CN209914190U - Circuit board assembly and terminal - Google Patents
Circuit board assembly and terminal Download PDFInfo
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- CN209914190U CN209914190U CN201920445943.3U CN201920445943U CN209914190U CN 209914190 U CN209914190 U CN 209914190U CN 201920445943 U CN201920445943 U CN 201920445943U CN 209914190 U CN209914190 U CN 209914190U
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- circuit board
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- mounting cavity
- board assembly
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Abstract
The utility model discloses a circuit board assembly and terminal, circuit board assembly includes: the circuit board comprises a first circuit board, a second circuit board and a third circuit board, wherein a mounting cavity is arranged in the first circuit board; the second circuit board is arranged in the mounting cavity and provided with a second wire, and the second wire is electrically connected with the first wire. The embodiment of the utility model provides a, through set up the installation cavity on first circuit board, the second circuit board that will be fixed with electron device is put into the installation cavity is fixed to first on the first circuit board walk the line electricity with the second on the second circuit board and connect, can arrange more electron devices on limited circuit board, and need not to set up the connecting plate that is used for supporting and switches on first circuit board and second circuit board alone, can reduce the whole thickness of circuit board, be favorable to the slimming development at terminal, and low cost.
Description
Technical Field
The utility model relates to the field of communication technology, especially, relate to a circuit board components and terminal.
Background
With the development of multifunction and high speed of electronic products, more and more electronic devices need to be carried on the circuit board, which requires more surface space of the circuit board to fix the electronic devices. Meanwhile, the full screen of the existing terminals such as smart phones is pursued, the larger the screen is, the larger the function is, the larger the power consumption is, the larger the required battery capacity is, and further the area of the printed circuit board in the terminal is smaller and smaller.
At present, a sandwich stack structure is utilized in the industry to manufacture a printed circuit board, namely, an electronic device is welded on one circuit board on a single side, components are welded on two sides of a second circuit board arranged above the circuit board, the two circuit boards are connected by utilizing a frame-shaped connecting plate, and a through hole is arranged in the connecting plate and used for realizing the electrical connection between the two circuit boards. However, the printed circuit board with the sandwich stack structure has the following defects: firstly, a connecting plate is designed independently for supporting and conducting, the utilization rate of the plate is low, and the cost is increased; secondly, the thickness of the whole circuit board is increased, and the thinning development is difficult to meet.
SUMMERY OF THE UTILITY MODEL
An embodiment of the utility model provides a circuit board assembly and terminal to solve among the prior art great and with high costs problem of circuit board thickness.
In a first aspect, an embodiment of the present invention provides a circuit board assembly, including:
the circuit board comprises a first circuit board, a second circuit board and a third circuit board, wherein a mounting cavity is arranged in the first circuit board;
the second circuit board is arranged in the mounting cavity and provided with a second wire, and the second wire is electrically connected with the first wire.
In a second aspect, the embodiment of the present invention further provides a terminal, including the above circuit board assembly.
Therefore, the above technical scheme of the utility model, through set up the installation cavity in first circuit board, the second circuit board that will be fixed with electronic device is put into the installation cavity is fixed to first on the first circuit board walk the line electricity and connect with the second on the second circuit board of walking. Therefore, more electronic devices can be arranged on the limited surface of the circuit board, a connecting plate for supporting and conducting the first circuit board and the second circuit board does not need to be arranged independently, the overall thickness of the circuit board can be reduced, the thinning development of the terminal is facilitated, and the cost can be reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor.
Fig. 1 is a schematic structural diagram of a circuit board assembly according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a second circuit board according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a mounting cavity in a first circuit board according to an embodiment of the present invention;
fig. 4 shows a top view of a mounting cavity in a first circuit board according to an embodiment of the present invention.
Description of reference numerals: 1. the heat conducting circuit board comprises a first circuit board 2, a second circuit board 3, an electronic device 4 and a heat conducting medium piece;
11. the mounting cavity 21, the mounting hole 22, the fixing part 23 and the electrical connecting piece;
111. a first pad, 112, a first metal plate, 113, a second metal plate.
Detailed Description
Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention can be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
As shown in fig. 1, an embodiment of the present invention provides a circuit board assembly, including:
the circuit board comprises a first circuit board 1, wherein a mounting cavity 11 is arranged in the first circuit board 1, and the first circuit board is provided with a first routing;
the second circuit board 2 is installed in the installation cavity 11, and is provided with a second routing wire which is electrically connected with the first routing wire.
