CN105578749B - Circuit board connection component and mobile terminal - Google Patents
Circuit board connection component and mobile terminal Download PDFInfo
- Publication number
- CN105578749B CN105578749B CN201511026227.4A CN201511026227A CN105578749B CN 105578749 B CN105578749 B CN 105578749B CN 201511026227 A CN201511026227 A CN 201511026227A CN 105578749 B CN105578749 B CN 105578749B
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- Prior art keywords
- copper foil
- circuit board
- several
- pads
- layer
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
A kind of circuit board connection component and mobile terminal, including printed circuit board and flexible PCB, printed circuit board includes at least two layers of copper foil layer and at least one layer of dielectric layer being located between at least two layers of copper foil layer, several first pads and the second pad are set at least two layers of copper foil layer respectively, several first pads or the second pad are connecting electronic component, several corresponding first pads or the second pad set several third pads on flexible PCB, several third pads are connect with several first pads or the second pad.Circuit board connection component provided by the invention can realize cloth device on a printed circuit, and pad is recycled to be connect with flexible PCB.Since printed circuit board is at least two-ply, big density cloth device can be carried out, so on flexible PCB the space of flexible PCB is saved without arranging devices.Simultaneously as flexible PCB is connect with printed circuit board, flexible PCB is without additionally setting reinforcement, so production cost can be reduced.
Description
Technical field
The present invention relates to the communications field more particularly to a kind of circuit board connection components and mobile terminal.
Background technology
Due to the development of science and technology, the function of intelligent mobile terminal equipment is more and more, and the wiring on circuit board is also increasingly
It is complicated.
At present, the pliable characteristic due to flexible circuit board in itself, it usually needs reinforcement is done on flexible PCB, in this way
So that when being connected up on flexible PCB (FPC), since the position for having done reinforcement can not be connected up, while can not
Cloth device is connect with other elements, it is therefore provided that the wiring volume in flexible circuit board becomes smaller.
However, when carrying out big density wiring on flexible PCB to connect electronic component, connected up generally for meeting
It is required that mostly using the form of Rigid Flex, then connected up on flexible PCB and hardboard simultaneously, and this measure due to
Manufacturing procedure is complex, so cost is higher, is unfavorable for controlling production cost.
Invention content
Technical problem to be solved of the embodiment of the present invention is, provides and a kind of meets big density cabling requirement, processing work
Sequence is simple and the relatively low circuit board connection component of cost and mobile terminal.
To achieve these goals, embodiment of the present invention provides following technical solution：
In a first aspect, the present invention provides a kind of circuit board connection component, the circuit board connection component includes printed circuit
Plate and flexible PCB, the printed circuit board include at least two layers of copper foil layer and at least one layer of dielectric layer, it is described at least
One layer of dielectric layer is clamped between every two layers in two layers of copper foil layer, is located at the two of outside at least two layers of copper foil layer
Several first pads and several second pads, and several described the first pad edges are respectively arranged on a copper foil layer
The extending direction of copper foil layer where it is arranged in order, several second pads along the copper foil layer where it extending direction successively
Arrangement, several described first pads or the second pad are to connect electronic component, corresponding institute on the flexible PCB
State several first pads or the second pad be provided with several third pads, several described third pads with it is described several
First pad or the connection of the second pad.
With reference to first aspect, in the first possible realization method of first aspect, the copper foil layer is four layers, respectively
To be sequentially overlapped the first copper foil layer, the second copper foil layer, third copper foil layer and the 4th copper foil layer of setting, the dielectric layer is three
Layer, is located between the copper foil layer successively respectively, and several described first pads are provided on first copper foil layer,
Several described second pads are provided on 4th copper foil layer.
The possible realization method of with reference to first aspect the first, in second of possible realization method of first aspect
In, several via holes are both provided on three layers of dielectric layer, several described via holes are every adjacent to be connected respectively
Two layers of copper foil layer.
With reference to first aspect or the first possible realization method of first aspect, the third in first aspect are possible
Realization method in, several corresponding described second pads of the circuit board connection component are provided with several electronics member devices
Part, several described electronic components are mounted together respectively with several second pads by surface mounting technology.
The possible realization method of with reference to first aspect the first, in the 4th kind of possible realization method of first aspect
In, several described first pads and the second pad are plated on first copper foil layer and the 4th copper foil layer respectively
On.
The possible realization method of with reference to first aspect the first, in the 5th kind of possible realization method of first aspect
In, solder mask is additionally provided on first copper foil layer, several described first pads are set on the solder mask.
