CN206585832U - Pcb board - Google Patents
Pcb board Download PDFInfo
- Publication number
- CN206585832U CN206585832U CN201720282434.4U CN201720282434U CN206585832U CN 206585832 U CN206585832 U CN 206585832U CN 201720282434 U CN201720282434 U CN 201720282434U CN 206585832 U CN206585832 U CN 206585832U
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- CN
- China
- Prior art keywords
- hole
- insulated substrate
- layer
- signal wire
- pcb board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model discloses a kind of pcb board, including multiple insulated substrates, the first insulated substrate is followed successively by from top to bottom, the second insulated substrate, provided with insulation impedance layer on first insulated substrate, a conductive layer is provided with first insulated substrate and the second insulated substrate, first through hole and the second through hole are provided with first insulated substrate, it is connected with conductive layer, a signal wire and an antenna are respectively equipped with the first through hole and the second through hole, company's sensor provided with an energy mutually transmission information between the signal wire and antenna, in the first through hole and the second through-hole wall layer is shielded provided with pair of lamina, provided with a shielding shell outside the even sensor.The pcb board is used shields layer on through hole thereon provided with a silver soldering tin, and shielding shell is set on company's sensor between signal wire and antenna, the influence of parasitic capacitance is overcome, the generation for setting and avoiding parasitic capacitance can be effectively reduced, overall structure is simple, practical and convenient.
Description
Technical field：
The utility model is related to a kind of pcb board.
Background technology：
Any electronic installation generally all includes electronic component wiring board and many carryings thereon, to constitute circuit module,
In addition to the motherboard applied to electronic installation, the wiring board can also apply as chip package base plate, such as be applied to lead or
The package substrate of flip chip bonding engagement.There is signal wire on the PCB plates, and need to carry out impedance matching to the signal wire.It is existing
The implementation of some impedance matchings：By applying copper in the adjacent layers of the place of signal wire layer, and calculated by lamination
To corresponding impedance.But the adjacent layers of the place layer of the signal wire and the place layer of the signal wire are metal level so that this two
Parasitic capacitance is produced between individual metal level, the parasitic capacitance does not have to the impedance matching for transmitting the signal wire of general signal frequency
Influence, but the parasitic capacitance just has very big to the impedance matching for transmitting high speed signal frequency such as larger than 2GHz signal wire
Influence so that the impedance of the signal wire in communication process changes, causes signal wire and carries out information exchange with signal wire
Antenna performance reduction, although have clearance hole of the part pcb board provided with reduction parasitic capacitance at present, but application effect is not
It is very preferable.
Utility model content：
Technical problem to be solved in the utility model be to provide it is a kind of simple in construction, it is convenient and practical and can have and reduce
Produce parasitic capacitance, signal wire impedance matching it is unaffected and improve the pcb board of the performance of signal wire and antenna.
In order to solve the above-mentioned technical problem, the utility model is achieved through the following technical solutions：
A kind of pcb board, including multiple insulated substrates, are followed successively by the first insulated substrate, the second insulated substrate from top to bottom,
First insulated substrate is provided with one provided with insulation impedance layer on first insulated substrate and the second insulated substrate
Conductive layer, is provided with first through hole and the second through hole, it is connected with conductive layer on first insulated substrate, described the
A signal wire and an antenna are respectively equipped with one through hole and the second through hole, an energy is provided between the signal wire and antenna
Company's sensor of mutual transmission information, shields layer, described in the first through hole and the second through-hole wall provided with pair of lamina
Even provided with a shielding shell outside sensor.
Preferably, the double layer screen layer is set to silver soldering soldering layer.
Preferably, being arranged right below a groove being arranged on the first insulated substrate in the even sensor.
Preferably, the groove area is more than the projected area immediately below the even sensor.
Preferably, the frequency range of the signal of signal wire transmission is 2GHz-4GHz.
Compared with prior art, usefulness of the present utility model is：The pcb board is used is provided with one on through hole thereon
Silver soldering tin shields and shielding shell is set on layer, and company's sensor between signal wire and antenna, thus the not only company of saving
Sensor device is to the cable of prestage, and so, parasitic capacitance is greatly reduced, and causes conductive layer and the even electricity such as sensor internal core wire
Position, eliminates cored wire and the capacitive of conductive layer is leaked electricity, overcome the influence of parasitic capacitance, can effectively reduce setting and avoid parasitic electricity
The generation of appearance, overall structure is simple, practical and convenient.
Brief description of the drawings：
The utility model is further illustrated below in conjunction with the accompanying drawings.
