CN105636334A - Flexible printed circuit board and mobile terminal - Google Patents
Flexible printed circuit board and mobile terminal Download PDFInfo
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- CN105636334A CN105636334A CN201511025741.6A CN201511025741A CN105636334A CN 105636334 A CN105636334 A CN 105636334A CN 201511025741 A CN201511025741 A CN 201511025741A CN 105636334 A CN105636334 A CN 105636334A
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- line layer
- flex area
- flexible pcb
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Insulated Conductors (AREA)
Abstract
The invention discloses a flexible printed circuit board and a mobile terminal. A first dielectric layer comprises non-bending regions and a bending region arranged on one side of the non-bending regions. The flexible printed circuit board comprises the first dielectric layer, a first circuit layer, a second circuit layer, a first protection layer and a second protection layer. First terminals are arranged in places, corresponding to the non-bending regions, of the first circuit layer. A second connection line connecting the first terminals is arranged in a place corresponding to the bending region. The second circuit layer is used for correspondingly covering the non-bending regions and first conductive pieces are arranged between the second circuit layer and the first terminals. Thus, circuit connection can be performed on the bending region of the flexible printed circuit board via the first circuit layer; flexibility of the flexible printed circuit board in the bending region is improved; and by use of the first circuit layer and the second circuit layer, the conductive performance of the flexible printed circuit board can be improved.
Description
Technical field
The present invention relates to display screen field, particularly relate to a kind of flexible PCB and mobile terminal.
Background technology
The application of current flexible PCB is more and more extensive, thus the flexibility requirements of flexible PCB is more and more stricter. But current many flexible PCBs adopt multilayer wiring structure for meeting multiple conductivity, thus the flexibility causing flexible PCB is not good, and then affects the use of flexible PCB. Do not have one both can meet multiple conductivity at present, the flexible PCB of flex capability can be improved again.
Summary of the invention
Not only in view of this, the present invention provides a kind of and meets multiple conductivity but also improve flexible flexible PCB and mobile terminal.
The present invention provides a kind of flexible PCB, wherein, described flexible PCB comprises first medium layer, first line layer, two line layers, first protective layer and the 2nd protective layer, described first medium layer comprises non-flex area and is arranged at the flex area of side, described non-flex area, described first line layer fits in described first medium layer side, and cover described non-flex area and described flex area, the first wiring end that position, described first line layer relatively described non-flex area is provided with first line and disconnects mutually with described first line, position, described first line layer relatively described flex area is provided with the first wire connecting described first line and connects the 2nd wire of described first wiring end, described two line layers fits in described first medium layer and deviates from described first line layer side, and the described non-flex area of corresponding covering, described two line layers is provided with the 2nd circuit, described 2nd circuit and described first wiring end are connected with the first electric-conductor through described first medium layer, described first protective layer and described 2nd protective layer all cover described flex area and described non-flex area, described first protective layer fits in described first line layer and deviates from described first medium layer side, described 2nd protective layer fits in described two line layers and deviates from described first medium layer side.
Wherein, described flexible PCB also comprises second dielectric layer and the 3rd line layer, described second dielectric layer and described 3rd line layer are all laminated between described first line layer and described first protective layer, the described non-flex area of corresponding covering, and respectively near described first line layer and described first protective layer, described 3rd line layer is provided with the 3rd circuit, described first line layer relatively described non-flex area place is provided with the 2nd wiring end, and relatively described flex area place is provided with the 3rd wire being electrically connected described 2nd wiring end, the 2nd electric-conductor through described second dielectric layer and described first line layer it is connected with between described 2nd wiring end and described 3rd circuit.
Wherein, described flexible PCB also comprises the 3rd medium layer and the 4th line layer, described 3rd medium layer and described 4th line layer are all laminated between described 3rd line layer and described first protective layer, the described non-flex area of corresponding covering, and respectively near described 3rd line layer and described first protective layer, described 4th line layer is provided with the 4th circuit, described first line layer relatively described non-flex area place is provided with the 3rd wiring end, and relatively described flex area place is provided with the 3rd wire being electrically connected described 3rd wiring end, it is connected with successively through described 3rd line layer between described 3rd wiring end and described 4th circuit, 3rd electric-conductor of second dielectric layer and first line layer.
