CN106163213A - High conductive cover and preparation method thereof - Google Patents
High conductive cover and preparation method thereof Download PDFInfo
- Publication number
- CN106163213A CN106163213A CN201510154174.8A CN201510154174A CN106163213A CN 106163213 A CN106163213 A CN 106163213A CN 201510154174 A CN201510154174 A CN 201510154174A CN 106163213 A CN106163213 A CN 106163213A
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- conductive cover
- heat conduction
- solid
- housing
- manufacture method
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Abstract
The manufacture method of a kind of high conductive cover, comprises a blend step and a connecting step.This blend step is multiple heat conducting fiber to be blended after a substrate, makes this matrix immobilized, forms a pre-solid of heat conduction, and wherein, the heat conductivity of described heat conducting fiber is between 380～2000W/m K.This connecting step is to be connected by predetermined to pre-for this heat conduction solid and the housing inner surface towards this electronic installation, and prepares a high conductive cover.The present invention also provides for a kind of high conductive cover, comprising: a housing, has a reversely with each other inner surface and an outer surface；And a pre-solid of heat conduction, it is connected with this inner surface, including a substrate and multiple heat conducting fiber being scattered in this substrate.Present invention utilization has high heat conduction and bent heat conducting fiber makes the pre-solid of heat conduction, increases the thermal diffusivity that this high conductive cover is overall.
Description
Technical field
The present invention relates to a kind of cap and preparation method thereof, particularly relate to a kind of high conductive cover and
Its manufacture method.
Background technology
Along with the development of manufacture of semiconductor technology is more and more ripe, the integration degree of semiconductor subassembly
The highest, therefore, " heat radiation " has become one of important technology of semiconductor subassembly.Special
It is not for high power component, owing to the heat energy produced during assembly start is significantly increased so that
The temperature of electronic product can rise rapidly.Especially hand-held electronic equipment, such as mobile phone, flat board
Computers etc., owing to often to abut against mobile phone or tablet PC at hand or knee in operation
On, therefore heat dissipation problem is even more important.
It is usually used in the radiating mode of the hand-held electronic equipment such as mobile phone or tablet PC at present, is
Inner surface at the housing of those hand-held electronic equipments pastes one layer of graphite flake, utilizes graphite flake
High thermal conduction characteristic, by during the device start such as mobile phone or tablet PC produce thermal conductance cause shell
Body, then via housing, heat energy is reached the external world, to reach the purpose of heat radiation.But, because one
As the housing of the seen hand-held electronic equipment such as mobile phone or tablet PC on the market have more
Certain radian, but graphite flake is a flake, itself is brittle cannot bend, and therefore fits
Time, it is impossible to the radian along housing is fitted, and can only fit with regard to the planar section of housing, therefore,
Graphite flake also cannot the complete required position covered of blanketing.
Summary of the invention
It is an object of the invention to provide the making side of a kind of high conductive cover for electronic installation
Method.
The manufacture method of high conductive cover of the present invention, for an electronic installation, comprises: a mixing
Step, and a connecting step.
This blend step is multiple heat conducting fiber to be blended after a substrate, makes this matrix immobilized,
Forming a pre-solid of heat conduction, wherein, the heat conductivity of described heat conducting fiber is between 380～2000
W/m·K.This connecting step is towards this electronic installation by predetermined to pre-for this heat conduction solid and a housing
One inner surface connect, and prepare a high conductive cover.
It is preferred that the manufacture method of aforementioned high conductive cover, the most also comprise one and remove step,
By removing at least partially of the substrate of pre-for this heat conduction solid, make at least the one of described heat conducting fiber
Partial denudation and directly and extraneous contact.
It is preferred that the manufacture method of aforementioned high conductive cover, wherein said heat conducting fiber is to lead from this
After the periphery of the pre-solid of heat is exposed, and the pre-solid of this heat conduction is connected with this housing, described heat conduction is fine
Dimension can be exposed from this housing perimeter, and and extraneous contact.
