CN106973499B - A kind of mould group and its manufacturing method including printed circuit board and flexible circuit board - Google Patents
A kind of mould group and its manufacturing method including printed circuit board and flexible circuit board Download PDFInfo
- Publication number
- CN106973499B CN106973499B CN201710382721.7A CN201710382721A CN106973499B CN 106973499 B CN106973499 B CN 106973499B CN 201710382721 A CN201710382721 A CN 201710382721A CN 106973499 B CN106973499 B CN 106973499B
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- Prior art keywords
- circuit board
- printed circuit
- layer
- conductive layer
- golden finger
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
Abstract
The invention discloses a kind of mould group and its manufacturing method including printed circuit board and flexible circuit board, it is related to circuit board module group structure technical field, the printed circuit board of the mould group includes at least one layer of insulated base material layer and at least two conductive layers, is provided with one layer of insulated base material layer between adjacent two layers conductive layer；At least two conductive layers include at least the first conductive layer and the second conductive layer, and the side on the second conductive layer close to the first conductive layer is formed with the first golden finger；The boundary for the first surface for being located at printed circuit board is provided with first " U-shaped " opening of the first golden finger of exposure, first surface is located at the first conductive layer far from the second conductive layer side；The second golden finger on flexible circuit board is electrically connected in first " U-shaped " opening with the first golden finger.The present invention can reduce whole mould group thickness, space-saving purpose in the thickness compensation of flexible circuit board to first " U-shaped " opening by the way that the first golden finger is set to inner layer of printed-circuit board to reach.
Description
Technical field
The present invention relates to circuit board module group structure technical fields, more particularly, to a kind of including printed circuit board and soft
The mould group and its manufacturing method of property circuit board.
Background technique
Printed circuit board (Printed Circuit Board, PCB) is cut into certain using rigid insulation substrate layer as substrate
Size at least has a conductive pattern thereon, and is furnished with hole (such as component hole, fastener hole, plated through-hole), be used to replace with
Toward the chassis of device electronic component, and realize the interconnection between electronic component.
Flexible circuit board (Flexible Printed Circuit Board, FPC), is made of insulating substrate flexible
A kind of circuit board, it can be with free bend, winding, folding.It can be substantially reduced the volume of electronic product using FPC, be applicable in electricity
The needs that sub- product develops to high density, miniaturization, highly reliable direction.
PCB is typically employed in some occasions for not needing bending, and the place of harder intensity, such as computer main board, mobile phone
Mainboard etc.；FPC is generally used for needing the link of repeated deflection and some widgets, as clamshell phone flip lid bending part,
The position etc. of printer connection print head.There are also modular structures, such as display module and the connection structure of mainboard etc., need
PCB and FPC are used simultaneously, at this time, it may be necessary to realize the electric connection of PCB and FPC using some structures.
In the prior art, the mould group including PCB and FPC usually leans on FPC golden finger and setting in the outermost golden hand of pcb board
Refer to contraposition crimping, realizes electrical conducting.Fig. 1 is cutting for the mould group in the prior art including printed circuit board and flexible circuit board
Face figure, as shown in Figure 1, when crimping position and the component on PCB of PCB and FPC two surfaces that be set to PCB opposite,
When i.e. the crimping position and component antarafacial are arranged, mould group thickness includes FPC thickness, bonded adhesives thickness, PCB thickness, component
The sum of thickness causes the thickness of mould group entirety thicker, is unfavorable for current product and pursues light, thin, small trend requirement.
Therefore it provides the mould group and its manufacturing method including PCB and FPC of a kind of thickness thinning, are that this field urgently solves
Certainly the problem of.
Summary of the invention
In view of this, the present invention provides a kind of mould group including printed circuit board and flexible circuit board and its manufacturers
Method.
The present invention provides a kind of mould group including printed circuit board and flexible circuit board,
The printed circuit board includes at least one layer of insulated base material layer and at least two conductive layers, conduction described in adjacent two layers
One layer of insulated base material layer is provided between layer；
At least two conductive layers include at least the first conductive layer and the second conductive layer, lean on the second conductive layer
The side of nearly first conductive layer is formed with the first golden finger；
The boundary for the first surface for being located at the printed circuit board is provided with the of exposure first golden finger
One " U-shaped " opening, the first surface are located at side of first conductive layer far from second conductive layer；
The flexible circuit board includes the second golden finger, and second golden finger and first golden finger are described first
Electrical connection in " U-shaped " opening.
Optionally, the printed circuit board has second surface, and the second surface is opposite with the first surface, is hanging down
The part of second golden finger is directly provided on the flexible circuit board on the direction of plane where the printed circuit board
The distance of the second surface of the side of separate first golden finger to the printed circuit board is less than or equal to the print
Distance of the first surface of printed circuit board to the second surface.
Optionally, in the side of the second surface of the first surface by the printed circuit board to the printed circuit board
Upwards, first conductive layer is the first layer conductive layer of the printed circuit board, and second conductive layer is the printing electricity
The second layer conductive layer of road plate, the first surface are opposite with the second surface.
Optionally, the boundary of the printed circuit board of first " U-shaped " opening where it has the first width, institute
State development length of first width less than or equal to the boundary of the printed circuit board where described first " U-shaped " opening.
Optionally, the flexible circuit board is located in described first " U-shaped " opening.
Optionally, the printed circuit board further includes component, and the component is located at the second of the printed circuit board
Surface, the component are at least electrically connected with one layer of conductive layer, and the first surface is opposite with the second surface.
Optionally, the printed circuit board further includes the first separation layer, and it is conductive that first separation layer is located at described first
Side of the layer far from second conductive layer.
Optionally, first golden finger is electrically connected with second golden finger by anisotropic conductive film.
Optionally, where perpendicular to the printed circuit board on the direction of plane, the flexible circuit board includes described
70 μm≤d1≤100 μm of thickness of the part of second golden finger.
Optionally, where the vertical printed circuit board on the direction of plane, the thickness of the anisotropic conductive film
For 30 μm≤d2≤50 μm.
Optionally, where the vertical printed circuit board on the direction of plane, the first surface to first gold medal
The distance of finger is greater than or equal to 150 μm.
Optionally, the printed circuit board further includes the second separation layer, and it is conductive that second separation layer is located at described second
Side of the layer far from first conductive layer；
First " U-shaped " opening is located at second separation layer in the orthographic projection of plane where the printed circuit board and exists
Where the printed circuit board in the orthographic projection of plane；
First step is provided in described first " U-shaped " opening, the step surface of the first step is first gold medal
Plane where finger.
Based on the same inventive concept, the present invention also provides a kind of mould groups including printed circuit board and flexible circuit board
Manufacturing method, comprising:
Layer printed circuit board group is formed with laminar manner, the layer printed circuit board group includes at least one layer of insulated base material layer
At least two conductive layers are provided with one layer of insulated base material layer between every two layers of conductive layer, lead for described at least two layers
Electric layer includes the first conductive layer and the second conductive layer；
It is being directed toward on the direction of second conductive layer by first conductive layer, to the of the layer printed circuit board group
The boundary on one surface is punched out, and forms first " U-shaped " opening of exposure second conductive layer, the first surface position
In side of first conductive layer far from second conductive layer；
Part in second conductive layer by described first " U-shaped " opening exposure is handled to form the first gold medal hand
Refer to, forms printed circuit board；
By the second golden finger being arranged on ready-made flexible circuit board and first golden finger in the first " U
Electrical connection in shape " opening, to form the mould group for including the printed circuit board and the flexible circuit board.
