CN105430880A - Flexible circuit board and mobile terminal - Google Patents
Flexible circuit board and mobile terminal Download PDFInfo
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- CN105430880A CN105430880A CN201511025699.8A CN201511025699A CN105430880A CN 105430880 A CN105430880 A CN 105430880A CN 201511025699 A CN201511025699 A CN 201511025699A CN 105430880 A CN105430880 A CN 105430880A
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- layer
- line
- circuit board
- flexible circuit
- line layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/057—Shape retainable
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a flexible circuit board and a mobile terminal. A first dielectric layer comprises a non-bending region and a bending region arranged at one side of the non-bending region; the flexible circuit board comprises the first dielectric layer, a first line layer, a second line layer, a first protection layer and a second protection layer; the first line layer is provided with a first wiring end corresponding to the non-bending region and is provided with a second connecting line which is corresponding to the bending region and is connected with the first wiring end; the second line layer is utilized to correspondingly cover the non-bending region; a first electric conduction component is arranged between the second line layer and the first wiring end; and therefore, at the bending region of the flexible circuit board, only the first line layer is utilized to perform line connection, and the flexibility of the flexible circuit board at the bending region can be improved; and by means of the first line layer and the second line layer, the electric conduction performance of the flexible circuit board can be improved.
Description
Technical field
The present invention relates to display screen field, particularly relate to a kind of flexible circuit board and mobile terminal.
Background technology
The application of current flexible circuit board is more and more extensive, thus more and more stricter to the flexibility requirements of flexible circuit board.But current many flexible circuit board adopt multilayer wiring structure for meeting multiple electric conductivity; and in order to improve flexibility, individual layer line layer is only set in the flex area of flexible circuit board; but usually on individual layer line layer, only there is side cabling; and be adopt double shielding Rotating fields in current flexible PCB; and double shielding Rotating fields covers whole line layer; therefore cause the thickness of flexible circuit board in flex area to increase, thus flexibility is not good.
Summary of the invention
Not only in view of this, the invention provides and a kind ofly meet multiple electric conductivity but also improve flexible flexible circuit board and mobile terminal.
The invention provides a kind of flexible circuit board, wherein, described flexible circuit board comprises first medium layer, first line layer, second line layer, first protective layer and the second protective layer, described first medium layer comprises non-flex area and is arranged at the flex area of side, described non-flex area, described first line layer fits in described first medium layer side, and cover described non-flex area and described flex area, described second line layer fits in described first medium layer and deviates from described first line layer side, and the described non-flex area of corresponding covering, the first electric-conductor through described first medium layer is connected with between described second line layer and described first line layer, described first protective layer fits in described first line layer and deviates from described first medium layer side, the described flex area of corresponding covering and described non-flex area, described second protective layer fits in described second line layer and deviates from described first medium layer side, the described non-flex area of corresponding covering, or, described first protective layer fits in described first line layer and deviates from described first medium layer side, the described non-flex area of corresponding covering, described second protective layer fits in described second line layer and deviates from described first medium layer side, the described non-flex area of corresponding covering and described flex area.
Wherein, described flexible circuit board also comprises second dielectric layer and tertiary circuit layer; described second dielectric layer and described tertiary circuit layer are all laminated between described second line layer and described second protective layer; the described non-flex area of corresponding covering, and respectively near described second line layer and described second protective layer.
Wherein, described flexible circuit board also comprises the 3rd dielectric layer and the 4th line layer; described 3rd dielectric layer and described 4th line layer are all laminated between described tertiary circuit layer and described second protective layer; the described non-flex area of corresponding covering, and respectively near described tertiary circuit layer and described second protective layer.
Wherein, described flexible circuit board also comprises second dielectric layer and tertiary circuit layer; described second dielectric layer and described tertiary circuit layer are all laminated between described first line layer and described first protective layer; the described non-flex area of corresponding covering, and respectively near described first line layer and described first protective layer.
Wherein, described flexible circuit board also comprises the 3rd dielectric layer and the 4th line layer; described 3rd dielectric layer and described 4th line layer are all laminated between described tertiary circuit layer and described first protective layer; the described non-flex area of corresponding covering, and respectively near described tertiary circuit layer and described first protective layer.
Wherein, described flexible circuit board also comprises the 3rd dielectric layer and the 4th line layer; described 3rd dielectric layer and described 4th line layer are all laminated between described second line layer and described second protective layer; the described non-flex area of corresponding covering, and respectively near described second line layer and described second protective layer.