It is preferred that the manufacture method of aforementioned high conductive cover, wherein this remove step be utilize laser,
Sandblasting or cutting mode remove the substrate of part, and make described heat conducting fiber exposed.
It is preferred that the manufacture method of aforementioned high conductive cover, wherein this connecting step is by this heat conduction
Pre-solid fits in this housing.
It is preferred that the manufacture method of aforementioned high conductive cover, wherein this connecting step is to prepare one
There is the first mould of first groove, and one corresponding with this first mould and have one
Second mould of individual the second groove that can form this hull shape, is placed in pre-for this heat conduction solid
After this first groove, a kind of molding fluid of injection between this second mould and this heat conduction pre-solid,
After to be hardened, remove this first, second mould, obtain this housing, and be integrated with this housing
The pre-solid of this heat conduction shaped, and obtain this high conductive cover.
It is preferred that the manufacture method of aforementioned high conductive cover, wherein this housing has one and this shell
The outer surface that the inner surface of body is reverse, and the interior table partially passing through this housing of the pre-solid of this heat conduction
Face, and exposed from this outer surface.
It is preferred that the manufacture method of aforementioned high conductive cover, wherein this housing has one and this shell
The outer surface that the inner surface of body is reverse, and the interior table partially passing through this housing of the pre-solid of this heat conduction
Face also extends to this outer surface.
It is preferred that the manufacture method of aforementioned high conductive cover, wherein this substrate selected from macromolecular material,
Metal material, or ceramic material.
It is preferred that the manufacture method of aforementioned high conductive cover, wherein this macromolecular material is selected from following
One of group: epoxy resin, phenolic resin, furane resins, and polyurethane resin.
It is preferred that the manufacture method of aforementioned high conductive cover, wherein said heat conducting fiber is selected from metal
Fiber, highly-conductive hot carbon fiber, or graphitization vapour deposition carbon fiber.
Another object of the present invention is to provide a kind of high conductive cover for electronic installation.
High conductive cover of the present invention, including a housing and a pre-solid of heat conduction, this housing has
An inner surface reversely with each other and an outer surface.The pre-solid of this heat conduction is with this inner surface even
Connect, including a substrate and multiple heat conducting fiber being scattered in this substrate.
It is preferred that aforementioned high conductive cover, being exposed at least partially of wherein said heat conducting fiber
Outside this substrate, and contact with external environment.
It is preferred that aforementioned high conductive cover, wherein the pre-solid of this heat conduction partially pass through this housing
Inner surface, and exposed from this outer surface.
It is preferred that aforementioned high conductive cover, wherein said heat conducting fiber is led selected from metallic fiber, height
Hot carbon fiber, or graphitization vapour deposition carbon fiber.
It is preferred that aforementioned high conductive cover, wherein this substrate is selected from macromolecular material, metal material,
Or ceramic material.
The beneficial effects of the present invention is: utilize and there is high heat conduction and bent heat conducting fiber system
Become the pre-solid of heat conduction, increase the thermal diffusivity that this high conductive cover is overall.
Accompanying drawing explanation
Fig. 1 is a side-looking exploded view, illustrates that the present invention is used for the one of the high conductive cover of electronic installation
First embodiment；
Fig. 2 is a side-looking exploded view, illustrates that the present invention is used for the one of the high conductive cover of electronic installation
Second embodiment；
Fig. 3 is exploded side figure, illustrate the present invention for electronic installation high conductive cover this
Another pattern of two embodiments；
Fig. 4 is a word flow chart, and a kind of high conductive cover for electronic installation of the present invention is described
A blend step of manufacture method, one remove step and a connecting step；
Fig. 5 is an axonometric chart, and a heat conduction of the first embodiment of this high conductive cover of the present invention is described
Multiple heat conducting fiber of pre-solid the most exposed, and directly and extraneous contact；
Fig. 6 is an axonometric chart, illustrates in this first embodiment, the pre-solid of this heat conduction and a housing
Mode of connection；And
Fig. 7 is side view diagram, and the another kind of mode of connection of the pre-solid of this heat conduction and this housing is described.
Detailed description of the invention
Below in conjunction with the accompanying drawings and embodiment the present invention is described in detail.
Refering to Fig. 1, Fig. 2 and Fig. 3, high conductive cover 1 of the present invention be can be used for such as mobile phone,
The electronic installations such as tablet PC 100, and increase the power being arranged at this electronic installation 100
The radiating effect of assembly 200, is so that this high conductive cover 1 is applied to mobile phone in the present embodiment
As a example by explain.
Referring again to Fig. 1, a first embodiment of this high conductive cover 1 comprises a housing 11 and
The pre-solid of heat conduction 12.This housing 11 has an inner surface 111, and one is anti-with inner surface 111
To outer surface 112.The material of this housing 11 can be metal material or macromolecular material, such as:
Titanium alloy, aluminium alloy, Merlon, or acryl resin etc..
Coordinate refering to Fig. 5, the pre-solid of this heat conduction 12 along this housing 11 inner surface 111 with
This inner surface 111 is closely attached, and the pre-solid of this heat conduction 12 includes a substrate 121 and multiple
Dispersion is doped in the heat conducting fiber 122 in this substrate 121.Wherein, this substrate 121 is selected from height
Molecular material, metal material, or ceramic material, in particular, this macromolecular material is selected from
One of following group: epoxy resin, phenolic resin, furane resins, and polyurethane resin；Should
Metal material is selected from silver, copper, stannum, antimony, aluminum, almag, aluminium oxide alloy etc.；Should
Ceramic material is selected from silicon, carborundum etc.；Described heat conducting fiber 122 is to be situated between selected from heat conductivity
In the high-termal conductivity fiber of 380～2000W/m K, such as metallic fiber, highly-conductive hot carbon fiber,
Or graphitization vapour deposition carbon fiber.
It is preferred that described heat conducting fiber 122 can be exposed from this heat conduction pre-solid 12, and with outward
Boundary's environment contact, accordingly, can increase the thermal diffusivity of this heat conduction pre-solid 12 entirety, such as institute
Stating heat conducting fiber 122 can be exposed from the periphery of the pre-solid of this heat conduction 12, or described heat conduction is fine
Dimension 122 can arrange along the short side direction of this housing 11 parallel and can be corresponding from the length of this housing 11
Limit periphery exposes, and and extraneous contact, then the heat energy absorbed via described heat conducting fiber 122,
Can externally derive along described heat conducting fiber 122 with shortest path, and there is preferably thermal diffusivity.
As it is shown in figure 1, actually used time, this high conductive cover 1 i.e. replaces this electronic installation 100
Cap, by this high conductive cover 1 with the one of the pre-solid of this heat conduction 12 facing to this power packages
Part 200 and be combined with this electronic installation 100.
Refering to Fig. 2, one second embodiment of this high conductive cover 1 of the present invention, with this first enforcement
Example is roughly the same, also comprises this housing 11 and the pre-solid of this heat conduction 12, itself and this first enforcement
It is at example difference that the pre-solid of this heat conduction 12 is that part is connected with the inner surface 111 of this housing 11,
Another part is the inner surface 111 through this housing 11, and exposed from this outer surface 112.
More specifically, it is to connect anticipated for pre-for this heat conduction solid 12 with this (PCC) power 200
The part touched is combined with this inner surface 111, and allows the pre-solid of heat conduction 12 of another part pass
The inner surface 111 of this housing 11 and exposed from this outer surface 112, and formed as shown in Figure 2
Structure；It is preferred that refering to Fig. 3, the part of the pre-solid of this heat conduction 12 is in through this housing
After the inner surface 111 of 11, can re-extend to this outer surface 112, so, this heat conduction can be increased
Pre-solid 12 and extraneous contact area, and further promote its thermal diffusivity.
Hereby the manufacture method of this first embodiment of this high conductive cover 1 aforementioned is described as follows:
Refering to Fig. 1, Fig. 4 and Fig. 5, the manufacture method of this high conductive cover of the present invention, comprise one
Blend step 21, one removes step 22, and a connecting step 23.