In this embodiment, the first circuit board 1 is a main circuit board of the circuit board assembly, the second circuit board 2 is a sub-circuit board of the circuit board assembly, a mounting cavity 11 is arranged inside the first circuit board 1, and the second circuit board 2 mounted with electronic devices is placed in the mounting cavity 11 of the first circuit board 1 and fixed; the first circuit board 1 has a first trace, the second circuit board 2 has a second trace, and the first trace and the second trace are electrically connected through a connecting member. The shape of the second circuit board 2 is set according to the requirement, and can be square, strip or round.
Preferably, the second circuit board 2 is a multilayer circuit board of at least two layers. A plurality of layers of the second circuit board 2 are placed in the mounting cavity 11, so that more electronic components can be arranged on the second circuit board 2.
The embodiment of the utility model provides a, through set up the installation cavity on first circuit board, the second circuit board that will be fixed with electronic device is put into the installation cavity is fixed to first on the first circuit board walk the line electricity and connect with the second on the second circuit board of walking. Therefore, more electronic devices can be arranged on the limited surface of the circuit board, a connecting plate for supporting and conducting the first circuit board and the second circuit board does not need to be arranged independently, the overall thickness of the circuit board can be reduced, and the thinning development of the terminal is facilitated.
Specifically, the first circuit board 1 includes: the cover plate is arranged above the opening of the groove in a covering mode;
the cover plate covers the body, the wires on the cover plate are electrically connected with the wires on the body, the cover plate seals the groove, and the body and the cover plate jointly form the installation cavity.
In this embodiment, the first circuit board 1 is composed of a body and a cover plate, the body has a groove, the cover plate is covered over the opening of the groove, so that the groove forms a closed mounting cavity 11, and the traces on the cover plate are electrically connected with the traces on the body. The shape and size of the mounting cavity 11 are related to the second circuit board 2, and it should be ensured that the second circuit board 2 has a certain distance from the inner wall of the mounting cavity 11 after being fixed in the mounting cavity 11, so as to prevent the metal short circuit between the electronic device on the second circuit board 2 and the inner wall of the cavity of the mounting cavity 11. Specifically, the circuit board assembly further includes a heat conductive medium member 4 filled in the mounting cavity 11. After the second circuit board 2 and the first circuit board 1 are fixed, the mounting cavity 11 is filled with the heat-conducting medium piece 4, the heat-conducting medium piece 4 may be insulating resin, preferably, the heat-conducting medium piece 4 is insulating resin with high heat conductivity, which is beneficial to improving the heat dissipation effect in the mounting cavity 11, and can avoid abnormalities such as falling off of electronic devices on the second circuit board 2 caused by heating when the electronic devices are fixed on the first circuit board 1 after the second circuit board 2 provided with the electronic devices is placed in the mounting cavity 11; meanwhile, the heat-conducting medium pieces 4 are filled around the electronic device, so that the electronic device can be prevented from falling off when falling, and the reliability of the product is improved.
The above embodiment of the present invention, the second circuit board 2 and the distance of the cavity sidewall of the installation cavity 11 is greater than the first preset distance. The cross-sectional area of the cavity of the installation cavity 11 is larger than the area of the second circuit board 2, so that the second circuit board 2 is ensured to be arranged in the installation cavity 11 and have a certain distance with the cavity side wall of the installation cavity 11, and the electronic device on the second circuit board 2 and the metal on the cavity side wall of the installation cavity 11 are prevented from being short-circuited. The first preset distance may be 0.1mm, that is, the distance between the second circuit board 2 and the cavity side wall of the mounting cavity 11 is greater than 0.1 mm.
Specifically, the second circuit board 2 has a structure as shown in fig. 2, and the second circuit board 2 is provided with a mounting hole 21; the second circuit board 2 is fixedly connected with the first circuit board 1 through a fixing part 22 passing through the mounting hole 21. After the second circuit board 2 is placed in the mounting cavity 11, it needs to be fixed to the first circuit board 1 by a fixing member 22. The second circuit board 2 is provided with a mounting hole 21 for the fixing member 22 to pass through, and the fixing member 22 is fixed on a pad on the bottom surface of the cavity of the mounting cavity 11. Optionally, the fixing member 22 is a screw. The fixing component 22 may also be other components that can perform the fixing function.
As shown in fig. 2, the second circuit board 2 is provided with an electrical connector 23; the second trace is electrically connected to the first trace through the electrical connector 23. A first pad 111 is arranged in the first circuit board 1, and one end of the electrical connector 23 electrically connected to the first trace is fixed on the first pad 111. The electrical connector 23 may be a metal sheet, or may be another connector having a current conducting function. Two ends of the electrical connector 23 are respectively connected to a first trace on the first circuit board 1 and a second trace on the second circuit board 2, so as to realize the electrical connection between the first trace and the second trace.