Optionally, after forming the mould group including the printed circuit board and the flexible circuit board, perpendicular to the print
On the direction of plane where printed circuit board, be provided on the flexible circuit board second golden finger partially away from described the
The side of one golden finger to the layer printed circuit board group second surface distance be less than or equal to the layer printed circuit board
For the first surface of group to the distance of the second surface, the first surface is opposite with the second surface.
Optionally, the part in second conductive layer by described first " U-shaped " opening exposure is handled to be formed
After first golden finger, the method also includes:
Component is set in the second surface of the layer printed circuit board group, the component is led with described at least one layer
Electric layer electrical connection, the component are located at side of second conductive layer far from first conductive layer, the second surface
It is opposite with the first surface.
Optionally, after the step of forming the layer printed circuit board group with the laminar manner, the method is also wrapped
It includes: covering the first separation layer in the first surface of the layer printed circuit board group, first separation layer is located at described the
Side of one conductive layer far from second conductive layer.
Optionally, second golden finger and first golden finger being arranged on the flexible circuit board will be made in advance
The step of electrical connection, includes: in described first " U-shaped " is open
First golden finger is electrically connected with second golden finger by anisotropic conductive film.
Optionally, after the step of forming the layer printed circuit board group with the laminar manner, the method is also wrapped
It includes:
The second separation layer is covered in the second surface of the layer printed circuit board group, second separation layer is located at described the
Side of two conductive layers far from first conductive layer, the second surface are opposite with the first surface；
First " U-shaped " opening is located at second separation layer in the orthographic projection of plane where the printed circuit board and exists
Where the printed circuit board in the orthographic projection of plane；
In described first " U-shaped " opening, the boundary of second conductive layer is punched out, forms first step,
The step surface of the first step is plane where first golden finger.
Compared with prior art, the present invention at least has the advantages that protrude as follows:
A kind of mould group including printed circuit board and flexible circuit board provided by the invention will form in printed circuit board
The conductive layer of one golden finger is set to the internal layer of printed circuit board, and in the boundary for the first surface for being located at printed circuit board
It is provided with first " U-shaped " opening of first golden finger of exposure, when the second golden finger and printed circuit board of flexible circuit board
After first golden finger bonding, in the thickness compensation to first " U-shaped " opening of flexible circuit board, reduce whole mould group thickness to reach
Degree, space-saving purpose.
By referring to the drawings to the detailed description of exemplary embodiment of the present invention, other feature of the invention and its
Advantage will become apparent.
Detailed description of the invention
It is combined in the description and the attached drawing for constituting part of specification shows the embodiment of the present invention, and even
With its explanation together principle for explaining the present invention.
Fig. 1 is the sectional view of the mould group in the prior art including printed circuit board and flexible circuit board；
Fig. 2 is a kind of top view of mould group including printed circuit board and flexible circuit board of the invention；
Fig. 3 is a kind of explosive view of mould group including printed circuit board and flexible circuit board of the invention；
Fig. 4 is a kind of sectional view of mould group including printed circuit board and flexible circuit board of the invention；
Fig. 5 is a kind of a kind of bowing for printed circuit board of mould group including printed circuit board and flexible circuit board of the invention
View；
Fig. 6 is a kind of another printed circuit board of mould group including printed circuit board and flexible circuit board of the invention
Top view；
Fig. 7 be another kind of the invention include printed circuit board and flexible circuit board mould group top view；
Fig. 8 be another kind of the invention include printed circuit board and flexible circuit board mould group explosive view；
Fig. 9 be another kind of the invention include printed circuit board and flexible circuit board mould group sectional view；
Figure 10 is the partial enlarged view in Fig. 8 at the first golden finger of printed circuit board；
Figure 11 be another kind of the invention include printed circuit board and flexible circuit board mould group a kind of printed circuit board
Top view；
Figure 12 be another kind of the invention include printed circuit board and flexible circuit board mould group another printed circuit
The top view of plate；
Figure 13 is a kind of flow chart of the manufacturing method of mould group including printed circuit board and flexible circuit board of the invention；
Figure 14 to Figure 21 is a kind of manufacturing method for mould group including printed circuit board and flexible circuit board that Figure 13 is provided
Corresponding structural schematic diagram；
Figure 22 be another kind of the invention include printed circuit board and flexible circuit board mould group manufacturing method process
Figure；
Figure 23 to Figure 32 be the another kind that provides of Figure 22 include printed circuit board and flexible circuit board mould group manufacturer
The corresponding structural schematic diagram of method.
Specific embodiment
Carry out the various exemplary embodiments of detailed description of the present invention now with reference to attached drawing.
Be to the description only actually of at least one exemplary embodiment below it is illustrative, never as to the present invention
And its application or any restrictions used.
Technology, method and apparatus known to person of ordinary skill in the relevant may be not discussed in detail, but suitable
In the case of, the technology, method and apparatus should be considered as part of specification.
It is shown here and discuss all examples in, any occurrence should be construed as merely illustratively, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, then in subsequent attached drawing does not need that it is further discussed.
Fig. 2 is a kind of top view of mould group including printed circuit board and flexible circuit board of the invention；Fig. 3 is the present invention
A kind of mould group including printed circuit board and flexible circuit board explosive view；Fig. 4 is that one kind of the invention includes printed circuit
The sectional view of the mould group of plate and flexible circuit board.Wherein, the mould group including printed circuit board and flexible circuit board in Fig. 4 is figure
Along the sectional view in the direction A-A, Fig. 3 illustrates only electric including printing the mould group including printed circuit board and flexible circuit board in 2
The part-structure of the printed circuit board of the mould group of road plate and flexible circuit board.
Fig. 2 to Fig. 4 is referred to, a kind of mould group including printed circuit board and flexible circuit board is present embodiments provided.It should
The printed circuit board 1 of mould group includes at least one layer of insulated base material layer 103 and at least two conductive layers, between adjacent two layers conductive layer
It is provided with one layer of insulated base material layer 103.At least two conductive layers include at least the first conductive layer 101 and the second conductive layer 102,
Side on second conductive layer 102 close to the first conductive layer 101 is formed with the first golden finger 11.As shown in Figure 2 and Figure 4, it prints
Circuit board 1 has first surface a.Wherein, if the first conductive layer 101 is additionally provided with other far from the side of the second conductive layer 102
Film layer structure (in Fig. 4 withIndicate), then first surface a be side of first conductive layer 101 far from the second conductive layer 102 away from
The surface of the film layer farthest from the first conductive layer 101, for example, the farthest film layer is upper separation layer, then printed circuit board 1 herein
First surface a be also upper separation layer surface.
As shown in Fig. 2, the boundary in the first surface a for being located at printed circuit board 1 is provided with first golden finger of exposure
11 first " U-shaped " opening 10, first surface is located at side of first conductive layer 101 far from the second conductive layer 102.
As shown in Figure 3 and Figure 4, the flexible circuit board 2 of the mould group includes the second golden finger 21, the second golden finger 21 and first
The electrical connection in first " U-shaped " opening 10 of golden finger 11.
