CN207820320U - A kind of pad component and printed circuit board - Google Patents
A kind of pad component and printed circuit board Download PDFInfo
- Publication number
- CN207820320U CN207820320U CN201721857210.8U CN201721857210U CN207820320U CN 207820320 U CN207820320 U CN 207820320U CN 201721857210 U CN201721857210 U CN 201721857210U CN 207820320 U CN207820320 U CN 207820320U
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- pad
- circuit board
- printed circuit
- pcb
- component
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Abstract
The utility model provides a kind of pad component, is located on printed circuit board, the printed circuit board includes pad layer and solder mask, and the pad component includes pad and polarity mark；The pad is located at the pad layer of the printed circuit board；The polarity mark is located at the solder mask of the printed circuit board, and the position among the pad.The utility model also provides a kind of printed circuit board.In summary, the utility model on printed circuit board (PCB) pad by directly identifying positive and negative anodes, in production the patch direction with polar electronic component can be distinguished by being directly viewable printed circuit board (PCB), the making of silk-screen layer is decreased simultaneously, reduce the area of printed circuit board (PCB), time and the cost for having saved production printed circuit board (PCB) keep the repair of printed circuit board (PCB) more convenient.
Description
Technical field
The utility model is related to the fields printed circuit board (PCB), more particularly to a kind of pad component and printed circuit board.
Background technology
As electronic product tends to exquisite small and exquisite, to the design requirement of printed circuit board (PCB) with regard to higher and higher, wherein passing through
Light emitting diode (LED) etc. can be often used to be widely used in that there is polar electronic component in circuit design.Therefore, it is printing
Identification patch direction when printed circuit board (PCB) will make outer wire when designing and polarity mark line facilitates production and repair.
Polarity mark line and outer wire needs make on the silk-screen layer of printed circuit board (PCB), due to compact package
Electronic component silk-screen line can closely cause very much the silk-screen line made incomplete close to pad.To ensure polarity mark line and outline border
Line it is complete, the spacing between component needs enough width, that is, need increase printed circuit board (PCB) area, can cause
The electronic product high to printed circuit board (PCB) area requirements is may not apply to, there is certain limitation.
Printed circuit board (PCB) area can be reduced using high density electronic component layout, but electronics can be caused first
The outer wire and polarity mark line of device make incomplete or can not make, this is difficult that intuitive distinguish prints in production and repair
Patch direction with polarity electronic component on printed circuit board (PCB) can only use drawing comparison to distinguish, need to print accordingly
More positions PCB drawing, increases production cost.If band polarity electronics member device may be led to by carrying out production without using drawing
Part patch direction patch is anti-, causes device to burn out, needs repair of doing over again.
Utility model content
The purpose of the utility model is to provide a kind of pad components that can intuitively distinguish patch direction.
The utility model provides a kind of pad component, is located on printed circuit board, the printed circuit board includes pad layer
And solder mask, the pad component includes pad and polarity mark；The pad is located at the pad layer of the printed circuit board；Institute
State the solder mask that polarity mark is located at the printed circuit board, and the position among the pad.
Further, the polarity mark is located at the top of the pad.
Further, the pad includes positive terminal pad and negative terminal pad, and the polarity mark includes anode mark and bears
Pole marks is known；The anode mark is located among the positive terminal pad, and the cathode mark is located among the negative terminal pad.
Further, the pad is diode pad.
Further, the pad is patch pad or lead type component pads.
Further, the printed circuit board further includes silk-screen layer, and the pad further includes outline border silk-screen；The outline border silk
Print is located at silk-screen layer, and corresponding with the shape of the affiliated element of the pad and position, the silk-screen layer is located on the solder mask
Side.
The utility model also provides a kind of printed circuit board, including above-mentioned pad component.
Further, the printed circuit board is rigid circuit board or flexible PCB.
In conclusion the utility model is on printed circuit board (PCB) pad by directly identifying positive and negative anodes, in production
The patch direction with polar electronic component can be distinguished by being directly viewable printed circuit board (PCB), while also being reduced
The making of silk-screen layer, reduces the area of printed circuit board (PCB), saved production printed circuit board (PCB) time and
Cost keeps the repair of printed circuit board (PCB) more convenient.
The above description is merely an outline of the technical solution of the present invention, in order to better understand the skill of the utility model
Art means, and being implemented in accordance with the contents of the specification, and in order to allow the above and other purpose, feature of the utility model
It can be clearer and more comprehensible with advantage, it is special below to lift preferred embodiment, and coordinate attached drawing, detailed description are as follows.
Description of the drawings
Fig. 1 is the structural schematic diagram for the pad component first embodiment that the utility model first embodiment provides.
Fig. 2 is the structural schematic diagram for the pad component second embodiment that the utility model first embodiment provides.
Fig. 3 is the structural schematic diagram for the pad component first embodiment that the utility model second embodiment provides.
Fig. 4 is the structural schematic diagram for the pad component second embodiment that the utility model second embodiment provides.
Specific implementation mode
Further to illustrate that the utility model is to reach the technological means and effect that predetermined purpose of utility model is taken,
Below in conjunction with attached drawing and preferred embodiment, to according to the utility model proposes pad component specific implementation mode, method, step
Suddenly, structure, feature and its effect, detailed description are as follows.
Aforementioned and other technology contents, feature and effect in relation to the utility model, following cooperation with reference to schema compared with
It can be clearly appeared from the detailed description of good embodiment.By the explanation of specific implementation mode, when can be to the utility model up to
The technological means and effect taken at predetermined purpose are able to more go deep into and specifically understand, however institute's accompanying drawings are only to provide
Reference and description is used, and is not used for limiting the utility model.
Fig. 1 is the structural schematic diagram for the pad component first embodiment that the utility model first embodiment provides.Such as Fig. 1
Shown, pad component 10 includes the first pad 11, the second pad 12 and the first polarity mark 13, the second polarity mark 14.First
Polarity mark 13 is located among the first pad 11, and the second polarity mark 14 is located among the second pad 12.First pad 11 is just
Pole pad, the second pad 12 are negative terminal pad, and the first polarity mark 13 is that anode identifies, and the second polarity mark 14 is cathode mark
Know.
In the present embodiment, pad component 10 is located on printed circuit board (PCB), wherein the first pad 11 and the second pad
12 are located at the pad layer of printed circuit board (PCB), and the first polarity mark 13 and the second polarity mark 14 are located at printed circuit board
(PCB) solder mask.
SMT (Surface Mount Technology) is surface installation technique, also known as surface mounting technology, is current electricity
Subgroup fills a kind of most popular technology and technique in industry.Pad is the basic Component units of surface mount assembly, for constituting
The welding disk pattern of circuit board, i.e., the various pad combinations for the design of particular components type.There are two words for the English of pad：Land and
Pad can often be used alternatingly；But functionally, Land is two-dimensional surface characteristics, and without welding hole, being mainly used for can table
The element of face paste dress, and Pad is three-dimensional feature, there is welding hole, is mainly used for the element of pluggable unit.
In the present embodiment, the first pad 11 and the second pad 12 are the patch pad using surface mounting technology (SMT),
That is Land has polar electronic component, such as light emitting diode (LED) for mounting.
PCB (Printed Circuit Board), Chinese is printed circuit board, also known as printed wiring board, is important
Electronic unit, be the supporter of electronic component, be electronic component electrical connection carrier.At printed circuit board (PCB)
In manufacturing process, printed circuit board (PCB) is etched by plating copper coin forms the substrate with pad layer, then in addition to needing to open a window
Position (such as pad position) other than apply solder resist (such as welding resistance green oil) formed solder mask.Printed circuit board (PCB)
Electronic component pad need to reveal copper, so to open a window in solder mask, also with regard to saying that the region for needing dew copper will not be hindered
Green oil is welded to covering.If welding resistance windowed regions area is big as pad, due to the public affairs of printed circuit board (PCB) manufacturing
Difference just can not avoid welding resistance green oil from covering on pad position, so the process deviation of general plate factory in order to balance, welding resistance
The windowed regions size more certain than practical pad expanded in size.
In the present embodiment, the first polarity mark 13 and the second polarity mark 14 are respectively in the first pad 11 and the second pad
It is directly identified on 12, for example, the first polarity mark 13 and the second polarity mark 14 are located at the first pad 11 and the second pad
12 top or the first polarity mark 13 and the second polarity mark 14 are located at patterned first pad 11 and pattern words
The second pad 12 blank space.In production electronic component can be distinguished by being directly viewable printed circuit board (PCB)
Patch direction, while the making of silk-screen layer is decreased, the area of printed circuit board (PCB) is reduced, production printing has been saved
The time of circuit board (PCB) and cost keep the repair of printed circuit board (PCB) more convenient.
Fig. 2 is the structural schematic diagram for the pad component second embodiment that the utility model first embodiment provides.Such as Fig. 2
Shown, in the present embodiment, pad component 10 further includes outline border silk-screen 15, and outline border silk-screen is located at printed circuit board (PCB)
Silk-screen layer, the shape for sketching the contours of the affiliated element of pad and position.
In order to facilitate the installation and repair etc. of circuit, one layer of the top in printed circuit board (PCB) is usually silk-screen
Layer, i.e. character layer, can not have, and are generally used for annotation and use.Present embodiment increases the outline border silk-screen of electronic component, will be electric
The shape of sub- component and position with its belonging to pad demarcate, more intuitively illustrate the patch location of electronic component,
Prevent patch from slipping up.
Fig. 3 is the structural schematic diagram for the pad component first embodiment that the utility model second embodiment provides.Such as Fig. 3
Shown, pad component 20 includes the first pad 21, the second pad 22 and the first polarity mark 23, the second polarity mark 24.First
Polarity mark 23 is located among the first pad 21, and the second polarity mark 24 is located among the second pad 22.First pad 21 is just
Pole pad, the second pad 22 are negative terminal pad, and the first polarity mark 23 is that anode identifies, and the second polarity mark 24 is cathode mark
Know.
In the present embodiment, pad component 20 is located on printed circuit board (PCB), wherein the first pad 21 and the second pad
22 are located at the pad layer of printed circuit board (PCB), and the first polarity mark 23 and the second polarity mark 24 are located at printed circuit board
(PCB) solder mask.
Lead type electronic component is welded by the fairlead being inserted into conductive pin on printed circuit board (PCB) with scolding tin
It connects and fixes on a printed circuit board (pcb), printed circuit board (PCB) connects pad with printed conductor, realizes that element exists
Electrical connection in circuit.
In the present embodiment, the first pad 21 and the second pad 22 are the lead type pad with through-hole, i.e. Pad, being used for can
Lead type electronic component of plug-in unit, such as lead type motor, lead type receiver, lead type loud speaker, lead type microphone etc..
In the present embodiment, the through-hole of the first pad 21 and the second pad 22 is each passed through the first polarity mark 23 and second
Polarity mark 24.
In the present embodiment, the first polarity mark 23 and the second polarity mark 24 are respectively in the first pad 21 and the second pad
It is directly identified on 22, the plug-in unit direction of electronic component can be distinguished by being directly viewable printed circuit board (PCB) in production,
The making for decreasing silk-screen layer simultaneously, reduces the area of printed circuit board (PCB), has saved production printed circuit board
(PCB) time and cost keep the repair of printed circuit board (PCB) more convenient.
Fig. 4 is the structural schematic diagram for the pad component second embodiment that the utility model second embodiment provides.Such as Fig. 4
Shown, in the present embodiment, pad component 20 further includes outline border silk-screen 25, and outline border silk-screen is located at printed circuit board (PCB)
Silk-screen layer, the shape for sketching the contours of the affiliated element of pad and position.
Present embodiment increases the outline border silk-screen of electronic component, belonging to the shape of electronic component and position and its
Pad demarcate, more intuitively illustrate the card address of electronic component, prevent plug-in unit from slipping up.
In conclusion the utility model is on printed circuit board (PCB) pad by directly identifying positive and negative anodes, in production
The patch direction with polar electronic component can be distinguished by being directly viewable printed circuit board (PCB), while also being reduced
The making of silk-screen layer, reduces the area of printed circuit board (PCB), saved production printed circuit board (PCB) time and
Cost keeps the repair of printed circuit board (PCB) more convenient.
The above descriptions are merely preferred embodiments of the present invention, not makees in any form to the utility model
Limitation be not limited to the utility model although the utility model has been disclosed with preferred embodiment as above, it is any ripe
Professional and technical personnel is known, is not being departed within the scope of technical solutions of the utility model, when can be in the technology by the disclosure above
Hold the equivalent embodiment made a little change or be modified to equivalent variations, as long as being without departing from technical solutions of the utility model
Hold, any simple modification, equivalent change and modification made by the above technical examples according to the technical essence of the present invention, still
It is within the scope of the technical solutions of the present invention.
Claims (8)
1. a kind of pad component is located on printed circuit board, the printed circuit board includes pad layer and solder mask, and feature exists
In, including pad and polarity mark；
The pad is located at the pad layer of the printed circuit board；
The polarity mark is located at the solder mask of the printed circuit board, and the position among the pad.
2. pad component as described in claim 1, which is characterized in that the polarity mark is located at the top of the pad.
3. pad component as described in claim 1, which is characterized in that the pad includes positive terminal pad and negative terminal pad, institute
It includes anode mark and cathode mark to state polarity mark；The anode mark is located among the positive terminal pad, the cathode mark
Know and is located among the negative terminal pad.
4. pad component as described in claim 1, which is characterized in that the pad is diode pad.
5. pad component as described in claim 1, which is characterized in that the pad is that patch pad or lead type element weld
Disk.
6. pad component as described in claim 1, which is characterized in that the printed circuit board further includes silk-screen layer, the weldering
Disk further includes outline border silk-screen；The outline border silk-screen is located at silk-screen layer, corresponding with the shape of the affiliated element of the pad and position,
The silk-screen layer is located above the solder mask.
7. a kind of printed circuit board, which is characterized in that including pad component as claimed in any one of claims 1 to 6.
8. printed circuit board as claimed in claim 7, which is characterized in that the printed circuit board is rigid circuit board or flexibility
Circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721857210.8U CN207820320U (en) | 2017-12-26 | 2017-12-26 | A kind of pad component and printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721857210.8U CN207820320U (en) | 2017-12-26 | 2017-12-26 | A kind of pad component and printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207820320U true CN207820320U (en) | 2018-09-04 |
Family
ID=63331261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721857210.8U Active CN207820320U (en) | 2017-12-26 | 2017-12-26 | A kind of pad component and printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207820320U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109413850A (en) * | 2018-12-12 | 2019-03-01 | 珠海格力电器股份有限公司 | A kind of design method of improved plug-in components PCB encapsulation |
-
2017
- 2017-12-26 CN CN201721857210.8U patent/CN207820320U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109413850A (en) * | 2018-12-12 | 2019-03-01 | 珠海格力电器股份有限公司 | A kind of design method of improved plug-in components PCB encapsulation |
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