CN204157152U - A kind of multilayer circuit board - Google Patents
A kind of multilayer circuit board Download PDFInfo
- Publication number
- CN204157152U CN204157152U CN201420577638.7U CN201420577638U CN204157152U CN 204157152 U CN204157152 U CN 204157152U CN 201420577638 U CN201420577638 U CN 201420577638U CN 204157152 U CN204157152 U CN 204157152U
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- intermediate layer
- layer
- circuit intermediate
- circuit board
- prepreg
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Abstract
The utility model embodiment discloses a kind of multilayer circuit board, after achieving prepreg pressing after liquefaction, the pressing of minimum spacing between multiple circuit intermediate layer, solve the design of existing electronic product mainboard, and the thickness of the pcb board of producing just cannot meet nowadays for the technical problem of lightening design.The utility model embodiment comprises: multiple circuit intermediate layer, prepreg and copper foil layer; Circuit intermediate layer is provided with at least 4 and is arranged on the corner in circuit intermediate layer and the location hole at center; Multiple circuit intermediate layer is superimposed with prepreg between any two and carries out lamination; Copper foil layer is arranged on the top layer in first circuit intermediate layer after lamination and the bottom in last circuit intermediate layer; Multiple circuit intermediate layer, prepreg and copper foil layer are fixedly linked with pressing mode.
Description
Technical field
The utility model relates to PCB technical field, particularly relates to a kind of multilayer circuit board.
Background technology
PCB (Printed Circuit Board), Chinese is printed circuit board, and also known as printed circuit board (PCB), printed substrate, being important electronic unit, is the supporter of electronic devices and components, is the carrier of electronic devices and components electrical connection.Because it adopts electron printing to make, therefore be called as " printing " circuit board.Along with the high speed development of science and technology, electronic product, such as mobile phone etc. more and more tend to " lightening " design, and therefore, the lightening design of electronic product mainboard more and more enjoys those skilled in the art to favor.
Normally as shown in Figure 1, by copper-clad plate 101, the overlaying structure of prepreg 102 and multiple pure copper foil line layer 103 forms current electronic product mainboard.
But, the design of existing electronic product mainboard as shown in Figure 1, when electronic product mainboard needs up to 4 layers or more, such as cell phone mainboard routine is 10 layers of pcb board, then the thickness of the pcb board of producing just cannot meet nowadays for the technical problem of lightening design.
Utility model content
The utility model embodiment discloses a kind of multilayer circuit board, after achieving prepreg pressing after liquefaction, the pressing of minimum spacing between multiple circuit intermediate layer, solve the design of existing electronic product mainboard, and the thickness of the pcb board of producing just cannot meet nowadays for the technical problem of lightening design.
The utility model embodiment provides a kind of multilayer circuit board, it is characterized in that, comprising:
Multiple circuit intermediate layer, prepreg and copper foil layer;
Described circuit intermediate layer is provided with at least 4 and is arranged on the described corner in circuit intermediate layer and the location hole at center;
Multiple described circuit intermediate layer is superimposed with described prepreg between any two and carries out lamination;
Described copper foil layer is arranged on the top layer in first described circuit intermediate layer after lamination and the bottom in circuit intermediate layer described in last;
Multiple described circuit intermediate layer, described prepreg and described copper foil layer are fixedly linked with pressing mode.
Preferably,
Described prepreg is provided with between described circuit intermediate layer and described copper foil layer.
Preferably,
Described circuit intermediate layer is the insulation layer structure that one side is provided with line layer.
Preferably,
Described circuit intermediate layer is the insulating barrier that upper and lower surface is provided with line layer.
Preferably,
Described insulating barrier is polyimide layer.
Preferably,
Described multilayer circuit board also comprises:
Via, runs through whole described multilayer circuit board.
Preferably,
Described circuit intermediate layer is 10 layers.
Preferably,
Described prepreg has 5.
Preferably,
Described multilayer circuit board also comprises:
Solder mask, covers the bottom surface of the described copper foil layer surface on the top layer in first described circuit intermediate layer and the described copper foil layer in circuit intermediate layer described in last.
