CN215682757U - Core board and circuit board - Google Patents

Abstract

The utility model discloses a core board and a circuit board, wherein a plurality of first bonding pads and a plurality of second bonding pads are arranged on one surface of the core board, the plurality of first bonding pads are distributed along the periphery of the core board, and the plurality of second bonding pads are arranged on one side, away from the periphery of the core board, of the first bonding pads. According to the technical scheme, the core board is provided with the first pads positioned on the edge and the second pads positioned on the side, away from the periphery of the core board, of the first pads, the core board is provided with two circles of pads to increase the number of pins, the number of the pads of the core board is increased, the core board can meet different product requirements, meanwhile, the surface, facing the base board, of the core board is provided with the components, the area of the core board for arranging the components is increased, the applicability of a single core board is improved, and the cost of the product is reduced.

Description

Core board and circuit board

Technical Field

The present invention relates to the field of circuit board structures, and in particular, to a core board and a circuit board.

Background

With the development of miniaturization and high integration of electronic products, manufacturers usually adopt a structure in which a core board is separated from a base board in the design of a circuit board in order to save cost and development period, and the base board and the core board need to be connected when the whole electronic product is assembled. Generally, be provided with components and parts on core board, components and parts pass through the pad and are connected with the bottom plate electricity, and adopt the design of round pad usually in the core board structure of current, can not satisfy the welding demand of more pins of core board.

SUMMERY OF THE UTILITY MODEL

The main objective of the present invention is to provide a core board, which aims to increase the number of pads of the core board and improve the function and application range of the core board.

In order to achieve the above object, the core board provided by the present invention is used for connecting a bottom board, a plurality of first pads and a plurality of second pads are disposed on one surface of the core board, the plurality of first pads are arranged at intervals along an edge of the core board, and the plurality of second pads are disposed on one side of the first pads away from a periphery of the core board.

Optionally, the first pads extend to a side of the core board.

Optionally, the core board is provided with a plurality of stamp holes, the stamp holes are located on one side of the first bonding pad close to the periphery of the core board, one stamp hole is arranged corresponding to one first bonding pad, and the first bonding pad is communicated with the hole wall of the stamp hole.

Optionally, the number of the first pads is greater than the number of the second pads.

Optionally, the core board is square, the first pads are square, and the second pads are square.

The utility model further provides a circuit board which comprises the core board and a bottom board, wherein the core board and the bottom board are fixedly welded, the core board is provided with a first bonding pad and a second bonding pad, and the first bonding pad and the second bonding pad are electrically connected with the bottom board.

Optionally, a plurality of interface pads are arranged on the bottom plate, and one of the interface pads is welded to one of the first pads or one of the second pads correspondingly.

Optionally, a surface of the core board facing the bottom board is provided with components.

Optionally, the bottom plate is equipped with the holding tank on the inboard that the interface pad encloses, nuclear core plate with when the bottom plate is connected, components and parts are located in the holding tank.

Optionally, the opening of the accommodating groove is square;

and/or the accommodating groove penetrates through the bottom plate.

According to the technical scheme, the core board is provided with the first pads positioned on the edge and the second pads positioned on the side, away from the periphery of the core board, of the first pads, the core board is provided with two circles of pads to increase the number of pins, the number of the pads of the core board is increased, the core board can meet different product requirements, meanwhile, the surface, facing the base board, of the core board is provided with the components, the area of the core board for arranging the components is increased, the applicability of a single core board is improved, and the cost of the product is reduced.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a front side of a core board according to the present invention;

FIG. 2 is a schematic structural diagram of the back side of the core board according to the present invention;

FIG. 3 is a schematic structural diagram of a bottom plate of the circuit board of the present invention;

fig. 4 is a partially enlarged view of a portion a in fig. 3.

The reference numbers illustrate:

the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

The utility model provides a core board 1.

In the embodiment of the present invention, as shown in fig. 1 and fig. 2, a core board 1 is used for connecting a base board, a surface of the core board 1 connected to the base board 21 is provided with a plurality of first pads 13 and a plurality of second pads 15, the plurality of first pads 13 are arranged at intervals along an edge of the core board 1, and the plurality of second pads 15 are arranged on a side of the first pads 13 away from a peripheral edge of the core board 1.

The number of the first bonding pads 13 is multiple, and the first bonding pads are distributed at intervals along the periphery of the core board 1, so that the interference between the adjacent first bonding pads 13 is avoided, the working efficiency of the single first bonding pad 13 is protected, and the practicability of the first bonding pad 13 is improved.

The quantity of second pad 15 is a plurality of, a plurality of second pads 15 are located first pad 13 and are kept away from 1 peripheral one side of nuclear core plate, second pad 15 is used for increasing more interface pins on nuclear core plate 1, satisfy the different demands of nuclear core plate 1, on the other hand second pad 15 set up make full use of the space on nuclear core plate 1 surface, avoided the waste of plate material, when need not increase extra material and special technology, practiced thrift the cost of production. The plurality of second bonding pads 15 are added, so that the connection space between the core board 1 and the bottom board 21 is not affected, and the stability of signal transmission between the two boards and the convenience of connection are ensured.

According to the technical scheme, the core board 1 is provided with the first pads 13 located at the edge and the second pads 15 located at one side, far away from the periphery of the core board 1, of the first pads 13, the core board 1 is provided with two circles of pads to increase the number of pins, the number of the pads of the core board 1 is increased, the core board 1 can meet different product requirements, meanwhile, the surface, facing the bottom plate 21, of the core board 1 is provided with the component 17, the area of the core board 1 provided with the component 17 is increased, the applicability of a single core board 1 is improved, and the product cost is reduced.

In an embodiment of the present invention, as shown in fig. 1 and 2, the first pads 13 extend to the side surface of the core board 1.

The first pads 13 extend to the side of the core board 1, so that the first pads 13 can be welded with the base board 21 from the front surface, and the connection efficiency of the core board 1 and the base board 21 is improved.

In an embodiment of the present invention, as shown in fig. 1 and 2, the core board 1 is provided with a plurality of stamp holes 11, the stamp holes 11 are located on a side of the first pad 13 near the periphery of the core board 1, one stamp hole 11 is disposed corresponding to one first pad 13, and the first pad 13 is communicated with a hole wall of the stamp hole 11.

The setting of stamp hole 11 for when nuclear core plate 1 is connected with bottom plate 21, first pad 13 is closer apart from bottom plate 21's distance, and first pad 13 is connected with bottom plate 21 more easily, and avoided being similar to and arranged the needle, connection methods such as golden finger, stamp hole 11 link up nuclear core plate 1's setting, has reduced bottom plate 21 and the degree of difficulty of being connected of nuclear core plate 1, and it is convenient to make board and board assembly, only needs to realize being connected of nuclear core plate 1 and bottom plate 21 through modes such as SMD welding.

The number of the stamp holes 11 is multiple, the stamp holes 11 are arranged at intervals along the periphery of the core board 1 and communicated with the periphery of the core board 1, and the intervals between the adjacent stamp holes 11 are the same. Because circuit board 2 needs to realize different functions, therefore need core plate 1 to be connected with different boards, consequently through setting up a plurality of stamp holes 11 to reach and realize different functional requirements, realize that core plate 1 is arranged in the project of difference, enlarged core plate 1's range of application.

The postage stamp holes 11 are arranged by plating holes or through holes in the periphery of the board and cutting the edges of the board to form a series of half holes, which are the postage stamp holes 11. Board-to-board connection through the postage stamp hole 11 and the second land 15 is most commonly done using the postage stamp hole 11 to create a PCB stand-alone module, such as a Wi-Fi, bluetooth, or core board 1 module, which is then used as a stand-alone component placed on another board during PCB assembly. The more the number of the stamp holes 11 is, the more the number of the first bonding pads 13 is increased, and the requirement of multi-pin connection of different core boards 1 can be met.

It will be appreciated that the first pad 13 is provided in the stamp hole 11 or around the stamp hole 11, and that a quick electrical connection is possible through the stamp hole 11 and the first pad 13, without the need for a board connector to be used to effect the connection between the boards.

In an embodiment of the present invention, as shown in fig. 2, the number of the first pads 13 is larger than the number of the second pads 15.

The number of the first pads 13 is larger than that of the second pads 15, the first pads 13 are arranged on the stamp hole 11, the second pads 15 are arranged on the bottom surface of the core board 1, and the first pads 13 are arranged on the stamp hole 11 so as to be closer to the bottom board 21 when the core board 1 is connected with the bottom board 21, so that the first pads 13 are easier to connect with the bottom board 21, and the number of the first pads 13 is increased, which is beneficial to better exerting the advantages of the first pads 13.

Further, the shape of the first pad 13 is an ellipse, a square, or a circle; the first pad 15 has an elliptical, square or circular shape.

In the present embodiment, the first pad 13 and the second pad 15 are provided in a square shape, but it is understood that the pads may be provided in other shapes such as a circle, a polygon, and a rectangle, provided that the basic requirement of soldering is satisfied.

Furthermore, each bonding pad is provided with a gold plating layer, the gold plating layer is small in resistance, good in stability and high in weldability, conductivity is improved, welding of the bonding pads is facilitated, and reliability of electric connection between the base plate 21 and the core plate 1 is guaranteed.

In an embodiment of the present invention, as shown in fig. 1 and 2, the core board 1 has a square shape, the shape enclosed by the first pads 13 is a square shape, and the shape enclosed by the second pads 15 is a square shape.

It can be understood that the enclosing shape of the bonding pads can be different shapes such as a circle, a square and a rectangle, in an embodiment of the application, the enclosing shape is a square, and the arrangement of the square bonding pads can set the first bonding pads 13 and the second bonding pads 15 as many as possible on the premise of meeting the requirement of welding and ensuring the same distance between the bonding pads, so that the function and the function of each bonding pad are ensured; and because the square shape of the first pads 13 is outside the square shape of the second pads 15, it is ensured that the number of the first pads 13 is larger than the number of the second pads 15. Further, the square core board 1 is convenient for the connection between the boards, the square bonding pads are arranged and can be changed more in production, and meanwhile, the arrangement of the components 17 on the core board 1 is also convenient.