A second bonding pad is arranged on the outer surface of the first circuit board 1; a second bonding pad is arranged on the outer surface of the second circuit board 2; an electronic device 3 is fixed to the second pad. The second pads on the outer surfaces of the first circuit board 1 and the second circuit board 2 are used for fixing the electronic devices 3, so that more electronic devices can be arranged by using the limited surface space of the circuit boards, and the thickness of the circuit board assembly is further reduced.
A first metal plate 112 is arranged on the side wall of the mounting cavity 11, and the distance between the first pad 111 and the first metal plate 112 is greater than a second preset distance; when signal shielding is needed, the sidewall of the mounting cavity 11 of the first circuit board 1 may be plated with metal by using a pattern plating process to form the first metal plate 112, and the first metal plate 112 may be used for signal shielding. The metal side wall is used for shielding signals, a shielding cover arranged on the electronic device can be replaced, the overall thickness of the second circuit board 2 after the electronic device is fixed is reduced, and the total thickness of the circuit board is further reduced. Optionally, the first metal plate 112 is a copper sheet, that is, a copper plate is plated on a side wall of the mounting cavity 11 of the first circuit board 1, so that a function of shielding signals can be realized.
Wherein, the distance between the first pad 111 and the first metal plate 112 is greater than a second preset distance. Thereby preventing an electronic device connected to the first pad 111 from being short-circuited to the first metal plate 112. The second preset distance may be 0.05mm, that is, the distance between the first pad 111 and the first metal plate 112 is greater than 0.05 mm.
Specifically, the top surface and the bottom surface of the cavity of the installation cavity 11 are respectively provided with a second metal plate 113. The second metal plate 113 is used for heat conduction and has a heat dissipation function. The second metal plate 113 and the heat conducting medium piece 4 are arranged, so that the heat dissipation effect of the circuit board is effectively improved. Optionally, the second metal plate 113 is a copper sheet, that is, the top surface and the bottom surface of the cavity of the mounting cavity 11 are plated with copper, so that the heat dissipation function of the circuit board can be realized.
The manufacturing process of the circuit board is as follows: first, the second circuit board 2 is manufactured according to design requirements, the upper and lower surfaces of the second circuit board 2 are both provided with pads and mounting holes 21 for fixing and positioning, an electronic device is attached to the upper Surface pad of the second circuit board 2 by using Surface Mount Technology (SMT), the electronic device and an electrical connector 23 for electrical connection are attached to the lower Surface pad of the second circuit board 2, and the structure of the second circuit board 2 is as shown in fig. 2.
When the first circuit board 1 is manufactured, the first circuit board 1 is manufactured to a certain thickness, a groove body with a mounting cavity is formed in a laser depth control mode, a mechanical depth control mode or a Polypropylene (PP) plate grooving mode, and a first welding pad 111 (capable of welding a fixing part and conducting an electrical connecting piece 23 for electrical use) for positioning is arranged at the bottom of the mounting cavity 11. According to the requirement, if a signal is required to be shielded, the side wall of the mounting cavity 11 can be plated with metal by using a pattern plating process to form the first metal plate 112, the signal is shielded by using the metal side wall, a shielding cover can be attached to the electronic device instead, the overall thickness of the second circuit board 2 after the electronic device is attached is reduced, and further the total thickness of the circuit board can be reduced.
A fixing member 22 is mounted at the first land 111 at the bottom of the mounting cavity 11, and the second circuit board 2 mounted with the electronic component is placed in the mounting cavity 11 and fixed by the fixing member 22. After the second circuit board 2 is fixed, the mounting cavity is filled with a heat conductive medium member 4 (e.g., insulating resin). After the heat-conducting medium member 4 is filled, a heat-dissipating copper foil, i.e., a second metal plate 113, is attached to the surface of the heat-conducting medium member 4; arranging a bonding layer PP on the upper surface and the lower surface of the unfinished first circuit board 1, then placing a copper foil on the PP, and pressing and curing to finish the manufacture of the first circuit board 1; and finally, respectively attaching electronic devices to the bonding pads on the upper surface and the lower surface of the first circuit board 1 by using an SMT process. The structure in the mounting cavity 11 of the first circuit board 1 is as shown in fig. 3 and 4, the first pad 111 has a certain distance from the side wall of the mounting cavity 11, so as to prevent short circuit with the first metal plate 112 on the side wall of the mounting cavity 11; the second metal plates 113 of the top and bottom surfaces of the mounting cavity 11 serve to dissipate heat.
