CN202941039U - Composite substrate high-frequency copper-clad plate - Google Patents
Composite substrate high-frequency copper-clad plate Download PDFInfo
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- CN202941039U CN202941039U CN201220465091.2U CN201220465091U CN202941039U CN 202941039 U CN202941039 U CN 202941039U CN 201220465091 U CN201220465091 U CN 201220465091U CN 202941039 U CN202941039 U CN 202941039U
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- copper foil
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- polytetrafluoroethylene
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Abstract
The utility model discloses a composite substrate high-frequency copper-clad plate, which comprises an insulating reinforcement layer, a ceramic basement layer, a polytetrafluoroethylene impregnated layer and a copper foil layer, wherein the insulating reinforcement layer, the ceramic basement layer, the polytetrafluoroethylene impregnated layer and the copper foil layer are overlapped sequentially; or the composite substrate high-frequency copper-clad plate comprises an insulating reinforcement layer, two ceramic basement layers, two polytetrafluoroethylene impregnated layers and two copper foil layers, wherein the insulating reinforcement layer, the ceramic basement layers, the polytetrafluoroethylene impregnated layers and the copper foil layers are symmetrically and sequentially overlapped by taking the insulating reinforcement layer as a center. The composite substrate high-frequency copper-clad plate has good high-frequency electrical properties, small dielectric constant and dielectric loss factor, and has good heat dissipation performance and safety at the same time, is low in cost, and can improve the popularization adaptability of products.
Description
Technical field
The utility model relates to laminated sheet field, the particularly high-frequency copper foil covered plate of a kind of composite base material.
Background technology
Along with the development of science and technology, the research of types of functionality material and use has also obtained the development of advancing by leaps and bounds.in the electronic product field, progressively lifting along with the electronic product functionalization, and electronic product is to faster, less, lighter future development, electronic product is at mass computing machine equipment such as large-scale and superhuge computer, the application of the aspects such as computer server and large-scale programme-controlled exchange device has obtained significant progress, the transmitted frequency of its electronic signal constantly increases, even reach the GHz level, this just requires the transmission of electronic signal faster, transmission to signal will be disturbed less, accuracy rate is higher, loss in transmitting procedure is less, and the diversity of the heat of facing long-play and large electric current and producing will be got well.In addition, day by day perfect along with communicating terminal service, the development of electronic product terminal is more and more less, light, fast, and the application of high-density integration technology has all proposed higher requirement to the fail safe of product, agility and the accuracy of signal transmission.
Therefore, in electronic product, copper coated foil plate for carrying electronics main components, requirement to it is no longer simple carrying and insulating effect, but will ensure that the fail safe of product, high efficiency and accuracy, the minimizing that improves the transmission of electronic signal roll into one to many requirements such as interference of circuit signal, thereby the high frequency electrical performance to copper coated foil plate has proposed higher requirement, namely requires copper coated foil plate to possess lower DIELECTRIC CONSTANT ε and dielectric dissipation factor α.
In recent years, some have occurred and possessed the copper coated foil plate of high-frequency functions, these products adopt polytetrafluoroethylmaterial material and dielectric glass fibre cloth (claiming again D glass fibre cloth) to produce fully, yet because material price is higher, promote slowly.And this type of copper-clad plate mostly is flexible version, can't use in large electric equipment and large scale plate-making printed circuit board.And in actual applications, can't evacuate well the amount of heat that circuit itself produces, cause its application relatively poor.
The utility model content
The technical problems to be solved in the utility model is high in order to overcome the existing copper coated foil plate material price that possesses high-frequency functions, and common copper coated foil plate is difficult to be applied to the defective of large electric appliances equipment, provides a kind of composite base material high-frequency copper foil covered plate.The high-frequency copper foil covered plate of this composite base material possesses good high frequency electrical performance, has simultaneously thermal diffusivity and fail safe preferably, and cost is lower, popularization adaptability that can improving product.
The utility model is to solve above-mentioned technical problem by following technical proposals.
The utility model provides a kind of composite base material high-frequency copper foil covered plate, and it comprises an insulation enhancement layer, a ceramic basic unit, a polytetrafluoroethylene impregnate layer and a copper foil layer; Described insulation enhancement layer, described ceramic basic unit, described polytetrafluoroethylene impregnate layer and described copper foil layer are superimposed in order;
Perhaps, the high-frequency copper foil covered plate of described composite base material comprises: an insulation enhancement layer, two ceramic basic units, two polytetrafluoroethylene impregnate layer and two copper foil layers; Described insulation enhancement layer, described ceramic basic unit, described polytetrafluoroethylene impregnate layer and described copper foil layer are symmetrical and sequentially superimposed centered by described insulation enhancement layer.
By this area general knowledge, described ceramic basic unit is comprised of ceramic prepreg.Described ceramic prepreg is to be made by the adhesive lay-up that contains ultra-fine pottery filling powder.The preparation process of described ceramic prepreg is: ultra-fine pottery is filled powder be dispersed in the stable gluing system of formation in the high viscosity resins adhesive, again reinforcing material be impregnated in described gluing system, form the ceramic prepreg of semi-cured state through high-temperature baking.Described ceramic basic unit comprises the ceramic prepreg more than.The thickness of described ceramic prepreg is preferably 0.1mm ~ 0.5mm.
By this area general knowledge, described polytetrafluoroethylene impregnate layer is comprised of the polytetrafluoroethylene dipstick.Described polytetrafluoroethylene dipstick is made by polytetrafluoroethylene concentrate lay-up.The preparation process of described polytetrafluoroethylene dipstick is: with polytetrafluoroethylene concentrate lay-up, then the reinforcing material after flooding forms the polytetrafluoroethylene dipstick of semi-solid preparation after moisture, solvent and surfactant are deviate from baking.Described polytetrafluoroethylene impregnate layer comprises the polytetrafluoroethylene dipstick more than.The thickness of described polytetrafluoroethylene dipstick is preferably 0.05mm ~ 0.5mm.
By this area general knowledge, affiliated insulation enhancement layer is comprised of the epoxy resin prepreg.Described epoxy resin prepreg is made by the epoxy adhesive lay-up.The conventional preparation process of described epoxy resin prepreg is: with the epoxy adhesive lay-up, through high-temperature baking, form the epoxy resin prepreg.Described insulation enhancement layer preferably comprises the epoxy resin prepreg more than.The thickness of described epoxy resin prepreg is preferably 0.1mm ~ 0.3mm.
Described copper foil layer is the Copper Foil of this area routine.The thickness of described copper foil layer is preferably 9 μ m ~ 105 μ m.
Described reinforcing material is the conventional reinforcing material that uses in copper coated foil plate field, is preferably glass fabric, glass fibre non-woven or fibrous paper.
Described superimposed be to form by the mode that adds hot pressing.Describedly add the common process that hot pressing technique is this area, be generally: after each layer superposeed in order, send into vacuum pressing-combining equipment, pressurization makes between each layer curing bonding under hot conditions, gets final product.
Positive progressive effect of the present utility model is:
1, possesses good high frequency electrical performance, application due to polytetrafluoroethylene, pottery and insulation reinforcing material, make copper coated foil plate possess lower dielectric constant and dielectric dissipation factor, its DIELECTRIC CONSTANT ε is less than 3.3, dielectric dissipation factor α ensures high efficiency, accuracy and the fail safe of electronic signal transmission better less than 0.0046;
2, has outstanding thermal diffusivity, ultra-fine pottery is filled powder can be at the inner heat dissipation channel that extends in all direction that forms of adhesive, can effectively evacuate the amount of heat that circuit itself produces, promoted the fail safe of copper coated foil plate and associated electrical components and parts, security performance and the useful life of machine product have been ensured simultaneously
3, fill the high frequency electrical performance that to improve resin system that adds of powder due to ultra-fine pottery, thereby can reduce the ratio of polytetrafluoroethylmaterial material, effectively controlled production cost.
Description of drawings
Fig. 1 is the cross-sectional view of embodiment 1.
Fig. 2 is the cross-sectional view of embodiment 2.
Mark in accompanying drawing represents respectively:
11: the insulation enhancement layer;
21: ceramic basic unit;
31: the polytetrafluoroethylene impregnate layer;
41: copper foil layer.
Embodiment
Provide the utility model preferred embodiment below in conjunction with accompanying drawing, to describe the technical solution of the utility model in detail.
