CN219248174U - Small-sized circuit board with positioning function - Google Patents
Small-sized circuit board with positioning function Download PDFInfo
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- CN219248174U CN219248174U CN202223553282.7U CN202223553282U CN219248174U CN 219248174 U CN219248174 U CN 219248174U CN 202223553282 U CN202223553282 U CN 202223553282U CN 219248174 U CN219248174 U CN 219248174U
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- circuit board
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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Abstract
The utility model discloses a small circuit board with a positioning function, which comprises a circuit board body, wherein two positioning holes are formed in the circuit board body, one positioning hole is formed in the left front side of the circuit board body, and the other positioning hole is formed in the right rear side of the circuit board body; the circuit board body comprises a bottom surface solder mask layer, a bottom surface circuit layer, a through hole layer, a top surface circuit layer, a top surface bonding pad layer, a top surface solder mask layer and a top surface silk screen printing layer. Two positioning holes are formed in the circuit board body, one positioning hole is formed in the left front side of the circuit board body, the other positioning hole is formed in the right rear side of the circuit board body, the circuit board cannot be reversely mounted, the circuit board is mounted more firmly and reliably, two positioning hole marking areas are formed in the surface of the through hole layer, and each positioning hole marking area is opposite to the corresponding positioning hole, so that the positioning holes are formed more accurately and reliably.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a small circuit board with a positioning function.
Background
The circuit board may be called a printed wiring board or a printed circuit board, which miniaturizes and visualizes the circuit, and plays an important role in mass production of a fixed circuit and optimizing the layout of an electrical appliance. Therefore, circuit boards are widely used in devices, especially some intelligent electronic devices.
With the development of the age, intelligent electronic devices, such as smartwatches and smartbracelets, have been increasingly miniaturized, and at the same time, the intelligent electronic devices have a plurality of functions and a plurality of functional modules, so that a large number of circuit boards are required in the manufacturing process, and the smaller the circuit boards are, the better the circuit boards are. The smaller the circuit board, the more difficult it is to perceive the difference in appearance, and during the assembly process, the circuit board is easy to install reversely, so that the final product needs to be disassembled and then assembled again when the problem is tested. Therefore, there is a need for improvements over existing small circuit boards.
Disclosure of Invention
In view of the above, the present utility model aims at overcoming the drawbacks of the prior art, and its primary object is to provide a small-sized circuit board with positioning function, which can effectively solve the problem that the existing small-sized circuit board is easy to reverse install during the assembly process.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
a small-sized circuit board with a positioning function comprises a circuit board body, wherein two positioning holes are formed in the circuit board body, one positioning hole is formed in the left front side of the circuit board body, and the other positioning hole is formed in the right rear side of the circuit board body; the circuit board body comprises a bottom surface solder mask layer, a bottom surface circuit layer, a through hole layer, a top surface circuit layer, a top surface bonding pad layer, a top surface solder mask layer and a top surface silk screen printing layer; the bottom surface circuit layer is laminated on the upper surface of the bottom surface solder mask layer; the through holes are laminated on the upper surface of the bottom circuit layer; the surface of the through hole layer is provided with two positioning hole marking areas, and each positioning hole marking area is opposite to the corresponding positioning hole; the top surface circuit layer is arranged on the upper surface of the through hole layer in a lamination mode; the top surface bonding pad is laminated on the upper surface of the top surface circuit layer; the top surface solder mask layer is overlapped on the upper surface of the top surface bonding pad layer; the top screen printing layer is laminated on the upper surface of the top solder mask layer.
As a preferable scheme, the upper surface of the circuit board body is provided with a first accommodating hole, the first accommodating hole penetrates through the top surface bonding pad layer, the top surface solder mask layer and the top surface silk screen layer and takes the top surface circuit layer as the bottom surface, the upper surface of the through hole layer is provided with two first accommodating hole marking areas, and each first accommodating hole marking area is opposite to the corresponding first accommodating hole.
As a preferable scheme, the first accommodating holes are two arranged at left and right intervals, and the two first accommodating holes are both positioned at the rear side of the circuit board body.
As a preferable scheme, the lower surface of the circuit board body is provided with a second accommodating hole, the second accommodating hole penetrates through the bottom surface solder mask layer and takes the bottom surface circuit layer as the bottom surface, the lower surface of the through hole layer is provided with two second accommodating hole marking areas, and each second accommodating hole marking area is opposite to the corresponding second accommodating hole.
As a preferable scheme, the number of the second accommodating holes is two, and the two second accommodating holes are arranged at left and right intervals and are both positioned at the rear side of the circuit board body.
As a preferable scheme, the length of the circuit board body is 38.00mm, and the width of the circuit board body is 27.00mm.
Compared with the prior art, the utility model has obvious advantages and beneficial effects, and in particular, the technical scheme can be as follows:
two positioning holes are formed in the circuit board body, one positioning hole is formed in the left front side of the circuit board body, the other positioning hole is formed in the right rear side of the circuit board body, the circuit board cannot be reversely mounted, the circuit board is mounted more firmly and reliably, two positioning hole marking areas are formed in the surface of the through hole layer, and each positioning hole marking area is opposite to the corresponding positioning hole, so that the positioning holes are formed more accurately and reliably.
In order to more clearly illustrate the structural features and efficacy of the present utility model, the present utility model will be described in detail below with reference to the accompanying drawings and examples.
Drawings
FIG. 1 is a cross-sectional view of a preferred embodiment of the present utility model;
FIG. 2 is a top view of a top silk screen layer in a preferred embodiment of the present utility model;
FIG. 3 is a top view of a top solder mask layer in accordance with a preferred embodiment of the present utility model;
FIG. 4 is a top view of a top pad layer in accordance with a preferred embodiment of the present utility model;
FIG. 5 is a top view of a top circuit layer in a preferred embodiment of the present utility model;
FIG. 6 is a top view of a via layer in a preferred embodiment of the utility model;
FIG. 7 is a top view of a bottom wiring layer in a preferred embodiment of the present utility model;
FIG. 8 is a top view of a bottom solder mask layer in accordance with a preferred embodiment of the present utility model.
The attached drawings are used for identifying and describing:
10. circuit board body 101, positioning hole
102. First accommodation hole 103, second accommodation hole
11. Bottom solder mask layer 12, bottom circuit layer
13. Through hole layer 131, positioning hole mark region
132. First accommodation hole mark area 133 and second accommodation hole mark area
14. Top surface wiring layer 15, top surface pad layer
16. A top solder mask layer 17 and a top screen printing layer.
Detailed Description
Referring to fig. 1 to 8, a specific structure of a preferred embodiment of the present utility model is shown, which includes a circuit board body 10.
Two positioning holes 101 are formed in the circuit board body 10, wherein one positioning hole 101 is formed in the left front side of the circuit board body 10, and the other positioning hole 101 is formed in the right rear side of the circuit board body 10; in this embodiment, the upper surface of the circuit board body 10 is provided with two first accommodating holes 102, which are arranged at left and right intervals, and the two first accommodating holes 102 are both located at the rear side of the circuit board body 10; in addition, the lower surface of the circuit board body 10 is provided with two second accommodating holes 103, wherein the two second accommodating holes 103 are arranged at left and right intervals, and the two second accommodating holes 103 are positioned at the rear side of the circuit board body 10; and the length of the circuit board body 10 is 38.00mm, and the width of the circuit board body is 27.00mm.
The circuit board body 10 comprises a bottom surface solder mask layer 11, a bottom surface circuit layer 12, a through hole layer 13, a top surface circuit layer 14, a top surface bonding pad layer 15, a top surface solder mask layer 16 and a top surface silk screen layer 17; the bottom circuit layer 12 is stacked on the upper surface of the bottom solder resist layer 11; the through hole layer 13 is overlapped on the upper surface of the bottom surface circuit layer 12; the surface of the through hole layer 13 is provided with two positioning hole marking areas 131, and each positioning hole marking area 131 is opposite to the corresponding positioning hole 101; the top circuit layer 14 is stacked on the upper surface of the through hole layer 13; the top land layer 15 is stacked on the upper surface of the top wiring layer 14; the top solder resist layer 16 is stacked on the upper surface of the top pad layer 15; the top screen printing layer 17 is overlapped on the upper surface of the top solder mask layer 16; in this embodiment, the first accommodating hole 10 penetrates through the top pad layer 15, the top solder mask layer 16 and the top screen printing layer 17 and uses the top circuit layer 14 as the bottom surface, the upper surface of the through hole layer 13 has two first accommodating hole mark areas 132, and each first accommodating hole mark area 132 is opposite to the corresponding first accommodating hole 102; in addition, the second accommodating hole 103 penetrates through the bottom solder mask layer 11 and takes the bottom circuit layer 12 as the bottom surface, the lower surface of the through hole layer 13 is provided with two second accommodating hole marking areas 133, and each second accommodating hole marking area 133 is opposite to the corresponding second accommodating hole 103.
