CN105704922B - Splice wiring board and terminal - Google Patents
Splice wiring board and terminal Download PDFInfo
- Publication number
- CN105704922B CN105704922B CN201610105660.5A CN201610105660A CN105704922B CN 105704922 B CN105704922 B CN 105704922B CN 201610105660 A CN201610105660 A CN 201610105660A CN 105704922 B CN105704922 B CN 105704922B
- Authority
- CN
- China
- Prior art keywords
- electronic component
- splicing
- layer
- wiring board
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011469 building brick Substances 0.000 claims abstract description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 35
- 239000011889 copper foil Substances 0.000 claims description 35
- 238000009413 insulation Methods 0.000 claims description 27
- 229910000831 Steel Inorganic materials 0.000 claims description 13
- 230000002787 reinforcement Effects 0.000 claims description 13
- 239000010959 steel Substances 0.000 claims description 13
- 239000004020 conductor Substances 0.000 claims description 8
- 239000013039 cover film Substances 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 7
- 230000000694 effects Effects 0.000 abstract description 13
- 230000002708 enhancing effect Effects 0.000 abstract description 4
- 230000005611 electricity Effects 0.000 description 6
- 238000003466 welding Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000009877 rendering Methods 0.000 description 2
- 241001232787 Epiphragma Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a kind of splicing wiring board and terminals, the splicing wiring board includes circuit base plate and electronic building brick, the circuit base plate includes the first splicing edge and non-edge area, the electronic building brick includes the first electronic component and the second electronic component, the internal stress of first electronic component is more than the internal stress of second electronic component, first electronic component is arranged in first splicing edge, and second electronic component is arranged in the non-edge area.It is more than the internal stress of the second electronic component in non-edge area using the internal stress of the first electronic component, first electronic component is subjected to the distortional stress effect in non-edge area compared with the second electronic component, to which the first electronic component is not easily disconnected from the first splicing edge, and make the resistance to stress effect propety enhancing at the first splicing edge, and then the second electronic component is not easily susceptible to the distortional stress effect at the first splicing edge, so that entirely splicing circuit board structure is firm, service life improves.
Description
Technical field
The present invention relates to electronic device field more particularly to a kind of splicing wiring board and terminals.
Background technology
The application of splicing wiring board is more and more extensive at present, and splicing wiring board is typically provided with splicing edge and connection splicing edge
Electronic component is arranged in non-edge area for the non-edge area of edge.Mutually splice at the splicing edge of two splicing wiring boards so that splicing
Wiring board interconnects.However splicing edge is easy to be stressed effect under normal conditions, causes to splice edge deformation,
To be easy to cause splicing damage of edges；The electronic component for being set to non-edge area is driven and is detached from non-edge area so that whole
A splicing wiring board damage, influences the service life for splicing wiring board.
Invention content
In view of this, the present invention provides a kind of splicing wiring board and terminal improving service life.
The present invention provides a kind of splicing wiring board, wherein the splicing wiring board includes circuit base plate and electronic building brick, institute
Circuit base plate is stated to include the first splicing edge and splice the non-edge area that edge is connected, the electronic building brick packet with described first
The first electronic component and the second electronic component are included, the internal stress of first electronic component is more than the interior of second electronic component
Stress, first electronic component are arranged in first splicing edge, and second electronic component is arranged in the non-edge
Area.
Wherein, the circuit base plate further includes the second splicing edge being oppositely arranged with first splicing edge, described
Electronic building brick further includes third electronic component, and the third electronic component is arranged in second splicing edge, the third electricity
Subcomponent is staggered with first electronic component.
Wherein, the circuit base plate includes the rigid insulation layer, line layer and anti-solder ink layer stacked gradually, and described first
Electronic component and second electronic component are welded in line layer side opposite with the rigid insulation layer, and pass through institute
State anti-solder ink layer.
Wherein, the circuit base plate further includes flexible media layer and copper foil layer, and the flexible media layer is fixed on described hard
Matter insulating layer deviates from the line layer side, and the copper foil layer is superimposed on the flexible media layer, and is located at the rigid insulation
Between layer and the flexible media layer.
