CN207340283U - High-frequency multilayer printed wiring board is used in one kind communication - Google Patents
High-frequency multilayer printed wiring board is used in one kind communication Download PDFInfo
- Publication number
- CN207340283U CN207340283U CN201721415833.XU CN201721415833U CN207340283U CN 207340283 U CN207340283 U CN 207340283U CN 201721415833 U CN201721415833 U CN 201721415833U CN 207340283 U CN207340283 U CN 207340283U
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- China
- Prior art keywords
- wiring board
- multilayer printed
- printed wiring
- line plate
- convex portion
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Abstract
High-frequency multilayer printed wiring board is used in one kind communication, it is characterised in that：Including the insulated substrate set gradually, first line plate and the second wiring board, duct is both provided with the first line plate and second wiring board, high frequency material is equipped with the duct, the upper surface of the first line plate is equipped with convex portion, the convex portion is equipped with some perforation, the lower surface of second wiring board is equipped with and the corresponding recess in the convex portion, the recess is equipped with and the corresponding through hole of perforation, aluminium oxide thermal dispersant coatings are equipped between the insulated substrate and the first line plate, second wiring board is equipped with some heat emission holes, its is simple in structure, it can realize more complicated function and application, the practicality of end product and rich is greatly reinforced, wireless signal is more stablized, antijamming capability greatly reinforces, transmission range significantly extends.
Description
Technical field
This printed wiring board technical field is the utility model is related to, more particularly to high-frequency multilayer printed wiring is used in a kind of communication
Plate.
Background technology
With economic recovery both domestic and external, dependence of the people to mobile communication.Believe the high frequency as these telecommunication medias
Communications equipment market will necessarily expand, following global spread spectrum technic field will there are state-run assets, private, foreign capitals etc.
And the situation deposited, the huge market demand will be had to HF communication equipment under such a situation, thereupon, it will drive
Such a circuit board revival of the market.And high-frequency multilayer printed wiring board is cheap due to its cost, and performance is superior, and has
There is the long-range huge market share.As the communication technology is maked rapid progress, high-frequency multilayer plate obtains extensively in the communications industry very much in the future
General utilization.The use cost relative line plate of cable and connector in a communication network is high.And its instability mode,
And the problems such as being difficult to detection, often perplexs the running and maintenance of base station operator.Following development trend must be more lines
Road plate and more complicated precise circuit board can substitute current cable and link.
Present multilayer circuit board is in the form of a single, is made up of multilayer circuit board of processing technology, component is limited to electricity
The surface area of road plate, can be larger for complicated electric equipment products circuit board since electronic component has certain volume, in order to make
Must be compact-sized, the volume of circuit board is reduced, the distance between cooperation electronic component can be leaned on to close, this such structure
The decay and interference of signal are easily produced, influences the performance of product.
Utility model content
For above-mentioned problem, the utility model offer is a kind of simple in structure, and communication high frequency easy to make is more
Layer printed wiring board.
The technical solution of the utility model is：High-frequency multilayer printed wiring board is used in one kind communication, including is set gradually
Insulated substrate, first line plate and the second wiring board, be both provided with hole on the first line plate and second wiring board
Road, high frequency material is equipped with the duct, and the upper surface of the first line plate is equipped with convex portion, and the convex portion is equipped with some wear
Hole, the lower surface of second wiring board is equipped with and the corresponding recess in the convex portion, and the recess is equipped with and the perforation
Corresponding through hole, is equipped with aluminium oxide thermal dispersant coatings, second circuit between the insulated substrate and the first line plate
Plate is equipped with some heat emission holes.
Further improvement of the utility model is：Solder mask is equipped with above second wiring board.
Further improvement of the utility model is：The inner surface of the heat emission hole is equipped with metal screen layer, the metal
Shielded layer is made of metal foil.
Further improvement of the utility model is：The insulated substrate is pet layer, its thickness is 0.5 ~ 1mm.
Further improvement of the utility model is：Insulation is equipped between the first line plate and second wiring board
Film, the dielectric film are PET film.