The present embodiment is suitable for the connection of printed circuit board 1 and flexible circuit board 2 including at least two conductive layers.Printing
One layer of insulated base material layer 103 is provided between the adjacent two layers conductive layer of circuit board 1, which is used for two
The insulation of conductive layer prevents short-circuit between two conductive layers.It should be appreciated that through-hole can be set in insulated base material layer 103, with reality
Functional connection between existing different conductive layers, but this insulating effect for not interfering insulated base material layer 103 to play.Second
Side on conductive layer 102 close to the first conductive layer 101 is formed with the first golden finger 11, and is being located at printed circuit board 1
First surface a boundary be provided with one exposure the first golden finger 11 first " U-shaped " opening 10, this makes the first golden finger
11 are located at the internal layer of printed circuit board 1.Flexible circuit board 2 includes the second golden finger 21, the second golden finger 21 and the first golden finger
11 electrical connections in first " U-shaped " opening 10, so that after printed circuit board 1 and flexible circuit board 2 assemble, flexible circuit board 2
All or part of thickness can be compensated into first " U-shaped " opening 10, be conducive to the thickness for reducing whole mould group, save mould group institute
The space accounted for.
" first " and " second " in the embodiment of the present invention is only as differentiation, without order qualifier.
Optionally, as shown in figure 4, printed circuit board 1 has second surface b, second surface b is opposite with first surface a.If
Second conductive layer 102 far from the side of the first conductive layer 101 be additionally provided with other film layer structures (in Fig. 4 withIndicate), then the
Two surface b are table of second conductive layer 102 far from the farthest film layer of lateral extent second conductive layer 102 of the first conductive layer 101
Face, for example, the farthest film layer is lower separation layer, then the table of separation layer under the second surface b of printed circuit board 1 is also herein
Face.
Meanwhile as shown in figure 4, being arranged on flexible circuit board 2 in the direction perpendicular to 1 place plane of printed circuit board
There is the distance d4 of second surface b of the side partially away from the first golden finger 11 of the second golden finger 21 to printed circuit board 1 small
In or equal to printed circuit board 1 first surface a to second surface b distance d5 (provided in Fig. 4 less than the case where), that is, it is soft
Property circuit board 2 thickness can be fully compensated to first " U-shaped " opening 10 in.And by the way that the thickness of flexible circuit board is mended completely
It repays in first " U-shaped " opening, the whole mould group thickness of reduction, space-saving purpose can be reached to greatest extent.
Optionally, as shown in Figure 5, Figure 6, Fig. 5 is a kind of mould including printed circuit board and flexible circuit board of the invention
A kind of top view of printed circuit board of group, Fig. 6 are a kind of mould group including printed circuit board and flexible circuit board of the invention
Another printed circuit board top view, the boundary of first " U-shaped " opening, 10 printed circuit board 1 where it has first
Width d.
Wherein, as shown in figure 5, the first width d less than the printed circuit board 1 where first " U-shaped " opening 10 boundary
Development length.Specifically, the width of the first width d and flexible circuit board is adapted.When the width of flexible circuit board is less than first
When the length on the boundary of the printed circuit board 1 where " U-shaped " opening 10, the first width d can be less than first " U-shaped " opening, 10 institutes
Printed circuit board 1 boundary development length.Width lesser first " U-shaped " opening 10 is set, the first " U can be reduced
The fluting area of shape " opening 10, to reduce the influence to each layer for needing to carry out slot treatment.
Wherein, as shown in fig. 6, the first width d is equal to the boundary of the printed circuit board 1 where first " U-shaped " opening 10
Development length.Specifically, the width of the first width d and flexible circuit board 2 is adapted.Be greater than when the width of flexible circuit board 2 or
Equal to first " U-shaped " opening 10 where printed circuit board 1 boundary length when, the first width d be equal to first " U-shaped " opening
The development length on the boundary of the printed circuit board 1 where 10, at this point, the width regardless of flexible circuit board 2, can guarantee
Flexible circuit board 2 is in flattened state.
Optionally, as shown in Fig. 2, flexible circuit board 2 is located in first " U-shaped " opening 10.Property circuit board 2 is set to
In one " U-shaped " opening 10, guarantee that flexible circuit board can be located in first " U-shaped " opening, the whole mould group of reduction can either be played
The effect of thickness, and can guarantee the connection effect of printed circuit board and flexible circuit board.
Optionally, as shown in Figure 3 and Figure 4, the mould group in the present embodiment further include: anisotropic conductive film 3, the first gold medal hand
Finger 11 and the second golden finger 21 pass through the anisotropic conductive film 3 and are electrically connected.
Specifically, it can be easy to implement between the first golden finger 11 and the second golden finger 21 using anisotropic conductive film 3
Electrical connection, and current limit is flowed up in 21 sides of vertical first golden finger 11 and the second golden finger；Anisotropy simultaneously
3 thickness of conductive adhesive film is lower, is conducive to the thickness for reducing whole mould group.
Optionally, as shown in figure 3, in the direction perpendicular to 1 place plane of printed circuit board, flexible circuit board 2 includes
70 μm≤d1≤100 μm of thickness of the part of second golden finger.
Optionally, as shown in figure 3, on the direction of 1 place plane of vertical printed circuit plate, anisotropic conductive film 3
With a thickness of 30 μm≤d2≤50 μm.
Optionally, as shown in figure 4, on the direction of 1 place plane of vertical printed circuit plate, first surface a to the first gold medal
The distance of finger 11 is d3 >=150 μm.
Specifically, where vertical printed circuit plate on the direction of plane, when by first surface to the first golden finger 11
When the depth of distance, i.e., first " U-shaped " opening is set greater than or is equal to 150 μm, it can guarantee as far as possible after being installed
Mould group in flexible circuit board include the second golden finger part thickness and the sum of the thickness of anisotropic conductive film be less than or
Person is equal to the depth of first " U-shaped " opening, it ensure that the thickness of flexible circuit board and anisotropic conductive film can be as far as possible
Full remuneration to first " U-shaped " opening in, and when the thickness of flexible circuit board and anisotropic conductive film is fully compensated to the
When in one " U-shaped " opening, the thickness of printed circuit board is exactly the thickness of whole mould group, and the thickness of whole mould group reaches minimum.
A kind of mould group including printed circuit board and flexible circuit board provided in this embodiment, by printed circuit board by shape
The internal layer of printed circuit board is set at the conductive layer of the first golden finger, and on the side for the first surface for being located at printed circuit board
First " U-shaped " opening of first golden finger of exposure is provided at boundary, when the second golden finger and printed circuit of flexible circuit board
After the first golden finger bonding of plate, in the thickness compensation to first " U-shaped " opening of anisotropic conductive film and flexible circuit board,
Reduce whole mould group thickness, space-saving purpose to reach.
Fig. 7 is the top view of another mould group including printed circuit board and flexible circuit board provided by the invention；Fig. 8 is
Another kind of the invention includes the explosive view of the mould group of printed circuit board and flexible circuit board；Fig. 9 is another packet of the invention
Include the sectional view of the mould group of printed circuit board and flexible circuit board；At the first golden finger of the Figure 10 for printed circuit board in Fig. 8
Partial enlarged view.Wherein, it includes printing that the mould group including printed circuit board and flexible circuit board in Fig. 9, which is another in Fig. 7,
Sectional view of the mould group of circuit board and flexible circuit board along the direction B-B.
Fig. 7 to Figure 10 is referred to, another mould group including printed circuit board and flexible circuit board is present embodiments provided.
The printed circuit board 1 of the mould group includes at least one layer of insulated base material layer 103 and at least two conductive layers, adjacent two layers
One layer of insulated base material layer 103 is provided between conductive layer.
The conductive layer of printed circuit board 1 includes at least the first conductive layer 101 and the second conductive layer 102, in the second conductive layer
Side on 102 close to the first conductive layer 101 is formed with the first golden finger 11.