Wherein, described flexible PCB also comprises the 3rd medium layer and the 4th line layer, described 3rd medium layer and described 4th line layer are all laminated between described two line layers and described 2nd protective layer, the described non-flex area of corresponding covering, and respectively near described two line layers and described 2nd protective layer, described 4th line layer is provided with the 4th circuit, described first line layer relatively described non-flex area place is provided with the 3rd wiring end, and relatively described flex area place is provided with the 3rd wire being electrically connected described 3rd wiring end, it is connected with successively through described 4th line layer between described 3rd wiring end and described 4th circuit, 3rd medium layer, 3rd line layer, 3rd electric-conductor of second dielectric layer and described first line layer.
Wherein, described flexible PCB also comprises second dielectric layer and the 3rd line layer, described second dielectric layer and described 3rd line layer are all laminated between described two line layers and described 2nd protective layer, the described non-flex area of corresponding covering, and respectively near described two line layers and described 2nd protective layer, described 3rd line layer is provided with the 3rd circuit, described first line layer relatively described non-flex area place is provided with the 2nd wiring end, and relatively described flex area place is provided with the 3rd wire being electrically connected described 2nd wiring end, it is connected with successively through described 3rd line layer between described 2nd wiring end and described 3rd circuit, described second dielectric layer, two line layers, 2nd electric-conductor of described first medium layer and described first line layer.
Wherein, described flexible PCB also comprises the 3rd medium layer and the 4th line layer, described 3rd medium layer and described 4th line layer are all laminated between described 3rd line layer and described 2nd protective layer, the described non-flex area of corresponding covering, and respectively near described 3rd line layer and described 2nd protective layer, described 4th line layer is provided with the 4th circuit, described first line layer relatively described non-flex area place is provided with the 3rd wiring end, and relatively described flex area place is provided with the 3rd wire being electrically connected described 3rd wiring end, it is connected with successively through described 4th line layer between described 3rd wiring end and described 4th circuit, 3rd medium layer, 3rd line layer, described second dielectric layer, two line layers, 3rd electric-conductor of first medium layer and first line layer. wherein, described first line layer offer at described first wiring end place be through in described two line layers to connect described 2nd circuit cross hole, described first electric-conductor is fixed on described mistake in hole.
Wherein, described first protective layer and described 2nd protective layer respectively viscose glue be adhered on described first line layer and described two line layers on.
Wherein, described first wire and described 2nd wire are arranged in the corresponding described flex area place of described first line layer.
The present invention also provides a kind of mobile terminal, and wherein, described mobile terminal comprises body, is located at flexible PCB described in the mainboard of described body interior and above-mentioned any one, and described flexible PCB is located at described body interior, and is electrically connected with described mainboard.
The flexible PCB of the present invention and mobile terminal, by described first line layer, corresponding described non-flex area place arranges the first wiring end, and the 2nd wire connecting described first wiring end is set at correspondence described flex area place, described two line layers correspondence is utilized to cover described non-flex area, and the first electric-conductor is set between described 2nd circuit and described first wiring end, so that the flex area of described flexible PCB only utilizes described first line layer to carry out connection, so that described flexible PCB is in the flexible raising of flex area, and make described flexible PCB that described first line layer and described two line layers can be utilized to improve conductivity.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme of the present invention, it is briefly described to the accompanying drawing used required in enforcement mode below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the schematic diagram of the flexible PCB of the first embodiment provided by the invention;
Fig. 2 is the schematic diagram of the flexible PCB of the 2nd embodiment;
Fig. 3 is the schematic diagram of the flexible PCB of the 3rd embodiment;
Fig. 4 is the schematic diagram of the flexible PCB of the 4th embodiment;
Fig. 5 is the schematic diagram of the flexible PCB of the 5th embodiment;
Fig. 6 is the schematic diagram of the flexible PCB of the 6th embodiment.
Embodiment
Below in conjunction with the accompanying drawing in embodiment of the present invention, the technical scheme in embodiment of the present invention is clearly and completely described.