Wherein, described first line layer offers at described first terminals place the via hole being through to and described second line layer connecting described second circuit, and described first electric-conductor is fixed in described via hole.
Wherein, described first protective layer and described second protective layer respectively viscose glue to be adhered on described first line layer and on described second line layer.
Wherein, described first connecting line and described second connecting line are arranged in the corresponding described flex area place of described first line layer.
Invention also provides a kind of mobile terminal, and wherein, described mobile terminal comprises body, is located at flexible circuit board described in the mainboard of described body interior and above-mentioned any one, and described flexible circuit board is located at described body interior, and is electrically connected with described mainboard.
Flexible circuit board of the present invention and mobile terminal; by described first electric-conductor, the second circuit of described second line layer is guided on described first line layer; thus make the one-sided cabling of described first line layer; and utilize described first protective layer or described second protective layer corresponding described flex area that single protective layer is set, thus the flexibility of described flexible circuit board in flex area is improved.
Accompanying drawing explanation
In order to be illustrated more clearly in technical scheme of the present invention, be briefly described to the accompanying drawing used required in execution mode below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the schematic diagram of the flexible circuit board of the first embodiment provided by the invention;
Fig. 2 is the schematic diagram of the flexible circuit board of the second embodiment;
Fig. 3 is the schematic diagram of the flexible circuit board of the 3rd embodiment;
Fig. 4 is the schematic diagram of the flexible circuit board of the 4th embodiment;
Fig. 5 is the schematic diagram of the flexible circuit board of the 5th embodiment;
Fig. 6 is the schematic diagram of the flexible circuit board of the 6th embodiment.
Embodiment
Below in conjunction with the accompanying drawing in embodiment of the present invention, the technical scheme in embodiment of the present invention is clearly and completely described.
Refer to Fig. 1, the invention provides a kind of flexible circuit board 100 of the first embodiment, described flexible circuit board 100 comprises first medium layer 10, first line layer 20, second line layer 30, first protective layer 40 and the second protective layer 50.Described first medium layer 10 comprises non-flex area 11 and is arranged at the flex area 12 of side, described non-flex area 11.Described first line layer 20 fits in described first medium layer 10 side, and covers described non-flex area 11 and described flex area 12; The first terminals (not shown) that described first line layer 20 relatively described non-flex area 11 place is provided with first line (not shown) and disconnects mutually with described first line; Described first line layer 20 relatively described flex area 12 place is provided with the first connecting line (not shown) and the second connecting line (not shown) being connected described first terminals that connect described first line, described second line layer 30 correspondence covers described non-flex area 11, and being provided with the second circuit (not shown), the second circuit of described second line layer 30 and the first terminals of described first line layer 10 are connected with the first electric-conductor 31.Described first protective layer 40 fits in described first line layer 20 and deviates from described first medium layer 10 side; the described flex area 12 of corresponding covering and described non-flex area 11; described second protective layer 50 fits in described 30 layers, second circuit and deviates from described first medium layer 10 side, the described non-flex area 12 of corresponding covering.
By described first line layer 20, corresponding described non-flex area 11 place arranges the first terminals, and the second connecting line connecting described first terminals is set at correspondence described flex area 12 place, described second line layer 30 correspondence is utilized to cover described non-flex area 11, and the first electric-conductor 31 is set between described second circuit 30 and described first terminals, thus make the flex area 12 of described flexible circuit board 100 only utilize described first line layer 20 to carry out connection, and single protective layer is set, thus the flexibility of described flexible circuit board 100 in flex area 12 is improved, and make described flexible circuit board 100 that described first line layer 20 and described second line layer 20 can be utilized to improve electric conductivity.
In the present embodiment, described first medium layer 10 can adopt the material such as polyimides or the two stupid diformates (PolyethyleneterephthalatePET) of polyethylene, so that arrange described first line layer 20 and described second line layer 30 on described first medium layer 10, and described first medium layer 10 can provide insulation environment for described first line layer 20 and described tertiary circuit layer 40, so that the etching of described first line layer 20 and described second line layer 30.Preferably, the thickness of described first medium layer 10 can be 20 μm.Described non-flex area 11 can be that the both sides being positioned at described flex area 12 are oppositely arranged, thus the conducting making described flexible circuit board 100 realize between multiple electronic devices and components and multiple electronic devices and components.
In this side's of enforcement example, described first line layer 20 is plate film being arranged Copper Foil, and the first line on described first line layer 20 and the first connecting line are Copper Foil and form through etching technics according to prescribed route structure.Described first line layer and described first connecting line can be wholely set, and described first line layer and described first connecting line form conducting wire, thus realize the conduction between electric elements.Described first terminals disconnect mutually with described first line, described first terminals can be the one end being arranged at the second connecting line, thus described first terminals and described first line do not interfere with each other, so that described second connecting line can be other, more electric elements realize conduction connection.Described first connecting line and described second connecting line are arranged in described first line corresponding described flex area 12 place of 20 plates layer by layer, thus make the wiring at described first line layer 20 corresponding described flex area 12 place tight, thus reduce the width of the corresponding described flex area 12 of described first line layer 20, thus the bending part width of described flexible circuit board 100 is reduced, improve the flexibility of described flexible circuit board 100 further.In other embodiments, described first line and described first connecting line also can be made up of the cable of many same alike results, and the number of described first terminals and described second connecting line also can be multiple.
In the present embodiment, described second line layer 30 is plate film being arranged Copper Foil, and the second circuit on described second line layer 30 is that Copper Foil forms through etching technics according to prescribed route structure.Relatively described first terminals in one end of described second circuit are arranged, thus facilitate one end of described second circuit to be electrically connected described first electric-conductor 31, and described first electric-conductor 31 is electrically connected described first terminals away from one end of described second circuit.Described first electric-conductor 31 runs through described second line layer 30, first medium layer 10 and described first line layer 20, thus the second circuit of described second line layer 30 is electrically connected on the second connecting line on described first line layer 20, thus make described first line layer 20 that multiple circuit can be set at correspondence described flex area 12 place, thus improve the conduction switching performance of described flexible circuit board 100, and improve the flex capability of described flexible circuit board 100.In other embodiments, the number of described second circuit and described first electric-conductor 211 also can be multiple.
In the present embodiment, it is hot-forming that described first protective layer 40 and described second protective layer 50 can adopt polyester material to carry out.Described first protective layer 40 and described second protective layer 50 are pasted on described first line layer 20 and described second line layer 30 respectively by viscose glue.Because cabling is carried out by means of only described first line layer 20 in the corresponding described flex area 2 of described flexible circuit board 100; thus described first protective layer 40 or described second protective layer 50 corresponding described flex area 12 place can hollow out; thus reduce the thickness of described flexible circuit board 100 in described flex area 12, thus improve the flexibility of described flexible circuit board 100.Concrete, describedly fit on described first line layer 20 completely, and the first line covered on described first line layer 20, first connecting line and the second connecting line, to protect described first line, the cabling of the first connecting line and the second connecting line is not lost or is damaged, simultaneously, adopt the mode of paste adhesive, also described first protective layer 40 can be made tightr with the connection of described first line layer 20, described first protective layer 40 is prevented to be shifted and cannot to the part first line exposing the first protective layer 40, first connecting line and the second connecting line are protected.Described second protective layer 50 and the identical setting of described first protective layer 40 structure; unlike; described second protective layer 50 is except fitting on described second line layer 30; also fit on the flex area 12 of described first medium layer 10; thus realize better to the sealing of described second circuit, and improve the switching performance of described second circuit.In other embodiments, described first protective layer 40 and described second protective layer 50 can also be adopt spraying plated film mode to carve to be plated on described first line layer 20 and described second line layer 30; Described first protective layer 40 fits in described first line layer 20 and deviates from described first medium layer 10 side; the described non-flex area 11 of corresponding covering; described second protective layer 50 fits in described second line layer 30 and deviates from described first medium layer 10 side, the described non-flex area 11 of corresponding covering and described flex area 12.
In the present embodiment, described first line layer 20 offers the via hole 20a being through to and described second line layer 30 connecting described second circuit at described first terminals place, and described first electric-conductor 31 is fixed in described via hole 20a.Concrete, described via hole 20a also runs through described first medium layer 10 and described second line layer 30, and described first electric-conductor 31 is the copper post through described via hole 20a.Described first electric-conductor 31 is successively through described first line layer 20, first medium layer 10 and described second line layer 30, and then make the second circuit of described second line layer 30 can be connected to the second connecting line of described first line layer 20, thus ensure that the multi cabling requirement of described flexible circuit board 100.
Further; refer to Fig. 2; the present invention also provides the flexible circuit board 200 of the second embodiment; roughly the same with described flexible circuit board 100; second dielectric layer 210 and tertiary circuit layer 230 is also comprised unlike described flexible circuit board 200; described second dielectric layer 210 and described tertiary circuit layer 230 are all laminated between described first line layer 20 and described first protective layer 40, the described non-flex area 11 of corresponding covering, and respectively near described first line layer 20 and described first protective layer 40.Described tertiary circuit layer 40 is provided with tertiary circuit (sign), described first line layer 20 relatively described non-flex area 11 place is provided with the second terminals (sign), and relatively described flex area 12 place is provided with the 3rd connecting line (sign) of described second terminals of electrical connection, is connected with the second electric-conductor 41 between the second terminals 22 of described first line layer 20 and described tertiary circuit.
Concrete, described second dielectric layer 210 is roughly the same with described first medium layer 10 structure, unlike, described second dielectric layer 210 is the corresponding non-flex area 11 covering described first medium layer 10 only.Described second dielectric layer 210 provides insulation environment for described tertiary circuit layer 230 and described first line layer 20.Described second dielectric layer 210 can be adopt hot press forming technology to fit on described first line layer 20.Described tertiary circuit layer 230 is the corresponding non-flex area 11 covering described first medium layer 10 only, and the tertiary circuit on described tertiary circuit layer 230 can connect different electronic devices and components respectively from the first line on described first line layer 20.Second terminals 22 of described first line layer 20 are electrically connected described tertiary circuit by described second electric-conductor 41, thus make described tertiary circuit be electrically connected on described 3rd connecting line, and then ensure that described flexible circuit board 100 can connect more polyelectron components and parts further, put on electric conductivity, make described flexible circuit board 100 can only utilize described first line layer 20 cabling by bending part simultaneously, thus described flexible circuit board 100 is improved in the flexibility of bending part.Described second electric-conductor 41 and the identical setting of described first electric-conductor 31 structure, described tertiary circuit layer 230, second dielectric layer 210 and first line layer 20 arrange the via hole (sign) connected, described two electric-conductors 41 are arranged in described via hole, described second electric-conductor 41 is successively through described tertiary circuit layer 230, second dielectric layer 210 and first line layer 20, and described second electric-conductor 41 disconnects with described first electric-conductor 31 phase, thus ensure that the conduction property of described flexible circuit board 100.
Further; refer to Fig. 3; the present invention also provides the flexible circuit board 300 of the 3rd embodiment; roughly the same with described flexible circuit board 200; the 3rd dielectric layer 310 and the 4th line layer 340 is also comprised unlike described flexible circuit board 300; described 3rd dielectric layer 310 and described 4th line layer 340 are all laminated between described tertiary circuit layer 230 and described first protective layer 40; the described non-flex area 11 of corresponding covering, and respectively near described tertiary circuit layer 230 and described first protective layer 40.Described 4th line layer 340 is provided with the 4th circuit (sign), described first line layer 20 relatively described non-flex area 11 place is provided with the 3rd terminals (not shown), and relatively described flex area 12 place is provided with the 3rd connecting line being electrically connected described 3rd terminals 23, between the 3rd terminals of described first line layer 20 and described 4th circuit, connect the 3rd electric-conductor 51.
Concrete, described 3rd dielectric layer 310 and the identical setting of described second dielectric layer 210 structure, described 3rd dielectric layer 310 is hot-forming between described three line layers 230 and described 4th line layer 340.Described 4th line layer 340 fits between described 3rd dielectric layer 310 and described first protective layer 40.4th circuit of described 4th line layer 340 is connected to the 3rd connecting line on described first line layer 20 through described 3rd electric-conductor 51, thus make described flexible circuit board 100 can connect more electronic devices and components further, thus improve the serviceability of described flexible circuit board 100, and individual layer line layer still can be set carry out cabling by bending part of described flexible circuit board 100, ensure the flexibility of described flexible circuit board 100.Described 3rd electric-conductor 51 and the identical setting of described second electric-conductor 41 structure, described 3rd electric-conductor 51 is successively through described 4th line layer 340, the 3rd dielectric layer 310, tertiary circuit layer 230, second dielectric layer 210 and described first line layer 20.
