CN105555018A - Printed circuit board and electronic terminal - Google Patents
Printed circuit board and electronic terminal Download PDFInfo
- Publication number
- CN105555018A CN105555018A CN201610087599.6A CN201610087599A CN105555018A CN 105555018 A CN105555018 A CN 105555018A CN 201610087599 A CN201610087599 A CN 201610087599A CN 105555018 A CN105555018 A CN 105555018A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- pcb
- holding wire
- wiring layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The embodiment of the invention discloses a printed circuit board and an electronic terminal, wherein the printed circuit board comprises at least one wiring layer; at least one signal line and at least one grounding end are arranged outside the outer wiring layer in at least one wiring layer; a shielding layer is covered outside at least one signal line; and the shielding layer is electrically connected with at least one grounding end. By means of the printed circuit board and the electronic terminal provided in the embodiment of the invention, electromagnetic shielding can be realized.
Description
Technical field
The embodiment of the present invention relates to electronic technology field, particularly relates to a kind of printed circuit board (PCB) and electric terminal.
Background technology
Along with the development of scientific and technological level, the quantity of the upper integrated electronic component of electronic product (as mobile phone or computer etc.) gets more and more.In order to reduce electronic component size shared in electronic product, to make the size of electronic product less, generally by electronic component integration on a printed circuit with reduces electronic component in electronic product shared by size.
Printed circuit board (PCB) is not only integrated with various electronic component, is also integrated with various holding wire.In PCB design process, when the wiring space of printed circuit board (PCB) is nervous, segment signal line can be distributed in the skin of printed circuit board (PCB).
Above-mentionedly holding wire is distributed in the outer field design of printed circuit board (PCB) and easily produces electromagnetic interference problem: holding wire is easily subject to external interference, thus affects the quality of the signal transmitted in holding wire; Easy other signal to external world of the signal transmitted in holding wire produces interference.Therefore, the electric terminal comprising above-mentioned printed circuit board (PCB) also easily produces electromagnetic interference problem.
Summary of the invention
The embodiment of the present invention proposes a kind of printed circuit board (PCB) and electric terminal, to solve the problem that printed circuit board (PCB) of the prior art and electric terminal easily produce electromagnetic interference.
For reaching this object, the present invention by the following technical solutions:
First aspect, the embodiment of the present invention provides a kind of printed circuit board (PCB), comprises at least one deck wiring layer;
At least arranged outside of wiring layer described in one deck being positioned at outside in described at least one deck wiring layer has at least one holding wire and at least one earth terminal;
The outer side covers of described at least one holding wire has screen, and described screen is electrically connected with at least one earth terminal described.
Second aspect, the embodiment of the present invention additionally provides a kind of electric terminal, comprises the printed circuit board (PCB) that first aspect provides.
The printed circuit board (PCB) that the embodiment of the present invention provides and electric terminal, by the outer side covers screen of at least one holding wire on the wiring layer being arranged at outside, and screen is electrically connected with at least one earth terminal on the wiring layer in outside, achieve electromagnetic shielding: holding wire can not be subject to extraneous interference, thus can ensure the quality of the signal transmitted in holding wire; The signal transmitted in holding wire can not produce interference by other signal to external world.
Accompanying drawing explanation
Fig. 1 is the cross-sectional schematic of the printed circuit board (PCB) that the embodiment of the present invention one provides.
Fig. 2 is the cross-sectional schematic of the printed circuit board (PCB) that the embodiment of the present invention two provides.
Fig. 3 is the cross-sectional schematic of the printed circuit board (PCB) that the embodiment of the present invention three provides.
Fig. 4 is the cross-sectional schematic of the printed circuit board (PCB) that the embodiment of the present invention four provides.
Fig. 5 is the cross-sectional schematic of the printed circuit board (PCB) that the embodiment of the present invention five provides.
Fig. 6 is the cross-sectional schematic of the printed circuit board (PCB) that the embodiment of the present invention six provides.
