CN105682354A - Flexible-rigid combined board and terminal - Google Patents
Flexible-rigid combined board and terminal Download PDFInfo
- Publication number
- CN105682354A CN105682354A CN201610105727.5A CN201610105727A CN105682354A CN 105682354 A CN105682354 A CN 105682354A CN 201610105727 A CN201610105727 A CN 201610105727A CN 105682354 A CN105682354 A CN 105682354A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- layer
- foil layer
- soft
- hard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a flexible-rigid combined board and a terminal. The flexible-rigid combined board comprises two flexible circuit substrates and a rigid insulating layer, wherein each flexible circuit substrate comprises a flexible substrate layer, a copper foil layer and a covering film; each copper foil layer is laminated on the corresponding flexible substrate layer; each covering film is laminated on and covers the corresponding copper foil layer; and the rigid insulating layer is laminated between the two flexible circuit substrates and covers partial copper foil layers. The rigid insulating layer is laminated between the two flexible circuit substrates and covers partial copper foil layers, so that each flexible circuit substrate forms a rigid circuit board structure at the position corresponding to the rigid insulating layer, and forms a flexible circuit board structure at the part beyond the rigid insulating layer; fabrication of the flexible-rigid combined board can be finished only by employing production equipment of the flexible circuit substrates; the production cost of the flexible-rigid combined board is reduced; and the production efficiency of the flexible-rigid combined board is improved.
Description
Technical field
The present invention relates to electronic device field, particularly relate to a kind of soft or hard board and terminal.
Background technology
Soft or hard board is flexible circuit board and the combination of rigid wiring board, by flexible circuit board and rigid wiring board through operations such as pressings, combine by related process requirement, what formed has FPC characteristic and the wiring board of PCB characteristic, because soft or hard board is the combination of FPC and PCB, the production of soft or hard board should possess FPC production unit and PCB production unit simultaneously, thus causes production cost higher, and complex procedures, affect production efficiency.
Summary of the invention
In view of this, the present invention provides a kind of soft or hard board and the terminal that can improve production efficiency.
The present invention provides a kind of soft or hard board, wherein, described soft or hard board comprises two flexible circuit boards and hard insulation layer, flexible circuit board described in each comprises flexible substrate layer, copper foil layer and mulch film, described copper foil layer fits in described flexible substrate layer, described mulch film fits in described copper foil layer, and covers described copper foil layer, and described hard insulation layer fits between two described flexible circuit boards.
Wherein, flexible circuit board described in each comprises two layers of described copper foil layer, it is the first copper foil layer and the 2nd copper foil layer respectively, described first copper foil layer fits in the relative both sides of described flexible substrate layer respectively with described 2nd copper foil layer, described hard insulation layer fits in described first copper foil layer, and described mulch film fits in described 2nd copper foil layer.
Wherein, described flexible substrate layer is provided with signal via, arranges signal conductor in described signal via, and described signal conductor is connected to described first copper foil layer and described 2nd copper foil layer.
Wherein, described flexible substrate layer is provided with ground connection and crosses hole, and described ground connection is crossed and arranged ground connection conductor in hole, and described ground connection conductor is connected to described first copper foil layer and described 2nd copper foil layer.
Wherein, the corresponding described hard insulation layer of described mulch film is provided with welding hole, is welded with the electrical element being electrically connected described 2nd copper foil layer in described welding hole.
Wherein, described hard insulation layer is provided with through hole, arranges electrical conductor in described through hole, and described electrical conductor is electrically connected on the copper foil layer of two described flexible circuit boards.
Wherein, the both sides of described hard insulation layer arrange adhesive-layer, and two layers of described adhesive-layer are adhered to two described flexible circuit boards respectively.
Wherein, the flex area that described flexible substrate layer comprises two non-flex area and is connected between two non-flex area, described soft or hard board comprises two layers of described hard insulation layer, and two layers of described hard insulation layer fit in described flexible circuit board in corresponding two described non-flex area respectively.
Wherein, described hard insulation layer adopts polyethylene material.
The present invention also provides a kind of terminal, and wherein, described terminal comprises body, is located at soft or hard board described in the mainboard of described body interior and above-mentioned any one, and described soft or hard board is located at described body interior, and is electrically connected with described mainboard.
