CN206879217U - Mobile terminal and its circuit board assemblies - Google Patents
Mobile terminal and its circuit board assemblies Download PDFInfo
- Publication number
- CN206879217U CN206879217U CN201720707296.XU CN201720707296U CN206879217U CN 206879217 U CN206879217 U CN 206879217U CN 201720707296 U CN201720707296 U CN 201720707296U CN 206879217 U CN206879217 U CN 206879217U
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- China
- Prior art keywords
- circuit board
- pad
- area
- layer
- top layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a kind of mobile terminal and its circuit board assemblies, the circuit board assemblies include circuit board and plant and weld earphone base on circuit boards, earphone base is provided with five pins, circuit board is correspondingly provided with five through holes to receive five pin insertions, circuit board is multi-layer sheet, each layer circuit board is provided with pad around through hole, and the area of the pad at least one layer in the circuit board on non-top layer is less than the area of the pad on the circuit board on top layer.Mobile terminal and its circuit board assemblies provided by the utility model can improve the cabling space of circuit board in the case where not influenceing device paster effect.
Description
Technical field
Technical field of circuit design is the utility model is related to, more particularly to a kind of mobile terminal and its circuit board assemblies.
Background technology
PCB (Printed Circuit Board), Chinese is printed circuit board, also known as printed circuit board (PCB), track
Road plate, it is important electronic unit, is the supporter of electronic component, is the supplier of electronic component electrical connection.
In order to fix and be connected electrically on PCB electronic component, copper foil is mounted typically in PCB substrate as weldering
Disk, tin cream is then coated on copper foil, electronic component is electrically connected and secured on PCB by tin cream, some have pin device
The pad of part is usually that the Kong Yirang pins that certain size is outputed on PCB can insert, and copper is then mounted around hole
Paper tinsel is as pad.
Steel mesh (Stencils) namely SMT templates (SMT Stencil), it is a kind of SMT particular manufacturing crafts, its main work(
The deposition of tin cream can be to aid in, it is therefore an objective to which the tin cream of accurate quantity is transferred to accurate location on the PCB of sky.
SMT (Surface Mounted Technology) is surface installation technique, be in current electronic assembly industry most
Popular a kind of technology and technique.It is that one kind will be without pin or short leg surface-assembled component (abbreviation SMC/SMD, Chinese
Claim sheet component) it is arranged on the surface of printed circuit board (Printed Circuit Board, PCB) or the table of other substrates
On face, the circuit load technology of welding assembly is subject to by the methods of Reflow Soldering or immersed solder.
By taking earphone base device as an example, earphone base has five pins, so corresponding PCB devises five in the both sides of earphone base
The individual hole with pad, usual PCB have several layers of, and just there is several layers of pad, such as one piece 8 layers of PCB corresponding to each pin, then
Each pin is just corresponding with 8 layers of pad, and each layer pad etc. is big, by hole wall copper-plating technique every when PCB makes
One layer of pad connection is got up, when SMT is produced the pin of earphone base be inserted into corresponding in band pad hole, tin cream stream during Reflow Soldering
Move up, the pad of pin and hole wall, PCB surface earphone base is fixed together.
The each layer of pad design corresponding to pin is all to wait big in the prior art, but tin cream only can be with when SMT is produced
Hole wall, the pad of PCB surface combine (wherein tin is more in the surface pads of device side, and tin is less in non-surface pads), in PCB
The pad of layer is not combined with tin cream, and pad as design occupies excessive cabling in the cell phone mainboard of high density cabling
Space.
Utility model content
The utility model provides a kind of mobile terminal and circuit board, to solve the through hole on the non-top layer of circuit board in the prior art
The pad at place takes the technical problem of excessive cabling space.