The present invention further provides a circuit board 2, as shown in fig. 3, the circuit board includes a base board 21 and a core board 1, the core board 1 is fixed to the base board 21 by welding, and the first bonding pad 13 and the second bonding pad 15 are electrically connected to the base board 21. The specific structure of the core board 1 refers to the above embodiments, and since the circuit board 2 adopts all technical solutions of all the above embodiments, at least all the beneficial effects brought by the technical solutions of the above embodiments are achieved, and no further description is given here.

In an embodiment of the present invention, as shown in fig. 3 and 4, a plurality of interface pads 211 are disposed on the bottom plate 21, and one interface pad 211 is soldered to one first pad 13 or one second pad 15.

The bonding pad and the interface bonding pad 211 are mutually welded, so that the core board 1 can be welded on the bottom board 21, the core board 1 is connected with the bottom board 21, and the electrical connection is stable and quick.

The interface pads 211 are arranged on the periphery of the bottom plate, the pads electrically connected with the interface pads 211 are correspondingly arranged on the periphery of the core plate 11, the center of the stamp hole 11 is positioned on the interface pads 211, the core plate 1 can be directly welded on the bottom plate through the stamp hole 11, the connection between the plates can be realized without adopting a plate connector, and the problem of poor contact caused by long-time repeated plugging and unplugging and easy looseness of the traditional plate connector is solved.

In an embodiment of the present invention, as shown in fig. 2, a component 17 is disposed on a surface of the core board 1 facing the bottom board 21.

The core board 1 is provided with the components 17 on one surface facing the bottom board 21, so that the core is realized, the components 17 on the front side and the back side of the core board 1 are arranged, the utilization space is improved, the functions and functions of the core board 1 are increased, and the space utilization rate of the core board 1 is improved.

In an embodiment of the utility model, as shown in fig. 3 and 4, the bottom board is provided with a receiving groove 213 on the inner side surrounded by the interface pad 211, and when the core board 1 is connected to the bottom board 21, the component 17 is disposed in the receiving groove 213.

The degree of depth of holding tank 213 equals with components and parts 17's height, or slightly is greater than components and parts 17's height, the setting of holding tank 213 for core plate 1 can set up components and parts 17 on the side surface of being connected with bottom plate 21, reserves the space for components and parts 17 that arrange on core plate 1 bottom surface, avoids interfering, and is convenient for core plate 1 dispel the heat.

In an embodiment of the utility model, as shown in fig. 3 and 4, the opening of the receiving groove 213 is square; and/or, the receiving groove 213 is disposed through the bottom plate 21.

The opening shape of holding tank 213 can be different shapes such as circular, square, rectangle, and in an example embodiment of this application, the opening shape of holding tank 213 is the square, and under the condition that the shape of nuclear core plate 1 is the square, set up the opening shape of holding tank 213 to the square, improved the position of arranging of components and parts 17 on nuclear core plate 1 on the one hand, improved the pleasing to the eye degree of arranging, the holding tank 213 shape of on the other hand square is simple, makes things convenient for PCB production, has reduced manufacturing cost.

The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (10)

1. The utility model provides a nuclear core plate for connect the bottom plate, its characterized in that, nuclear core plate one surface is equipped with a plurality of first pads and a plurality of second pad, and is a plurality of first pad is followed the periphery of nuclear core plate is arranged, and is a plurality of the second pad is located first pad is kept away from the peripheral one side of nuclear core plate.

2. The core board of claim 1, wherein the first bond pads extend to a side of the core board.

3. The core plate of claim 1, wherein the core plate defines a plurality of stamp holes therethrough, the stamp holes being located on a side of the first bonding pad adjacent to the periphery of the core plate, one of the stamp holes corresponding to one of the first bonding pads, the first bonding pad being in communication with a hole wall of the stamp hole.

4. The core board of claim 1, wherein the number of first pads is greater than the number of second pads.

5. The core board of claim 1, wherein the core board has a square shape, the first pads are enclosed in the square shape, and the second pads are enclosed in the square shape.

6. A circuit board comprising the core board according to any one of claims 1 to 5 and a board substrate, wherein the core board is solder-fixed to the board substrate, and the first pads and the second pads are electrically connected to the board substrate.

7. The circuit board of claim 6, wherein a plurality of interface pads are provided on the bottom plate, and one of the interface pads is soldered to one of the first pads or one of the second pads.

8. The circuit board of claim 6, wherein a surface of the core board facing the backplane board is provided with components.

9. The circuit board of claim 8, wherein the bottom board has a receiving groove on an inner side of the interface pad enclosure, and the component is located in the receiving groove when the core board is connected to the bottom board.

10. The circuit board of claim 9, wherein the opening of the receiving groove is square in shape;

and/or the accommodating groove penetrates through the bottom plate.

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