The soft or hard board of the present invention and terminal, fit between two described flexible circuit boards by described hard insulation layer, and copper foil layer described in cover part, described flexible circuit board is made to form rigid circuit board structure at correspondence described hard insulation layer place, exceeding described hard insulation layer part formation flexible circuitry plate structure, thus only need to use the production unit of flexible circuit board can complete the making of soft or hard board, thus reduce the production cost of described soft or hard board, it is to increase the production efficiency of described soft or hard board.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme of the present invention, it is briefly described to the accompanying drawing used required in enforcement mode below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the schematic cross-section of soft or hard board provided by the invention.
Embodiment
Below in conjunction with the accompanying drawing in embodiment of the present invention, the technical scheme in embodiment of the present invention is clearly and completely described.
Refer to Fig. 1, a kind of soft or hard board 100 provided by the invention, described soft or hard board 100 comprises two flexible circuit boards 10 and hard insulation layer 20, flexible circuit board 10 described in each comprises flexible substrate layer 11, copper foil layer 12 and mulch film 13, described copper foil layer 12 fits in described flexible substrate layer 11, described mulch film 13 fits in described copper foil layer 12, and cover described copper foil layer 12, described hard insulation layer 20 fits between two described flexible circuit boards 10, and copper foil layer 12 described in cover part. It should be appreciated that described soft or hard board 100 is applied in terminal, this terminal can be mobile phone, panel computer, notebook computer etc. The conduction that described soft or hard board 100 is responsible between terminal inner electronic component.
Fit between two described flexible circuit boards 10 by described hard insulation layer 20, and copper foil layer 12 described in cover part, described flexible circuit board 10 is made to form rigid circuit board structure at correspondence described hard insulation layer 10 place, exceeding described hard insulation layer part formation flexible circuitry plate structure, thus only need to use the production unit of flexible circuit board can complete the making of soft or hard board, thus reduce the production cost of described soft or hard board, it is to increase the production efficiency of described soft or hard board.
Described flexible circuit assembly 10 can be FPC (FlexiblePrintedCircuitboard, flexible PCB). Concrete, described flexible substrate layer 11 can adopt the material such as polyimide or the two stupid diformates (PolyethyleneterephthalatePET) of polyethylene, so that arranging described copper foil layer 12 in described flexible substrate layer 11, and described flexible substrate layer 11 can be described copper foil layer 12 provides insulation environment, so that etching signal walks line and ground connection walks line on described copper foil layer 12. Preferably, the thickness of described flexible substrate layer 11 can be 20 μm. Described flexible substrate layer 11 can arrange flex area 11a and non-flex area 11b, described flex area 11a is used for presenting flexibility, described Soft Bonding plate 100 is facilitated to produce deformation, and then facilitate described soft or hard board 100 to connect external device, described non-flex area 11b can fix hard plate, thus improve the rigidity of described Soft Bonding plate 100, thus described Soft Bonding plate 100 is facilitated to be assemblied in terminal.
In present embodiment, described copper foil layer 12 is the plate arranging Copper Foil on film, and the ground connection on described copper foil layer 12 is walked line and is Copper Foil with signal lead and becomes through etching technics according to predetermined wire structures. Ground connection on described copper foil layer 12 walks line and signal lead can be wholely set, and the signal lead on described copper foil layer 12 realizes the conduction between electric elements, and the ground connection on described copper foil layer 12 is walked line and carried out ground connection. Described flexible circuit board 10 can comprise two layers of described copper foil layer, 12, two layers of described copper foil layer 12 and fit in described flexible substrate layer 11 both sides respectively. In other embodiments, described flexible circuit board 10 can also be arrange copper foil layer 12 described in single side, copper foil layer 12 described in individual layer fits in described flexible substrate layer 11, and described hard insulation layer 20 fits in copper foil layer 12 described in individual layer and deviates from described flexible substrate layer 11 side; Copper foil layer 12 described in individual layer and described insulating rigid layer 20 can also be the both sides fitting in described flexible substrate layer 11 respectively.