Wherein, the flexible media floor includes the firstth area and is connected to secondth area in firstth area, the rigid insulation
In on the flexible media floor and view field overlaps with firstth area, the cover film is just thrown in the flexibility for floor orthographic projection
On dielectric layer and view field coincides with secondth area.
Wherein, the first electronic component orthographic projection is located in firstth area.
Wherein, first electronic component is located in the orthographic projection of the flexible media floor in secondth area, the spelling
Link plate includes steel reinforcement, and the steel reinforcement is fixed on the flexible media layer, be located at the flexible media layer with it is described
The opposite side of first electronic component, and be oppositely arranged with first electronic component.
Wherein, the flexible media layer is equipped with first through hole, in the first through hole setting be electrically connected the copper foil layer and
The earth conductor of the steel reinforcement.
Wherein, the rigid insulation layer is equipped with the second through-hole, in second through-hole setting be electrically connected the line layer with
The signal conductor of the copper foil layer.
The present invention also provides a kind of terminals, wherein the terminal include ontology, set on the body interior mainboard and
Splice wiring board described in above-mentioned any one, the splicing wiring board is set to the body interior, and is electrically connected with the mainboard.
The splicing wiring board and terminal of the present invention utilizes the by the way that the first electronic component is arranged on the first splicing edge
The internal stress of one electronic component is more than the internal stress of the second electronic component in non-edge area, the first electronic component and circuit base plate
Bond strength be more than the bond strength of the second electronic component and circuit base plate, be not easily disconnected from the first spelling to the first electronic component
Edge fit edge, and make the resistance to stress effect propety enhancing at the first splicing edge, the first splicing edge deformation extent reduces, Jin Er
Two electronic components are not easily susceptible to the distortional stress effect at the first splicing edge, so that entirely splicing circuit board structure is firm,
Service life improves.
Description of the drawings
In order to illustrate more clearly of technical scheme of the present invention, attached drawing needed in embodiment will be made below
Simply introduce, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present invention, general for this field
For logical technical staff, without creative efforts, other drawings may also be obtained based on these drawings.
Fig. 1 is the vertical view of splicing wiring board provided by the invention；
Fig. 2 is the schematic cross-section of the splicing wiring board of Fig. 1
Fig. 3 is the schematic cross-section of the splicing wiring board of another embodiment provided by the invention.
Specific implementation mode
Below in conjunction with the attached drawing in embodiment of the present invention, the technical solution in embodiment of the present invention is carried out clear
Chu is fully described by.
It please refers to Fig.1 and Fig. 2, a kind of splicing wiring board 100 provided by the invention, the splicing wiring board 100 includes line
Base board 10 and electronic building brick 20, the circuit base plate 10 include that the first splicing edge 11 splices edge with being connected to described first
11 non-edge area 12, the electronic building brick 20 include the first electronic component 21 and the second electronic component 22, first electronics
The internal stress of element 21 is more than the internal stress of second electronic component 22, and first electronic component 21 is arranged in described first
Splice edge 11, second electronic component 22 is arranged in the non-edge area 12.
By the way that the first electronic component 21 is arranged on the first splicing edge 11, the internal stress using the first electronic component 21 is big
In the internal stress of the second electronic component 22 in non-edge area 12, the first electronic component 21 is subjected to compared with the second electronic component 22
The distortional stress in non-edge area 12 acts on, and to which the first electronic component 21 is not easily disconnected from the first splicing edge 11, and makes first
Splice the resistance to stress effect propety enhancing at edge 11, the first splicing 11 deformation extent of edge reduces, and then the second electronic component 22
It is not easily susceptible to the distortional stress effect at the first splicing edge, so that entirely splicing 100 stabilized structure of wiring board, service life
It improves.