In order to solve the above technical problems, the technical scheme that the utility model uses is：A kind of circuit board assemblies are provided,
The circuit board assemblies include circuit board and the earphone base planted and be welded on the circuit board, and the earphone base is provided with five
Pin, the circuit board are correspondingly provided with five through holes and inserted with receiving five pins, and the circuit board is multi-layer sheet, each
The layer circuit board is provided with pad around the through hole, the weldering at least one layer in the circuit board on non-top layer
The area of disk is less than the area of the pad on the circuit board on top layer.
According to the preferred embodiment of the utility model one, the area of the pad on the second layer circuit board is less than the institute on top layer
State the area of the pad on circuit board.
According to the preferred embodiment of the utility model one, the area of the pad on third layer circuit board is less than the institute on top layer
State the area of the pad on circuit board.
According to the preferred embodiment of the utility model one, the area of the pad on four-layer circuit board is less than the institute on top layer
State the area of the pad on circuit board.
According to the preferred embodiment of the utility model one, the area of the pad on layer 5 circuit board is less than the institute on top layer
State the area of the pad on circuit board.
In order to solve the above technical problems, another technical scheme that the utility model uses is：A kind of mobile terminal is provided,
The mobile terminal includes circuit board assemblies, and the circuit board assemblies include circuit board and plant and be welded on the circuit board
Earphone base, the earphone base is provided with five pins, and the circuit board is correspondingly provided with five through holes to receive five pins
Insertion, the circuit board is multi-layer sheet, and each layer circuit board is provided with pad around the through hole, non-top layer it is described
The area of the pad at least one layer in circuit board is less than the area of the pad on the circuit board on top layer.
The beneficial effects of the invention are as follows：Be different from the situation of prior art, mobile terminal provided by the utility model and its
Circuit board assemblies can improve the cabling space of circuit board in the case where not influenceing device paster effect.
Brief description of the drawings
, below will be to needed for embodiment description in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
The accompanying drawing to be used is briefly described, it should be apparent that, drawings in the following description are only some realities of the present utility model
Example is applied, for those of ordinary skill in the art, on the premise of not paying creative work, can also be according to these accompanying drawings
Other accompanying drawings are obtained, wherein：
Fig. 1 is the simplification structural representation of the circuit board assemblies of the utility model preferred embodiment.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only part of the embodiment of the present utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
Referring to Fig. 1, Fig. 1 is the simplification structural representation of the circuit board assemblies of the utility model preferred embodiment.Wherein,
Fig. 1 is visual angle of the bottom depending on (looking up), and conceals circuit board and remain the pad in circuit board on each laminate, pad 130 with
The overlapping part of pad 140 is covered by pad 140.
Specifically, the utility model provides a kind of circuit board assemblies, and the circuit board assemblies include circuit board (not shown)
With plant and weld earphone base 110 on circuit boards, earphone base 110 is provided with five pin (not shown), and circuit board is correspondingly set
There are five through holes 120 to receive five pin insertions.Wherein, through hole 120 can be diagram track type or circle,
Ellipse, rectangle or polygon etc..
Circuit board is multi-layer sheet, and each layer circuit board is provided with pad (130,140) around through hole 120, non-top layer
The area of pad 140 at least one layer in circuit board is less than the area of the pad 130 on the circuit board on top layer.
In a particular embodiment, circuit board can be the weldering on the second layer circuit board for that can be five laminates or eight laminates
The area of disk 140 is less than the area of the pad 130 on the circuit board on top layer；It can also be the pad 140 on third layer circuit board
Area be less than top layer circuit board on pad 130 area；It can also be the area of the pad 140 on four-layer circuit board
Less than the area of the pad 130 on the circuit board on top layer；It can also be that the area of the pad 140 on layer 5 circuit board is less than table
The area of pad 130 on the circuit board of layer or second and third, the pad 140 on four, five layer circuit boards be same chi
Very little specification and area are less than the area of the pad 130 on the circuit board on top layer.That is, around through hole 120 on multi-layer sheet
Pad be divided to two kinds of specifications, the area of the pad 130 on the circuit board on top layer is combined due to needing with scolding tin, thus area needs
Enough, the area of the pad 140 rather than on the circuit board on top layer can reduce to concede due to need not be combined with scolding tin
More cabling space need for other circuit traces.
In addition, the utility model also provides a kind of mobile terminal, the mobile terminal includes circuit board assemblies, circuit board assemblies
Including circuit board and plant and earphone base 110 on circuit boards is welded, earphone base 110 is provided with five pins, and circuit board is corresponding
Provided with five through holes 120 to receive five pin insertions, circuit board is multi-layer sheet, and each layer circuit board is around through hole 120
Provided with pad, the area of the pad at least one layer in the circuit board on non-top layer is less than the face of the pad on the circuit board on top layer
Product.
In summary, it should be readily apparent to one skilled in the art that mobile terminal provided by the utility model and its circuit board group
Part can improve the cabling space of circuit board in the case where not influenceing device paster effect.
Embodiment of the present utility model is the foregoing is only, not thereby limits the scope of the claims of the present utility model, it is every
The equivalent structure or equivalent flow conversion made using the utility model specification and accompanying drawing content, or be directly or indirectly used in
Other related technical areas, similarly it is included in scope of patent protection of the present utility model.
Claims (10)
1. a kind of circuit board assemblies, it is characterised in that the circuit board assemblies include circuit board and plant and be welded on the electricity
Earphone base on the plate of road, the earphone base are provided with five pins, and the circuit board is correspondingly provided with five through holes to receive described five
Individual pin insertion, the circuit board is multi-layer sheet, and each layer circuit board is provided with pad, non-top layer around the through hole
The circuit board at least one layer on the pad area be less than top layer the circuit board on pad area.
2. circuit board assemblies according to claim 1, it is characterised in that the area of the pad on the second layer circuit board
Less than the area of the pad on the circuit board on top layer.
3. circuit board assemblies according to claim 1, it is characterised in that the area of the pad on third layer circuit board
Less than the area of the pad on the circuit board on top layer.
4. circuit board assemblies according to claim 1, it is characterised in that the area of the pad on four-layer circuit board
Less than the area of the pad on the circuit board on top layer.
5. circuit board assemblies according to claim 1, it is characterised in that the area of the pad on layer 5 circuit board
Less than the area of the pad on the circuit board on top layer.
6. a kind of mobile terminal, it is characterised in that the mobile terminal includes circuit board assemblies, and the circuit board assemblies include electricity
Road plate and the earphone base planted and be welded on the circuit board, the earphone base are provided with five pins, and the circuit board is corresponding
Inserted provided with five through holes with receiving five pins, the circuit board is multi-layer sheet, and each layer circuit board is described
It is provided with pad around through hole, the area of the pad at least one layer in the circuit board on non-top layer is less than top layer
The area of pad on the circuit board.
7. mobile terminal according to claim 6, it is characterised in that the area of the pad on the second layer circuit board is small
In the area of the pad on the circuit board on top layer.
8. mobile terminal according to claim 6, it is characterised in that the area of the pad on third layer circuit board is small
In the area of the pad on the circuit board on top layer.
9. mobile terminal according to claim 6, it is characterised in that the area of the pad on four-layer circuit board is small
In the area of the pad on the circuit board on top layer.
10. mobile terminal according to claim 6, it is characterised in that the area of the pad on layer 5 circuit board
Less than the area of the pad on the circuit board on top layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720707296.XU CN206879217U (en) | 2017-06-16 | 2017-06-16 | Mobile terminal and its circuit board assemblies |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720707296.XU CN206879217U (en) | 2017-06-16 | 2017-06-16 | Mobile terminal and its circuit board assemblies |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206879217U true CN206879217U (en) | 2018-01-12 |
Family
ID=61333418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720707296.XU Expired - Fee Related CN206879217U (en) | 2017-06-16 | 2017-06-16 | Mobile terminal and its circuit board assemblies |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206879217U (en) |
-
2017
- 2017-06-16 CN CN201720707296.XU patent/CN206879217U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180112 Termination date: 20190616 |