The boundary for the first surface a for being located at printed circuit board 1 is provided with the first " U of first golden finger 11 of exposure
Shape " opening 10, first surface a is located at side of first conductive layer 101 far from the second conductive layer 102.
The flexible circuit board 2 of the mould group includes the second golden finger 21, and the second golden finger 21 and the first golden finger 11 are first
Electrical connection in " U-shaped " opening 10.
The present embodiment is suitable for the connection of printed circuit board 1 and flexible circuit board 2 including multiple conductive layers.Printed circuit
One layer of insulated base material layer 103 is provided between the adjacent two layers conductive layer of plate 1, which is used for two conductions
The insulation of layer prevents short-circuit between two conductive layers.It should be appreciated that through-hole can be set in insulated base material layer 103, to realize not
With connection functional between conductive layer, but this insulating effect for not interfering insulated base material layer 103 to play.In the second conduction
Side on layer 102 close to the first conductive layer 101 is formed with the first golden finger 11, and is being located at the of printed circuit board 1
The boundary on one surface is provided with first " U-shaped " opening 10 of first golden finger 11 of exposure, this makes the first golden finger 11
In the internal layer of printed circuit board 1.Flexible circuit board 2 includes the second golden finger 21, and the second golden finger 21 and the first golden finger 11 exist
Electrical connection in first " U-shaped " opening 10, so that after printed circuit board 1 and flexible circuit board 2 assemble, the thickness of flexible circuit board 2
It compensates into first " U-shaped " opening 10, is conducive to the thickness for reducing whole mould group, save space shared by mould group.
Optionally, as shown in figure 9, printed circuit board 1 has second surface b, second surface b is opposite with first surface a,
Perpendicular on the direction of 1 place plane of printed circuit board, be provided on flexible circuit board 2 second golden finger 21 partially away from
The side of one golden finger 11 to printed circuit board 1 second surface distance d4 be less than or equal to printed circuit board 1 the first table
Distance d5 (in Fig. 9 provide equal to the case where) of the face to second surface.That is: the thickness of flexible circuit board 2 can be fully compensated
In first " U-shaped " opening 10.
By being fully compensated the thickness of flexible circuit board into first " U-shaped " opening, the whole mould of reduction can be reached
Group thickness, space-saving purpose.
Optionally, as is illustrated by figs. 11 and 12, it includes printed circuit board and flexible circuit that Figure 11, which is another kind of the invention,
A kind of top view of printed circuit board of the mould group of plate, Figure 12 are that another kind of the invention includes printed circuit board and flexible circuit
The top view of another printed circuit board of the mould group of plate, the boundary of printed circuit board 1 of first " U-shaped " opening 10 where it
With the first width d.Dotted diagram indicates insulating layer in " U-shaped " opening 10 first in Figure 11 and Figure 12.
Wherein, as shown in figure 11, boundary of the first width d less than the printed circuit board 1 where first " U-shaped " opening 10
Development length.Specifically, the width of the first width d and flexible circuit board is adapted.When the width of flexible circuit board is less than first
When the length on the boundary of the printed circuit board 1 where " U-shaped " opening 10, the first width d can be less than first " U-shaped " opening, 10 institutes
Printed circuit board 1 boundary development length.Width lesser first " U-shaped " opening 10 is set, the first " U can be reduced
The fluting area of shape " opening 10, to reduce the influence to each layer for needing to carry out slot treatment.
Wherein, as shown in figure 12, the first width d is equal to the boundary of the printed circuit board 1 where first " U-shaped " opening 10
Development length.Specifically, the width of the first width d and flexible circuit board 2 is adapted.Be greater than when the width of flexible circuit board 2 or
Equal to first " U-shaped " opening 10 where printed circuit board 1 boundary length when, the first width d be equal to first " U-shaped " opening
The development length on the boundary of the printed circuit board 1 where 10, at this point, the width regardless of flexible circuit board 2, can guarantee
Flexible circuit board 2 is in flattened state.
Optionally, as shown in fig. 7, flexible circuit board 2 is located in first " U-shaped " opening 10.Flexible circuit board 2 is set to
In first " U-shaped " opening 10, guarantee that flexible circuit board can be located in first " U-shaped " opening, the whole mould of reduction can either be played
The effect of group thickness, and can guarantee the connection effect of printed circuit board and flexible circuit board.
Optionally, as shown in Figure 8 and Figure 9, in the second table of the first surface a by printed circuit board 1 to printed circuit board 1
On the direction of face b, the first conductive layer 101 is the first layer conductive layer of printed circuit board 1, and the second conductive layer 102 is printed circuit
The second layer conductive layer of plate 1, first surface a are opposite with second surface b.
It specifically, preferably, will be in the second surface of the first surface a by printed circuit board to printed circuit board
On the direction of b, the second conductive layer 102 is the second layer conductive layer of printed circuit board 1, this is because flexible circuit board usually compares
Thin, the first golden finger is made on second layer conductive layer can realize the purpose of thinned mould group, and such first " U-shaped " opening is not
It needs too deeply, and other following layers will not be impacted.
Optionally, as shown in Figure 8 and Figure 9, the mould group in the present embodiment further include: anisotropic conductive film 3, the first gold medal hand
Finger 11 and the second golden finger 21 pass through the anisotropic conductive film 3 and are electrically connected.
Specifically, being electrically connected between the first golden finger and the second golden finger can be easy to implement using anisotropic conductive film
It connects, and current limit is flowed up in the side of vertical first golden finger and the second golden finger；Anisotropic conductive film is thick simultaneously
It spends lower, is conducive to the thickness for reducing whole mould group.
Optionally, as shown in figure 8, in the direction perpendicular to 1 place plane of printed circuit board, flexible circuit board 2 includes
70 μm≤d1≤100 μm of thickness of the part of second golden finger.
Optionally, as shown in figure 8, on the direction of 1 place plane of vertical printed circuit plate, anisotropic conductive film 3
With a thickness of 30 μm≤d2≤50 μm.
Optionally, as shown in figure 9, on the direction of 1 place plane of vertical printed circuit plate, first surface a to the first gold medal
The distance of finger 11 is d3 >=150 μm.
Specifically, when the distance by first surface a to the first golden finger 11, i.e., the depth of first " U-shaped " opening is set as
When more than or equal to 150 μm, it can guarantee that flexible circuit board includes the second golden finger in the mould group after being installed as far as possible
The thickness of part and the sum of the thickness of anisotropic conductive film be less than or equal to the depth of first " U-shaped " opening, this guarantee
The thickness of flexible circuit board and anisotropic conductive film can be fully compensated as far as possible into first " U-shaped " opening, and is worked as
When the thickness of flexible circuit board and anisotropic conductive film is fully compensated into first " U-shaped " opening, the thickness of printed circuit board
It is exactly the thickness of whole mould group, the thickness of whole mould group reaches minimum.
Optionally, as shown in Figure 8 and Figure 9, printed circuit board 1 further includes component 104, and component 104 is located at printing electricity
The second surface b of road plate 1, component 104 are at least electrically connected with one layer of conductive layer, and first surface is opposite with second surface.
Specifically, component 104 includes but is not limited to resistance, capacitor, inductance, potentiometer, transformer, diode and three poles
Pipe.One component 104 is connected with one layer of conductive layer of printed circuit board 1, and different components is according to the function of circuit and sets
Meter is connected to identical or different conductive layer.