Fig. 1 is structural representation of the present utility model
In figure：1st, the first insulated substrate 2, the second insulated substrate 3, insulation impedance layer 4, conductive layer 5, first through hole
6th, the second through hole 7, signal wire 8, even antenna 9, sensor 10, double layer screen layer 11, shielding shell 12, groove
Embodiment：
Below in conjunction with the accompanying drawings and the utility model is described in detail embodiment：
A kind of pcb board shown in Fig. 1, including multiple insulated substrates, are followed successively by the first insulated substrate 1, second exhausted from top to bottom
Edge substrate 2, it is exhausted in first insulated substrate 1 and second provided with insulation impedance layer 3 on first insulated substrate 1
Edge substrate 2 be provided with a conductive layer 4, on first insulated substrate 1 be provided with the through hole 6 of first through hole 5 and second, its with
Conductive layer 4 is connected, and a signal wire 7 and an antenna 8, the letter are respectively equipped with the through hole 5 of first through hole 5 and second
Number between line 7 and antenna 8 provided with one can mutual transmission information company's sensor 9, in the through hole 6 of first through hole 5 and second
Inwall shields layer 10 provided with pair of lamina, provided with a shielding shell 11 outside the even sensor 9 so that conductive layer 4 is with even feeling
The internal core wire equipotential of device 9, eliminates cored wire and the capacitive of conductive layer is leaked electricity, overcome the influence of parasitic capacitance, can effectively reduce
The generation for avoiding parasitic capacitance is set, so that in practical application, the company's of saving sensor 9 is to the cable of prestage, so, parasitism is electric
Appearance is greatly reduced, and is the double layer screen layer 10 is preferably reduced between signal wire 7 and antenna 8 and conductive layer 4
Parasitic capacitance, even up to eliminate parasitic capacitance effect, the double layer screen layer 10 be set to silver soldering soldering layer.
In practical application, can also the even sensor 9 be arranged right below one be arranged on 1 on the first insulated substrate
Groove 12, the area of groove 12 is more than the projected area immediately below the even sensor 9.The signal of the signal wire 7 transmission
Frequency range be 2GHz-4GHz, by groove 12, the frequency range of the signal transmitted in the signal wire 7 is 2GHz-
During 4GHz, the signal wire 7 and the groove 12 and the antenna 8 on the conductive layer 4 and the groove 12 on the conductive layer 4
Between will not produce parasitic capacitance, thus the further generation for avoiding parasitic capacitance thereon, thus the resistance of the signal wire 7
Anti- matching would not be affected, and then improve the performance of the signal wire 7 and the antenna 8.
Above-mentioned pcb board is used shields layer on through hole thereon provided with a silver soldering tin, and signal wire and antenna it
Between company's sensor on shielding shell is set, thus not only the company's of saving sensor device is to the cable of prestage, and so, parasitic capacitance is greatly
Reduce, and cause conductive layer and even sensor internal core wire equipotential, eliminate cored wire and the capacitive of conductive layer is leaked electricity, overcome
The influence of parasitic capacitance, can effectively reduce the generation for setting and avoiding parasitic capacitance, and overall structure is simple, practical and convenient.
It is emphasized that：It the above is only preferred embodiment of the present utility model, not the utility model appointed
What formal limitation, every any simple modification made according to technical spirit of the present utility model to above example, etc.
With change and modification, in the range of still falling within technical solutions of the utility model.
Claims (5)
1. a kind of pcb board, including multiple insulated substrates, are followed successively by the first insulated substrate from top to bottom（1）, the second insulated substrate
（2）, in first insulated substrate（1）Provided with insulation impedance layer（3）, in first insulated substrate（1）And second
Insulated substrate（2）It is provided with a conductive layer（4）, in first insulated substrate（1）It is provided with first through hole（5）And second is logical
Hole（6）, it is and conductive layer（4）Connection, in the first through hole（5）And second through hole（6）On be respectively equipped with a signal wire
（7）And an antenna（8）, the signal wire（7）And antenna（8）Between provided with one can mutually transmission information company's sensor（9）,
It is characterized in that：In the first through hole（5）And second through hole（6）Inwall shields layer provided with pair of lamina（10）, described
Connect sensor（9）Outside is provided with a shielding shell（11）.
2. pcb board according to claim 1, it is characterised in that：The double layer screen layer（10）It is set to silver soldering soldering
Layer.
3. pcb board according to claim 1, it is characterised in that：In the even sensor（9）Be arranged right below one be arranged at
Groove on first insulated substrate（12）.
4. pcb board according to claim 3, it is characterised in that：The groove（12）Area is more than the even sensor（9）Just
The projected area of lower section.
5. pcb board according to claim 1, it is characterised in that：The signal wire（7）The frequency range of the signal of transmission is
2GHz-4GHz。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720282434.4U CN206585832U (en) | 2017-03-22 | 2017-03-22 | Pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720282434.4U CN206585832U (en) | 2017-03-22 | 2017-03-22 | Pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206585832U true CN206585832U (en) | 2017-10-24 |
Family
ID=60113977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720282434.4U Expired - Fee Related CN206585832U (en) | 2017-03-22 | 2017-03-22 | Pcb board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206585832U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112566356A (en) * | 2020-11-20 | 2021-03-26 | 深圳市金晟达电子技术有限公司 | Millimeter wave radar printed circuit board |
-
2017
- 2017-03-22 CN CN201720282434.4U patent/CN206585832U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112566356A (en) * | 2020-11-20 | 2021-03-26 | 深圳市金晟达电子技术有限公司 | Millimeter wave radar printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171024 Termination date: 20190322 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |