CN201888027U - Rigid flexible circuit board formed by pressing mixture of polyphenyl ether and polyimide - Google Patents
Rigid flexible circuit board formed by pressing mixture of polyphenyl ether and polyimide Download PDFInfo
- Publication number
- CN201888027U CN201888027U CN2010206506565U CN201020650656U CN201888027U CN 201888027 U CN201888027 U CN 201888027U CN 2010206506565 U CN2010206506565 U CN 2010206506565U CN 201020650656 U CN201020650656 U CN 201020650656U CN 201888027 U CN201888027 U CN 201888027U
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- CN
- China
- Prior art keywords
- circuit board
- rigid
- flexible circuit
- rigid flexible
- polyphenyl ether
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model discloses a rigid flexible circuit board formed by pressing mixture of polyphenyl ether and polyimide, which has a simple structure, is convenient to manufacture and can be bent. The rigid flexible circuit board comprises rigid circuit boards at the two ends, and the rigid circuit boards adopt the polyphenyl ether as a substrate. The rigid flexible circuit board is characterized in that a circuit between the rigid circuit boards is adhered to a polyimide sheet. The rigid flexible circuit board has high temperature resistance. Since the polyimide sheet has good elasticity, the middle part of the rigid flexible circuit board can be bent to facilitate three-dimensional connection of the circuit and to save the connection space. Moreover, since the rigid circuit boards adopt the polyphenyl ether as the substrate, high-frequency transmission can be realized.
Description
Technical field
The utility model relates to the structure of wiring board, especially relates to the rigid-flexible circuit board of polyphenylene oxide and polyimides mixed pressure.
Background technology
Common wiring board all is a rigidity, can not be crooked, in use require between the circuit board connector at grade, and require accuracy of manufacture height, therefore for connector manufacturing requirement and cost height between the circuit board.
The utility model content
The purpose of this utility model provides a kind of simple in structure, easily manufactured, the polyphenylene oxide that can be crooked and the rigid-flexible circuit board of polyimides mixed pressure.
In order to satisfy above-mentioned requirements, the utility model is achieved through the following technical solutions: it includes the circuit board that the two ends base material is the rigidity of polyphenylene oxide, it is characterized in that at the circuit between the rigid circuit board be attached on the book sheet of polyimides.
Polyimides is one of high-molecular organic material of combination property the best, high temperature resistant reaching more than 400 ℃, long-term serviceability temperature scope-200～300 ℃, no sharp melting point, high insulating property, 103 hertz of following dielectric constants 4.0, dielectric loss only 0.004～0.007 belongs to F to H class F insulating material F.Polyphenylene oxide can satisfy the instructions for use of the high-frequency electronic signal equipment that is no more than 10GHz.According to the polyphenylene oxide of such scheme manufacturing and the rigid-flexible circuit board of polyimides mixed pressure, except energy is high temperature resistant, also because the book sheet of polyimides has good elasticity, can be crooked in the middle of the rigid-flexible circuit board of made polyphenylene oxide and polyimides mixed pressure, the solid that can realize circuit easily connects, and saves connection space.The base material of rigid circuit board is a polyphenylene oxide, can realize high-frequency transmission.
Description of drawings
Fig. 1 is the profile of the rigid-flexible circuit board of polyphenylene oxide and polyimides mixed pressure.
Wherein: 1, rigid circuit board; 2, circuit; 3, book sheet 4, the protective layer of polyimides; 5, plated-through hole.
Embodiment
The utility model will be further described below in conjunction with drawings and Examples.
Fig. 1 is the rigid-flexible board structure of circuit schematic diagram of polyphenylene oxide and polyimides mixed pressure.As seen from the figure, it includes the rigid circuit board 1 that the two ends base material is a polyphenylene oxide, is attached on the book sheet 3 of polyimides at the circuit between the rigid circuit board 12.Scribble the protective layer 4 of insulation on the surface of circuit 2, on rigid circuit board 1, be shaped on the plated-through hole 5 that is communicated with circuit 2, be used for the fixing of circuit 2 and electronic devices and components and be connected.
Claims (1)
1. the rigid-flexible circuit board of polyphenylene oxide and polyimides mixed pressure, it includes the circuit board that the two ends base material is the rigidity of polyphenylene oxide, it is characterized in that at the circuit between the rigid circuit board be attached on the book sheet of polyimides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206506565U CN201888027U (en) | 2010-11-30 | 2010-11-30 | Rigid flexible circuit board formed by pressing mixture of polyphenyl ether and polyimide |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206506565U CN201888027U (en) | 2010-11-30 | 2010-11-30 | Rigid flexible circuit board formed by pressing mixture of polyphenyl ether and polyimide |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201888027U true CN201888027U (en) | 2011-06-29 |
Family
ID=44185568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206506565U Expired - Fee Related CN201888027U (en) | 2010-11-30 | 2010-11-30 | Rigid flexible circuit board formed by pressing mixture of polyphenyl ether and polyimide |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201888027U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105704922A (en) * | 2016-02-25 | 2016-06-22 | 广东欧珀移动通信有限公司 | Splicing circuit board and terminal |
| CN105704910A (en) * | 2016-02-25 | 2016-06-22 | 广东欧珀移动通信有限公司 | Soft or hard combination board and terminal |
| CN113038702A (en) * | 2021-03-08 | 2021-06-25 | 浙江九通电子科技有限公司 | Rigid-flexible high-frequency circuit board limited by reinforced core strip |
-
2010
- 2010-11-30 CN CN2010206506565U patent/CN201888027U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105704922A (en) * | 2016-02-25 | 2016-06-22 | 广东欧珀移动通信有限公司 | Splicing circuit board and terminal |
| CN105704910A (en) * | 2016-02-25 | 2016-06-22 | 广东欧珀移动通信有限公司 | Soft or hard combination board and terminal |
| CN105704910B (en) * | 2016-02-25 | 2018-06-29 | 广东欧珀移动通信有限公司 | Rigid Flex and terminal |
| CN105704922B (en) * | 2016-02-25 | 2018-09-04 | 广东欧珀移动通信有限公司 | Splice wiring board and terminal |
| CN108601215A (en) * | 2016-02-25 | 2018-09-28 | 广东欧珀移动通信有限公司 | Rigid Flex and terminal |
| CN108601215B (en) * | 2016-02-25 | 2020-01-14 | Oppo广东移动通信有限公司 | Rigid-flex board and terminal |
| CN113038702A (en) * | 2021-03-08 | 2021-06-25 | 浙江九通电子科技有限公司 | Rigid-flexible high-frequency circuit board limited by reinforced core strip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Zhejiang Jiutong Electronic and Technology Ltd. Assignor: Jin Renhai Contract record no.: 2011330001219 Denomination of utility model: Rigid flexible circuit board formed by pressing mixture of polyphenyl ether and polyimide Granted publication date: 20110629 License type: Exclusive License Record date: 20111026 |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110629 Termination date: 20161130 |