Embodiment
Technical scheme of the present invention is further illustrated by embodiment below in conjunction with accompanying drawing.Be understandable that, specific embodiment described herein is only for explaining the present invention, but not limitation of the invention.It also should be noted that, for convenience of description, illustrate only part related to the present invention in accompanying drawing but not entire infrastructure.
Embodiment one
Fig. 1 is the cross-sectional schematic of the printed circuit board (PCB) that the embodiment of the present invention one provides.As shown in Figure 1, the printed circuit board (PCB) that the embodiment of the present invention one provides comprises one deck wiring layer 101.
The side of wiring layer 101 is provided with at least one holding wire 102 and at least one earth terminal 103.
The outer side covers of at least one holding wire 102 has electromagnetic interference (EMI, ElectroMagneticInterference) screened film 104, and emi shielding film 104 is electrically connected with at least one earth terminal 103.
The printed circuit board (PCB) that the embodiment of the present invention one provides, by the outer side covers emi shielding film 104 at least one holding wire 102 as screen, and emi shielding film 104 is electrically connected with at least one earth terminal 103, achieve electromagnetic shielding: holding wire 102 can not be subject to extraneous interference, thus the quality of the signal of transmission in holding wire 102 can be ensured; The signal of transmission in holding wire 102 can not produce interference by other signal to external world.
When printed circuit board (PCB) only comprises one deck wiring layer 101, wires design all can be carried out in the both sides of wiring layer 101.In printed circuit board (PCB) shown in Fig. 1, holding wire 102 is positioned at the upside of wiring layer 101, and in addition, holding wire 102 can also be positioned at the downside of wiring layer 101, or holding wire 102 can be positioned at the upper side and lower side of wiring layer 101.That is: holding wire 102 can be positioned at upside and/or the downside of wiring layer 101.
The particular location of holding wire 102, and number and arrangement mode can design according to actual needs, are not specifically limited in the embodiment of the present invention one.
Be understandable that, when the quantity of holding wire 102 is more than or equal to 2, electric insulation between any two signal line 102.Electric insulation between any signal line 102 and any one earth terminal 103.
The quantity of earth terminal 103 and size can design according to actual needs, are not specifically limited in the embodiment of the present invention one.Be understandable that, the quantity of earth terminal 103 is more, size is larger, and the effect of electromagnetic shielding is better.Preferably, earth terminal 103 can be evenly distributed on the fringe region of at least one holding wire 102; The size of earth terminal 103 can be more than or equal to 0.25 square millimeter.
The surface of earth terminal 103 can be provided with anti oxidation layer (not shown in figure 1).This kind of structural design, can strengthen the non-oxidizability of earth terminal 103, thus can ensure the reliability of the electrical connection between earth terminal 103 and emi shielding film 104, and then can ensure the reliability of electromagnetic shielding.The anti oxidation layer on earth terminal 103 surface can by obtaining the process of earth terminal 103 surfaceization gold.
Emi shielding film 104 can be made by attaching process.Emi shielding film 104 can be open up from reach (Tatsuta) SF-PC5000 series, SF-PC6000 is serial, SF-PC3000 is serial or square nation 6000 series.
The thickness of emi shielding film 104 can be 15 microns.This kind of structural design makes the thickness of printed circuit board (PCB) can not increase because of the increase of emi shielding film 104 too much, that is: can ensure the thinness of printed circuit board (PCB), thus can meet the slimming of the electric terminal comprising this printed circuit board (PCB).
Be understandable that, in order to effectiveness is best, emi shielding film 104 can cover all holding wires 102.This kind of structural design can realize the electromagnetic shielding of all holding wires 102.
As shown in Figure 1, the printed circuit board (PCB) that the embodiment of the present invention one provides also comprises conducting resinl 105.Conducting resinl 105 is between earth terminal 103 and emi shielding film 104, and conducting resinl 105 is for realizing electrical connection by between emi shielding film 104 and at least one earth terminal 103.