Referring to Fig. 1, the present invention provides a kind of flexible PCB 100 of the first embodiment, and described flexible PCB 100 comprises first medium layer 10, first line layer 20, two line layers 30, first protective layer 40 and the 2nd protective layer 50. Described first medium layer 10 comprises non-flex area 11 and is arranged at the flex area 12 of side, described non-flex area 11. Described first line layer 20 fits in described first medium layer 10 side, and covers described non-flex area 11 and described flex area 12; The first wiring end (not shown) that described first line layer 20 relatively described non-flex area 11 place is provided with first line (not shown) and disconnects mutually with described first line; Described first line layer 20 relatively described flex area 12 place is provided with the first wire (not shown) connecting described first line and connects the 2nd wire (not shown) of described first wiring end, described two line layers 30 correspondence covers described non-flex area 11, and it being provided with the 2nd circuit (not shown), the 2nd circuit of described two line layers 30 and the first wiring end of described first line layer 10 are connected with the first electric-conductor 31. Described first protective layer 40 and described 2nd protective layer 50 all cover described flex area 12 and described non-flex area 11; described first protective layer 40 fits in described first line layer 20 and deviates from described first medium layer 10 side, and described 2nd protective layer 50 fits in described two line layers 30 and deviates from described first medium layer 10 side.
By described first line layer 20, corresponding described non-flex area 11 place arranges the first wiring end, and the 2nd wire connecting described first wiring end is set at correspondence described flex area 12 place, described two line layers 30 correspondence is utilized to cover described non-flex area 11, and the first electric-conductor 31 is set between described 2nd circuit 30 and described first wiring end, so that the flex area 12 of described flexible PCB 100 only utilizes described first line layer 20 to carry out connection, so that described flexible PCB 100 is in the flexible raising of flex area 12, and make described flexible PCB 100 that described first line layer 20 and described two line layers 20 can be utilized to improve conductivity.
In the present embodiment, described first medium layer 10 can adopt the material such as polyimide or the two stupid diformates (PolyethyleneterephthalatePET) of polyethylene, so that arranging described first line layer 20 and described two line layers 30 on described first medium layer 10, and described first medium layer 10 can provide insulation environment for described first line layer 20 and described 3rd line layer 40, so that the etching of described first line layer 20 and described two line layers 30. Preferably, the thickness of described first medium layer 10 can be 20 ��m. Described non-flex area 11 can be that the both sides being positioned at described flex area 12 are oppositely arranged, so that described flexible PCB 100 realizes the conducting between multiple electronic devices and components and multiple electronic devices and components.
In this embodiment party example, described first line layer 20 is the plate arranging Copper Foil on film, and the first line on described first line layer 20 is Copper Foil with the first wire and becomes through etching technics according to predetermined wire structures. Described first line layer and described first wire can be wholely set, and described first line layer and described first wire form conducting wire, thus realize the conduction between electric elements. Described first wiring end disconnects mutually with described first line, described first wiring end can be the one end being arranged at the 2nd wire, thus described first wiring end and described first line do not interfere with each other, so that described 2nd wire can be other more electric elements realizes conduction connection. Described first wire and described 2nd wire are arranged in described first line layer 20 corresponding described flex area 12 place, so that the wiring at described first line layer 20 corresponding described flex area 12 place is tight, thus reduce the width of the corresponding described flex area 12 of described first line layer 20, so that the bending part width of described flexible PCB 100 reduces, improve the flexibility of described flexible PCB 100 further. In other embodiments, described first line and described first wire can also be made up of the cable of many same alike results, and the number of described first wiring end and described 2nd wire can also be multiple.
In the present embodiment, described two line layers 30 is the plate arranging Copper Foil on film, and the 2nd circuit in described two line layers 30 is that Copper Foil becomes through etching technics according to predetermined wire structures. The relatively described first wiring end in one end of described 2nd circuit is arranged, thus the one end facilitating described 2nd circuit is electrically connected described first electric-conductor 31, and described first electric-conductor 31 is electrically connected described first wiring end away from one end of described 2nd circuit. Described first electric-conductor 31 runs through described two line layers 30, first medium layer 10 and described first line layer 20, thus the 2nd circuit of described two line layers 30 is electrically connected on the 2nd wire on described first line layer 20, so that described first line layer 20 can arrange multiple circuit at correspondence described flex area 12 place, thus improve described flexible PCB 100 lead electrical connection properties, and improve the flex capability of described flexible PCB 100. In other embodiments, the number of described 2nd circuit and described first electric-conductor 211 can also be multiple.