The circuit base plate 10 is equipped with the circuit for being electrically connected the electronic building brick 20, to be provided to the electronic building brick 20
Electric signal, the circuit base plate 10 carry the electronic building brick 20 so that the electronic building brick 20 is stable in the circuit base plate
On 10.The circuit base plate 10 can be printed circuit board, can also be flexible circuit board, in present embodiment, the circuit
Substrate 10 is Rigid Flex.First splicing, 11 linear extension of edge, the first splicing edge 11 and another splicing line
Plate 100 phase in road is spliced, and the first electronic component 21 on first splicing edge 11 enhances the anti-of first splicing edge 11
Deformation nature.In other embodiments, first splicing edge 11 can also be arcuately curve extension.
In present embodiment, the number of first electronic component 21 can be multiple, multiple first electronic components
21 length direction along first splicing edge 11 is arranged, and spaced setting.Multiple first electronic component, 21 phases
Mutually interval setting so that first splicing edge 11 lengthens, so that the stress at first splicing edge 11 increases.Institute
It can be the larger electronic component of the internal stress such as resistance, chip, battery to state the first electronic component 21.Second electronic component 22
Number can also be multiple, multiple second electronic components 22 are arranged in the non-edge area 12.Multiple described second
Electronic component 22 can be mutually arranged side by side, and can also be spaced setting.Second electronic component 22 can be electricity
The internal stress such as appearance, diode or triode are less than the electronic component of first electronic component 22.It is described in other embodiment
Electronic building brick 20 can be single first electronic component 21 of setting, and second electronic component 22 can be single.
Further, the circuit base plate 10 further includes the second splicing edge 13 at first splicing edge 11 relatively,
The electronic building brick 20 further includes third electronic component 23, and the third electronic component 23 is arranged in second splicing edge
13, it is described when the second splicing edge 13 splices with the first splicing 13 phase of edge for splicing wiring board 100 described in another
Third electronic component 23 is staggered with first electronic component 21.
In present embodiment, the second splicing edge 13 is parallel with the first splicing edge 11.The non-edge
Area 12 is located at described first and splices between edge 11 and second splicing edge 13.The number of the third electronic component 23 can
To be multiple, length direction of multiple third electronic components 23 along second splicing edge 13 is arranged, and each other
Every setting.The third electronic component 23 on the direction at vertical second splicing edge 13 with first electronic component 11
It mutually staggers.In first splicing 11 phase of the edge splicing at the second splicing edge 13 and another splicing wiring board 100,
Interval between first electronic component 21 and the two neighboring third electronic component 23 is oppositely arranged so that described first
Electronic component 21 enhances the anti-deformation of second splicing part between two adjacent third electronic components 23 of edge 13
Effect, the interval between the third electronic component 23 and two neighboring first electronic component 21 are oppositely arranged, to institute
Stating third electronic component 23 enhances first splicing part between two neighboring first electronic component 21 of edge 11
Anti- deformation effect.And first electronic component 21 is avoided to collide with 23 rigidity of the third electronic component, to avoid
It states the first electronic component 21 and the third electronic component 23 mutually damages.Improve the service life of the splicing wiring board 100.
In other embodiments, second splicing edge 13 can also be the arc extended along parallel first splicing edge 11
Curve.
Further, the circuit base plate 10 includes rigid insulation layer 14, line layer 15 and anti-solder ink layer 16, and described the
One electronic component 21 and second electronic component 22 both pass through the anti-solder ink layer 16 and are welded in the line layer 15.
In present embodiment, the rigid insulation layer 14 uses polyethylene material, the rigid insulation layer 14 to have insulation
Characteristic so that the line layer 15 is set to insulation environment, to facilitate the trace arrangements diversification of the circuit base plate 10.Profit
With the rigidity of the rigid insulation layer 14 so that 10 intensity of the circuit base plate increases, and is not easy bending.
In present embodiment, the line layer 15 can be the etched technological forming of copper foil.The line layer 15 fits in
On the rigid insulation layer 14.The circuit trace mode of the line layer 15 can arrange by the line map being pre-designed,
15 setting signal cabling of the line layer and ground connection cabling, signal lead weld the electronic building brick 20, are the electronic building brick
20 provide electric signal, are grounded cabling connection signal cabling, and grounding electrode is provided for the electronic building brick 20.