Further improvement of the utility model is：The first line plate is bonded by layer of silica gel and the insulated substrate
Connection.
Further improvement of the utility model is：The high frequency material is arranged in the duct by bonding sheet.
The utility model provides a kind of communication high-frequency multilayer printed wiring board, including insulated substrate, first line plate with
Second wiring board, is equipped with dielectric film between first line plate and the second wiring board, lead between first line plate and the second wiring board
Cross convex portion and recess carries out concave-convex jointing, and conducting is realized by perforation and corresponding through hole, ensure that multilayer circuit
Plate has preferable compactness, adds the surface area of wiring board, ensures that more complicated circuit and more component can be
Complete on wiring board, at the same have preferable interference free performance and, enabling it is effective to reduce signal attenuation and dry
Disturb, improve its reliability, duct is respectively provided with first line plate and the second wiring board, and high frequency material is equipped with duct,
Meet the requirement of high frequency signal transmission.
The beneficial effects of the utility model are：Its is simple in structure, can realize more complicated function and application, greatly greatly
The strong practicality of end product and rich, wireless signal is more stablized, and antijamming capability greatly reinforces, and transmission range is shown
Write and extend, ensure to greatly reduce product cost, low-loss, low tolerance and excellent high frequency while final performance is stablized
Can, meet the requirement of high frequency signal transmission, the utility model is skillfully constructed, and function is extremely practical, is with a wide range of applications.
Brief description of the drawings
Fig. 1 is the structure diagram of the utility model；
Fig. 2 is the utility model the second wiring board schematic diagram；
Wherein：1- insulated substrates, 2- first line plates, the second wiring boards of 3-, 4- ducts, 5- high frequency materials, 6- convex portions,
7- perforates, 8- recesses, 9- through holes, 10- aluminium oxide thermal dispersant coatings, 11- heat dissipating layers, 12- metal screen layers, 13- dielectric films, 14-
Layer of silica gel, 15- solder masks.
Embodiment
In order to deepen the understanding to the utility model, the utility model is done further below in conjunction with drawings and examples
It is described in detail, which is only used for explaining the utility model, and the scope of protection of the utility model is not formed and is limited.
Such as figure, the present embodiment provides a kind of communication high-frequency multilayer printed wiring board, including the insulated substrate set gradually
1st, it is respectively provided with 2 and second wiring board 3 of first line plate, the first line plate 2 and second wiring board 3 mutually opposite up and down
The duct 4 answered, is equipped with high frequency material 5 in the duct 4, and the high frequency material 5 is arranged in the duct 4 by bonding sheet,
The upper surface of the first line plate 2 is equipped with convex portion 6, and the convex portion 6 is formed for chemical etching, and the convex portion 6 is equipped with some
Perforation 7, the lower surface of second wiring board 3 is equipped with and the corresponding recess 8 in the convex portion 6, and the recess 8 is equipped with and institute
The corresponding through hole 9 of perforation is stated, aluminium oxide thermal dispersant coatings 10, institute are equipped between the insulated substrate 1 and the first line plate 2
State the second wiring board and be equipped with some heat emission holes 11, the inner surface of the heat emission hole 11 is equipped with metal screen layer 12, the metal
Shielded layer 12 is made of metal foil, and solder mask 15 is equipped with above second wiring board.
The insulated substrate 1 is pet layer, its thickness is 0.5mm, the first line plate 2 and second wiring board 3 it
Between be equipped with dielectric film 13, the dielectric film 13 is PET film, and the first line plate 2 passes through layer of silica gel 14 and the insulated substrate 1
Bonding connection.
High-frequency multilayer printed wiring board, including insulated substrate 1, first line plate 2 and second are used in a kind of communication of the present embodiment
Wiring board 3, is equipped with dielectric film 13 between 2 and second wiring board 3 of first line plate, between 2 and second wiring board 3 of first line plate
Concave-convex jointing is carried out by convex portion 6 and recess 8, and conducting is realized by perforation 7 and corresponding through hole 9, ensure that more
Layer circuit board has preferable compactness, adds the surface area of wiring board, ensures more complicated circuit and more component
Can complete in the circuit board, at the same have preferable interference free performance and, enabling the effective signal that reduces declines
Subtract and disturb, improve its reliability, be respectively provided with duct 4 on 2 and second wiring board 3 of first line plate, and be equipped with duct 4
High frequency material 5, meets the requirement of high frequency signal transmission.