This blend step 21 is to blend after this substrate 121 by multiple described heat conducting fiber 122,
Make this substrate 121 solidify, form the interior of a shape essence and follow-up this housing 11 to be connected
The pre-solid of heat conduction 12 that surface 111 shape is suitable, wherein, the heat conduction of described heat conducting fiber 122
Coefficient between 380～2000W/m K, and described heat conducting fiber 122 can be as it is shown in figure 5,
In the way of weaving, it is distributed in this substrate 121, or (figure is not along a predetermined direction arrangement
Show), and it is distributed in this substrate 121.In the present embodiment, this housing 11 is as a example by elongated,
Therefore, the shape of the pre-solid of this heat conduction 12 is also general in elongated.But it practice, this heat conduction is pre-solid
The visual demand of body 12, is designed to correspond only to this (PCC) power 200 and arranges, or in ladder type,
Any shape such as polygon, and it is not necessary to the shape of the inner surface 111 of this housing 11 fully mated.
Specifically, when this substrate 121 is selected from metal or macromolecular material, this mixing step
Rapid 21 is first this substrate 121 to be melted, and then, is substrate 121 and the institute of molten by this
State heat conducting fiber 122 to mix, then make this substrate 121 solidify, i.e. can obtain the pre-solid of this heat conduction
12.And the visual demand of the pre-solid of this heat conduction 12 is trimmed to required size shape further.
And when this substrate 121 is Ceramics material, be then by ceramic powders (Si or SiC
Deng) make an addition in dispersant solution (polyethyleneimine/isopropyl alcohol),
Make it dispersed with ultrasonic vibrating again, then (this is with phenolic aldehyde tree to pour this solution into a resin
Illustrate as a example by fat) in make a slurry, then, described heat conducting fiber 122 is laid and is soaked in
In this slurry, hot-forming in 150～170 DEG C after, be heated to 1100 DEG C and make this phenolic resin split
Solve carbonization, finally process 3 hours at 1450 DEG C, i.e. can obtain this substrate 121 for pottery material
The pre-solid of this heat conduction 12 of material.
This removes at least some of shifting that step 22 is the substrate 121 by pre-for this heat conduction solid 12
Remove, make being exposed at least partially outside substrate 121 directly with outer of described heat conducting fiber 122
Boundary contacts.Specifically, this removes step 22 is to utilize laser, sandblasting or cutting mode to move
Except the substrate 121 of part, and make the most exposed of described heat conducting fiber 122.
To be remarked additionally, if this substrate 121 selects metal material, then this removes step 22
The mode of chemical attack still can be used to remove the substrate 121 of part.
It is preferred that this removes step 22 is by the substrate 121 of pre-for heat conduction solid 12 periphery extremely
A few part removes, and allows at least some of from the pre-solid of this heat conduction of described heat conducting fiber 122
The side of 12 is exposed and direct and extraneous contact, to increase the thermal diffusivity of the pre-solid of this heat conduction 12,
More preferably, when described heat conducting fiber 122 be along this housing 11 parallel short side direction arrange and
Can corresponding expose, then via described from the long limit periphery of this housing 11 after this removes step 22
The heat energy that heat conducting fiber 122 absorbs, externally can lead along described heat conducting fiber 122 with shortest path
Go out, and there is preferably thermal diffusivity.
Refering to Fig. 1 and Fig. 6, this connecting step 23 is by pre-for this heat conduction solid 12 and this housing
The 11 predetermined inner surfacies 111 towards this electronic installation 100 connect.
This connecting step 23 can be to utilize laminating type, utilizes viscose by pre-for this heat conduction solid
12 inner surfacies 111 fitting in this housing 11, or utilize in-molded mode allow this heat conduction
Pre-solid 12 and this housing 11 one joint forming, and obtain the height shown in this first embodiment
Conductive cover 1.