In present embodiment, the circuit on 16 pairs of line layer 15 of the anti-solder ink layer is protected, and is prevented described
Line short on line layer 15.Specifically, the anti-solder ink layer 16 is equipped with the welding electricity in welding hole described in welding hole
Sub-component 20 fills scolding tin, by the electricity specifically, the electronic building brick 20 passes through the welding hole in the welding hole
Sub-component 20 is welded on the circuit of the line layer 15, to realize that the splicing wiring board 100 has printed circuit board
Function.
Further, the circuit base plate 10 further includes flexible media layer 17 and copper foil layer 18, the flexible media layer 17
It is fixed on the rigid insulation layer 14 and deviates from 15 side of the line layer, the copper foil layer 18 is arranged in the flexible media layer 17
On, and be laminated between the rigid insulation layer 14 and the flexible media layer 17.
In present embodiment, polyimides or the double stupid diformates of polyethylene can be used in the flexible substrate layer 17
Materials such as (Polyethylene terephthalate PET), in order to which the copper foil is arranged in the flexible substrate layer 17
Layer 18, and the flexible substrate layer 17 can be that the copper foil layer 18 provides insulation environment, in order in the copper foil layer 18
Upper etching signal cabling and ground connection cabling.Preferably, the thickness of the flexible substrate layer 17 can be 20 μm.The flexible substrate layer
17 can be arranged the first area 17a and the second area 17b, and the firstth area 17a is rigid for rendering, fixed on the firstth area 17a
The rigid insulation layer 14, to improve it is described splicing wiring board 100 the first area 17a rigidity, to facilitate the splicing
Wiring board 100 realizes printed circuit board function.The secondth area 17b is flexible for rendering, and the secondth area 17b facilitates the spelling
Link plate 100 generates deformation, and then the splicing wiring board 100 is facilitated to connect external device, realizes flexible circuit board function.
In present embodiment, the copper foil layer 18 is the plate that copper foil is arranged on film, the ground connection on the copper foil layer 18
Cabling and signal lead are that copper foil is formed according to the etched technique of prescribed route structure.Ground connection cabling on the copper foil layer 18
Can be wholely set with signal lead, the signal lead on the copper foil layer 18 realizes the conduction between electric elements, described
Ground connection cabling on copper foil layer 18 is grounded.
Further, orthographic projection region of the rigid insulation floor 14 on the flexible media floor 17 and firstth area
17a coincides, and the circuit base plate 10 further includes cover film 19, the cover film 19 with 14 phase of rigid insulation layer side by side,
And the orthographic projection region on the flexible media floor 17 coincides with the secondth area 17b.
In the present embodiment, it is hot-forming that polyester material progress may be used in the cover film 19.The cover film 19 passes through
Paste adhesive is on the copper foil layer 18, to being protected positioned at the copper foil layer 18 of the secondth area 17b.Specifically, described cover
Epiphragma 19 is fitted in completely on the copper foil layer 18, and part covers signal lead and ground connection cabling on the copper foil layer 18,
To protect signal lead and ground connection cabling on the copper foil layer 18 being located in the secondth area 17b not lost or damaged, together
When, by the way of paste adhesive, it is also possible that the cover film 19 and the connection of the copper foil layer 18 are closer, prevent institute
It states the displacement of cover layer 19 and the part cabling for exposing the cover film 19 can not be protected.14 pairs of the rigid insulation layer
Copper foil layer 18 in the firstth area 10a is protected, and realizes that the copper foil layer 18 is mutual with the line layer 15
Isolation.