In present embodiment, described mulch film 13 is laminated in described flexible substrate layer 11 and deviates from described hard insulation layer 20 side, and covers described copper foil layer 12. concrete, two layers of described copper foil layer 12 are the first copper foil layer 121 and the 2nd copper foil layer 122 that fit in described flexible substrate layer 11 both sides respectively. described insulating rigid layer 20 fits on described first copper foil layer 121, and described mulch film 13 fits on described 2nd copper foil layer 122. it is shaping that described mulch film 13 can adopt polyester material to carry out hot pressing. described mulch film 13 by paste adhesive on described 2nd copper foil layer 122. more specifically, described mulch film 13 fits on described 2nd copper foil layer 122 completely, and cover the signal lead on described 2nd copper foil layer 122 completely and ground connection walks line, namely described mulch film 13 is corresponding with the flex area 11a and non-flex area 11b of described flexible substrate layer 11, walk line to protect signal lead and ground connection on described 2nd copper foil layer 122 do not lost or damage, simultaneously, adopt the mode of paste adhesive, also described mulch film 13 can be made tightr with the connection of described 2nd copper foil layer 122, described covering rete 13 is prevented to be shifted and the part exposing described mulch film 13 cannot be walked line and protect. in other embodiments, if described flexible circuit board 10 arranges individual layer copper foil layer 12, then described mulch film 13 can also directly fit in described flexible substrate layer 11,In other embodiments, described mulch film 13 can also be arrange two layers, and two layers of described mulch film 13 fit on two layers of described copper foil layer 12 respectively.
In present embodiment, described hard insulation layer 20 adopts polyethylene material, described hard insulation layer 20 has insulativity characteristic, first copper foil layer 121 of two described flexible circuit boards 10 is completely cut off mutually, thus described first copper foil layer 121 signal lead of two described flexible circuit boards 10 is disturbed mutually. Described hard insulation layer 20 is corresponding to the non-flex area 11b of described flexible substrate layer 11. Utilize the rigidity of described hard insulation layer 20 so that the intensity of described soft or hard board 100 on described non-flex area 11b increases so that described soft or hard board 100 is in described non-flex area 11b not easily bending, and then realizes hard plate structure. Meanwhile, the circuit of described first copper foil layer 121 at 11b place, described non-flex area is protected by described hard insulation layer 20, increases the firm property of structure of described soft or hard board 100.
Further, described flexible substrate layer 11 is provided with signal via 111, through to described first copper foil layer 121 of described signal via 111 and described 2nd copper foil layer 122, arrange the signal conductor 112 of described first copper foil layer 121 of electrical connection and described 2nd copper foil layer 122 in described signal via 111. In present embodiment, described signal conductor 112 is copper post. Described signal conductor 112 runs through described flexible substrate layer 11, and described signal conductor 112 can be positioned at described flex area 11a, it is also possible to be positioned at described non-flex area 11b. The two ends of described signal conductor 112 are connected in the signal lead of described first copper foil layer 121 and the signal lead of described 2nd copper foil layer 122, thus the signal conduction on described first copper foil layer 121 and described 2nd copper foil layer 122, described flexible substrate layer 11 is utilized to completely cut off between described first copper foil layer 121 and described 2nd copper foil layer 122, prevent the signal lead of described first copper foil layer 121 and the signal lead short circuit of described 2nd copper foil layer 122, effectively improve the security of described soft or hard board 100. In other embodiments, described signal via 111 can also pass described hard insulation layer 20, so that the signal conduction between two described flexible circuit boards 10.
Further, described flexible substrate layer 11 is provided with the ground connection isolated with described signal via 111 and crosses hole 113, described ground connection crosses through to described first copper foil layer 121 in hole 22 and described 2nd copper foil layer 122, described ground connection is crossed and is arranged ground connection conductor 114 in hole 113, and described ground connection conductor 114 is electrically connected on described first copper foil layer 121 and described 2nd copper foil layer 122. In present embodiment, described ground connection conductor 114 can be conductive copper post or aluminium post, described ground connection conductor 114 can be the signal lead that one end is connected to described first copper foil layer 121, and the ground connection that the other end is connected to described 2nd copper foil layer 122 walks line, thus realizes described first copper foil layer 121 ground connection; Described ground connection conductor 114 can also be that the ground connection that one end is connected to described first copper foil layer 121 walks line, and the other end connects the signal lead of described 2nd copper foil layer 122, thus realizes described 2nd copper foil layer 122 ground connection. Certainly, in other embodiments, described ground connection crosses hole 113 can also run through described hard insulation layer 20, so that described ground connection conductor 114 is connected to described first copper foil layer 121 and described 2nd copper foil layer 122, and between ground-electrode, thus realize described first copper foil layer 121 and described 2nd copper foil layer 122 all ground connection.