Refering to Fig. 7 and coordinate Fig. 1, specifically, this in-molded mode is to prepare one to have
First mould 3 of one first groove 31, and one is corresponding with this first mould 3 and have an energy
Form the second mould 4 of the second groove 41 of this housing 11 shape, by pre-for this heat conduction solid 12
After being placed in this first groove 31, pre-with this heat conduction in the second groove 41 of this second mould 4
Be molded a molding fluid that can prepare this housing 11 between solid 12, to be hardened after, remove this
One, the second mould 3,4, i.e. can obtain this housing 11, and integrally formed with this housing 11
The pre-solid of this heat conduction 12, and obtain this high conductive cover 1.
Additionally, be noted that this purpose removing step 22 is intended to make described heat conducting fiber
122 can be the most exposed and increase the thermal diffusivity of this heat conduction pre-solid 12 entirety from this substrate 121,
Therefore, it is possible to regarding use environment or the radiating requirements of the pre-solid of this heat conduction 12, be not necessary to through this
Remove step 22, directly the prepared pre-solid of this heat conduction 12 is engaged in this housing 11.
Then, the manufacture method of the high conductive cover of this second embodiment aforementioned is described.
As shown in Figure 4, the manufacture method of the second embodiment of this high conductive cover of the present invention, comprise:
One blend step 21, removes step 22, and a connecting step 23.This blend step 21
And it is identical with the manufacture method of this first embodiment to remove step 22, therefore, no longer add to go to live in the household of one's in-laws on getting married
State.Except for the difference that, in the manufacture method of this second embodiment, this connecting step 23 is to utilize
Mould internal shaping mode described in this first embodiment, and prepare this height as shown in Figure 2 or Figure 3
Conductive cover 1.
Specifically, this connecting step 23 is to use and mould internal shaping mould identical shown in Fig. 7
Tool, is at its difference that this mould need to have solid 12 preformed shape phase pre-with this heat conduction
First, second groove coordinated, and corresponding adjustment need to be done depending on the material of this substrate 121.
Specifically, when this base material 121 is macromolecular material and metal material, due to macromolecule material
Material and the pliability of metal material, the pre-solid of this heat conduction 12 can do slabbing rearmounted enter mould
In, mould the pre-solid of heat conduction 12 of directly pressing lamellar can become predetermined bending shape, connects
And utilize in-molded mode can make this high conductive cover 1.But, if this base material 121
It is ceramic material, owing to the ceramic material after sintering does not have pliability, therefore, in this mixing step
Rapid 21, must be first by pre-for ceramic material molded (such as Fig. 2 when preparing the pre-solid 12 of this heat conduction
Z-shaped shown in shown L-type or Fig. 3).
Additionally, to be illustrated says, no matter the pre-solid of this heat conduction 12 is in the way of laminating, or
Link with this housing 11 in the way of in-molded, be exposed to this substrate 121 when controlling order
The described heat conducting fiber 122 of side exposes this housing 11 further, direct and contacting external air
Time, consequently, it is possible to when this electronic installation 100 and this (PCC) power 200 produce heat, it is possible to
Outside air is conducted the heat to by the heat conducting fiber 122 being exposed to this housing 11 periphery, and
Obtain more preferable thermal diffusivity.
The present invention utilizes the pre-solid of this heat conduction 12 that described heat conducting fiber 122 is made, it is possible to according to being somebody's turn to do
The shape of high conductive cover 1 is closely obedient to this high conductive cover 1, it is to avoid existing graphite flake,
Cannot fit along radian, the problem can only fitted with regard to the planar section of housing, therefore, it is possible to increase
Add the laying area of the pre-solid of this heat conduction 12, increase area of dissipation.Additionally, this electronic installation
100 and this (PCC) power 200 produced by heat, additionally it is possible to by being exposed to this housing 11 periphery
Described heat conducting fiber 122 spill into the external world, therefore, it is possible to effectively increase thermal diffusivity.
