temperature rises hot pressing condition from 50 DEG C To 180 DEG C, 40min is kept, then 10min is raised to 200 DEG C of holding 80min, and then 5min is raised to 230 DEG C of holding 80min, finally 180min is cooled to 50 DEG C.1min pressure is from 0Kg/cm2It is raised to 15Kg/cm2, then pressurize 80min, then 1min be raised to 20Kg/ cm2Pressurize 60min, last 1min are raised to 35Kg/cm2, pressurize 80min.
Comparative example one
(1) preparation of resin matrix, 300g bisphenol A cyanate ester monomers are added in beaker, and 90 DEG C of oil bath reacts 8 points Clock, is warming up to 150 DEG C, adds 0.07g monoethanolamines, reacts 20 minutes, liquid is poured into pallet, natural cooling obtains white Solid；
(2) product, 12g phosphor nitrogen combustion inhibitors, 80g butanone solvents prepared by 100g steps (1) are added into beaker, unlatching is stirred Mix, 0.5h is up to glue；Then E-glass cloth is immersed in above-mentioned glue, toasted in an oven under the conditions of 170 DEG C 2min, prepares prepreg, the mass fraction of glass cloth is 20%；Prepreg is cut out into burr removing；Take 4 lamella poststacks are two-sided to be covered with 1oz rolled copper foils, hot forming, you can obtain the flame-proof heat-resistant copper-clad plate.Pressing condition uses what is progressively heated up and boost Mode, 20min temperature are raised to 150 DEG C from 50 DEG C, keep 120min, and then 10min is raised to 200 DEG C of holding 90min, then 5min It is raised to 240 DEG C of holdings 100min, last 180min and is cooled to 50 DEG C.1min pressure is from 0Kg/cm2It is raised to 5Kg/cm2, then pressurize 25min, then 1min be raised to 15Kg/cm2Pressurize 50min, last 1min are raised to 25Kg/cm2, pressurize 100min.
Comparative example two
100g bisphenol A epoxide resins, 10gDOPO, 80g butanone solvent are added into beaker, opens stirring, 0.5h is up to glue Liquid；Then E-glass cloth is immersed in above-mentioned glue, toasts 2min under the conditions of 170 DEG C in an oven, prepare prepreg, The mass fraction of glass cloth is 22%；Prepreg is cut out into burr removing；Take 4 lamella poststacks are two-sided to be covered with 1oz rolled copper foils, be hot pressed into Shape, you can obtain the flame-proof heat-resistant copper-clad plate.Pressing condition is by the way of progressively heating up and boosting, and 20min temperature is from 50 150 DEG C DEG C are raised to, keeps 120min, then 10min is raised to 200 DEG C of holding 60min, and then 5min is raised to 220 DEG C of holdings 110min, last 180min are cooled to 50 DEG C.1min pressure is from 0Kg/cm2It is raised to 5Kg/cm2, then pressurize 25min, then 1min is raised to 15Kg/cm2Pressurize 50min, last 1min are raised to 25Kg/cm2, pressurize 100min.
According to mechanical performance of the IPC standard methods to the plate in the embodiment and comparative example of above-mentioned preparation, dielectricity Energy and hot property, adhesive property are determined, as a result referring to table 1.
The performance of 1 flame-proof heat-resistant copper-clad plate of table
Flame retardant rating Wicking/second tanδ ε Td/℃ Peel strength/1b/in Tg/℃
Embodiment one V0 ＞ 300 0.007 3.68 412 8.6 244
Embodiment two V0 ＞ 300 0.008 3.60 414 8.6 246
Embodiment three V0 ＞ 300 0.006 3.54 419 8.8 245
Example IV V0 ＞ 300 0.006 3.65 411 8.7 251
Embodiment five V0 ＞ 300 0.007 3.61 412 8.6 247
Comparative example one V1 ＞ 300 0.011 3.82 401 8.1 240
Comparative example two V1 254 0.016 4.12 369 7.5 212
To sum up, flame-proof heat-resistant copper-clad plate composition disclosed by the invention is reasonable, and compatibility is good between each component, thus prepares Flame-proof heat-resistant copper-clad plate has been obtained, there is good anti-flammability, excellent heat resistance, especially with low hydroscopicity, has been implemented Example hydroscopicity is less than 0.05%；Meet the development and application of flame-proof heat-resistant copper-clad plate.

Claims (3)

1. a kind of preparation method of flame-proof heat-resistant copper-clad plate filler, it is characterised in that comprise the following steps：
By nano silicon dioxide foam dispersion in deionized water, dodecyl benzene sulfonic acid, five water bismuth nitrates and first are then added Base trichlorosilane；Then when hydro-thermal reaction 2 is small at 150 DEG C；Then filtering reacting liquid, filter cake are added in ethanol, are uniformly dispersed After add Tween-80, in 60 DEG C stirring 2 it is small when, finally drying obtain filler.
2. the preparation method of flame-proof heat-resistant copper-clad plate filler according to claim 1, it is characterised in that：The nano-silica SiClx foam, dodecyl benzene sulfonic acid, five water bismuth nitrates and methyl trichlorosilane, the matter of Tween-80 Amount is than being 1: 0.2: 0.2: 0.35: 0.05；The particle diameter of the filler is 560~880nm.
3. the flame-proof heat-resistant copper-clad plate that according to claim 1 prepared by the preparation method of flame-proof heat-resistant copper-clad plate filler is with filling out Material.
CN201711164020.2A 2015-09-02 2015-09-02 Flame-proof heat-resistant copper-clad plate filler and preparation method thereof Pending CN107973934A (en)

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