As can be seen from the above technical solutions, the utility model embodiment has the following advantages:
The utility model embodiment provides a kind of multilayer circuit board, comprising: multiple circuit intermediate layer, prepreg and copper foil layer; Circuit intermediate layer is provided with at least 4 and is arranged on the corner in circuit intermediate layer and the location hole at center; Multiple circuit intermediate layer is superimposed with prepreg between any two and carries out lamination; Copper foil layer is arranged on the top layer in first circuit intermediate layer after lamination and the bottom in last circuit intermediate layer; Multiple circuit intermediate layer, prepreg and copper foil layer are fixedly linked with pressing mode.In the present embodiment, by multiple circuit intermediate layer, prepreg is set between any two, copper foil layer is superposed respectively again by below top layer, circuit intermediate layer and bottom, finally carry out pressing, after achieving prepreg pressing after liquefaction, the pressing of minimum spacing between multiple circuit intermediate layer, solve the design of existing electronic product mainboard, and the thickness of the pcb board of producing just cannot meet nowadays for the technical problem of lightening design.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of an embodiment of a kind of multilayer circuit board in the utility model embodiment;
Fig. 2 is the structural representation of another embodiment of a kind of multilayer circuit board in the utility model embodiment.
Embodiment
The utility model embodiment discloses a kind of multilayer circuit board, after achieving prepreg pressing after liquefaction, the pressing of minimum spacing between multiple circuit intermediate layer, solve the design of existing electronic product mainboard, and the thickness of the pcb board of producing just cannot meet nowadays for the technical problem of lightening design.
Refer to Fig. 1, an embodiment of a kind of multilayer circuit board provided in the utility model embodiment comprises:
Multiple circuit intermediate layer 1, prepreg 2 and copper foil layer 3;
Circuit intermediate layer 1 is provided with at least 4 and is arranged on the corner in circuit intermediate layer 1 and the location hole at center;
Multiple circuit intermediate layer 1 is superimposed with prepreg 2 between any two and carries out lamination;
Copper foil layer 3 is arranged on the multiple top layer, circuit intermediate layer 1 after lamination and bottom;
Multiple circuit intermediate layer 1, prepreg 2 and copper foil layer 3 are fixedly linked with pressing mode.
In the present embodiment, by multiple circuit intermediate layer 1, prepreg 2 is set between any two, copper foil layer 3 is superposed respectively again by below top layer, circuit intermediate layer 1 and bottom, finally carry out pressing, after achieving prepreg 2 pressing after liquefaction, the pressing of minimum spacing between multiple circuit intermediate layer 1, solve the design of existing electronic product mainboard, and the thickness of the pcb board of producing just cannot meet nowadays for the technical problem of lightening design.
The above is described in detail the structure of multilayer circuit board, is described in detail below, refers to Fig. 2 by the structure in circuit intermediate layer, and another embodiment of a kind of multilayer circuit board provided in the utility model embodiment comprises:
Multiple circuit intermediate layer 1, prepreg 2 and copper foil layer 3;
Circuit intermediate layer 1 is provided with at least 4 and is arranged on the corner in circuit intermediate layer 1 and the location hole at center;
Multiple circuit intermediate layer 1 is superimposed with prepreg 2 between any two and carries out lamination;
Copper foil layer 3 is arranged on the top layer in first circuit intermediate layer 1 after lamination and the bottom in last circuit intermediate layer 1
Multiple circuit intermediate layer 1, prepreg 2 and copper foil layer 3 are fixedly linked with pressing mode.
Further, prepreg 2 is provided with between circuit intermediate layer 1 and copper foil layer 3, aforesaid circuit intermediate layer 2 is insulating barrier 22 structure that one side or upper and lower surface are provided with line layer 21, further, insulating barrier 22 is polyimides material, makes a kind of multilayer circuit board provided in the utility model embodiment realize ultrathin design.
A kind of multilayer circuit board provided in the utility model embodiment can further include:
Via 4, runs through whole multilayer circuit board;
Solder mask, covers the bottom surface of copper foil layer 3 surface on the top layer in first circuit intermediate layer 1 and the copper foil layer 3 in last circuit intermediate layer 1.