In the present embodiment, it is shaping that described first protective layer 40 and described 2nd protective layer 50 can adopt polyester material to carry out hot pressing. described first protective layer 40 and described 2nd protective layer 50 are pasted on respectively by viscose glue in described first line layer 20 and described two line layers 30. concrete, described fit on described first line layer 20 completely, and cover the first line on described first line layer 20, first wire and the 2nd wire, to protect described first line, the line of walking of the first wire and the 2nd wire is not lost or is damaged, simultaneously, adopt the mode of paste adhesive, also described first protective layer 40 can be made tightr with the connection of described first line layer 20, prevent described first protective layer 40 to be shifted and cannot to the part first line exposing the first protective layer 40, first wire and the 2nd wire are protected. described 2nd protective layer 50 and the described first identical setting of protective layer 40 structure, the difference is that, described 2nd protective layer 50 is except fitting in described two line layers 30, also fit on the flex area 12 of described first medium layer 10, thus realize the stopping property of described 2nd circuit is better, and improve the connection performance of described 2nd circuit. in other embodiments, described first protective layer 40 and described 2nd protective layer 50 can also be adopt spraying plated film mode to carve to be plated in described first line layer 20 and described two line layers 30.
In the present embodiment, described first line layer 20 offer at described first wiring end place be through in described two line layers 30 to connect described 2nd circuit cross hole 20a, described first electric-conductor 31 is fixed on described mistake in the 20a of hole. Concrete, the described hole 20a that crosses also runs through described first medium layer 10 and described two line layers 30, and described first electric-conductor 31 is through the described copper post crossing hole 20a. Described first electric-conductor 31 is successively through described first line layer 20, first medium layer 10 and described two line layers 30, and then the 2nd circuit making described two line layers 30 can be connected to the 2nd wire of described first line layer 20, thus ensure that described flexible PCB 100 multi-line walk line requirement.
Further; refer to Fig. 2; the present invention also provides the flexible PCB 200 of the 2nd embodiment; roughly the same with described flexible PCB 100; second dielectric layer 210 and the 3rd line layer 230 is also comprised the difference is that described flexible PCB 200; described second dielectric layer 210 and described 3rd line layer 230 are all laminated between described first line layer 20 and described first protective layer 40, the described non-flex area 11 of corresponding covering, and respectively near described first line layer 20 and described first protective layer 40. Described 3rd line layer 40 is provided with the 3rd circuit (sign), described first line layer 20 relatively described non-flex area 11 place is provided with the 2nd wiring end (sign), and relatively described flex area 12 place is provided with the 3rd wire (sign) of the described 2nd wiring end of electrical connection, between the 2nd wiring end 22 of described first line layer 20 and described 3rd circuit, it is connected with the 2nd electric-conductor 41.
Concrete, described second dielectric layer 210 is roughly the same with described first medium layer 10 structure, the difference is that, described second dielectric layer 210 is the corresponding non-flex area 11 covering described first medium layer 10 only. Described second dielectric layer 210 is described 3rd line layer 230 and described first line layer 20 offer insulation environment. Described second dielectric layer 210 can be adopt hot press forming technology to fit on described first line layer 20. Described 3rd line layer 230 is the corresponding non-flex area 11 covering described first medium layer 10 only, and the 3rd circuit on described 3rd line layer 230 can connect different electronic devices and components respectively from the first line on described first line layer 20. 2nd wiring end 22 of described first line layer 20 is electrically connected described 3rd circuit by described 2nd electric-conductor 41, so that described 3rd circuit is electrically connected on described 3rd wire, and then ensure that described flexible PCB 100 can connect more polyelectrons components and parts further, put on conductivity, make described flexible PCB 100 can only utilize described first line layer 20 to walk line by bending part, so that described flexible PCB 100 is in the flexible raising of bending part simultaneously. Described 2nd electric-conductor 41 and the described first identical setting of electric-conductor 31 structure, what described 3rd line layer 230, second dielectric layer 210 and first line layer 20 setting connected crosses hole (sign), described two electric-conductors 41 are arranged in described hole excessively, described 2nd electric-conductor 41 is successively through described 3rd line layer 230, second dielectric layer 210 and first line layer 20, and described 2nd electric-conductor 41 disconnects with described first electric-conductor 31 phase, thus ensure that the conduction property of described flexible PCB 100.
Further; refer to Fig. 3; the present invention also provides the flexible PCB 300 of the 3rd embodiment; roughly the same with described flexible PCB 200; the 3rd medium layer 310 and the 4th line layer 340 is also comprised the difference is that described flexible PCB 300; described 3rd medium layer 310 and described 4th line layer 340 are all laminated between described 3rd line layer 230 and described first protective layer 40; the described non-flex area 11 of corresponding covering, and respectively near described 3rd line layer 230 and described first protective layer 40. Described 4th line layer 340 is provided with the 4th circuit (sign), described first line layer 20 relatively described non-flex area 11 place is provided with the 3rd wiring end (not shown), and relatively described flex area 12 place is provided with the 3rd wire being electrically connected described 3rd wiring end 23, between the 3rd wiring end of described first line layer 20 and described 4th circuit, connect the 3rd electric-conductor 51.
Concrete, the setting identical with described second dielectric layer 210 structure of described 3rd medium layer 310, described 3rd medium layer 310 hot pressing takes shape between described three line layers 230 and described 4th line layer 340. Described 4th line layer 340 fits between described 3rd medium layer 310 and described first protective layer 40. The 3rd wire that 4th circuit of described 4th line layer 340 is connected on described first line layer 20 through described 3rd electric-conductor 51, so that described flexible PCB 100 can connect more electronic devices and components further, thus improve the use properties of described flexible PCB 100, and individual layer line layer can be still set the entering walking line by bending part of described flexible PCB 100, ensure the flexibility of described flexible PCB 100. Described 3rd electric-conductor 51 and the described 2nd identical setting of electric-conductor 41 structure, described 3rd electric-conductor 51 is successively through described 4th line layer 340, the 3rd medium layer 310, the 3rd line layer 230, second dielectric layer 210 and described first line layer 20.
Further, refer to Fig. 4, the present invention also provides the flexible PCB 400 of the 4th embodiment, roughly the same with described flexible PCB 300, the difference is that, described 3rd medium layer 410 and described 4th line layer 440 are all laminated between described two line layers 30 and described 2nd protective layer 50, the described non-flex area 11 of corresponding covering, and respectively near described two line layers 30 and described 2nd protective layer 50, described 4th line layer 440 is provided with the 4th circuit, described first line layer 20 relatively described non-flex area 11 place is provided with the 3rd wiring end 423, and relatively described flex area 12 place is provided with the 3rd wire being electrically connected described 3rd wiring end 423, it is connected with the 3rd electric-conductor 451 between 3rd wiring end 423 of described first line layer 20 and described 4th circuit. described 3rd electric-conductor 451 and the described 2nd identical setting of electric-conductor 41 structure, described 3rd electric-conductor 451 is successively through described 4th line layer 440, the 3rd medium layer 410, two line layers 30, first medium layer 10 and described first line layer 20. described 3rd medium layer 410 and described 4th line layer 440 are arranged between described two line layers 30 and described 2nd protective layer 50, make the both sides of described first medium layer 10 that the line layer of the identical number of plies is set, so that the consistency of thickness of described first medium layer 10 both sides, so that described flexible PCB 100 increases in non-flex area place mode of connection, it is to increase the using function of described flexible PCB 100.
Further, refer to Fig. 5, the present invention also provides the flexible PCB 500 of the 5th embodiment, roughly the same with described flexible PCB 200, the difference is that, described second dielectric layer 510 and described 530 layers, 3rd circuit are all laminated between described two line layers 30 and described 2nd protective layer 50, the described non-flex area 11 of corresponding covering, and respectively near described two line layers 30 and described 2nd protective layer 50, described 3rd line layer 530 is provided with the 3rd circuit, described first line layer 20 relatively described non-flex area 11 place is provided with the 2nd wiring end (sign), and relatively described flex area 12 place is provided with the 3rd wire being electrically connected described 2nd wiring end, it is connected with the 2nd electric-conductor 541 between 2nd wiring end of described first line layer 20 and described 3rd circuit. described 2nd electric-conductor 541 is successively through described 3rd line layer 530, described second dielectric layer 510, two line layers 30, described first medium layer 10 and described first line layer 20.
Further, refer to Fig. 6, the present invention also provides the flexible PCB 600 of the 5th embodiment, roughly the same with described flexible PCB 300, the difference is that, described 3rd medium layer 610 and described 4th line layer 640 are all laminated between described 3rd line layer 630 and described 2nd protective layer 50, the described non-flex area 11 of corresponding covering, and respectively near described 3rd line layer 630 and described 2nd protective layer 50, described 4th line layer 640 is provided with the 4th circuit, described first line layer 20 relatively described non-flex area 11 place is provided with the 3rd wiring end (sign), and relatively described flex area 12 place is provided with the 3rd wire being electrically connected described 3rd wiring end, the 3rd electric-conductor 61 is connected between 3rd wiring end of described first line layer 20 and described 4th circuit. described 3rd electric-conductor 61 is successively through described 4th line layer 640, the 3rd medium layer 610, the 3rd line layer 630, described second dielectric layer 610, two line layers 30, described first medium layer 10 and described first line layer 20.
The present invention also provides a kind of mobile terminal (not shown), described mobile terminal comprises body (not shown), be located at described body interior mainboard (not shown) and described flexible PCB 100, described flexible PCB 100 is located at described body interior, and is electrically connected with described mainboard. Described mobile terminal can be mobile phone, computer, flat board, handheld game machine or media player etc.
The flexible PCB of the present invention and mobile terminal, by described first line layer, corresponding described non-flex area place arranges the first wiring end, and the 2nd wire connecting described first wiring end is set at correspondence described flex area place, described two line layers correspondence is utilized to cover described non-flex area, and the first electric-conductor is set between described 2nd circuit and described first wiring end, so that the flex area of described flexible PCB only utilizes described first line layer to carry out connection, so that described flexible PCB is in the flexible raising of flex area, and make described flexible PCB that described first line layer and described two line layers can be utilized to improve conductivity.
Being more than the preferred embodiment of the present invention, it should be noted that for those skilled in the art, under the premise without departing from the principles of the invention, it is also possible to make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a flexible PCB, it is characterized in that, described flexible PCB comprises first medium layer, first line layer, two line layers, first protective layer and the 2nd protective layer, described first medium layer comprises non-flex area and is arranged at the flex area of side, described non-flex area, described first line layer fits in described first medium layer side, and cover described non-flex area and described flex area, the first wiring end that position, described first line layer relatively described non-flex area is provided with first line and disconnects mutually with described first line, position, described first line layer relatively described flex area is provided with the first wire connecting described first line and connects the 2nd wire of described first wiring end, described two line layers fits in described first medium layer and deviates from described first line layer side, and the described non-flex area of corresponding covering, described two line layers is provided with the 2nd circuit, described 2nd circuit and described first wiring end are connected with the first electric-conductor through described first medium layer, described first protective layer and described 2nd protective layer all cover described flex area and described non-flex area, described first protective layer fits in described first line layer and deviates from described first medium layer side, described 2nd protective layer fits in described two line layers and deviates from described first medium layer side.
2. flexible PCB according to claim 1, it is characterized in that, described flexible PCB also comprises second dielectric layer and the 3rd line layer, described second dielectric layer and described 3rd line layer are all laminated between described first line layer and described first protective layer, the described non-flex area of corresponding covering, and respectively near described first line layer and described first protective layer, described 3rd line layer is provided with the 3rd circuit, described first line layer relatively described non-flex area place is provided with the 2nd wiring end, and relatively described flex area place is provided with the 3rd wire being electrically connected described 2nd wiring end, the 2nd electric-conductor through described second dielectric layer and described first line layer it is connected with between described 2nd wiring end and described 3rd circuit.
3. flexible PCB according to claim 2, it is characterized in that, described flexible PCB also comprises the 3rd medium layer and the 4th line layer, described 3rd medium layer and described 4th line layer are all laminated between described 3rd line layer and described first protective layer, the described non-flex area of corresponding covering, and respectively near described 3rd line layer and described first protective layer, described 4th line layer is provided with the 4th circuit, described first line layer relatively described non-flex area place is provided with the 3rd wiring end, and relatively described flex area place is provided with the 3rd wire being electrically connected described 3rd wiring end, it is connected with successively through described 3rd line layer between described 3rd wiring end and described 4th circuit, 3rd electric-conductor of second dielectric layer and first line layer.