Embodiment 1
The high-frequency copper foil covered plate of a kind of composite base material as shown in Figure 1, it comprises an insulation enhancement layer 11, a ceramic basic unit 21, a polytetrafluoroethylene impregnate layer 31 and a copper foil layer 41; Insulation enhancement layer 11, ceramic basic unit 21, polytetrafluoroethylene impregnate layer 31 and copper foil layer 41 are superimposed in order;
Wherein, insulation enhancement layer 11 comprises 5 epoxy resin prepregs, and the thickness of every epoxy resin prepreg is 0.2mm; Pottery basic unit 21 is 1 ceramic prepreg, and thickness is 0.3mm; Polytetrafluoroethylene impregnate layer 31 is 1 polytetrafluoroethylene dipstick, and thickness is 0.2mm; The thickness of copper foil layer 41 is 35 μ m.
Wherein, in epoxy resin prepreg, ceramic prepreg and polytetrafluoroethylene impregnate layer, reinforcing material used is glass fabric.
The DIELECTRIC CONSTANT ε of the high-frequency copper foil covered plate of this composite base material is less than 3.3, and dielectric dissipation factor α is less than 0.0046.
Embodiment 2
The high-frequency copper foil covered plate of a kind of composite base material as shown in Figure 2, it comprises an insulation enhancement layer 11, two ceramic basic units 21, two polytetrafluoroethylene impregnate layer 31 and two copper foil layers 41; Each layer is copper foil layer 41, polytetrafluoroethylene impregnate layer 31, ceramic basic unit 21, insulation enhancement layer 11, ceramic basic unit 21, polytetrafluoroethylene impregnate layer 31 and copper foil layer 41 from top to bottom, and each layer is superimposed successively;
Wherein, insulation enhancement layer 11 comprises three epoxy resin prepregs, and the thickness of every epoxy resin prepreg is 0.2mm; Pottery basic unit 21 comprises two ceramic prepregs, and thickness is 0.3mm; Polytetrafluoroethylene impregnate layer 31 comprises two polytetrafluoroethylene dipsticks, and thickness is 0.2mm; The thickness of copper foil layer 41 is 35 μ m.
Wherein, in epoxy resin prepreg, ceramic prepreg and polytetrafluoroethylene impregnate layer, reinforcing material used is glass fabric.
The DIELECTRIC CONSTANT ε of the high-frequency copper foil covered plate of this composite base material is less than 3.3, and dielectric dissipation factor α is less than 0.0046.
Although more than described embodiment of the present utility model, it will be understood by those of skill in the art that above-mentioned statement only for to description and interpretation of the present utility model, is not limitation of the utility model.Protection range of the present utility model is limited by claims.Any modification that the utility model is made, improve and be equal to replacement, within all being included in protection range of the present utility model.
Claims (18)
1. the high-frequency copper foil covered plate of composite base material, is characterized in that, it comprises an insulation enhancement layer, a ceramic basic unit, a polytetrafluoroethylene impregnate layer and a copper foil layer; Described insulation enhancement layer, described ceramic basic unit, described polytetrafluoroethylene impregnate layer and described copper foil layer are superimposed in order.
2. the high-frequency copper foil covered plate of composite base material as claimed in claim 1, is characterized in that, described ceramic basic unit comprises the ceramic prepreg more than; Described ceramic prepreg is to be made by the adhesive lay-up that contains ultra-fine pottery filling powder.
3. the high-frequency copper foil covered plate of composite base material as claimed in claim 2, is characterized in that, the thickness of described ceramic prepreg is 0.1mm ~ 0.5mm.
4. the high-frequency copper foil covered plate of composite base material as claimed in claim 1, is characterized in that, described polytetrafluoroethylene impregnate layer comprises the polytetrafluoroethylene dipstick more than; Described polytetrafluoroethylene dipstick is made by polytetrafluoroethylene concentrate lay-up.
5. the high-frequency copper foil covered plate of composite base material as claimed in claim 4, is characterized in that, the thickness of described polytetrafluoroethylene dipstick is 0.05mm ~ 0.5mm.
6. the high-frequency copper foil covered plate of composite base material as claimed in claim 1, is characterized in that, described insulation enhancement layer comprises the epoxy resin prepreg more than; Described epoxy resin prepreg is made by the epoxy adhesive lay-up.
7. the high-frequency copper foil covered plate of composite base material as claimed in claim 6, is characterized in that, the thickness of described epoxy resin prepreg is 0.1mm ~ 0.3mm.