With reference to first aspect, in the 6th kind of possible realization method of first aspect, at least one layer dielectric layer is
Insulating layer, and the material of at least one layer of dielectric layer is polypropylene.
With reference to first aspect, in the 7th kind of possible realization method of first aspect, several described first pads with
And several third pads are pressed by conducting resinl connect respectively.
With reference to first aspect, in the 8th kind of possible realization method of first aspect, the flexible circuit board include according to
The secondary substrate layer being superposed, the 5th copper foil layer and cover layer, several described third pads are set on the 5th copper foil
On layer.
Second aspect, the present invention also provides a kind of mobile terminal, the mobile terminal is including ontology and as described above
Circuit board connection component is provided with host cavity on the ontology, and the circuit board connection component is placed in the host cavity.
Circuit board connection component provided by the invention is by setting printed circuit board to include at least two layers of copper foil layer and folder
At least one layer of dielectric layer between at least two layers of copper foil layer, then sets several first respectively at least two layers of copper foil layer
Pad and the second pad, first pad or the second pad can be used to connection electronic component, so as to fulfill in printed circuit
Arranging devices are carried out on plate.Then corresponding several third pads of setting on flexible PCB, and the third pad can
It connect with the first pad or the second pad, is connected so as to fulfill by printed circuit board and flexible PCB.Further, since print
Printed circuit board is at least two-ply, therefore can carry out big density wiring and arranging devices, therefore, need not on flexible PCB
Arranging devices cost saved the space of flexible PCB, meanwhile, also due to flexible PCB is connect with printed circuit board,
So flexible PCB is without additionally setting reinforcement, so production cost can be reduced.
Description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention, for those of ordinary skill in the art, without creative efforts, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the structure diagram of circuit board connection component provided in an embodiment of the present invention；
Fig. 2 is the structure diagram of arranging devices on circuit board connection component provided in an embodiment of the present invention.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment shall fall within the protection scope of the present invention.
Also referring to Fig. 1 to Fig. 2, a kind of mobile terminal provided in an embodiment of the present invention (is not marked including ontology in figure
Show) and circuit board connection component 100, host cavity is provided on the ontology, and the circuit board connection component 100 is placed in institute
It states in host cavity.
In the present embodiment, the mobile terminal can be but be not limited to mobile phone, tablet, computer or personal digital assistant
(PDA) etc..The present invention for mobile phone preferably by the mobile terminal to illustrate.
The ontology can be mobile phone body, including housing, display module and touch control component etc., be provided on the housing
The host cavity, the display module and the touch control component are contained in the host cavity, and the display module
And the touch control component is electrically connected with the circuit board connection component 100, to realize the display function of the display module
And the touch function of the touch control component.
The circuit board connection component 100 includes printed circuit board 10 and flexible PCB 20.The printed circuit board
10 include at least two layers of copper foil layer 12 and at least one layer of dielectric layer 13.Every at least two layers of copper foil layer 12 is between two layers
Clamp one layer of dielectric layer 13.It is set respectively on two copper foil layers 12 in outside at least two layers of copper foil layer 12
There are several first pads 121 and several second pads 122, and several described first pads 121 are along where it
The extending direction of copper foil layer 12 is arranged in order.Extending direction of several described second pads 122 along the copper foil layer 12 where it
It is arranged in order setting.Several described 121 or second pads 122 of the first pad are connecting electronic component.The flexible electrical
Several corresponding described 121 or second pads 122 of the first pad are provided with several third pads 21 on road plate 20, if described
Dry third pad 21 is connect with several described 121 or second pads 122 of the first pad.
Circuit board connection component 100 provided by the invention, by the knot that printed circuit board 10 is arranged to at least two-ply
Then structure sets the first weldering respectively at least two layers of copper foil layer 12 of printed circuit board 10 on two copper foil layers 12 in outside
121 and second pad 122 of disk, 121 or second pad 122 of the first pad can be used to connect with electronic component, so as to
Realize arranging electronic component on the printed circuit board 10.Meanwhile utilize the first pad 121 or the second pad 122 and flexibility
Third pad 21 on circuit board 20 connects, and electrically connects so that flexible PCB 20 is realized with printed circuit board 10
It connects, and then electronic component can be arranged on the printed circuit board 10, then pass through printed circuit board 10 and flexible PCB
20 connection is connect so that electronic component can also be realized with flexible PCB 20.Because without in flexible PCB 20
On connected up or arranging electronic component, while saving the wiring space of flexible PCB 20, without in flexibility
Reinforcement is set on circuit board 20, cost saved making processing cost.