As shown in Figure 1, the printed circuit board (PCB) that the embodiment of the present invention one provides also comprises solder mask 106.Solder mask 106 is between at least one holding wire 102 and emi shielding film 104.Solder mask 106 is for strengthening the non-oxidizability of holding wire 102.The material of above-mentioned solder mask 106 can be solder mask.
Embodiment two
Fig. 2 is the cross-sectional schematic of the printed circuit board (PCB) that the embodiment of the present invention two provides.As shown in Figure 2, the printed circuit board (PCB) that the embodiment of the present invention two provides comprises one deck wiring layer 201.
The side of wiring layer 201 is provided with at least one holding wire 202 and at least one earth terminal 203.
The outer side covers of at least one holding wire 202 has metal screen layer 204, and metal screen layer 204 is electrically connected with at least one earth terminal 203.
The printed circuit board (PCB) that the embodiment of the present invention two provides, by the outer side covers metal screen layer 204 at least one holding wire 202 as screen, and metal screen layer 204 is electrically connected with at least one earth terminal 203, achieve electromagnetic shielding: holding wire 202 can not be subject to extraneous interference, thus the quality of the signal of transmission in holding wire 202 can be ensured; The signal of transmission in holding wire 202 can not produce interference by other signal to external world.
When printed circuit board (PCB) only comprises one deck wiring layer 201, wires design all can be carried out in the both sides of wiring layer 201.In printed circuit board (PCB) shown in Fig. 2, holding wire 202 is positioned at the upside of wiring layer 201, and in addition, holding wire 202 can also be positioned at the downside of wiring layer 201, or holding wire 202 can be positioned at the upper side and lower side of wiring layer 201.That is: holding wire 202 can be positioned at upside and/or the downside of wiring layer 201.
The particular location of holding wire 202, and number and arrangement mode can design according to actual needs, are not specifically limited in the embodiment of the present invention one.
Be understandable that, when the quantity of holding wire 202 is more than or equal to 2, electric insulation between any two signal line 202.Electric insulation between any signal line 202 and any one earth terminal 203.
The quantity of earth terminal 203 and size can design according to actual needs, are not specifically limited in the embodiment of the present invention two.Be understandable that, the quantity of earth terminal 203 is more, size is larger, and the effect of electromagnetic shielding is better.Preferably, earth terminal 203 can be evenly distributed on the fringe region of at least one holding wire 202; The size of earth terminal 203 can be more than or equal to 0.25 square millimeter.
The surface of earth terminal 203 can be provided with anti oxidation layer (not shown in Fig. 2).This kind of structural design, can strengthen the non-oxidizability of earth terminal 203, thus can ensure the reliability of the electrical connection between earth terminal 203 and metal screen layer 204, and then can ensure the reliability of electromagnetic shielding.The anti oxidation layer on earth terminal 203 surface can by obtaining the process of earth terminal 203 surfaceization gold.
Metal screen layer 204 can be made by silk screen printing process.The material of metal screen layer 204 can be the conductive metal material such as conductivity silver foil or conductivity copper cream.
The thickness of metal screen layer 204 can be more than or equal to 5 microns, and is less than or equal to 20 microns.This kind of structural design makes the thickness of printed circuit board (PCB) can not increase because of the increase of metal screen layer 204 too much, that is: can ensure the thinness of printed circuit board (PCB), thus can meet the slimming of the electric terminal comprising this printed circuit board (PCB).
Be understandable that, in order to effectiveness is best, metal screen layer 204 can cover all holding wires 202.This kind of structural design can realize the electromagnetic shielding of all holding wires 202.
As shown in Figure 2, metal screen layer 204 can directly contact with at least one earth terminal 203, realizes electrical connection between the two.
As shown in Figure 2, the printed circuit board (PCB) that the embodiment of the present invention two provides also comprises insulating barrier 205.Insulating barrier 205 is positioned at the outside of metal screen layer 204, and insulating barrier 205 can realize metal screen layer 204 and extraneous electric insulation.