Further, the corresponding described hard insulation layer 20 of described mulch film 13 is provided with welding hole 131, is welded with the electrical element 132 being electrically connected described 2nd copper foil layer 122 in described welding hole 131.
In present embodiment, described electrical element 132 can be the electronic components such as resistance, electric capacity, diode, it is also possible to is the devices such as junctor, chip or pad. Fill scolding tin in described welding hole 131, to be welded in the signal lead of described 2nd copper foil layer 122 by described electrical element 132, thus realize the function that described soft or hard board 100 possesses printed circuit board (PCB).
Further, described hard insulation layer 20 is provided with through hole 21, arranges electrical conductor 211 in described through hole 21, and described electrical conductor 211 is electrically connected between the copper foil layer 12 of two described flexible circuit boards 10.
In present embodiment, described first copper foil layer 121 of two described flexible circuit boards 10 is respectively equipped with different circuits, to increase the circuit arrangement space of described soft or hard board 100, it is to increase the conductivity of described soft or hard board 100. Described through hole 21 is opened in circuit one end of described first copper foil layer 121, and the circuit towards the first copper foil layer 121 described in another extends. Concrete, described electric-conductor 211 is the copper post through described through hole 21. Described electric-conductor 211 realizes the conducting of described two layer of first copper foil layer 121, thus the multi-line that ensure that described soft or hard board 100 walks line requirement. In other embodiments, the number of described through hole 21 can be multiple, and described electrical conductor 14 can be grounded conducting or realize signal conduction.
Further, the both sides of described hard insulation layer 20 arrange adhesive-layer 22, and two layers of described adhesive-layer 22 are adhered to two described flexible circuit boards 10 respectively. Concrete, two layers of described adhesive-layer 22 are adhered on two layers of described first copper foil layer 121 respectively, and corresponding to described non-flex area 11b. Described adhesive-layer 22 is utilized to be adhered between described hard insulation layer 20 and described first copper foil layer 121; make the structure of described soft or hard board 100 firm on the one hand; make the manufacture craft of described soft or hard board 100 easy on the other hand; reduce production cost; and improve described hard insulation layer 20 to the protection of described first copper foil layer 121; prevent described hard insulation layer 20 from misplacing with described first copper foil layer 121, so that the first copper foil layer 121 exposing described hard insulation layer 20 damages.
Further, the flex area 11a that described flexible substrate layer 11 comprises two non-flex area 11b and is connected between two non-flex area 11b, described soft or hard board 100 comprise two layers of described hard insulation layer, 20, two layers of described hard insulation layer 20 respectively corresponding two described non-flex area 11b fit in described flexible circuit board 10. Two layers of described hard insulation layer 20 are utilized to fit in 11b place, non-flex area described in two places of described flexible circuit board 10 respectively, so that described soft or hard board 100 can realize two printed circuit board arrangements, thus improve the functional of described soft or hard board 100, meet multiple occasion service requirements.
The present invention also provides a kind of terminal (not shown), described terminal comprises body (not shown), be located at described body interior mainboard (not shown) and described soft or hard board 100, described soft or hard board 100 is located at described body interior, and is electrically connected with described mainboard. Described terminal can be mobile phone, computer, flat board, handheld game machine or media player etc.