In the present embodiment, by multiple circuit intermediate layer 1, prepreg 2 is set between any two, copper foil layer 3 is superposed respectively again by below top layer, circuit intermediate layer 1 and bottom, finally carry out pressing, gap between the circuit layer 21 infiltrating circuit intermediate layer 1 after liquefaction after achieving prepreg 2 pressing, the pressing of minimum spacing between multiple circuit intermediate layer 1, solve the design of existing electronic product mainboard, and the thickness of the pcb board of producing just cannot meet nowadays for the technical problem of lightening design, and the roughening treatment of circuit layer 21 and insulating barrier 22, further increase the adhesion after multilayer circuit board stitching.
For ease of understanding, describe with an embody rule example a kind of multilayer circuit board provided in the present embodiment in detail below, application examples comprises:
A) position hole by hole knockout to the corner in multiple circuit intermediate layer and center to arrange;
In the present embodiment, when needs make multilayer circuit board, need, by hole knockout, hole is positioned to the corner in multiple circuit intermediate layer and center and arrange, be understandable that, aforesaid location hole can have 4, holes respectively in 4 corners in aforesaid circuit intermediate layer and center.
B) Graphic transitions is carried out to circuit intermediate layer;
After by hole knockout the corner in multiple circuit intermediate layer and center being positioned to hole and arranging, need to carry out Graphic transitions to circuit intermediate layer, circuit intermediate layer is made to be the insulation layer structure that one side or upper and lower surface are provided with line layer, be understandable that, aforesaid insulating barrier is between line layer, this insulation layers, as possessed the flaggy of the isolation material such as the PI polyimides material of insulation function, does not specifically limit herein.
It should be noted that, aforesaidly Graphic transitions is carried out to circuit intermediate layer be known to the skilled person technology, be just no longer described in detail herein.
Should be noted that, the circuit intermediate layer in the present embodiment can be the process carrying out pre-harmomegathus compensation according to those skilled in the art by experiment, and this pre-harmomegathus is compensated for as technology as well known to those skilled in the art, is no longer described in detail herein.
C) roughening treatment is carried out to line layer and insulating barrier;
After carrying out Graphic transitions to circuit intermediate layer, need to carry out roughening treatment to line layer and insulating barrier, aforesaid roughening treatment can be carry out the process of micro-rough by mechanical means or chemical method to line layer and insulating barrier.
D) prepreg is superimposed with respectively below the multiple top layer, circuit intermediate layer after riveted lamination and bottom;
After roughening treatment is carried out to line layer and insulating barrier, need to be superimposed with prepreg respectively below the multiple top layer, circuit intermediate layer after riveted lamination and bottom, it should be noted that, aforesaidly according to location hole, riveted lamination being carried out in multiple circuit intermediate layer, can be carry out one_to_one corresponding according to the location hole on multiple circuit intermediate layer to carry out riveted lamination.
E) copper foil layer is added in prepreg outer stack;
Be superimposed with prepreg respectively below the multiple top layer, circuit intermediate layer after riveted lamination and bottom after, need to add copper foil layer in prepreg outer stack.
F) pressing is carried out under vacuum conditions to the multiple circuit intermediate layers being superimposed with copper foil layer and become multilayer circuit board;
After adding copper foil layer in prepreg outer stack, needing to carry out pressing under vacuum conditions to the multiple circuit intermediate layers being superimposed with copper foil layer becomes multilayer circuit board, and be understandable that, aforesaid pressing can be HTHP pressing mode.
G) by bore mode, via boring is carried out to multilayer circuit board.
After the multiple circuit intermediate layers being superimposed with copper foil layer being carried out under vacuum conditions to pressing and becoming multilayer circuit board, need to carry out via boring to multilayer circuit board by bore mode.
It should be noted that, when carrying out via boring, can also arrange blind hole further, buried via hole etc., and carry out Graphic transitions to the copper foil layer of top layer and bottom, aforesaid Graphic transitions is known to the skilled person technology, is just no longer described in detail herein.
In the present embodiment, by multiple circuit intermediate layer, prepreg is set between any two, copper foil layer is superposed respectively again by below top layer, circuit intermediate layer and bottom, finally carry out pressing, gap between the circuit layer infiltrating circuit intermediate layer after liquefaction after achieving prepreg pressing, make the pressing of minimum spacing between multiple circuit intermediate layer, solve the design of existing electronic product mainboard, and the thickness of the pcb board of producing just cannot meet nowadays for the technical problem of lightening design, and the roughening treatment of circuit layer and insulating barrier, further increase the adhesion after multilayer circuit board stitching.