The thickness of insulating barrier 205 can be more than or equal to 10 microns, and is less than or equal to 30 microns.This kind of structural design makes the thickness of printed circuit board (PCB) can not increase because of the increase of insulating barrier 205 too much, that is: can ensure the thinness of printed circuit board (PCB), thus can meet the slimming of the electric terminal comprising this printed circuit board (PCB).
The material of insulating barrier 205 can be the insulating material such as solder mask, polyimides or glass fiber resin.
As shown in Figure 2, the printed circuit board (PCB) that the embodiment of the present invention two provides also comprises solder mask 206.Solder mask 206 is between at least one holding wire 202 and metal screen layer 204.Solder mask 206 is for strengthening the non-oxidizability of holding wire 202.The material of above-mentioned solder mask 206 can be solder mask.
Embodiment three
Fig. 3 is the cross-sectional schematic of the printed circuit board (PCB) that the embodiment of the present invention three provides.As shown in Figure 3, the printed circuit board (PCB) that the embodiment of the present invention three provides comprises one deck wiring layer 301.
The side of wiring layer 301 is provided with at least one holding wire 302 and at least one earth terminal 303.
The outer side covers of at least one holding wire 302 has sheet metal 304, and sheet metal 304 is electrically connected with at least one earth terminal 303.
The printed circuit board (PCB) that the embodiment of the present invention three provides, by the outer side covers sheet metal 304 at least one holding wire 302 as screen, and sheet metal 304 is electrically connected with at least one earth terminal 303, achieve electromagnetic shielding: holding wire 302 can not be subject to extraneous interference, thus the quality of the signal of transmission in holding wire 302 can be ensured; The signal of transmission in holding wire 302 can not produce interference by other signal to external world.
When printed circuit board (PCB) only comprises one deck wiring layer 301, wires design all can be carried out in the both sides of wiring layer 301.In printed circuit board (PCB) shown in Fig. 3, holding wire 302 is positioned at the upside of wiring layer 301, and in addition, holding wire 302 can also be positioned at the downside of wiring layer 301, or holding wire 302 can be positioned at the upper side and lower side of wiring layer 301.That is: holding wire 302 can be positioned at upside and/or the downside of wiring layer 301.
The particular location of holding wire 302, and number and arrangement mode can design according to actual needs, are not specifically limited in the embodiment of the present invention three.
Be understandable that, when the quantity of holding wire 302 is more than or equal to 2, electric insulation between any two signal line 302.Electric insulation between any signal line 302 and any one earth terminal 303.
The quantity of earth terminal 303 and size can design according to actual needs, are not specifically limited in the embodiment of the present invention three.Be understandable that, the quantity of earth terminal 303 is more, size is larger, and the effect of electromagnetic shielding is better.Preferably, earth terminal 303 can be evenly distributed on the fringe region of at least one holding wire 302; The size of earth terminal 303 can be more than or equal to 0.25 square millimeter.
The surface of earth terminal 303 can be provided with anti oxidation layer (not shown in Fig. 3).This kind of structural design, can strengthen the non-oxidizability of earth terminal 303, thus can ensure the reliability of the electrical connection between earth terminal 303 and sheet metal 304, and then can ensure the reliability of electromagnetic shielding.The anti oxidation layer on earth terminal 303 surface can by obtaining the process of earth terminal 303 surfaceization gold.
Sheet metal 304 can be made by paster technique.The material of sheet metal 304 can be copper, stainless steel, foreign copper-nickel alloy or other alloy type metal.
The thickness of sheet metal 304 can be more than or equal to 0.1 millimeter, and is less than or equal to 0.5 millimeter.This kind of structural design makes the thickness of printed circuit board (PCB) can not increase because of the increase of sheet metal 304 too much, that is: can ensure the thinness of printed circuit board (PCB), thus can meet the slimming of the electric terminal comprising this printed circuit board (PCB).
Be understandable that, in order to effectiveness is best, sheet metal 304 can cover all holding wires 302.This kind of structural design can realize the electromagnetic shielding of all holding wires 302.
As shown in Figure 3, the printed circuit board (PCB) that the embodiment of the present invention three provides also comprises soldering paste 305.Soldering paste 305 is between earth terminal 303 and sheet metal 304, and soldering paste 305 is for realizing electrical connection by between sheet metal 304 and at least one earth terminal 303.The material of above-mentioned soldering paste 305 can be solder(ing) paste.
As shown in Figure 3, the printed circuit board (PCB) that the embodiment of the present invention three provides also comprises solder mask 306.Solder mask 306 is between at least one holding wire 302 and sheet metal 304.Solder mask 306 is for strengthening the non-oxidizability of holding wire 302.The material of above-mentioned solder mask 306 can be solder mask.
As shown in Figure 3, the printed circuit board (PCB) that the embodiment of the present invention three provides also comprises insulating barrier 307.Insulating barrier 307 is positioned at the outside of sheet metal 304, and insulating barrier 307 can realize sheet metal 304 and extraneous electric insulation.
The thickness of insulating barrier 307 can be more than or equal to 10 microns, and is less than or equal to 30 microns.This kind of structural design makes the thickness of printed circuit board (PCB) can not increase because of the increase of insulating barrier 307 too much, that is: can ensure the thinness of printed circuit board (PCB), thus can meet the slimming of the electric terminal comprising this printed circuit board (PCB).
The material of insulating barrier 307 can be the insulating material such as solder mask, polyimides or glass fiber resin.
Embodiment four
Fig. 4 is the cross-sectional schematic of the printed circuit board (PCB) that the embodiment of the present invention four provides.As shown in Fig. 4 and Fig. 1, compared with the printed circuit board (PCB) provided with the embodiment of the present invention one, the quantity of the wiring layer 101 in the printed circuit board (PCB) that the embodiment of the present invention four provides is more than or equal to 2, and at least two layers of wiring layer 101 stacks gradually from top to bottom.Insulating barrier 401 is provided with between adjacent two layers of wiring layer 101.
In printed circuit board (PCB) shown in Fig. 4, holding wire 102 is positioned at the outside of the wiring layer 101 of the superiors, in addition, holding wire 102 can also be positioned at the outside of undermost wiring layer 101, or, holding wire 102 can be positioned at the outside of the wiring layer 101 of the superiors and the outside of undermost wiring layer 101, that is: holding wire 102 can be positioned at the outside of the wiring layer 101 of the superiors and/or the outside of undermost wiring layer 101.
Compared with the printed circuit board (PCB) provided with the embodiment of the present invention one, the printed circuit board (PCB) that the embodiment of the present invention four provides is top-down at least two-layer by being set to by wiring layer 101, and making can integrated more electronic component when printed circuit board (PCB) small volume.
Embodiment five
Fig. 5 is the cross-sectional schematic of the printed circuit board (PCB) that the embodiment of the present invention five provides.As shown in Fig. 5 and Fig. 2, compared with the printed circuit board (PCB) provided with the embodiment of the present invention two, the quantity of the wiring layer 201 in the printed circuit board (PCB) that the embodiment of the present invention five provides is more than or equal to 2, and at least two layers of wiring layer 201 stacks gradually from top to bottom.Insulating barrier 501 is provided with between adjacent two layers of wiring layer 201.
In printed circuit board (PCB) shown in Fig. 5, holding wire 202 is positioned at the outside of the wiring layer 201 of the superiors, in addition, holding wire 202 can also be positioned at the outside of undermost wiring layer 201, or, holding wire 202 can be positioned at the outside of the wiring layer 201 of the superiors and the outside of undermost wiring layer 201, that is: holding wire 202 can be positioned at the outside of the wiring layer 201 of the superiors and/or the outside of undermost wiring layer 201.
Compared with the printed circuit board (PCB) provided with the embodiment of the present invention two, the printed circuit board (PCB) that the embodiment of the present invention five provides is top-down at least two-layer by being set to by wiring layer 201, and making can integrated more electronic component when printed circuit board (PCB) small volume.