Further, a kind of more excellent embodiment is provided, first electronic component 21 is in the flexible media layer 17
Orthographic projection is located in the firstth area 17a.Second electronic component 22 and the third electronic component 23 are in flexible Jie
The orthographic projection of matter floor 17 is located in the secondth area 17b, to which the electronic building brick 20 is by the rigid insulation layer 14
Support, the first splicing edge 11 and splicing edge 13 are by the support of the rigid insulation layer 14 so that described
First splicing edge 11 and second splicing edge 13 are unlikely to deform, so that 100 stabilized structure of splicing wiring board,
To improve the service life of the splicing wiring board 100.
Referring to Fig. 3, another embodiment is provided, it is roughly the same with more excellent embodiment, unlike, first electricity
Subcomponent 21 is located in the orthographic projection of the flexible media floor 17 in the secondth area 17b, and the splicing wiring board 100 includes steel
Reinforcement 30, the steel reinforcement 30 are fixed on the flexible media layer 17, and the flexible media layer 17 and first electricity are located at
21 opposite side of subcomponent, and be oppositely arranged with first electronic component 21.Enhance the flexibility using the steel reinforcement 30
Dielectric layer 17 the second area 17b intensity so that the circuit base plate 10 at the secondth area 17b stress enhance, institute
It states the first splicing edge 11 to be supported by the steel reinforcement 30, to be unlikely to deform, that improves the splicing wiring board 100 uses the longevity
Life.
Further, in another embodiment, the flexible media layer 17 is equipped with first through hole 171, and described first is logical
Setting is electrically connected the earth conductor 172 of the copper foil layer 18 and the steel reinforcement 30 in hole 171.Utilize the earth conductor 172
It is electrically connected the copper foil layer 18 and the steel reinforcement 30 so that the copper foil layer 18 is grounded, to utilize 30 shape of steel reinforcement
At grounding electrode, to improve the line construction of the splicing wiring board 100.
Further, in more excellent embodiment, the rigid insulation layer 14 is equipped with the second through-hole 141, and described second is logical
Setting is electrically connected the signal conductor 142 of the line layer 15 and the copper foil layer 18 in hole 141.Utilize the signal conductor 142
It is electrically connected the line layer 15 and the copper foil layer 18 so that the signal lead of the line layer 15 and the copper foil layer 18 is mutual
Conducting, to improve the line construction of the splicing wiring board 100.
The present invention also provides a kind of terminal (not shown), the terminal includes ontology (not shown), is set in the ontology
The mainboard (not shown) in portion and the splicing wiring board 100, the splicing wiring board 100 be set to the body interior, and with
The mainboard electrical connection.The terminal can be mobile phone, computer, tablet, handheld device or media player etc..
The splicing wiring board and terminal of the present invention utilizes the by the way that the first electronic component is arranged on the first splicing edge
The internal stress of one electronic component is more than the internal stress of the second electronic component in non-edge area, and the first electronic component is compared with the second electronics
Element is subjected to the distortional stress effect in non-edge area, to which the first electronic component is not easily disconnected from the first splicing edge, and makes
The resistance to stress effect propety enhancing at the first splicing edge is obtained, the first splicing edge deformation extent reduces, and then the second electronic component
It is not easily susceptible to the distortional stress effect at the first splicing edge, so that entirely splicing circuit board structure is firm, service life carries
It is high.
It is the preferred embodiment of the present invention above, it is noted that for those skilled in the art,
Various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also considered as this hair
Bright protection domain.
Claims (10)
1. a kind of splicing wiring board, which is characterized in that the splicing wiring board includes circuit base plate and electronic building brick, the circuit
Substrate includes the first splicing edge and splices the non-edge area that edge is connected with described first, and the electronic building brick includes first
Electronic component and the second electronic component, the internal stress of first electronic component are more than the internal stress of second electronic component,
First electronic component is arranged in first splicing edge, and second electronic component is arranged in the non-edge area.
2. splicing wiring board according to claim 1, which is characterized in that the circuit base plate further includes being spelled with described first
The second splicing edge that edge fit edge is oppositely arranged, the electronic building brick further includes third electronic component, the third electronic component
It is arranged in second splicing edge, the third electronic component is staggered with first electronic component.