The height of component can be to be more than the thickness of flexible circuit board, so being arranged on the surface where component similar
In having little significance for other openings that first " U-shaped " is open, therefore the present embodiment is suitable for the surface and first where component
The case where surface where " U-shaped " opening is antarafacial.
Optionally, as shown in Figure 8 and Figure 9, printed circuit board 1 further includes the first separation layer 105, the first separation layer 105
In side of first conductive layer 101 far from the second conductive layer 102.Wherein, it is conductive can to play protection first for the first separation layer 105
The effect of layer 101, can effectively prevent the corrosion of the first conductive layer 101, while can also play the role of preventing electric leakage.
Optionally, as shown in Figure 8 and Figure 9, printed circuit board 1 further includes the second separation layer 106, the second separation layer 106
In side of second conductive layer 102 far from the first conductive layer 101.Wherein, the second separation layer 106, which plays, protects what is be in contact with it to lead
The effect of electric layer can effectively prevent the corrosion for the conductive layer being in contact with it, while can also play the role of preventing electric leakage.And
And since the second separation layer has the function of preventing electric leakage, allow component and printed circuit board that there is smaller spacing,
To be conducive to reduce the thickness of whole mould group.
As shown in Figure 9 and Figure 10, first " U-shaped " opening 10 is located at second in the orthographic projection of 1 place plane of printed circuit board
Separation layer 106 is in the orthographic projection of 1 place plane of printed circuit board.It is provided with first step 12 in first " U-shaped " opening 10,
The step surface of first step 12 is 11 place plane of the first golden finger.
Specifically, the sum of thickness of the height of first step 12 and anisotropic conductive film 3 is more than or equal to flexible electrical
Road plate 2 the second golden finger 21 be directed toward the first golden finger 11 direction on, the part beyond 21 place plane of the second golden finger
Highly.By the way that first step 12 is arranged, and the first golden finger 11 is arranged in the step surface of first step 12, so that flexible circuit
For plate 2 on the direction that the second golden finger 21 is directed toward the first golden finger 11, the part beyond 21 place plane of the second golden finger can
It compensates into first " U-shaped " opening, guarantees the thinned effect of mould group integral thickness.
Mould group provided in this embodiment including printed circuit board and flexible circuit board will will form in printed circuit board
The conductive layer of one golden finger is set to the internal layer of printed circuit board, and in the boundary for the first surface for being located at printed circuit board
It is provided with first " U-shaped " opening of first golden finger of exposure, when the second golden finger and printed circuit board of flexible circuit board
After first golden finger bonding, in the thickness compensation to first " U-shaped " opening of anisotropic conductive film and flexible circuit board, to reach
To the whole mould group thickness of reduction, space-saving purpose；It will be the of the first surface by printed circuit board to printed circuit board
On the direction on two surfaces, the second conductive layer is the second layer conductive layer of printed circuit board, makes first on second layer conductive layer
Golden finger not only may be implemented be thinned mould group purpose, but also pair other layers will not impact；By in printed circuit
The first surface and second surface of plate increase the first separation layer and the second separation layer, are effectively protected conductive layer.
The mould group including printed circuit board and flexible circuit board that embodiment each for the present invention provides, can use
Following manufacturing method is manufactured.
Figure 13 is the flow chart of the manufacturing method of a kind of printed circuit board of the invention and flexible circuit template die group, Tu14Zhi
Figure 21 is each step structural schematic diagram in the manufacturing method.Referring to Figure 13, present embodiments providing a kind of includes printed circuit
The preparation method of the mould group of plate and flexible circuit board, comprising the following steps:
Step S101: layer printed circuit board group is formed with laminar manner, layer printed circuit board group includes at least one layer of insulation
Substrate layer and at least two conductive layers are provided with one layer of insulated base material layer, at least two conductive layers packet between every two conductive layers
Include the first conductive layer and the second conductive layer.
It as shown in figure 14, include at least one layer of insulated base material layer by the layer printed circuit board group that step S101 is formed
103 and at least two conductive layers, one layer of insulated base material layer 103, at least two conductive layers packet are provided between every two conductive layers
Include the first conductive layer 101 and the second conductive layer 102.
It should be noted that only showing first in the structural schematic diagram provided in Figure 14, Figure 15, Figure 18 and Figure 21 and leading
Insulated base material layer 103 between electric layer 101, the second conductive layer 102 and the first conductive layer 101 and the second conductive layer 102.
Step S102: it is being directed toward on the direction of the second conductive layer by the first conductive layer, to the first of layer printed circuit board group
The boundary on surface is punched out, and forms first " U-shaped " opening of second conductive layer of exposure, it is conductive that first surface is located at first
Side of the layer far from the second conductive layer.
As shown in figure 15, it is being directed toward on the direction of the second conductive layer 102 by the first conductive layer 101, to layer printed circuit board
The boundary of the first surface of group is punched out, until forming first " U-shaped " opening 10 of second conductive layer 102 of exposure.
It should be noted that if the first conductive layer 101 is provided with other film layer knots far from the side of the second conductive layer 102
Structure, then first surface is the first conductive layer 101 film farthest far from lateral extent first conductive layer 101 of the second conductive layer 102
The surface of layer.
Wherein, the boundary of printed circuit board of first " U-shaped " opening where it has the first width d.
As shown in figure 16, the first width d is long less than the extension on the boundary of the printed circuit board where first " U-shaped " opening
Degree.Specifically, the width of the first width d and flexible circuit board is adapted.When the width of flexible circuit board is opened less than first " U-shaped "
When the length on the boundary of the printed circuit board 1 where mouth 10, the first width d can be less than the print where first " U-shaped " opening 10
The development length on the boundary of printed circuit board 1.Width lesser first " U-shaped " opening 10 is set, first " U-shaped " opening can be reduced
10 fluting area, to reduce the influence to each layer for needing to carry out slot treatment.
As shown in figure 17, the first width d is long equal to the extension on the boundary of the printed circuit board where first " U-shaped " opening
Degree.Development length of the first width d equal to the boundary of the printed circuit board 1 where first " U-shaped " opening 10 is set, it is no matter flexible
How is the width of wiring board, can guarantee that flexible circuit board is in flattened state.
Step S103: the part in the second conductive layer by first " U-shaped " opening exposure is handled to form the first gold medal
Finger forms printed circuit board.
As shown in figure 18, the part in the second conductive layer 102 by first " U-shaped " opening, 10 exposure is handled to be formed
First golden finger 11 forms printed circuit board.
Step S104: by the second golden finger being arranged on ready-made flexible circuit board and the first golden finger described
Electrical connection in one " U-shaped " opening, to form the mould group for including printed circuit board and the flexible circuit board.
As shown in figure 19, by the second golden finger 21 being arranged on ready-made flexible circuit board 2 and the first golden finger 11
The electrical connection in described first " U-shaped " is open, to form the mould group for including printed circuit board and the flexible circuit board.
By lamination and die cutting techniques, one layer is provided between the adjacent two layers conductive layer of printed circuit board 1 absolutely
Edge substrate layer 103, the insulated base material layer 103 prevent short-circuit between two conductive layers for the insulation to two conductive layers.It should
Understand, through-hole can be set in insulated base material layer 103, to realize functional connection between different conductive layers, but this is not
The insulating effect for interfering insulated base material layer 103 to play.Side on the second conductive layer 102 close to the first conductive layer 101 is formed
There is the first golden finger 11, and the boundary for the first surface for being located at printed circuit board 1 is provided with first golden finger of exposure
11 first " U-shaped " opening 10, this makes the first golden finger 11 be located at the internal layer of printed circuit board 1.Flexible circuit board 2, including
Second golden finger 21, the second golden finger 21 is electrically connected in first " U-shaped " opening 10 with the first golden finger 11, so that printed circuit
After plate 1 and flexible circuit board 2 assemble, in the thickness compensation to first " U-shaped " opening 10 of flexible circuit board 2, be conducive to reduce whole
The thickness of body mould group saves space shared by mould group.