The embodiment of the utility model provides a, through set up the installation cavity in first circuit board, place electron device in the inside of circuit board, be favorable to setting up more electron devices on limited plane. A heat-conducting medium piece and a metal plate for heat dissipation are filled in the mounting cavity of the first circuit board, so that the heat dissipation effect is improved; the side wall of the mounting cavity of the first circuit board is plated with metal, so that the shielding cover has a shielding function, can replace a shielding cover on the second circuit board, and the thickness of the circuit board is reduced; the second circuit board provided with the electronic device is embedded in the first circuit board, and the periphery of the second circuit board is filled with the heat-conducting medium pieces, so that the electronic device can be prevented from falling off due to heating when the electronic device is welded on the first circuit board, and the reliability of the product is improved.
The present invention provides a terminal device, which is described in detail below by way of specific embodiments. For convenience of illustration, a mobile phone is used as a specific example of the terminal device of the present invention for illustration, and it can be understood by those skilled in the art that, besides the mobile phone is used as the terminal device, the present invention is also applicable to other terminal devices with a display screen, such as a tablet computer, an e-book reader, an MP3 (Moving Picture Experts Group Audio Layer III) player, an MP4 (Moving Picture Experts Group Audio Layer IV) player, a laptop portable computer, a car computer, a desktop computer, a set-top box, an intelligent tv, a wearable device, etc., all fall within the protection scope of the embodiments of the present invention.
The utility model provides a terminal, including foretell circuit board subassembly, wherein, circuit board subassembly sets up the inside at terminal, circuit board subassembly utilizes limited space to set up more electron device, and thickness is less, is favorable to the slimming development at terminal.
The embodiment of the utility model provides a, through set up the installation cavity on first circuit board, the second circuit board that will be fixed with electronic device is put into the installation cavity is fixed to first on the first circuit board walk the line electricity and connect with the second on the second circuit board of walking. This allows more electronic devices to be placed on a limited surface and reduces the overall thickness of the circuit board.
The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
While preferred embodiments of the present invention have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the embodiments of the invention.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.
The foregoing is directed to the preferred embodiments of the present invention, and it will be understood by those skilled in the art that various changes and modifications may be made without departing from the principles of the invention, and that such changes and modifications are intended to be included within the scope of the invention.
Claims (12)
1. A circuit board assembly, comprising:
the circuit board comprises a first circuit board, a second circuit board and a third circuit board, wherein a mounting cavity is arranged in the first circuit board;
the second circuit board is arranged in the mounting cavity and provided with a second wire, and the second wire is electrically connected with the first wire.
2. The circuit board assembly of claim 1, wherein the first circuit board comprises: the cover plate is arranged above the opening of the groove in a covering mode;
the cover plate covers the body, the wires on the cover plate are electrically connected with the wires on the body, the cover plate seals the groove, and the body and the cover plate jointly form the installation cavity.
3. The circuit board assembly of claim 1, further comprising: and the heat conducting medium piece is filled in the mounting cavity.
4. The circuit board assembly of claim 1, wherein the second circuit board is spaced from a cavity sidewall of the mounting cavity by a distance greater than a first predetermined distance.
5. The circuit board assembly of claim 1, wherein the second circuit board defines a mounting hole;
the second circuit board penetrates through the mounting hole through a fixing component and is fixedly connected with the first circuit board.
6. The circuit board assembly of claim 1, wherein the second circuit board has electrical connectors thereon;
the second wire is electrically connected with the first wire through the electrical connector.
7. The circuit board assembly according to claim 6, wherein a first pad is disposed in the first circuit board, and an end of the electrical connector electrically connected to the first trace is fixed on the first pad.
8. The circuit board assembly of claim 7, wherein the cavity sidewall of the mounting cavity is provided with a first metal plate;
the distance between the first bonding pad and the first metal plate is larger than a second preset distance.
9. The circuit board assembly of claim 1, wherein the cavity top and bottom surfaces of the mounting cavity are respectively provided with a second metal plate.
10. The circuit board assembly of claim 1, wherein the outer surface of the first circuit board is provided with second pads; a second bonding pad is arranged on the outer surface of the second circuit board;
an electronic device is fixed on the second bonding pad.
11. The circuit board assembly of claim 1, wherein the second circuit board is a multilayer circuit board.
12. A terminal, characterized in that it comprises a circuit board assembly according to any one of claims 1 to 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920445943.3U CN209914190U (en) | 2019-04-03 | 2019-04-03 | Circuit board assembly and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920445943.3U CN209914190U (en) | 2019-04-03 | 2019-04-03 | Circuit board assembly and terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209914190U true CN209914190U (en) | 2020-01-07 |
Family
ID=69034781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920445943.3U Active CN209914190U (en) | 2019-04-03 | 2019-04-03 | Circuit board assembly and terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209914190U (en) |
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2019
- 2019-04-03 CN CN201920445943.3U patent/CN209914190U/en active Active
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