The soft or hard board of the present invention and terminal, fit between two described flexible circuit boards by described hard insulation layer, and copper foil layer described in cover part, described flexible circuit board is made to form rigid circuit board structure at correspondence described hard insulation layer place, exceeding described hard insulation layer part formation flexible circuitry plate structure, thus only need to use the production unit of flexible circuit board can complete the making of soft or hard board, thus reduce the production cost of described soft or hard board, it is to increase the production efficiency of described soft or hard board. Being more than the preferred embodiment of the present invention, it should be noted that for those skilled in the art, under the premise without departing from the principles of the invention, it is also possible to make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a soft or hard board, it is characterized in that, described soft or hard board comprises two flexible circuit boards and hard insulation layer, flexible circuit board described in each comprises flexible substrate layer, copper foil layer and mulch film, described copper foil layer fits in described flexible substrate layer, described mulch film fits in described copper foil layer, and covers described copper foil layer, and described hard insulation layer fits between two described flexible circuit boards.
2. soft or hard board according to claim 1, it is characterized in that, flexible circuit board described in each comprises two layers of described copper foil layer, it is the first copper foil layer and the 2nd copper foil layer respectively, described first copper foil layer fits in the relative both sides of described flexible substrate layer respectively with described 2nd copper foil layer, described hard insulation layer fits in described first copper foil layer, and described mulch film fits in described 2nd copper foil layer.
3. soft or hard board according to claim 2, it is characterised in that, described flexible substrate layer is provided with signal via, arranges signal conductor in described signal via, and described signal conductor is connected to described first copper foil layer and described 2nd copper foil layer.
4. soft or hard board according to claim 2, it is characterised in that, described flexible substrate layer is provided with ground connection and crosses hole, and described ground connection is crossed and arranged ground connection conductor in hole, and described ground connection conductor is connected to described first copper foil layer and described 2nd copper foil layer.
5. soft or hard board according to claim 2, it is characterised in that, the corresponding described hard insulation layer of described mulch film is provided with welding hole, is welded with the electrical element being electrically connected described 2nd copper foil layer in described welding hole.
6. soft or hard board according to claim 1, it is characterised in that, described hard insulation layer is provided with through hole, arranges electrical conductor in described through hole, and described electrical conductor is electrically connected on the copper foil layer of two described flexible circuit boards.
7. soft or hard board according to claim 1, it is characterised in that, the both sides of described hard insulation layer arrange adhesive-layer, and two layers of described adhesive-layer are adhered to two described flexible circuit boards respectively.
8. soft or hard board according to claim 1, it is characterized in that, the flex area that described flexible substrate layer comprises two non-flex area and is connected between two non-flex area, described soft or hard board comprises two layers of described hard insulation layer, and two layers of described hard insulation layer fit in described flexible circuit board in corresponding two described non-flex area respectively.
9. soft or hard board according to claim 1, it is characterised in that, described hard insulation layer adopts polyethylene material.
10. a terminal, it is characterised in that, described terminal comprises body, is located at the mainboard of described body interior and soft or hard board as described in claim 1～9 any one, and described soft or hard board is located at described body interior, and is electrically connected with described mainboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610105727.5A CN105682354A (en) | 2016-02-25 | 2016-02-25 | Flexible-rigid combined board and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610105727.5A CN105682354A (en) | 2016-02-25 | 2016-02-25 | Flexible-rigid combined board and terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105682354A true CN105682354A (en) | 2016-06-15 |
Family