3. splicing wiring board according to claim 1, which is characterized in that the circuit base plate includes the hard stacked gradually
Insulating layer, line layer and anti-solder ink layer, first electronic component and second electronic component are welded in the circuit
Layer side opposite with the rigid insulation layer, and pass through the anti-solder ink layer.
4. splicing wiring board according to claim 3, which is characterized in that the circuit base plate further include flexible media layer and
Copper foil layer, the flexible media layer are fixed on the rigid insulation layer and deviate from the line layer side, and the copper foil layer is superimposed institute
It states on flexible media layer, and between the rigid insulation layer and the flexible media layer.
5. splicing wiring board according to claim 4, which is characterized in that the flexible media floor includes the firstth area and connection
The secondth area in firstth area, the rigid insulation layer orthographic projection is on the flexible media layer and view field and described the
One area overlaps, and cover film is just being thrown on the flexible media floor and view field coincides with secondth area.
6. splicing wiring board according to claim 5, which is characterized in that the first electronic component orthographic projection is located at described
In firstth area.
7. splicing wiring board according to claim 5, which is characterized in that first electronic component is in the flexible media
The orthographic projection of floor is located in secondth area, and the splicing wiring board includes steel reinforcement, and the flexibility is fixed in the steel reinforcement
On dielectric layer, be located at flexible media layer side opposite with first electronic component, and with the first electronic component phase
To setting.
8. splicing wiring board according to claim 7, which is characterized in that the flexible media layer is equipped with first through hole, institute
State the earth conductor that setting in first through hole is electrically connected the copper foil layer and the steel reinforcement.
9. splicing wiring board according to claim 7, which is characterized in that the rigid insulation layer is equipped with the second through-hole, institute
State the signal conductor that setting in the second through-hole is electrically connected the line layer and the copper foil layer.
10. a kind of terminal, which is characterized in that the terminal includes ontology, set on the mainboard of the body interior and such as right
It is required that splicing wiring board described in 1~9 any one, the splicing wiring board is set to the body interior, and electric with the mainboard
Connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610105660.5A CN105704922B (en) | 2016-02-25 | 2016-02-25 | Splice wiring board and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610105660.5A CN105704922B (en) | 2016-02-25 | 2016-02-25 | Splice wiring board and terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105704922A CN105704922A (en) | 2016-06-22 |
| CN105704922B true CN105704922B (en) | 2018-09-04 |
Family
ID=56223361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610105660.5A Expired - Fee Related CN105704922B (en) | 2016-02-25 | 2016-02-25 | Splice wiring board and terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105704922B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201491384U (en) * | 2009-08-19 | 2010-05-26 | 广东依顿电子科技股份有限公司 | Jointing-board structure of circuit board |
| CN201888027U (en) * | 2010-11-30 | 2011-06-29 | 金壬海 | Rigid flexible circuit board formed by pressing mixture of polyphenyl ether and polyimide |
| EP2498586A2 (en) * | 2011-03-11 | 2012-09-12 | Funai Electric Co., Ltd. | Flexible Flat Cable and Image Display Device |
| CN203661414U (en) * | 2013-11-22 | 2014-06-18 | 广州视源电子科技股份有限公司 | PCB spliced board |
-
2016
- 2016-02-25 CN CN201610105660.5A patent/CN105704922B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201491384U (en) * | 2009-08-19 | 2010-05-26 | 广东依顿电子科技股份有限公司 | Jointing-board structure of circuit board |
| CN201888027U (en) * | 2010-11-30 | 2011-06-29 | 金壬海 | Rigid flexible circuit board formed by pressing mixture of polyphenyl ether and polyimide |
| EP2498586A2 (en) * | 2011-03-11 | 2012-09-12 | Funai Electric Co., Ltd. | Flexible Flat Cable and Image Display Device |
| CN203661414U (en) * | 2013-11-22 | 2014-06-18 | 广州视源电子科技股份有限公司 | PCB spliced board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105704922A (en) | 2016-06-22 |
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