Specifically, the printed circuit board 10 is hardboard, and the printed circuit board 10 is at least doubling plate.It is preferred that
Ground, the printed circuit board 10 is four laminates, i.e., including four layers of copper foil layer 12.Since the printed circuit board 10 is using extremely
The design of few doubling plate, so as to which there are more wiring spaces than lamina, when needing to carry out big density arranging electronic member
During device, enough arrangement space requirements are also disclosure satisfy that.It is understood that in other embodiments, the printed circuit
Plate 10 can also be doubling plate, six laminates or eight laminates etc., be selected depending on specific wiring and the requirement of arranging electronic component
Select setting.
Further, the printed circuit board 10 is platelet, i.e., the length of described printed circuit board 10 is less than the flexibility
The length of circuit board 20.Preferably, the length of the printed circuit board 10 can be the flexible PCB 20 a quarter or
Person 1/3rd, so as to while meeting the printed circuit board 10 and being connect with the flexible PCB 20, additionally it is possible to
Reduce occupied space of the printed circuit board 10 on the flexible PCB 20.Further, since the printed circuit board 10
For platelet, when the circuit board connection component 100 is installed on the body interior of the mobile terminal, can also reduce described
Occupied space of the circuit board assemblies 100 on the mainboard of ontology, so as to the thickness for being conducive to mobile terminal do it is thin.
In the present embodiment, the copper foil layer 12 be four layers, be respectively sequentially overlapped setting the first copper foil layer 12a, second
Copper foil layer 12b, third copper foil layer 12c and the 4th copper foil layer 12d.Specifically, as shown in Figure 1, according to paper direction from lower past
On see, the first layers of the first copper foil layer 12a from the bottom up, the 4th copper foil layer 12d is from the bottom up the 4th layer.Institute
It states and first pad 121 is provided on the first copper foil layer 12a, second pad is provided on the 4th copper foil layer 12d
122, so as to which first pad 121 is convenient for be connect with the flexible PCB 20, second pad 20 and electronics member
Device connects.It is understood that in other embodiments, second weldering can be also set on the first copper foil layer 12a
Disk 122, sets first pad 121 on the 4th copper foil layer 12d, and first pad 121 can be used to connection electronics
Component is either connect with flexible PCB 20, and second pad 122 can also connect flexible PCB 20 and either connect
Electronic component.
Further, in order to ensure 121 and second pad 122 of the first pad respectively in first copper foil layer
Adhesive ability on 12a and the 4th copper foil layer 12d prevents 121 and second pad 122 of the first pad from coming off, described
First pad 121 and the second pad 122 are plated on respectively on the first copper foil layer 12a and the 4th copper foil layer 12d.It can be with
Understand, in other embodiments, 121 and second pad 122 of the first pad is also solderable to be connected to first copper foil
On layer 12a and the 4th copper foil layer 12d, such as used soldering.
Several described first pads 121 are evenly distributed along the extending direction of the first copper foil layer 12a, it is described several
Second pad 122 is evenly distributed along the extending direction of the 4th copper foil layer 12d.In the present embodiment, in first copper foil layer
The arrangement position of several first pads 121 on 12a and several second pads on the 4th copper foil layer 12d
122 arrangement position is consistent, that is, on the first copper foil layer 12a and the 4th copper foil layer 12d, first pad 121 with
Second pad, the 122 relative symmetry setting.It is understood that in other embodiments, first pad 121 with it is described
Second pad 122 or asymmetric setting.
In order to further improve, solder mask 123, several described first welderings are provided on the first copper foil layer 12a
Disk 121 is set on the solder mask 123.By the way that first pad 121 is welded on the solder mask 123, Neng Gouli
With the welding characteristic of the solder mask 123 so that first pad 121 is firmly welded on the solder mask 123, so as to
Cause first pad 121 subsequently when with the pressing of the third pad 21 of the flexible PCB 20, it will not be easily from described
It comes off on solder mask 123.
In the present embodiment, the dielectric layer 13 is three layers, is located in successively respectively between every two layers copper foil layer 12.Tool
Body, the dielectric layer 13 is respectively first medium layer 13a, second dielectric layer 13b and third dielectric layer 13c.Described first
Dielectric layer 13a is located between the first copper foil layer 12a and the second copper foil layer 12b, the second dielectric layer 13b folders
Between the second copper foil layer 12b and the third copper foil layer 12c, the third dielectric layer 13c is located in described
Between three copper foil layer 12c and the 4th copper foil layer 12d.And preferably, in order to ensure the copper foil layer 12 of adjacent two layers it
Between can mutual conduction, be both provided with several via holes 131, several described via holes 131 on three layers of dielectric layer 13
Respectively to be connected per two layers adjacent of copper foil layer 12, need to connect into walking line on adjacent two layers of copper foil layer 12 so as to work as
When connecing, it can draw or connect into walking line by the via hole 131.It is understood that in other embodiments, it is described
The number of plies of dielectric layer 13 can also be adjusted according to the actual design situation of the printed circuit board 10, as long as in every two layers of copper foil layer 12
Between one layer of the sandwiched dielectric layer 13.