Embodiment six
Fig. 6 is the cross-sectional schematic of the printed circuit board (PCB) that the embodiment of the present invention six provides.As indicated in fig. 6 and fig. 3, compared with the printed circuit board (PCB) provided with the embodiment of the present invention three, the quantity of the wiring layer 301 in the printed circuit board (PCB) that the embodiment of the present invention six provides is more than or equal to 2, and at least two layers of wiring layer 301 stacks gradually from top to bottom.Insulating barrier 601 is provided with between adjacent two layers of wiring layer 301.
In printed circuit board (PCB) shown in Fig. 6, holding wire 302 is positioned at the outside of the wiring layer 301 of the superiors, in addition, holding wire 302 can also be positioned at the outside of undermost wiring layer 301, or, holding wire 302 can be positioned at the outside of the wiring layer 301 of the superiors and the outside of undermost wiring layer 301, that is: holding wire 302 can be positioned at the outside of the wiring layer 301 of the superiors and/or the outside of undermost wiring layer 301.
Compared with the printed circuit board (PCB) provided with the embodiment of the present invention three, the printed circuit board (PCB) that the embodiment of the present invention six provides is top-down at least two-layer by being set to by wiring layer 301, and making can integrated more electronic component when printed circuit board (PCB) small volume.
In addition, the embodiment of the present invention additionally provides a kind of electric terminal, comprises the printed circuit board (PCB) that in embodiment one to embodiment six, any embodiment provides.This electric terminal can be mobile phone or panel computer etc.The electric terminal that the embodiment of the present invention provides has the beneficial effect of the printed circuit board (PCB) that the embodiment of the present invention provides, and specifically see above-described embodiment one to embodiment six, can not repeat them here.
Note, above are only preferred embodiment of the present invention and institute's application technology principle.Skilled person in the art will appreciate that and the invention is not restricted to specific embodiment described here, various obvious change can be carried out for a person skilled in the art, readjust and substitute and can not protection scope of the present invention be departed from.Therefore, although be described in further detail invention has been by above embodiment, the present invention is not limited only to above embodiment, when not departing from the present invention's design, can also comprise other Equivalent embodiments more, and scope of the present invention is determined by appended right.
Claims (11)
1. a printed circuit board (PCB), is characterized in that, comprises at least one deck wiring layer;
The arranged outside being positioned at the wiring layer in outside in described at least one deck wiring layer has at least one holding wire and at least one earth terminal;
The outer side covers of described at least one holding wire has screen, and described screen is electrically connected with at least one earth terminal described.
2. printed circuit board (PCB) according to claim 1, is characterized in that, described screen comprises: emi shielding film or metal screen layer.
3. printed circuit board (PCB) according to claim 2, it is characterized in that, described screen comprises described emi shielding film, and described printed circuit board (PCB) also comprises conducting resinl, and described emi shielding film is electrically connected with at least one earth terminal described by described conducting resinl.
4. printed circuit board (PCB) according to claim 2, is characterized in that, described metal screen layer is sheet metal, and described printed circuit board (PCB) also comprises soldering paste, and described sheet metal is electrically connected with at least one earth terminal described by described soldering paste.
5. printed circuit board (PCB) according to claim 2, is characterized in that, described screen comprises described metal screen layer, and described printed circuit board (PCB) also comprises insulating barrier, and described insulating barrier is positioned at the outside of described metal screen layer.
6. printed circuit board (PCB) according to claim 2, is characterized in that, the thickness of described emi shielding film is 15 microns;
The thickness of described metal screen layer is more than or equal to 5 microns, and is less than or equal to 20 microns.
7. printed circuit board (PCB) according to claim 4, is characterized in that, the thickness of described sheet metal is more than or equal to 0.1 millimeter, and is less than or equal to 0.5 millimeter.
8. printed circuit board (PCB) according to claim 5, is characterized in that, the thickness of described insulating barrier is more than or equal to 10 microns, and is less than or equal to 30 microns.
9. printed circuit board (PCB) according to claim 1, is characterized in that, also comprises solder mask, and described solder mask is between described at least one holding wire and described screen.