4. flexible PCB according to claim 2, it is characterized in that, described flexible PCB also comprises the 3rd medium layer and the 4th line layer, described 3rd medium layer and described 4th line layer are all laminated between described two line layers and described 2nd protective layer, the described non-flex area of corresponding covering, and respectively near described two line layers and described 2nd protective layer, described 4th line layer is provided with the 4th circuit, described first line layer relatively described non-flex area place is provided with the 3rd wiring end, and relatively described flex area place is provided with the 3rd wire being electrically connected described 3rd wiring end, it is connected with successively through described 4th line layer between described 3rd wiring end and described 4th circuit, 3rd medium layer, 3rd line layer, 3rd electric-conductor of second dielectric layer and described first line layer.
5. flexible PCB according to claim 1, it is characterized in that, described flexible PCB also comprises second dielectric layer and the 3rd line layer, described second dielectric layer and described 3rd line layer are all laminated between described two line layers and described 2nd protective layer, the described non-flex area of corresponding covering, and respectively near described two line layers and described 2nd protective layer, described 3rd line layer is provided with the 3rd circuit, described first line layer relatively described non-flex area place is provided with the 2nd wiring end, and relatively described flex area place is provided with the 3rd wire being electrically connected described 2nd wiring end, it is connected with successively through described 3rd line layer between described 2nd wiring end and described 3rd circuit, described second dielectric layer, two line layers, 2nd electric-conductor of described first medium layer and described first line layer.
6. flexible PCB according to claim 5, it is characterized in that, described flexible PCB also comprises the 3rd medium layer and the 4th line layer, described 3rd medium layer and described 4th line layer are all laminated between described 3rd line layer and described 2nd protective layer, the described non-flex area of corresponding covering, and respectively near described 3rd line layer and described 2nd protective layer, described 4th line layer is provided with the 4th circuit, described first line layer relatively described non-flex area place is provided with the 3rd wiring end, and relatively described flex area place is provided with the 3rd wire being electrically connected described 3rd wiring end, it is connected with successively through described 4th line layer between described 3rd wiring end and described 4th circuit, 3rd medium layer, 3rd line layer, described second dielectric layer, two line layers, 3rd electric-conductor of first medium layer and first line layer.
7. flexible PCB according to claim 1, it is characterised in that, described first line layer offer at described first wiring end place be through in described two line layers to connect described 2nd circuit cross hole, described first electric-conductor is fixed on described mistake in hole.
8. flexible PCB according to claim 1, it is characterised in that, described first protective layer and described 2nd protective layer respectively viscose glue be adhered on described first line layer and described two line layers on.
9. flexible PCB according to claim 1, it is characterised in that, described first wire and described 2nd wire are arranged in the corresponding described flex area place of described first line layer.
10. a mobile terminal, it is characterized in that, described mobile terminal comprises body, is located at the mainboard of described body interior and flexible PCB as described in claim 1��9 any one, and described flexible PCB is located at described body interior, and is electrically connected with described mainboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511025741.6A CN105636334A (en) | 2015-12-29 | 2015-12-29 | Flexible printed circuit board and mobile terminal |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511025741.6A CN105636334A (en) | 2015-12-29 | 2015-12-29 | Flexible printed circuit board and mobile terminal |
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| CN105636334A true CN105636334A (en) | 2016-06-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201511025741.6A Pending CN105636334A (en) | 2015-12-29 | 2015-12-29 | Flexible printed circuit board and mobile terminal |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5408052A (en) * | 1992-01-24 | 1995-04-18 | Nippon Mektron, Ltd. | Flexible multi-layer circuit wiring board |
| CN101400219A (en) * | 2007-09-27 | 2009-04-01 | 夏普株式会社 | Multilayer printed wiring board and method for fabrication thereof |
| CN102131340A (en) * | 2010-01-12 | 2011-07-20 | 住友电工印刷电路株式会社 | Flexible printed wiring board, method of manufacturing the same, and electronic equipment with the same |
-
2015
- 2015-12-29 CN CN201511025741.6A patent/CN105636334A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5408052A (en) * | 1992-01-24 | 1995-04-18 | Nippon Mektron, Ltd. | Flexible multi-layer circuit wiring board |
| CN101400219A (en) * | 2007-09-27 | 2009-04-01 | 夏普株式会社 | Multilayer printed wiring board and method for fabrication thereof |
| CN102131340A (en) * | 2010-01-12 | 2011-07-20 | 住友电工印刷电路株式会社 | Flexible printed wiring board, method of manufacturing the same, and electronic equipment with the same |
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Application publication date: 20160601 |