In addition, in other embodiments, several described via holes 131 can be also set on the first medium layer 13a,
And cause several described via holes 131 directly through the second dielectric layer 13b and third dielectric layer 13c, thus
It is easy to process without additionally setting the via hole 131 between the second dielectric layer 13b and third dielectric layer 13c.When
So, several described via holes 131 can be also directly set on the second dielectric layer 13b or third dielectric layer 13c, then
Through other dielectric layers.
Further, the dielectric layer 13 is insulating layer, and the material of the dielectric layer 13 is polypropylene.It is that is, described
Three layers of dielectric layer 13 are insulating layer, to prevent from short circuit phenomenon occur between adjacent two layers of copper foil layer 12.It is understood that
In other embodiments, epoxy glass cloth laminated board (FR4) also can be used in the dielectric layer 13.
The flexible PCB 20 includes the substrate layer 22, the 5th copper foil layer 23 and cover layer that are sequentially overlapped setting
24, several described third pads 21 are set on the 5th copper foil layer 23.In the present embodiment, the flexible PCB 20 can be
Lamina or doubling plate are adjusted according to actual design situation and are selected.For the ease of the third pad 21 and first pad
121 connection is both provided with opening (in figure on the cover layer 24 at the position of each corresponding third pad 21
Do not indicate), each opening can be rectangular, waveform or circle etc., and the third pad 21 is exposed.
Several described third pads 21 press with several described first pads 121 connect respectively.In the present embodiment, institute
It states several third pads 21 and connection is pressed by conducting resinl with several first pads 121 respectively, so as to fulfill the printing
Connection between circuit board 10 and the flexible PCB 20.It, can be described in guarantee by the way of conducting resinl pressing connection
First pad 121 and the third pad 21 it is fixed at the same time it can also solving to connect between the big density pad used at present
It connects use and is welded with problem of faulty soldering caused by possibility.In addition, by the way of conducting resinl pressing connection, for the opposite welding of process
It is relatively simple, so as to easy to operation and reduce production cost.
Further, several corresponding described second pads 122 of the circuit board connection component 100 are provided with several
Electronic component 30, several described electronic components 30 pass through surface mount skill with the second pad 122 several described respectively
Art (SMT) mounts together.By by the electronic component 30SMT in second pad 122, so as to realize hard
(that is, described printed circuit board 10) is connected up and arranging devices on plate, then utilizes printed circuit board 10 and flexible circuit
Connection between plate 20, to realize the purpose being connect between electronic component 30 and flexible PCB 20.So as to instead of existing
Some uses are directly arranged the problem of component needs reinforcement on flexible PCB 20 or simultaneously in flexible PCBs
20 and printed circuit board 10 on be arranged component and lead to complex procedures, the problem of cost is higher.It cost saved
While the wiring space of flexible PCB 20, manufacturing procedure is also simplified, greatly reduces production cost.
Circuit board connection component provided by the invention is by setting printed circuit board to include at least two layers of copper foil layer and folder
At least one layer of dielectric layer between at least two layers of copper foil layer, then sets several first respectively at least two layers of copper foil layer
Pad and the second pad, first pad or the second pad can be used to connection electronic component, so as to fulfill in printed circuit
Arranging devices are carried out on plate.Then corresponding several third pads of setting on flexible PCB, and the third pad can
It connect with the first pad or the second pad, is connected so as to fulfill by printed circuit board and flexible PCB.Further, since print
Printed circuit board is at least two-ply, therefore can carry out big density wiring and arranging devices, therefore, need not on flexible PCB
Arranging devices cost saved the space of flexible PCB, meanwhile, also due to flexible PCB is connect with printed circuit board,
So flexible PCB is without additionally setting reinforcement, so production cost can be reduced.
Embodiments described above does not form the restriction to the technical solution protection domain.It is any in above-mentioned implementation
Modifications, equivalent substitutions and improvements made within the spirit and principle of mode etc., should be included in the protection model of the technical solution
Within enclosing.