10. printed circuit board (PCB) according to claim 1, is characterized in that, the size of described earth terminal is more than or equal to 0.25 square millimeter.
11. 1 kinds of electric terminals, is characterized in that, comprise the arbitrary described printed circuit board (PCB) of claim 1-10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610087599.6A CN105555018A (en) | 2016-02-16 | 2016-02-16 | Printed circuit board and electronic terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610087599.6A CN105555018A (en) | 2016-02-16 | 2016-02-16 | Printed circuit board and electronic terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105555018A true CN105555018A (en) | 2016-05-04 |
Family
ID=55833874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610087599.6A Pending CN105555018A (en) | 2016-02-16 | 2016-02-16 | Printed circuit board and electronic terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105555018A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106231787A (en) * | 2016-09-22 | 2016-12-14 | 深圳市迅捷兴科技股份有限公司 | Printed circuit plate structure of electromagnetism shadow shield and preparation method thereof |
| CN106231781A (en) * | 2016-07-28 | 2016-12-14 | 广东欧珀移动通信有限公司 | Pcb board, the manufacture method of pcb board and mobile terminal |
| CN106413246A (en) * | 2016-11-22 | 2017-02-15 | 郑州云海信息技术有限公司 | Board card, board card manufacturing method and server |
| CN107256757A (en) * | 2017-06-21 | 2017-10-17 | 苏州华启智能科技有限公司 | Magnetic core is embedded in the PCB high temperature resistant common mode inductance with screen layer |
| CN108738226A (en) * | 2018-05-04 | 2018-11-02 | 华显光电技术（惠州）有限公司 | Flexible circuit board structure, backlight assembly and mobile terminal |
| CN112909659A (en) * | 2019-12-03 | 2021-06-04 | 日本航空电子工业株式会社 | Wire harness, connector, and connector |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08250891A (en) * | 1995-03-15 | 1996-09-27 | Canon Inc | Counter-noise component and its mounting method |
| CN1332599A (en) * | 2000-05-30 | 2002-01-23 | 阿尔卑斯电气株式会社 | Plane mounted electronic circuit unit |
| CN1462088A (en) * | 2001-07-05 | 2003-12-17 | 松下电器产业株式会社 | Manufacturing method of radio circuit and radio circuit |
| CN1774804A (en) * | 2003-04-15 | 2006-05-17 | 波零公司 | EMI shielding for electronic component packaging |
| EP1415521B1 (en) * | 2001-08-11 | 2006-06-28 | UbiNetics (VPT) Limited | A method of providing radio frequency screening for electric components |
| US20090260872A1 (en) * | 2008-04-21 | 2009-10-22 | Advanced Semiconductor Engineering, Inc. | Module for packaging electronic components by using a cap |
| CN101785100A (en) * | 2008-07-02 | 2010-07-21 | 欧姆龙株式会社 | Electronic component |
| CN104851871A (en) * | 2014-02-19 | 2015-08-19 | 株式会社东芝 | Wiring board and semiconductor device using the same |
-
2016
- 2016-02-16 CN CN201610087599.6A patent/CN105555018A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08250891A (en) * | 1995-03-15 | 1996-09-27 | Canon Inc | Counter-noise component and its mounting method |
| CN1332599A (en) * | 2000-05-30 | 2002-01-23 | 阿尔卑斯电气株式会社 | Plane mounted electronic circuit unit |
| CN1462088A (en) * | 2001-07-05 | 2003-12-17 | 松下电器产业株式会社 | Manufacturing method of radio circuit and radio circuit |
| EP1415521B1 (en) * | 2001-08-11 | 2006-06-28 | UbiNetics (VPT) Limited | A method of providing radio frequency screening for electric components |
| CN1774804A (en) * | 2003-04-15 | 2006-05-17 | 波零公司 | EMI shielding for electronic component packaging |
| US20090260872A1 (en) * | 2008-04-21 | 2009-10-22 | Advanced Semiconductor Engineering, Inc. | Module for packaging electronic components by using a cap |