The design focus of the utility model is that: two positioning holes are formed in the circuit board body, one positioning hole is formed in the left front side of the circuit board body, the other positioning hole is formed in the right rear side of the circuit board body, the circuit board cannot be reversely mounted, the circuit board is mounted more firmly and reliably, two positioning hole marking areas are formed in the surface of the through hole layer, and each positioning hole marking area is opposite to the corresponding positioning hole, so that the positioning holes are formed more accurately and reliably.
The foregoing description is only a preferred embodiment of the present utility model, and is not intended to limit the technical scope of the present utility model, so any minor modifications, equivalent changes and modifications made to the above embodiments according to the technical principles of the present utility model are still within the scope of the technical solutions of the present utility model.
Claims (6)
1. A small-size circuit board with locate function, its characterized in that: the circuit board comprises a circuit board body, wherein two positioning holes are formed in the circuit board body, one positioning hole is formed in the left front side of the circuit board body, and the other positioning hole is formed in the right rear side of the circuit board body; the circuit board body comprises a bottom surface solder mask layer, a bottom surface circuit layer, a through hole layer, a top surface circuit layer, a top surface bonding pad layer, a top surface solder mask layer and a top surface silk screen printing layer; the bottom surface circuit layer is laminated on the upper surface of the bottom surface solder mask layer; the through holes are laminated on the upper surface of the bottom circuit layer; the surface of the through hole layer is provided with two positioning hole marking areas, and each positioning hole marking area is opposite to the corresponding positioning hole; the top surface circuit layer is arranged on the upper surface of the through hole layer in a lamination mode; the top surface bonding pad is laminated on the upper surface of the top surface circuit layer; the top surface solder mask layer is overlapped on the upper surface of the top surface bonding pad layer; the top screen printing layer is laminated on the upper surface of the top solder mask layer.
2. The miniature circuit board with positioning function of claim 1, wherein: the upper surface of the circuit board body is provided with a first accommodating hole, the first accommodating hole penetrates through the top surface bonding pad layer, the top surface solder mask layer and the top surface screen printing layer and takes the top surface circuit layer as the bottom surface, the upper surface of the through hole layer is provided with two first accommodating hole marking areas, and each first accommodating hole marking area is opposite to the corresponding first accommodating hole.
3. The miniature circuit board with positioning function of claim 2, wherein: the first accommodating holes are arranged at left and right intervals, and the two first accommodating holes are positioned at the rear side of the circuit board body.
4. The miniature circuit board with positioning function of claim 1, wherein: the circuit board comprises a circuit board body, a bottom circuit layer and a through hole layer, wherein the bottom surface of the circuit board body is provided with a first accommodating hole, the bottom surface of the circuit board body is provided with a second accommodating hole, the second accommodating hole penetrates through the bottom surface solder mask layer and takes the bottom surface circuit layer as the bottom surface, the lower surface of the through hole layer is provided with two second accommodating hole marking areas, and each second accommodating hole marking area is opposite to a corresponding second accommodating hole.
5. The miniature circuit board with positioning function of claim 4, wherein: the second accommodating holes are arranged at left and right intervals, and the two second accommodating holes are positioned at the rear side of the circuit board body.
6. The miniature circuit board with positioning function of claim 1, wherein: the length of the circuit board body is 38.00mm, and the width of the circuit board body is 27.00mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223553282.7U CN219248174U (en) | 2022-12-30 | 2022-12-30 | Small-sized circuit board with positioning function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223553282.7U CN219248174U (en) | 2022-12-30 | 2022-12-30 | Small-sized circuit board with positioning function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219248174U true CN219248174U (en) | 2023-06-23 |
Family
ID=86840342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223553282.7U Active CN219248174U (en) | 2022-12-30 | 2022-12-30 | Small-sized circuit board with positioning function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219248174U (en) |
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2022
- 2022-12-30 CN CN202223553282.7U patent/CN219248174U/en active Active
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