Optionally, after forming the mould group including printed circuit board and flexible circuit board, as shown in figure 20, perpendicular to printing
On the direction of 1 place plane of circuit board, be provided on flexible circuit board 2 second golden finger 21 partially away from the first golden finger 11
Side to printed circuit board 1 second surface b distance d4 be less than or equal to printed circuit board 1 first surface a to second
The distance d5 (provide in Figure 20 less than the case where) of surface b, the thickness of flexible circuit board 2 can be fully compensated to the first " U
In shape " opening.And by being fully compensated the thickness of flexible circuit board into first " U-shaped " opening, it can be maximum
Reach the whole mould group thickness of reduction, space-saving purpose.
Optionally, the second golden finger being arranged on flexible circuit board and the first golden finger will be made in advance in first " U-shaped "
The step of electrical connection includes: to be electrically connected the first golden finger by anisotropic conductive film with the second golden finger in opening.Such as figure
Shown in 19, the first golden finger 11 is electrically connected with the second golden finger 21 by anisotropic conductive film 3.
Being electrically connected between the first golden finger and the second golden finger can be easy to implement using anisotropic conductive film, and
Current limit is flowed up in the side of vertical first golden finger and the second golden finger；Anisotropic conductive film thickness is lower simultaneously,
Be conducive to reduce the thickness of whole mould group.
Optionally, as shown in figure 21, in the direction perpendicular to 1 place plane of printed circuit board, flexible circuit board 2 is wrapped
The thickness control for including the part of the second golden finger 21 is 70 μm≤d1≤100 μm.
Optionally, as shown in figure 21, on the direction of 1 place plane of vertical printed circuit plate, by anisotropic conductive film 3
Thickness control be 30 μm≤d2≤50 μm.
Optionally, as shown in figure 20, on the direction of 1 place plane of vertical printed circuit plate, by first surface a to first
The distance d3 control of golden finger is d3 >=150 μm.
Specifically, on the direction of 1 place plane of vertical printed circuit plate, when by first surface a to the first golden finger 11
Distance, i.e., first " U-shaped " opening 10 depth be set greater than or be equal to 150 μm when, can guarantee to install as far as possible
Flexible circuit board 2 includes the thickness of the part of the second golden finger and the sum of the thickness of anisotropic conductive film 3 in mould group after
Less than or equal to the depth of first " U-shaped " opening, it ensure that the thickness energy of flexible circuit board 2 and anisotropic conductive film 3
It is enough to be fully compensated as far as possible into first " U-shaped " opening, and when the thickness of flexible circuit board 2 and anisotropic conductive film 3 is complete
When in full compensation to first " U-shaped " opening, the thickness of printed circuit board 1 is exactly the thickness of whole mould group, the thickness of whole mould group
Reach minimum.
A kind of manufacturing method of mould group including printed circuit board and flexible circuit board provided in this embodiment, passes through lamination
The conductive layer for forming the first golden finger will be set to the internal layer of printed circuit board by technology and die cutting techniques in printed circuit board,
And the boundary for the first surface for being located at printed circuit board is provided with first " U-shaped " opening of first golden finger of exposure,
After the second golden finger of flexible circuit board and Nian Jie the first golden finger of printed circuit board, anisotropic conductive film and flexibility
In the thickness compensation of circuit board to first " U-shaped " opening, reduce whole mould group thickness, space-saving purpose to reach.
Figure 22 is the flow chart of the manufacturing method of another printed circuit board of the invention and flexible circuit template die group.Figure 23
It is each step structural schematic diagram in the manufacturing method to Figure 31.Figure 22 is referred to, present embodiments providing another includes printing
The preparation method of the mould group of circuit board and flexible circuit board, comprising the following steps:
Step S201: layer printed circuit board group is formed with laminar manner, layer printed circuit board group includes at least one layer of insulation
Substrate layer and at least two conductive layers are provided with one layer of insulated base material layer, at least two conductive layers packet between every two conductive layers
Include the first conductive layer and the second conductive layer.
As shown in figure 23, by step S201, it includes at least one layer of exhausted for forming layer printed circuit board group with laminar manner
Edge substrate layer 103 and at least two conductive layers, are provided with one layer of insulated base material layer 103 between every two conductive layers, and at least two layers
Conductive layer includes the first conductive layer 101 and the second conductive layer 102.
Step S202: it is being directed toward on the direction of the second conductive layer by the first conductive layer, to the first of layer printed circuit board group
The boundary on surface is punched out, and forms first " U-shaped " opening of second conductive layer of exposure, it is conductive that first surface is located at first
Side of the layer far from the second conductive layer.
As shown in figure 24, it by step S202, is being directed toward on the direction of the second conductive layer 102 by the first conductive layer 101,
After being punched out to the boundary of the first surface a of layer printed circuit board group, the first " U of second conductive layer 102 of exposure is formed
Shape " opening 10, first surface a is located at side of first conductive layer 101 far from the second conductive layer 102.
Wherein, the boundary of printed circuit board of first " U-shaped " opening where it has the first width d, and the first width is small
The development length on the boundary of the printed circuit board where first " U-shaped " is open.
As shown in figure 25, extension of the first width d less than the boundary of the printed circuit board 1 where first " U-shaped " opening 10
Length.Specifically, the width of the first width d and flexible circuit board is adapted.When the width of flexible circuit board is less than first " U-shaped "
When the length on the boundary of the printed circuit board 1 where opening 10, the first width d can be less than first " U-shaped " opening, 10 place
The development length on the boundary of printed circuit board 1.Width lesser first " U-shaped " opening 10 is set, first " U-shaped " can be reduced and opened
The fluting area of mouth 10, to reduce the influence to each layer for needing to carry out slot treatment.
Wherein, as shown in figure 26, the first width d is equal to the boundary of the printed circuit board 1 where first " U-shaped " opening 10
Development length.Specifically, the width of the first width d and flexible circuit board is adapted.When the width of flexible circuit board is greater than or waits
When the length on the boundary of the printed circuit board 1 where first " U-shaped " opening 10, the first width d is equal to first " U-shaped " opening 10
The development length on the boundary of the printed circuit board 1 at place, at this point, the width regardless of flexible circuit board, can guarantee soft
Property circuit board is in flattened state.
Step S203: the part in the second conductive layer by first " U-shaped " opening exposure is handled to form the first gold medal
Finger forms printed circuit board.
As shown in figure 27, by the step, in the second conductive layer 102 by the parts of first " U-shaped " opening, 10 exposure into
The first golden finger 11 is formed after row processing, forms printed circuit board.
Step S204: being arranged component in the second surface of layer printed circuit board group, and component and at least one layer is conductive
Layer electrical connection, component are located at side of second conductive layer far from the first conductive layer, and second surface is opposite with first surface.
As shown in figure 28, by the step, component 104 is set in the second surface b of layer printed circuit board group, by first device
Part 104 is electrically connected at least one layer of conductive layer, and component 104 is located at one of the second conductive layer 102 far from the first conductive layer 101
Side, second surface b are opposite with first surface a.