Claims (16)
1. a manufacture method for high conductive cover, for an electronic installation, it is characterised in that
Comprise:
Multiple heat conducting fiber are blended after a kind of substrate, make this substrate by one blend step
Solidification, forms a pre-solid of heat conduction, wherein, the heat conductivity of described heat conducting fiber between
380～2000W/m K；And
One connecting step, makes a reservation for fill towards this electronics by pre-for this heat conduction solid and a housing
The inner surface put connects, and prepares a high conductive cover.
The manufacture method of the highest conductive cover, it is characterised in that: institute
State the manufacture method of high conductive cover also to comprise one and remove step, by the base of pre-for this heat conduction solid
Removing at least partially of matter, make described heat conducting fiber the most exposed and direct with
Extraneous contact.
The manufacture method of the highest conductive cover, it is characterised in that: institute
It is exposed from the periphery of the pre-solid of this heat conduction for stating heat conducting fiber, and the pre-solid of this heat conduction and this shell
After body connects, described heat conducting fiber can be exposed from this housing perimeter, and and extraneous contact.
The manufacture method of the highest conductive cover, it is characterised in that: should
Removing step is the substrate utilizing laser, sandblasting or cutting mode to remove part, and makes described
Heat conducting fiber is exposed.
The manufacture method of the highest conductive cover, it is characterised in that: should
Connecting step is that pre-for this heat conduction solid is fitted in this housing.
The manufacture method of the highest conductive cover, it is characterised in that: should
Connecting step is to prepare first mould with first groove, and one with this
One mould is corresponding and has the second mould of second groove that can form this hull shape
Tool, after pre-for this heat conduction solid is placed in this first groove, in this second mould and this heat conduction
A kind of molding fluid of injection between pre-solid, to be hardened after, remove this first, second mould,
Obtain this housing, and the pre-solid of this heat conduction being one of the forming with this housing, and obtain this height
Conductive cover.
The manufacture method of the highest conductive cover, it is characterised in that: should
Housing has an outer surface reverse with the inner surface of this housing, and the pre-solid of this heat conduction
Partially pass through the inner surface of this housing, and exposed from this outer surface.
The manufacture method of the highest conductive cover, it is characterised in that: should
Housing has an outer surface reverse with the inner surface of this housing, and the pre-solid of this heat conduction
Partially pass through the inner surface of this housing and extend to this outer surface.
The manufacture method of the highest conductive cover, it is characterised in that: should
Substrate is selected from macromolecular material, metal material, or ceramic material.
The manufacture method of the highest conductive cover, it is characterised in that: should
Macromolecular material is selected from one of following group: epoxy resin, phenolic resin, furane resins,
And polyurethane resin.
The manufacture method of 11. the highest conductive cover, it is characterised in that: institute
State heat conducting fiber and be selected from metallic fiber, highly-conductive hot carbon fiber, or graphitization vapour deposition carbon is fine
Dimension.
12. 1 kinds of high conductive cover, it is characterised in that including:
One housing, has a reversely with each other inner surface and an outer surface；And
One pre-solid of heat conduction, is connected with this inner surface, including a substrate and multiple dispersion
Heat conducting fiber in this substrate.
13. high conductive cover according to claim 12, it is characterised in that: described heat conduction
Being exposed at least partially outside this substrate of fiber, and contact with external environment.
14. high conductive cover according to claim 12, it is characterised in that: this heat conduction is pre-
The inner surface partially passing through this housing of solid, and exposed from this outer surface.
15. high conductive cover according to claim 12, it is characterised in that: described heat conduction
Fiber is selected from metallic fiber, highly-conductive hot carbon fiber, or graphitization vapour deposition carbon fiber.