Further, refer to Fig. 4, the present invention also provides the flexible circuit board 400 of the 4th embodiment, roughly the same with described flexible circuit board 300, unlike, described 3rd dielectric layer 410 and described 4th line layer 440 are all laminated between described second line layer 30 and described second protective layer 50, the described non-flex area 11 of corresponding covering, and respectively near described second line layer 30 and described second protective layer 50, described 4th line layer 440 is provided with the 4th circuit, described first line layer 20 relatively described non-flex area 11 place is provided with the 3rd terminals 423, and relatively described flex area 12 place is provided with the 3rd connecting line being electrically connected described 3rd terminals 423, the 3rd electric-conductor 451 is connected with between 3rd terminals 423 of described first line layer 20 and described 4th circuit.Described 3rd electric-conductor 451 and the identical setting of described second electric-conductor 41 structure, described 3rd electric-conductor 451 is successively through described 4th line layer 440, the 3rd dielectric layer 410, second line layer 30, first medium layer 10 and described first line layer 20.Described 3rd dielectric layer 410 and described 4th line layer 440 are arranged between described second line layer 30 and described second protective layer 50; make the both sides of described first medium layer 10 that the line layer of the identical number of plies is set; thus make the consistency of thickness of described first medium layer 10 both sides; thus described flexible circuit board 100 is increased in non-flex area place connected mode, improve the using function of described flexible circuit board 100.
Further, refer to Fig. 5, the present invention also provides the flexible circuit board 500 of the 5th embodiment, roughly the same with described flexible circuit board 200, unlike, described second dielectric layer 510 and described tertiary circuit 530 layers are all laminated between described second line layer 30 and described second protective layer 50, the described non-flex area 11 of corresponding covering, and respectively near described second line layer 30 and described second protective layer 50, described tertiary circuit layer 530 is provided with tertiary circuit, described first line layer 20 relatively described non-flex area 11 place is provided with the second terminals (sign), and relatively described flex area 12 place is provided with the 3rd connecting line of described second terminals of electrical connection, the second electric-conductor 541 is connected with between second terminals of described first line layer 20 and described tertiary circuit.Described second electric-conductor 541 is successively through described tertiary circuit layer 530, described second dielectric layer 510 second line layer 30, described first medium layer 10 and described first line layer 20.
Further, refer to Fig. 6, the present invention also provides the flexible circuit board 600 of the 5th embodiment, roughly the same with described flexible circuit board 300, unlike, described 3rd dielectric layer 610 and described 4th line layer 640 are all laminated between described tertiary circuit layer 630 and described second protective layer 50, the described non-flex area 11 of corresponding covering, and respectively near described tertiary circuit layer 630 and described second protective layer 50, described 4th line layer 640 is provided with the 4th circuit, described first line layer 20 relatively described non-flex area 11 place is provided with the 3rd terminals (sign), and relatively described flex area 12 place is provided with the 3rd connecting line being electrically connected described 3rd terminals, the 3rd electric-conductor 61 is connected between 3rd terminals of described first line layer 20 and described 4th circuit.Described 3rd electric-conductor 61 is successively through described 4th line layer 640, the 3rd dielectric layer 610, tertiary circuit layer 630, described second dielectric layer 610, second line layer 30, described first medium layer 10 and described first line layer 20.
The present invention also provides a kind of mobile terminal (not shown), described mobile terminal comprises body (not shown), is located at the mainboard (not shown) of described body interior and described flexible circuit board 100, described flexible circuit board 100 is located at described body interior, and is electrically connected with described mainboard.Described mobile terminal can be mobile phone, computer, flat board, handheld device or media player etc.
Flexible circuit board of the present invention and mobile terminal; by described first electric-conductor, the second circuit of described second line layer is guided on described first line layer; thus make the one-sided cabling of described first line layer; and utilize described first protective layer or described second protective layer corresponding described flex area that single protective layer is set, thus the flexibility of described flexible circuit board in flex area is improved.
Be more than the preferred embodiment of the present invention, it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention, can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a flexible circuit board, it is characterized in that, described flexible circuit board comprises first medium layer, first line layer, second line layer, first protective layer and the second protective layer, described first medium layer comprises non-flex area and is arranged at the flex area of side, described non-flex area, described first line layer fits in described first medium layer side, and cover described non-flex area and described flex area, described second line layer fits in described first medium layer and deviates from described first line layer side, and the described non-flex area of corresponding covering, the first electric-conductor through described first medium layer is connected with between described second line layer and described first line layer, described first protective layer fits in described first line layer and deviates from described first medium layer side, the described flex area of corresponding covering and described non-flex area, described second protective layer fits in described second line layer and deviates from described first medium layer side, the described non-flex area of corresponding covering, or, described first protective layer fits in described first line layer and deviates from described first medium layer side, the described non-flex area of corresponding covering, described second protective layer fits in described second line layer and deviates from described first medium layer side, the described non-flex area of corresponding covering and described flex area.