Step S205: by the second golden finger being arranged on ready-made flexible circuit board and the first golden finger described
Electrical connection in one " U-shaped " opening, to form the mould group for including printed circuit board and the flexible circuit board.
As shown in figure 29, by the step, by the second golden finger 21 being arranged on ready-made flexible circuit board 2 and
The electrical connection in described first " U-shaped " is open of one golden finger 11, forms including printed circuit board and the flexible circuit board
Mould group.
By lamination and die cutting techniques, one layer is provided between the adjacent two layers conductive layer of printed circuit board 1 absolutely
Edge substrate layer 103, the insulated base material layer 103 prevent short-circuit between two conductive layers for the insulation to two conductive layers.It should
Understand, through-hole can be set in insulated base material layer 103, to realize functional connection between different conductive layers, but this is not
The insulating effect for interfering insulated base material layer 103 to play.Side on the second conductive layer 102 close to the first conductive layer 101 is formed
There is the first golden finger 11, and the boundary for the first surface for being located at printed circuit board 1 is provided with first golden finger of exposure
11 first " U-shaped " opening 10, this makes the first golden finger 11 be located at the internal layer of printed circuit board 1.Flexible circuit board 2, including
Second golden finger 21, the second golden finger 21 is electrically connected in first " U-shaped " opening 10 with the first golden finger 11, so that printed circuit
After plate 1 and flexible circuit board 2 assemble, in the thickness compensation to first " U-shaped " opening 10 of flexible circuit board 2, be conducive to reduce whole
The thickness of body mould group saves space shared by mould group.Component 104 is increased, the mould group for enhancing this method preparation is conducive to
Function.
Optionally, after forming the mould group including printed circuit board and flexible circuit board, as shown in figure 30, perpendicular to described
On the direction of 1 place plane of printed circuit board, be provided on flexible circuit board 2 second golden finger 21 partially away from first
The distance d4 of second surface b of the side of golden finger 11 to layer printed circuit board group is less than or equal to the of layer printed circuit board group
The distance d5 (provide in Figure 30 equal to the case where) of one surface a to second surface b, first surface a is opposite with second surface b, will
The thickness of flexible circuit board can be fully compensated into first " U-shaped " opening.And by the way that the thickness of flexible circuit board is mended completely
It repays in first " U-shaped " opening, the whole mould group thickness of reduction, space-saving purpose can be reached to greatest extent.
Optionally, the second golden finger being arranged on flexible circuit board and the first golden finger will be made in advance in first " U-shaped "
The step of electrical connection includes: to be electrically connected the first golden finger by anisotropic conductive film with the second golden finger in opening.Such as figure
Shown in 30 and Figure 31, the first golden finger 11 is electrically connected with the second golden finger 21 by anisotropic conductive film 3.
Specifically, being electrically connected between the first golden finger and the second golden finger can be easy to implement using anisotropic conductive film
It connects, and current limit is flowed up in the side of vertical first golden finger and the second golden finger；Anisotropic conductive film is thick simultaneously
It spends lower, is conducive to the thickness for reducing whole mould group.
Optionally, after the step of forming layer printed circuit board group with laminar manner, this method further include: in printing electricity
The first surface of road plate floor group covers the first separation layer, and the first separation layer is located at one of the first conductive layer far from the second conductive layer
Side.As shown in figures 30 and 31, the first separation layer 105, the first separation layer are covered in the first surface a of layer printed circuit board group
105 are located at side of first conductive layer 101 far from the second conductive layer 102.
Specifically, the first separation layer plays the role of protecting the first conductive layer, can effectively prevent the corruption of the first conductive layer
Erosion, while playing the role of preventing electric leakage.
Optionally, after the step of forming layer printed circuit board group with laminar manner, this method further include: in printing electricity
The second surface of road plate floor group covers the second separation layer, and the second separation layer is located at one of the second conductive layer far from the first conductive layer
Side, second surface are opposite with first surface.As shown in figures 30 and 31, in the second surface b covering the of layer printed circuit board group
Two separation layers 106.
Specifically, the second separation layer plays the role of the conductive layer that protection is in contact with the second separation layer 106, can be effective
The corrosion of the conductive layer is prevented, while playing the role of preventing electric leakage.
As shown in Figure 27 and Figure 28, as Figure 27 be not formed step when printed circuit board, Figure 28 is after forming step
Printed circuit board, first " U-shaped " opening are located at the second separation layer 106 described in the orthographic projection of 1 place plane of printed circuit board
Where printed circuit board in the orthographic projection of plane；
As shown in figure 32, Figure 32 shows the enlarged drawing of 12 structure of first step, in first " U-shaped " opening, to second
The boundary of conductive layer 102 is punched out, and forms first step 12, and the step surface of first step 12 is 11 place of the first golden finger
Plane.
Specifically, as shown in Figure 30, Figure 31 and Figure 32, the height of first step 12 and the thickness of anisotropic conductive film 3
The sum of be more than or equal to flexible circuit board 2 the second golden finger 21 be directed toward the first golden finger 22 direction on, exceed the second gold medal
The height of the part of 21 place plane of finger.
Second separation layer plays the role of protection conductive layer in contact, can effectively prevent the corruption of the conductive layer
Erosion, while playing the role of preventing electric leakage.Moreover, because the second separation layer has the function of preventing electric leakage, therefore allow first device
Part and printed circuit board have smaller spacing, to be conducive to reduce the thickness of whole mould group.By the way that first step is arranged, and
First golden finger is arranged in the step surface of first step, so that flexible circuit board is directed toward the first golden finger in the second golden finger
On direction, the part beyond plane where the second golden finger be can compensate for into first " U-shaped " opening, guarantee mould group integral thickness
Thinned effect.
Optionally, as shown in figure 31, where perpendicular to printed circuit board on the direction of plane, include by flexible circuit board
The thickness control of the part of second golden finger is 70 μm≤d1≤100 μm.
Optionally, as shown in figure 31, where vertical printed circuit plate on the direction of plane, by anisotropic conductive film 3
Thickness control be 30 μm≤d2≤50 μm.
Optionally, as shown in figure 30, where vertical printed circuit plate on the direction of plane, by first surface to the first gold medal
The distance controlling of finger is d3 >=150 μm.
Specifically, where vertical printed circuit plate on the direction of plane, when by first surface to the first golden finger away from
When depth from, i.e., first " U-shaped " opening is set greater than or is equal to 150 μm, it can guarantee as far as possible after being installed
In mould group flexible circuit board include the sum of the thickness of the part of the second golden finger and the thickness of anisotropic conductive film be less than or
Equal to the depth of first " U-shaped " opening, it ensure that the thickness of flexible circuit board and anisotropic conductive film can be as far as possible
It is fully compensated into first " U-shaped " opening, and when the thickness of flexible circuit board and anisotropic conductive film is fully compensated to first
When in " U-shaped " opening, the thickness of printed circuit board is exactly the thickness of whole mould group, and the thickness of whole mould group reaches minimum.
The manufacturing method of mould group provided in this embodiment including printed circuit board and flexible circuit board, by being laminated and rushing
The conductive layer for forming the first golden finger will be set to the internal layer of printed circuit board by incision technology in printed circuit board, and in place
The boundary of the first surface of printed circuit board is provided with first " U-shaped " opening of first golden finger of exposure, works as flexible electrical
After second golden finger of road plate and the first golden finger of printed circuit board are Nian Jie, anisotropic conductive film and flexible circuit board
In thickness compensation to first " U-shaped " opening, reduce whole mould group thickness, space-saving purpose to reach；It will be by printing electricity
On the first surface of road plate to the direction of the second surface of printed circuit board, the second conductive layer is that the second layer of printed circuit board is led
Electric layer, makes the first golden finger not only on second layer conductive layer and may be implemented the purpose that mould group is thinned, and pair other layers
It will not impact；Increase the first separation layer and the second isolation by the first surface and second surface in printed circuit board
Layer, is effectively protected conductive layer.