Above a kind of multilayer circuit board provided by the utility model is described in detail, for one of ordinary skill in the art, according to the thought of the utility model embodiment, all will change in specific embodiments and applications, in sum, this description should not be construed as restriction of the present utility model.
Claims (9)
1. a multilayer circuit board, is characterized in that, comprising:
Multiple circuit intermediate layer, prepreg and copper foil layer;
Described circuit intermediate layer is provided with at least 4 and is arranged on the described corner in circuit intermediate layer and the location hole at center;
Multiple described circuit intermediate layer is superimposed with described prepreg between any two and carries out lamination;
Described copper foil layer is arranged on the top layer in first described circuit intermediate layer after lamination and the bottom in circuit intermediate layer described in last;
Multiple described circuit intermediate layer, described prepreg and described copper foil layer are fixedly linked with pressing mode.
2. multilayer circuit board according to claim 1, is characterized in that, is provided with described prepreg between described circuit intermediate layer and described copper foil layer.
3. multilayer circuit board according to claim 1, is characterized in that, described circuit intermediate layer is the insulation layer structure that one side is provided with line layer.
4. multilayer circuit board according to claim 1, is characterized in that, described circuit intermediate layer is the insulating barrier that upper and lower surface is provided with line layer.
5. the multilayer circuit board according to claim 3 or 4, is characterized in that, described insulating barrier is polyimide layer.
6. multilayer circuit board according to claim 1, is characterized in that, described multilayer circuit board also comprises:
Via, runs through whole described multilayer circuit board.
7. multilayer circuit board according to claim 1, is characterized in that, described circuit intermediate layer is 8 layers.
8. multilayer circuit board according to claim 1, is characterized in that, described prepreg has 5.
9. multilayer circuit board according to claim 1, is characterized in that, described multilayer circuit board also comprises:
Solder mask, covers the bottom surface of the described copper foil layer surface on the top layer in first described circuit intermediate layer and the described copper foil layer in circuit intermediate layer described in last.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420577638.7U CN204157152U (en) | 2014-09-30 | 2014-09-30 | A kind of multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420577638.7U CN204157152U (en) | 2014-09-30 | 2014-09-30 | A kind of multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204157152U true CN204157152U (en) | 2015-02-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420577638.7U Expired - Fee Related CN204157152U (en) | 2014-09-30 | 2014-09-30 | A kind of multilayer circuit board |
Country Status (1)
| Country | Link |
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| CN (1) | CN204157152U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104244567A (en) * | 2014-09-30 | 2014-12-24 | 信利电子有限公司 | Multilayer circuit board and manufacturing method thereof |
| CN107741285A (en) * | 2017-10-12 | 2018-02-27 | 奇酷互联网络科技（深圳）有限公司 | A kind of circuit board and temperature checking method |
| CN108347839A (en) * | 2018-03-23 | 2018-07-31 | 珠海市金顺电子科技有限公司 | A kind of production method of multilayer circuit board |
| CN114295952A (en) * | 2021-12-30 | 2022-04-08 | 河北工业大学 | Non-contact voltage measurement method for dynamic voltage measurement of power device |
-
2014
- 2014-09-30 CN CN201420577638.7U patent/CN204157152U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104244567A (en) * | 2014-09-30 | 2014-12-24 | 信利电子有限公司 | Multilayer circuit board and manufacturing method thereof |
| CN107741285A (en) * | 2017-10-12 | 2018-02-27 | 奇酷互联网络科技（深圳）有限公司 | A kind of circuit board and temperature checking method |
| CN107741285B (en) * | 2017-10-12 | 2020-05-19 | 奇酷互联网络科技（深圳）有限公司 | Circuit board and temperature detection method |
| CN108347839A (en) * | 2018-03-23 | 2018-07-31 | 珠海市金顺电子科技有限公司 | A kind of production method of multilayer circuit board |
| CN114295952A (en) * | 2021-12-30 | 2022-04-08 | 河北工业大学 | Non-contact voltage measurement method for dynamic voltage measurement of power device |
| CN114295952B (en) * | 2021-12-30 | 2023-08-11 | 河北工业大学 | Non-contact voltage measurement method for dynamic voltage measurement of power device |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150211 |
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| CF01 | Termination of patent right due to non-payment of annual fee |