| CN101785100A (en) * | 2008-07-02 | 2010-07-21 | 欧姆龙株式会社 | Electronic component |
| CN104851871A (en) * | 2014-02-19 | 2015-08-19 | 株式会社东芝 | Wiring board and semiconductor device using the same |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106231781A (en) * | 2016-07-28 | 2016-12-14 | 广东欧珀移动通信有限公司 | Pcb board, the manufacture method of pcb board and mobile terminal |
| CN106231781B (en) * | 2016-07-28 | 2018-05-22 | 广东欧珀移动通信有限公司 | Pcb board, the manufacturing method of pcb board and mobile terminal |
| CN108391369A (en) * | 2016-07-28 | 2018-08-10 | Oppo广东移动通信有限公司 | Pcb board, the manufacturing method of pcb board and mobile terminal |
| CN108391369B (en) * | 2016-07-28 | 2019-07-23 | Oppo广东移动通信有限公司 | Pcb board, the manufacturing method of pcb board and mobile terminal |
| CN106231787A (en) * | 2016-09-22 | 2016-12-14 | 深圳市迅捷兴科技股份有限公司 | Printed circuit plate structure of electromagnetism shadow shield and preparation method thereof |
| CN106231787B (en) * | 2016-09-22 | 2019-03-08 | 深圳市迅捷兴科技股份有限公司 | Printed circuit board structure of electromagnetism shadow shield and preparation method thereof |
| CN106413246A (en) * | 2016-11-22 | 2017-02-15 | 郑州云海信息技术有限公司 | Board card, board card manufacturing method and server |
| CN107256757A (en) * | 2017-06-21 | 2017-10-17 | 苏州华启智能科技有限公司 | Magnetic core is embedded in the PCB high temperature resistant common mode inductance with screen layer |
| CN108738226A (en) * | 2018-05-04 | 2018-11-02 | 华显光电技术（惠州）有限公司 | Flexible circuit board structure, backlight assembly and mobile terminal |
| CN108738226B (en) * | 2018-05-04 | 2020-11-13 | 华显光电技术（惠州）有限公司 | Flexible circuit board structure, backlight assembly and mobile terminal |
| CN112909659A (en) * | 2019-12-03 | 2021-06-04 | 日本航空电子工业株式会社 | Wire harness, connector, and connector |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105555018A (en) | Printed circuit board and electronic terminal | |
| TWI615065B (en) | Flexible circuit board and method for manufacturing same | |
| TWI643334B (en) | High frequency signal transmission structure and manufacturing method thereof | |
| US20090000804A1 (en) | Transmission Cable | |
| US9640913B1 (en) | Electrical connector | |
| US20130201648A1 (en) | Stacked substrate structure | |
| US8050015B2 (en) | Composite electric element | |
| CN109121285B (en) | Circuit board structure and electronic equipment | |
| US9999125B2 (en) | Method for fabricating ceramic insulator for electronic packaging | |
| CN105636335B (en) | Mobile terminal, flexible PCB and its manufacture method | |
| TW201311065A (en) | Electronic circuit board | |
| CN211909269U (en) | Resin multilayer substrate, electronic component, and mounting structure thereof | |
| JP4877791B2 (en) | Printed circuit board | |
| JP2003273525A (en) | Wiring board | |
| KR20120053473A (en) | Wiring board | |
| CN217062469U (en) | Transmission line and circuit board | |
| JP4907281B2 (en) | Flexible printed circuit board | |
| CN212034479U (en) | Interposer and electronic device | |
| CN105430895A (en) | Mobile terminal, flexible circuit board and manufacture method of flexible circuit board | |
| CN209914190U (en) | Circuit board assembly and terminal | |
| CN202679794U (en) | Flexible printed circuit board and electronic module adopting same | |
| CN210692812U (en) | Interposer and electronic device | |
| CN113597084B (en) | Flexible circuit board and manufacturing method thereof | |
| CN112448151B (en) | Antenna stack structure and manufacturing method thereof | |
| CN202121863U (en) | Anti-interference flexible printed circuit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160504 |