Through the foregoing embodiment it is found that mould group and its manufacturer including printed circuit board and flexible circuit board of the invention
Method, reached it is following the utility model has the advantages that
(1) a kind of mould group including printed circuit board and flexible circuit board provided by the invention will incite somebody to action in printed circuit board
The conductive layer for forming the first golden finger is set to the internal layer of printed circuit board, and is being located at the first surface of printed circuit board
Boundary is provided with first " U-shaped " opening of first golden finger of exposure, when the second golden finger and printing electricity of flexible circuit board
After the first golden finger bonding of road plate, the thickness compensation of anisotropic conductive film and flexible circuit board is open to first " U-shaped "
It is interior, reduce whole mould group thickness, space-saving purpose to reach.
(2) by the direction of the second surface of the first surface by printed circuit board to printed circuit board, second is conductive
Layer is the second layer conductive layer of printed circuit board, and the first golden finger is made on second layer conductive layer not only may be implemented that mould is thinned
Group purpose, and pair other layers will not impact；
(3) increase the first separation layer and the second separation layer by the first surface and second surface in printed circuit board, have
Protect conductive layer to effect.
(4) manufacturing method of a kind of mould group including printed circuit board and flexible circuit board of the invention, by lamination and
The conductive layer that form the first golden finger will be set to the internal layer of printed circuit board in printed circuit board by die cutting techniques, and
It is provided with first " U-shaped " opening of first golden finger of exposure positioned at the boundary of the first surface of printed circuit board, works as flexibility
After second golden finger of circuit board and the first golden finger of printed circuit board are Nian Jie, anisotropic conductive film and flexible circuit board
Thickness compensation to first " U-shaped " opening in, reduce whole mould group thickness, space-saving purpose to reach.
Although some specific embodiments of the invention are described in detail by example, the skill of this field
Art personnel it should be understood that example above merely to being illustrated, the range being not intended to be limiting of the invention.The skill of this field
Art personnel are it should be understood that can without departing from the scope and spirit of the present invention modify to above embodiments.This hair
Bright range is defined by the following claims.
Claims (4)
1. a kind of manufacturing method of the mould group including printed circuit board and flexible circuit board characterized by comprising
Layer printed circuit board group is formed with laminar manner, the layer printed circuit board group is including at least one layer of insulated base material layer and extremely
Lack two conductive layers, is provided with one layer of insulated base material layer, at least two conductive layers between every two layers of conductive layer
Including the first conductive layer and the second conductive layer；
It is being directed toward on the direction of second conductive layer by first conductive layer, to the first table of the layer printed circuit board group
The boundary in face is punched out, and forms first " U-shaped " opening of exposure second conductive layer, and the first surface is located at institute
State side of first conductive layer far from second conductive layer；The layer printed circuit board group second surface covering second every
Absciss layer, second separation layer are located at side of second conductive layer far from first conductive layer, the second surface with
The first surface is opposite；
First " U-shaped " opening is located at second separation layer described in the orthographic projection of plane where the printed circuit board
Where printed circuit board in the orthographic projection of plane；
Part in second conductive layer by described first " U-shaped " opening exposure is handled to form the first golden finger,
In described first " U-shaped " opening, the boundary of second conductive layer is punched out, formation first step, described first
The step surface of step is plane where first golden finger, forms printed circuit board；
The second golden finger being arranged on ready-made flexible circuit board is opened with first golden finger in described first " U-shaped "
It is electrically connected in mouthful by anisotropic conductive film, to form the mould group for including the printed circuit board and the flexible circuit board；
The sum of thickness of the height of the first step and the anisotropic conductive film is more than or equal to the flexible circuit board and exists
Second golden finger is directed toward on the direction of first golden finger, the height beyond the part of plane where second golden finger
Degree.
2. the manufacturing method of the mould group according to claim 1 including printed circuit board and flexible circuit board, feature exist
In after forming the mould group including the printed circuit board and the flexible circuit board, where perpendicular to the printed circuit board
On the direction of plane, be provided on the flexible circuit board second golden finger partially away from the one of first golden finger
Side to the layer printed circuit board group second surface distance be less than or equal to the layer printed circuit board group described first
To the distance of the second surface, the first surface is opposite with the second surface on surface.
3. the manufacturing method of the mould group according to claim 1 including printed circuit board and flexible circuit board, feature exist
In, after being handled in second conductive layer by the part of described first " U-shaped " opening exposure to form the first golden finger,
The method also includes:
Component is set in the second surface of the layer printed circuit board group, by the component and at least one layer of conductive layer
Electrical connection, the component are located at side of second conductive layer far from first conductive layer, the second surface and institute
It is opposite to state first surface.
4. the manufacturing method of the mould group according to claim 1 including printed circuit board and flexible circuit board, feature exist
In, after the step of forming the layer printed circuit board group with the laminar manner, the method also includes: in the printing
The first surface of board layer group covers the first separation layer, and first separation layer is located at first conductive layer far from institute
State the side of the second conductive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107231743B (en) * | 2017-07-26 | 2019-05-14 | 中航海信光电技术有限公司 | Signal wire wiring method for module |
| CN107770957B (en) * | 2017-09-26 | 2019-06-14 | 武汉天马微电子有限公司 | A kind of flexible circuitry template die group and display device |
| CN111292612B (en) * | 2018-12-10 | 2022-02-11 | 北京小米移动软件有限公司 | Display module and mobile terminal |
| CN113161694B (en) * | 2021-04-20 | 2022-12-27 | 维沃移动通信有限公司 | Battery connection circuit board, battery pack and electronic equipment |
| CN113743307B (en) * | 2021-09-06 | 2023-12-12 | 业泓科技(成都)有限公司 | Bonding module, fingerprint identification component and electronic equipment |
| CN114422681B (en) * | 2022-01-27 | 2023-06-23 | 苏州昀冢电子科技股份有限公司 | Driving mechanism, driving mechanism combination, camera module and electronic equipment |
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| CN1781347A (en) * | 2003-04-30 | 2006-05-31 | 日本压着端子制造株式会社 | Printed wiring board connection structure |
| JP2011243895A (en) * | 2010-05-21 | 2011-12-01 | Sumitomo Electric Printed Circuit Inc | Connection structure of printed wiring board, wiring board connector, and electronic apparatus |
| CN105228343A (en) * | 2015-09-22 | 2016-01-06 | 广东欧珀移动通信有限公司 | A kind of Rigid Flex and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105578749B (en) * | 2015-12-29 | 2018-07-06 | 广东欧珀移动通信有限公司 | Circuit board connection component and mobile terminal |
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| CN1781347A (en) * | 2003-04-30 | 2006-05-31 | 日本压着端子制造株式会社 | Printed wiring board connection structure |
| JP2011243895A (en) * | 2010-05-21 | 2011-12-01 | Sumitomo Electric Printed Circuit Inc | Connection structure of printed wiring board, wiring board connector, and electronic apparatus |
| CN105228343A (en) * | 2015-09-22 | 2016-01-06 | 广东欧珀移动通信有限公司 | A kind of Rigid Flex and preparation method thereof |
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