2. flexible circuit board according to claim 1; it is characterized in that; described flexible circuit board also comprises second dielectric layer and tertiary circuit layer; described second dielectric layer and described tertiary circuit layer are all laminated between described second line layer and described second protective layer; the described non-flex area of corresponding covering, and respectively near described second line layer and described second protective layer.
3. flexible circuit board according to claim 2; it is characterized in that; described flexible circuit board also comprises the 3rd dielectric layer and the 4th line layer; described 3rd dielectric layer and described 4th line layer are all laminated between described tertiary circuit layer and described second protective layer; the described non-flex area of corresponding covering, and respectively near described tertiary circuit layer and described second protective layer.
4. flexible circuit board according to claim 1; it is characterized in that; described flexible circuit board also comprises second dielectric layer and tertiary circuit layer; described second dielectric layer and described tertiary circuit layer are all laminated between described first line layer and described first protective layer; the described non-flex area of corresponding covering, and respectively near described first line layer and described first protective layer.
5. flexible circuit board according to claim 4; it is characterized in that; described flexible circuit board also comprises the 3rd dielectric layer and the 4th line layer; described 3rd dielectric layer and described 4th line layer are all laminated between described tertiary circuit layer and described first protective layer; the described non-flex area of corresponding covering, and respectively near described tertiary circuit layer and described first protective layer.
6. flexible circuit board according to claim 4; it is characterized in that; described flexible circuit board also comprises the 3rd dielectric layer and the 4th line layer; described 3rd dielectric layer and described 4th line layer are all laminated between described second line layer and described second protective layer; the described non-flex area of corresponding covering, and respectively near described second line layer and described second protective layer.
7. flexible circuit board according to claim 1, is characterized in that, described first line layer offers at described first terminals place the via hole being through to and described second line layer connecting described second circuit, and described first electric-conductor is fixed in described via hole.
8. flexible circuit board according to claim 1, is characterized in that, described first protective layer and described second protective layer respectively viscose glue are adhered on described first line layer with on described second line layer.
9. flexible circuit board according to claim 1, is characterized in that, described first connecting line and described second connecting line are arranged in the corresponding described flex area place of described first line layer.
10. a mobile terminal, it is characterized in that, described mobile terminal comprises body, is located at the mainboard of described body interior and flexible circuit board as described in claim 1 ~ 9 any one, and described flexible circuit board is located at described body interior, and is electrically connected with described mainboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511025699.8A CN105430880A (en) | 2015-12-29 | 2015-12-29 | Flexible circuit board and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511025699.8A CN105430880A (en) | 2015-12-29 | 2015-12-29 | Flexible circuit board and mobile terminal |
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| Publication Number | Publication Date |
|---|---|
| CN105430880A true CN105430880A (en) | 2016-03-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511025699.8A Pending CN105430880A (en) | 2015-12-29 | 2015-12-29 | Flexible circuit board and mobile terminal |
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| CN110875156A (en) * | 2018-08-30 | 2020-03-10 | 群光电子股份有限公司 | Thin film switch device and keyboard device |
| CN111179759A (en) * | 2020-02-12 | 2020-05-19 | 京东方科技集团股份有限公司 | Folding structure and folding display device |
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| CN104754854A (en) * | 2013-12-30 | 2015-07-01 | 比亚迪股份有限公司 | Flexible circuit board and preparation method thereof |
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| CN1799289A (en) * | 2003-06-02 | 2006-07-05 | 昭和电工株式会社 | Flexible wiring board and flex-rigid wiring board |
| CN1900157A (en) * | 2006-03-20 | 2007-01-24 | 刘萍 | Flexible printed circuit coating film and its preparing method |
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| CN110875156A (en) * | 2018-08-30 | 2020-03-10 | 群光电子股份有限公司 | Thin film switch device and keyboard device |
| CN111179759A (en) * | 2020-02-12 | 2020-05-19 | 京东方科技集团股份有限公司 | Folding structure and folding display device |
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Application publication date: 20160323 |