ID=56306003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610105727.5A Pending CN105682354A (en) | 2016-02-25 | 2016-02-25 | Flexible-rigid combined board and terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105682354A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107949152A (en) * | 2017-11-30 | 2018-04-20 | 广州兴森快捷电路科技有限公司 | Rigid-flexible combined circuit board and preparation method thereof |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070000027A (en) * | 2005-06-24 | 2007-01-02 | 삼성전자주식회사 | Multi-layer flexible printed circuit and liquid crystal display device with the same |
| CN1960597A (en) * | 2005-11-04 | 2007-05-09 | 日本梅克特隆株式会社 | Hybrid multilayer circuit board and manufacture method thereof |
| CN101480114A (en) * | 2006-07-05 | 2009-07-08 | 富士通株式会社 | Printed circuit board, printed circuit board unit, and electronic apparatus |
| CN102045949A (en) * | 2011-01-14 | 2011-05-04 | 深圳市兴森快捷电路科技股份有限公司 | Method for making rigid/flexible combined printed circuit board |
| CN202068659U (en) * | 2011-03-15 | 2011-12-07 | 珠海元盛电子科技股份有限公司 | Layered FPC (Flexible Printed Circuit Board) for clamshell/slider mobile phone |
| CN102474985A (en) * | 2009-08-12 | 2012-05-23 | 大自达电线株式会社 | Multilayer flexible printed circuit board, and method for fabricating the same |
| CN103635036A (en) * | 2012-08-22 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | Flexible multilayer circuit board and method of manufacturing same |
| US20150282304A1 (en) * | 2014-03-26 | 2015-10-01 | Apple Inc. | Flexible Printed Circuits With Bend Retention Structures |
-
2016
- 2016-02-25 CN CN201610105727.5A patent/CN105682354A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070000027A (en) * | 2005-06-24 | 2007-01-02 | 삼성전자주식회사 | Multi-layer flexible printed circuit and liquid crystal display device with the same |
| CN1960597A (en) * | 2005-11-04 | 2007-05-09 | 日本梅克特隆株式会社 | Hybrid multilayer circuit board and manufacture method thereof |
| CN101480114A (en) * | 2006-07-05 | 2009-07-08 | 富士通株式会社 | Printed circuit board, printed circuit board unit, and electronic apparatus |
| CN102474985A (en) * | 2009-08-12 | 2012-05-23 | 大自达电线株式会社 | Multilayer flexible printed circuit board, and method for fabricating the same |
| CN102045949A (en) * | 2011-01-14 | 2011-05-04 | 深圳市兴森快捷电路科技股份有限公司 | Method for making rigid/flexible combined printed circuit board |
| CN202068659U (en) * | 2011-03-15 | 2011-12-07 | 珠海元盛电子科技股份有限公司 | Layered FPC (Flexible Printed Circuit Board) for clamshell/slider mobile phone |
| CN103635036A (en) * | 2012-08-22 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | Flexible multilayer circuit board and method of manufacturing same |
| US20150282304A1 (en) * | 2014-03-26 | 2015-10-01 | Apple Inc. | Flexible Printed Circuits With Bend Retention Structures |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107949152A (en) * | 2017-11-30 | 2018-04-20 | 广州兴森快捷电路科技有限公司 | Rigid-flexible combined circuit board and preparation method thereof |
| CN107949152B (en) * | 2017-11-30 | 2024-04-09 | 广州兴森快捷电路科技有限公司 | Manufacturing method of rigid-flex circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111511098B (en) | Flexible Printed Circuit (FPC) and display device | |
| US8779292B2 (en) | Substrate and substrate bonding device using the same | |
| CN105682343A (en) | Flexible-rigid combined board and terminal | |
| CN105682341B (en) | Rigid Flex and mobile terminal | |
| US7034232B2 (en) | Keysheet module | |
| CN105409025A (en) | Flexible printed circuit boards structure | |
| CN105555019A (en) | Soft-hard combination board, terminal and soft-hard combination board manufacturing method | |
| CN109257871B (en) | Flexible circuit board and mobile terminal | |
| CN109714882B (en) | Mobile terminal and flexible circuit board | |
| WO2014203633A1 (en) | Flexible cable and electronic apparatus | |
| CN112863442B (en) | Display panel and display device | |
| CN218768575U (en) | Display panel and display device | |
| CN105682354A (en) | Flexible-rigid combined board and terminal | |
| CN113838378B (en) | Display module and display device | |
| CN105430896B (en) | Flexible PCB and mobile terminal | |
| CN105578732B (en) | Rigid Flex and terminal | |
| CN105578724B (en) | Flexible PCB and mobile terminal | |
| CN105430883B (en) | Flexible PCB and mobile terminal | |
| CN105409026A (en) | Flexible printed circuit board structure | |
| CN105430880A (en) | Flexible circuit board and mobile terminal | |
| CN105530755A (en) | Rigid-flex board and mobile terminal | |
| CN105578747A (en) | Rigid-flex board and manufacturing method thereof | |
| CN112867226B (en) | High-frequency transmission circuit board and manufacturing method thereof | |
| CN105555020A (en) | Soft-hard combination board and terminal | |
| CN220653600U (en) | Multilayer substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160615 |