Claims (10)
1. a kind of circuit board connection component, which is characterized in that the circuit board connection component includes printed circuit board and flexibility
Circuit board, the printed circuit board include at least two layers of copper foil layer and at least one layer of dielectric layer, at least two layers of copper foil layer
In every two layers between clamp one layer of dielectric layer, be located at least two layers of copper foil layer on two copper foil layers in outside point
It is not provided with several first pads and several second pads, and several described first pads are along the copper foil where it
The extending direction of layer is arranged in order, several described second pads are arranged in order along the extending direction of the copper foil layer where it, institute
Several first pads or the second pad are stated to connect electronic component, on the flexible PCB it is corresponding it is described several
First pad or the second pad are provided with several third pads, several described third pads and several described first pads
Or second pad connection.
2. circuit board connection component as described in claim 1, which is characterized in that the copper foil layer is four layers, respectively successively
The first copper foil layer, the second copper foil layer, third copper foil layer and the 4th copper foil layer being superposed, the dielectric layer are three layers, point
It is not located in successively between every two layers copper foil layer, and several described first welderings is provided on first copper foil layer
Disk, is provided with several described second pads on the 4th copper foil layer, several described first pads to it is described several
The connection of a third pad, several described second pads with electronic component connecting.
3. circuit board connection component as claimed in claim 2, which is characterized in that be both provided on three layers of dielectric layer several
A via hole, several described via holes are respectively being connected per two layers adjacent of copper foil layer.
4. circuit board connection component as claimed in claim 1 or 2, which is characterized in that the circuit board connection component is corresponding
Several described second pads are provided with several electronic components, several described electronic components respectively with several second
Pad is mounted together by surface mounting technology.
5. the circuit board connection component stated such as claim 2, which is characterized in that several described first pads and the second pad
It is plated on respectively on first copper foil layer and the 4th copper foil layer.
6. circuit board connection component as claimed in claim 2, which is characterized in that be additionally provided with welding resistance on first copper foil layer
Layer, several described first pads are set on the solder mask.
7. circuit board connection component as described in claim 1, which is characterized in that at least one layer dielectric layer is insulating layer,
And the material of at least one layer dielectric layer is polypropylene.
8. circuit board connection component as described in claim 1, which is characterized in that several described first pads and several
Third pad is pressed by conducting resinl connect respectively.
9. circuit board connection component as described in claim 1, which is characterized in that the flexible circuit board includes being sequentially overlapped setting
Substrate layer, the 5th copper foil layer and the cover layer put, several described third pads are set on the 5th copper foil layer.
10. a kind of mobile terminal, which is characterized in that the mobile terminal includes ontology and such as claim 1 to 9 any one
The circuit board connection component is provided with host cavity on the ontology, and the circuit board connection component is placed in the receiving
Intracavitary.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511026227.4A CN105578749B (en) | 2015-12-29 | 2015-12-29 | Circuit board connection component and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511026227.4A CN105578749B (en) | 2015-12-29 | 2015-12-29 | Circuit board connection component and mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105578749A CN105578749A (en) | 2016-05-11 |
| CN105578749B true CN105578749B (en) | 2018-07-06 |
Family
ID=55888254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511026227.4A Active CN105578749B (en) | 2015-12-29 | 2015-12-29 | Circuit board connection component and mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105578749B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106295518A (en) * | 2016-07-28 | 2017-01-04 | 南昌欧菲生物识别技术有限公司 | Fingerprint module and mobile terminal |
| CN106973499B (en) * | 2017-05-26 | 2019-09-24 | 上海中航光电子有限公司 | A kind of mould group and its manufacturing method including printed circuit board and flexible circuit board |
| WO2021189491A1 (en) * | 2020-03-27 | 2021-09-30 | 京东方科技集团股份有限公司 | Display module and display device |
| CN114698231B (en) * | 2022-03-18 | 2024-01-23 | 武汉华星光电半导体显示技术有限公司 | Circuit board and display module |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4997377A (en) * | 1990-02-22 | 1991-03-05 | Amp Incorporated | Adaptor for computers |
| CN102933025A (en) * | 2012-11-13 | 2013-02-13 | 加弘科技咨询(上海)有限公司 | Printed circuit board and coupling subassembly of printed circuit board |
-
2015
- 2015-12-29 CN CN201511026227.4A patent/CN105578749B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4997377A (en) * | 1990-02-22 | 1991-03-05 | Amp Incorporated | Adaptor for computers |
| CN102933025A (en) * | 2012-11-13 | 2013-02-13 | 加弘科技咨询(上海)有限公司 | Printed circuit board and coupling subassembly of printed circuit board |
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| Publication number | Publication date |
|---|---|
| CN105578749A (en) | 2016-05-11 |
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Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Patentee after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Patentee before: Guangdong OPPO Mobile Communications Co., Ltd. |
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