8. the high-frequency copper foil covered plate of composite base material as claimed in claim 1, is characterized in that, the thickness of described copper foil layer is 9 μ m ~ 105 μ m.
9. the high-frequency copper foil covered plate of composite base material as described in claim 2 ~ 7 any one, is characterized in that, described reinforcing material is glass fabric, glass fibre non-woven or fibrous paper.
10. the high-frequency copper foil covered plate of composite base material, is characterized in that, it comprises: an insulation enhancement layer, two ceramic basic units, two polytetrafluoroethylene impregnate layer and two copper foil layers; Described insulation enhancement layer, described ceramic basic unit, described polytetrafluoroethylene impregnate layer and described copper foil layer are symmetrical and sequentially superimposed centered by described insulation enhancement layer.
11. the high-frequency copper foil covered plate of composite base material as claimed in claim 10 is characterized in that, described ceramic basic unit comprises the ceramic prepreg more than; Described ceramic prepreg is to be made by the adhesive lay-up that contains ultra-fine pottery filling powder.
12. the high-frequency copper foil covered plate of composite base material as claimed in claim 11 is characterized in that, the thickness of described ceramic prepreg is 0.1mm ~ 0.5mm.
13. the high-frequency copper foil covered plate of composite base material as claimed in claim 10 is characterized in that, described polytetrafluoroethylene impregnate layer comprises the polytetrafluoroethylene dipstick more than; Described polytetrafluoroethylene dipstick is made by polytetrafluoroethylene concentrate lay-up.
14. the high-frequency copper foil covered plate of composite base material as claimed in claim 13 is characterized in that, the thickness of described polytetrafluoroethylene dipstick is 0.05mm ~ 0.5mm.
15. the high-frequency copper foil covered plate of composite base material as claimed in claim 10 is characterized in that, described insulation enhancement layer comprises the epoxy resin prepreg more than; Described epoxy resin prepreg is made by the epoxy adhesive lay-up.
16. the high-frequency copper foil covered plate of composite base material as claimed in claim 15 is characterized in that, the thickness of described epoxy resin prepreg is 0.1mm ~ 0.3mm.
17. the high-frequency copper foil covered plate of composite base material as claimed in claim 10 is characterized in that, the thickness of described copper foil layer is 9 μ m ~ 105 μ m.
18. the high-frequency copper foil covered plate of composite base material as described in claim 10 ~ 16 any one is characterized in that described reinforcing material is glass fabric, glass fibre non-woven or fibrous paper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220465091.2U CN202941039U (en) | 2012-09-12 | 2012-09-12 | Composite substrate high-frequency copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220465091.2U CN202941039U (en) | 2012-09-12 | 2012-09-12 | Composite substrate high-frequency copper-clad plate |
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| Publication Number | Publication Date |
|---|---|
| CN202941039U true CN202941039U (en) | 2013-05-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201220465091.2U Expired - Lifetime CN202941039U (en) | 2012-09-12 | 2012-09-12 | Composite substrate high-frequency copper-clad plate |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108075339A (en) * | 2016-11-18 | 2018-05-25 | 天津华诚华丰电工器材有限公司 | A kind of preparation method of composite material for slip ring personality board |
| CN109677055A (en) * | 2017-10-18 | 2019-04-26 | 泰州市旺灵绝缘材料厂 | A kind of copper foil high frequency laminate and preparation method thereof |
| CN112318970A (en) * | 2020-11-17 | 2021-02-05 | 中国电子科技集团公司第四十六研究所 | Glass fiber reinforced fluorine-containing polymer circuit laminated board structure |
-
2012
- 2012-09-12 CN CN201220465091.2U patent/CN202941039U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108075339A (en) * | 2016-11-18 | 2018-05-25 | 天津华诚华丰电工器材有限公司 | A kind of preparation method of composite material for slip ring personality board |
| CN109677055A (en) * | 2017-10-18 | 2019-04-26 | 泰州市旺灵绝缘材料厂 | A kind of copper foil high frequency laminate and preparation method thereof |
| CN112318970A (en) * | 2020-11-17 | 2021-02-05 | 中国电子科技集团公司第四十六研究所 | Glass fiber reinforced fluorine-containing polymer circuit laminated board structure |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130515 |
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| CX01 | Expiry of patent term |