16. high conductive cover according to claim 12, it is characterised in that: this substrate is selected
From macromolecular material, metal material, or ceramic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510154174.8A CN106163213A (en) | 2015-04-02 | 2015-04-02 | High conductive cover and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510154174.8A CN106163213A (en) | 2015-04-02 | 2015-04-02 | High conductive cover and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106163213A true CN106163213A (en) | 2016-11-23 |
Family
ID=57337420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510154174.8A Pending CN106163213A (en) | 2015-04-02 | 2015-04-02 | High conductive cover and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106163213A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107465793A (en) * | 2017-08-17 | 2017-12-12 | 太仓劲松智能化电子科技有限公司 | The good titanium alloy mobile phone shell of wearability |
| CN109275308A (en) * | 2017-07-18 | 2019-01-25 | 东莞市普威玛精密工业有限公司 | The shell of portable electronic devices transfers hot-forming thermal dispersant coatings structure |
| WO2023102694A1 (en) * | 2021-12-06 | 2023-06-15 | 华为数字能源技术有限公司 | Thermally conductive insulating housing and electronic device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2337149Y (en) * | 1998-08-05 | 1999-09-08 | 汤勇 | Compound phase transformation heat accumulating material |
| US20100143650A1 (en) * | 2008-12-09 | 2010-06-10 | Pegatron Corporation | Casing and method for manufacturing the same |
| CN102672880A (en) * | 2012-05-04 | 2012-09-19 | 华为终端有限公司 | Carbon fiber member manufacturing method and carbon fiber member manufactured by method |
| JP2012186241A (en) * | 2011-03-04 | 2012-09-27 | Railway Technical Research Institute | Heat conductive sheet |
| CN103712192A (en) * | 2014-01-08 | 2014-04-09 | 武汉阳光佰鸿新能源股份有限公司 | Integrated phase-changing heat-sink high-power LED lamp radiator |
| US8873226B1 (en) * | 2012-09-10 | 2014-10-28 | Amazon Technologies, Inc. | Electronic device housing having a low-density component and a high-stiffness component |
| CN104144597A (en) * | 2012-12-11 | 2014-11-12 | 天诺光电材料股份有限公司 | Heat-conduction-fiber-enhanced high heat conductivity graphite cooling fin and manufacturing method |
| CN204190807U (en) * | 2014-10-15 | 2015-03-04 | 天津云辰科技有限公司 | The double-deck conductive structure of mobile phone |
-
2015
- 2015-04-02 CN CN201510154174.8A patent/CN106163213A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2337149Y (en) * | 1998-08-05 | 1999-09-08 | 汤勇 | Compound phase transformation heat accumulating material |
| US20100143650A1 (en) * | 2008-12-09 | 2010-06-10 | Pegatron Corporation | Casing and method for manufacturing the same |
| JP2012186241A (en) * | 2011-03-04 | 2012-09-27 | Railway Technical Research Institute | Heat conductive sheet |
| CN102672880A (en) * | 2012-05-04 | 2012-09-19 | 华为终端有限公司 | Carbon fiber member manufacturing method and carbon fiber member manufactured by method |
| US8873226B1 (en) * | 2012-09-10 | 2014-10-28 | Amazon Technologies, Inc. | Electronic device housing having a low-density component and a high-stiffness component |
| CN104144597A (en) * | 2012-12-11 | 2014-11-12 | 天诺光电材料股份有限公司 | Heat-conduction-fiber-enhanced high heat conductivity graphite cooling fin and manufacturing method |
| CN103712192A (en) * | 2014-01-08 | 2014-04-09 | 武汉阳光佰鸿新能源股份有限公司 | Integrated phase-changing heat-sink high-power LED lamp radiator |
| CN204190807U (en) * | 2014-10-15 | 2015-03-04 | 天津云辰科技有限公司 | The double-deck conductive structure of mobile phone |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109275308A (en) * | 2017-07-18 | 2019-01-25 | 东莞市普威玛精密工业有限公司 | The shell of portable electronic devices transfers hot-forming thermal dispersant coatings structure |
| CN107465793A (en) * | 2017-08-17 | 2017-12-12 | 太仓劲松智能化电子科技有限公司 | The good titanium alloy mobile phone shell of wearability |
| WO2023102694A1 (en) * | 2021-12-06 | 2023-06-15 | 华为数字能源技术有限公司 | Thermally conductive insulating housing and electronic device |
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Application publication date: 20161123 |