The beneficial effect of the present embodiment is：Its is simple in structure, can realize more complicated function and application, greatly reinforce
The practicality of end product and rich, wireless signal is more stablized, and antijamming capability greatly reinforces, transmission range is notable
Extend, ensure to greatly reduce product cost, low-loss, low tolerance and excellent high frequency performance while final performance is stablized,
Meet the requirement of high frequency signal transmission, the utility model is skillfully constructed, and function is extremely practical, is with a wide range of applications.
It should be understood by those skilled in the art that the present utility model is not limited to the above embodiments, above-described embodiment and
The principle for simply illustrating the utility model described in specification, on the premise of not departing from the spirit and scope of the utility model,
The utility model also has various changes and modifications, these changes and improvements both fall within claimed the scope of the utility model
It is interior.The protection scope of the present invention is defined by the appended claims and their equivalents.
Claims (7)
1. high-frequency multilayer printed wiring board is used in one kind communication, it is characterised in that：Including insulated substrate, the first line set gradually
Duct is both provided with plate and the second wiring board, the first line plate and second wiring board, height is equipped with the duct
Frequency material, the upper surface of the first line plate are equipped with convex portion, and the convex portion is equipped with some perforation, second wiring board
Lower surface is equipped with and the corresponding recess in the convex portion, and the recess is equipped with and the corresponding through hole of the perforation, it is described absolutely
Aluminium oxide thermal dispersant coatings are equipped between edge basic unit and the first line plate, second wiring board is equipped with some heat emission holes.
2. high-frequency multilayer printed wiring board is used in a kind of communication according to claim 1, it is characterised in that：Second circuit
Solder mask is equipped with above plate.
3. high-frequency multilayer printed wiring board is used in a kind of communication according to claim 1, it is characterised in that：The heat emission hole
Inner surface is equipped with metal screen layer, and the metal screen layer is made of metal foil.
4. high-frequency multilayer printed wiring board is used in a kind of communication according to claim 1, it is characterised in that：The insulated substrate
For pet layer, its thickness is 0.5 ~ 1mm.
5. high-frequency multilayer printed wiring board is used in a kind of communication according to claim 1, it is characterised in that：The first line
Dielectric film is equipped between plate and second wiring board, the dielectric film is PET film.
6. high-frequency multilayer printed wiring board is used in a kind of communication according to claim 1, it is characterised in that：The first line
Plate passes through layer of silica gel and the insulated substrate bonding connection.
7. high-frequency multilayer printed wiring board is used in a kind of communication according to claim 1, it is characterised in that：The high frequency material
It is arranged on by bonding sheet in the duct.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721415833.XU CN207340283U (en) | 2017-10-30 | 2017-10-30 | High-frequency multilayer printed wiring board is used in one kind communication |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721415833.XU CN207340283U (en) | 2017-10-30 | 2017-10-30 | High-frequency multilayer printed wiring board is used in one kind communication |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207340283U true CN207340283U (en) | 2018-05-08 |
Family
ID=62363250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721415833.XU Active CN207340283U (en) | 2017-10-30 | 2017-10-30 | High-frequency multilayer printed wiring board is used in one kind communication |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207340283U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109688708A (en) * | 2018-05-23 | 2019-04-26 | 华普通用技术研究（广州）有限公司 | A kind of production method of flexible printed circuit board |
-
2017
- 2017-10-30 CN CN201721415833.XU patent/CN207340283U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109688708A (en) * | 2018-05-23 | 2019-04-26 | 华普通用技术研究（广州）有限公司 | A kind of production method of flexible printed circuit board |
| CN109688708B (en) * | 2018-05-23 | 2020-02-07 | 邑升顺电子(深圳)有限公司 | Manufacturing method of flexible printed circuit board |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |