CN104661428A - Double-sided flexible circuit board and manufacturing method thereof - Google Patents
Double-sided flexible circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN104661428A CN104661428A CN201310596081.1A CN201310596081A CN104661428A CN 104661428 A CN104661428 A CN 104661428A CN 201310596081 A CN201310596081 A CN 201310596081A CN 104661428 A CN104661428 A CN 104661428A
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- Prior art keywords
- copper foil
- double
- copper
- foil layer
- screened film
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0723—Shielding provided by an inner layer of PCB
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention relates to a circuit board and a manufacturing method thereof, in particular to a double-sided flexible circuit board and a manufacturing method thereof. The double-sided flexible circuit board comprises a flexible substrate layer, a copper foil layer, a protective film, an EMI shielding film, and an insulating layer adhered onto the EMI shielding film, wherein the copper foil layer, the protective film and the EMI shielding film are arranged on the flexible substrate layer; the protective film is adhered to the upper part of the copper foil layer; the copper foil layer comprises copper-exposed parts; the EMI shielding film is arranged on the copper-exposed parts to achieve electrical connection between the copper-exposed parts. By the manufacturing method, the flexible circuit board manufacturing process can be simplified, and the production cost can be reduced.
Description
Technical field
The present invention relates to a kind of circuit board and preparation method thereof, espespecially a kind of double-sided flex circuit plate and preparation method thereof.
Background technology
Flexible PCB is that the one made based on polyimides or polyester film has height reliability, excellent flexible printed circuit.Be called for short soft board or FPC (Flexible PrintedCircuit), have the advantages that distribution density is high, lightweight, thickness is thin.Be mainly used in a lot of product such as mobile phone, notebook computer, PDA, digital camera, LCM (Liquid Crystal Module).FPC plate designs for improving space availability ratio and product design flexibility, can meet design needs that are more small-sized and more high-density installation, also contributes to minimizing assembling procedure and enhancing reliability.
Existing two-sided FPC board manufacturing method is for adopting two-sided copper foil base material, and as shown in Figures 1 to 4, it is the two-sided FPC board manufacturing method adopted in prior art.First, copper foil layer 10 is pasted respectively in the both sides up and down of flexible substrate layer 20, as shown in Figure 1.Then the sidepiece in said structure is holed, and obtains through hole 30 and makes to communicate between upper and lower two copper foil layers 10, realizes upper and lower two copper foil layers 10 and realizes electrical connection, as shown in Figure 2 by electroplating technology.Then exposure etch process is carried out to upper and lower two copper foil layers 10, remove unwanted Copper Foil, retain remaining Copper Foil, obtain required circuit pattern, as shown in Figure 3.Finally, at the outside of upper and lower two copper foil layers 10 laminating diaphragm 40, as shown in Figure 4, two-sided FPC plate is so just obtained.Adopt the structure of double-sided copper-clad layers of foil in prior art, make the cost of FPC high, again because adopting boring electroplating technology to realize electrical connection, making FPC making technology complicated, and easily causing the damage of FPC plate, affecting the yield of FPC.
Summary of the invention
The object of the invention is to the defect overcoming prior art, a kind of double-sided flex circuit plate and preparation method thereof is provided, the electrical connection between the Copper Foil on FPC can be realized when saving boring electroplating technology step, thus avoid the problem affecting yield because boring electroplating technology brings.
The technical scheme realizing above-mentioned purpose is:
A kind of double-sided flex circuit plate of the present invention, comprises a flexible substrate layer, is placed in a copper foil layer, a diaphragm, an EMI screened film on described flexible substrate layer; Described copper foil layer comprises dew copper portion, and described EMI screened film is placed on described dew copper portion, realizes the electrical connection between described dew copper portion.
One side copper foil layer and EMI screened film is adopted to make double-sided flex circuit plate, electrical connection is realized by pasting EMI (Electromagnetic Interference) screened film above copper foil layer, eliminate boring electroplating technique step, simplify processing technology, the problem affecting yield that complicated boring electroplating technology brings can also be avoided simultaneously.Because adopting the copper foil layer of one side, make the present invention effectively can save cost.
The further improvement of a kind of double-sided flex circuit of the present invention plate is: be formed with circuit pattern in described copper foil layer.
The further improvement of a kind of double-sided flex circuit of the present invention plate is also to comprise: fit in the insulating barrier on described EMI screened film.
The manufacture method of a kind of double-sided flex circuit plate of the present invention, comprises the following steps:
One copper foil layer is set on a flexible substrate layer;
Carry out exposure etching for described copper foil layer, obtain the circuit pattern needed;
To fit on described circuit pattern a diaphragm;
The diaphragm of the end of the circuit pattern that removal need be electrically connected, makes the end dew copper of the described circuit pattern that need be electrically connected;
In described end, dew copper place arranges an EMI (Electromagnetic Interference) screened film, described end is revealed between copper place and forms electrical connection.
The further improvement of the manufacture method of a kind of double-sided flex circuit of the present invention plate is also to comprise: an insulating barrier of fitting on described EMI screened film.
Accompanying drawing explanation
Fig. 1 to Fig. 4 is the decomposing state schematic diagram making double-sided flex circuit plate in prior art;
Fig. 5 is the flow chart of the manufacture method of a kind of double-sided flex circuit plate of the present invention;
Fig. 6 to Fig. 9 is the view of the Making programme in Fig. 5.
Embodiment
Below in conjunction with the drawings and specific embodiments, the invention will be further described.
A kind of double-sided flex circuit plate of the present invention and preparation method thereof adopts one side copper foil layer and EMI (Electromagnetic Interference, Electromagnetic Interference) screened film to make, can simplified processing process again can be cost-saving.EMI is a kind of electromagnetic radiation, can affect the operation of electronic equipment, also can damage human body, animal body.EMI screened film is a kind of screened film of electromagnetism interference of good conductivity, can prevent the interference of outside EMI and the protection of self-electrostatic electric discharge, can reduce the injury of EMI to human body, animal body.Below in conjunction with accompanying drawing, a kind of double-sided flex circuit plate of the present invention and preparation method thereof is described.
Refer to shown in Fig. 9, show the structure of a kind of double-sided flex circuit plate of the present invention.This flexible PCB comprises flexible substrate layer 20, be placed in a copper foil layer 10 on flexible substrate layer 20, diaphragm 40, EMI screened film 50 and the insulating barrier 60 that fits on EMI screened film 50.Copper foil layer 10, for the formation of the circuit pattern needed for double-sided flex circuit plate, can be realized by techniques such as exposure imagings.As shown in Figure 8; a part on copper foil layer 10 is fitted with diaphragm 40; copper foil layer 10 do not fit diaphragm 40 position for dew copper portion; this dew copper portion is arranged in the end on the circuit pattern partial line road that copper foil layer is formed; EMI screened film 50 is placed on dew copper portion; because EMI screened film itself has good conductivity, so can realize revealing the electrical connection between copper portion.
Refer to shown in Fig. 5, show the process step of the manufacture method of a kind of double-sided flex circuit plate of the present invention.The Making programme of this double-sided flex circuit plate is: on a flexible substrate layer, arrange a copper foil layer; Carry out exposing the circuit pattern needed for etching formation to described copper foil layer; Described circuit pattern to be fitted a diaphragm; Removal unit divides the diaphragm of line pattern end, makes the end dew copper of part circuit; To fit in described dew copper place an EMI screened film, to realize revealing the electrical connection between copper place.
Refer to shown in Fig. 6 to Fig. 9, show the view of a kind of flexible PCB Making programme of the present invention.Be specifically described below in conjunction with view.
For the manufacture method of a kind of double-sided flex circuit plate of the present invention, first perform step S1: a copper foil layer 10 is set on flexible substrate layer 20, form structure as shown in Figure 6.In the present embodiment, this copper foil layer 10 is for the formation of required circuit pattern, and the material of flexible substrate layer 20 can select polyimides.Glue can be adopted between copper foil layer 10 with flexible substrate layer 20 to be connected, select pressure sensitive or heat curing-type adhesive, but not as limit, in other embodiments, copper foil layer 10 and flexible substrate layer 20 also can adopt hot press pressing to be connected.Then, step S2 is performed.
Perform step S2: by exposure imaging etch process, etch away unwanted Copper Foil, retain remaining Copper Foil, form structure as shown in Figure 7, thus the circuit pattern needed for being formed.Then, step S3 is performed.
Perform step S3: diaphragm 40 of fitting on circuit pattern.In the present embodiment: glue can be adopted between diaphragm 40 with copper foil layer 10 to be connected, select pressure sensitive or heat curing-type adhesive, other modes also can be adopted to connect as pressing connects.The material of diaphragm 40 can select polyimides.Then, step S4 is performed.
Perform step S4: after posting diaphragm 40; the removal of diaphragm 40 is carried out to the end of circuit in the circuit pattern needing to be electrically connected; make the end of the circuit that need be electrically connected manifest copper foil layer 10 under diaphragm 40, form structure as shown in Figure 8.Then, step S5 is performed.
Perform step S5: laminating one deck EMI (Electromagnetic Interference) screened film 50 on the dew copper part of foregoing circuit pattern, between the circuit of realization dew copper part, form electrical connection.Particularly, glue can be adopted to be connected between EMI screened film 50 with dew copper part, select pressure sensitive or heat curing-type adhesive, other modes also can be adopted to connect as pressing connects.Then, step S6 is performed.
Perform step S6: a layer insulating 60 of fitting on EMI screened film 50, form structure as shown in Figure 9.Particularly, glue can be adopted between insulating barrier 60 with EMI screened film 50 to be connected, to select pressure sensitive or heat curing-type adhesive, other modes also can be adopted to connect as pressing connects.
By each step above-mentioned, double-sided flex circuit plate can be produced.
The present invention adopts one side copper foil base material, is etched away the Copper Foil of part, the circuit pattern needed for formation by exposure imaging, then to the end dew copper needing connection line, is that dew copper part sticks EMI screened film to realize electrical connection.Such scheme obtains double-sided flex circuit plate, and compared with prior art the present invention can save the operation of boring and plating in traditional two-sided FPC processing technology, significantly simplify construction technology, can also avoid the problem affecting yield that above-mentioned technique is brought.Again, because adopting one side copper foil layer, the double-side copper layers of foil compared to existing technology, effectively provides cost savings, has economic benefit.
Below embodiment is to invention has been detailed description by reference to the accompanying drawings, and those skilled in the art can make many variations example to the present invention according to the above description.Thus, some details in embodiment should not form limitation of the invention, the present invention by the scope that defines using appended claims as protection scope of the present invention.
Claims (5)
1. a double-sided flex circuit plate, is characterized in that, comprises a flexible substrate layer, is placed in a copper foil layer, a diaphragm, an EMI screened film on described flexible substrate layer; Described copper foil layer comprises dew copper portion, and described EMI screened film is placed on described dew copper portion, realizes the electrical connection between described dew copper portion.
2. a kind of double-sided flex circuit plate as claimed in claim 1, is characterized in that: be formed with circuit pattern in described copper foil layer.
3. a kind of double-sided flex circuit plate as claimed in claim 1 or 2, characterized by further comprising: fit in the insulating barrier on described EMI screened film.
4. a manufacture method for double-sided flex circuit plate, its characteristic is to comprise the following steps:
One copper foil layer is set on a flexible substrate layer;
Carry out exposure etching for described copper foil layer, obtain corresponding circuit pattern;
To fit on described circuit pattern a diaphragm;
The diaphragm of the end of the circuit pattern that removal need be electrically connected, makes the end dew copper of the described circuit pattern that need be electrically connected;
In described end, dew copper place arranges an EMI screened film, described end is revealed between copper place and forms electrical connection.
5. the manufacture method of a kind of double-sided flex circuit plate as claimed in claim 4, characterized by further comprising: an insulating barrier of fitting on described EMI screened film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310596081.1A CN104661428A (en) | 2013-11-22 | 2013-11-22 | Double-sided flexible circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310596081.1A CN104661428A (en) | 2013-11-22 | 2013-11-22 | Double-sided flexible circuit board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104661428A true CN104661428A (en) | 2015-05-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310596081.1A Pending CN104661428A (en) | 2013-11-22 | 2013-11-22 | Double-sided flexible circuit board and manufacturing method thereof |
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| Country | Link |
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| CN (1) | CN104661428A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108684143A (en) * | 2018-06-05 | 2018-10-19 | 深圳市信维通信股份有限公司 | The production method of wireless charging flexible PCB |
| CN114040590A (en) * | 2021-10-22 | 2022-02-11 | 重庆康佳光电技术研究院有限公司 | Double-sided circuit substrate, display panel and preparation method thereof |
| CN114690928A (en) * | 2020-12-30 | 2022-07-01 | 京东方科技集团股份有限公司 | Touch display device |
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| JP2005109101A (en) * | 2003-09-30 | 2005-04-21 | Nippon Mektron Ltd | Electromagnetic shield type flexible circuit board |
| CN101296586A (en) * | 2007-04-25 | 2008-10-29 | 索尼株式会社 | Portable electronic apparatus |
| CN101433132A (en) * | 2006-05-02 | 2009-05-13 | 富多电子公司 | Shielded flexible circuits and methods for manufacturing same |
| CN201403249Y (en) * | 2009-04-30 | 2010-02-10 | 厦门新福莱科斯电子有限公司 | Flexible circuit board structure with anti-electromagnetic interference function |
| CN201854502U (en) * | 2010-11-02 | 2011-06-01 | 淳华科技(昆山)有限公司 | Flexible circuit board with reinforcing structure |
| CN102316665A (en) * | 2010-07-09 | 2012-01-11 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and manufacture method thereof |
-
2013
- 2013-11-22 CN CN201310596081.1A patent/CN104661428A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005109101A (en) * | 2003-09-30 | 2005-04-21 | Nippon Mektron Ltd | Electromagnetic shield type flexible circuit board |
| CN101433132A (en) * | 2006-05-02 | 2009-05-13 | 富多电子公司 | Shielded flexible circuits and methods for manufacturing same |
| CN101296586A (en) * | 2007-04-25 | 2008-10-29 | 索尼株式会社 | Portable electronic apparatus |
| CN201403249Y (en) * | 2009-04-30 | 2010-02-10 | 厦门新福莱科斯电子有限公司 | Flexible circuit board structure with anti-electromagnetic interference function |
| CN102316665A (en) * | 2010-07-09 | 2012-01-11 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and manufacture method thereof |
| CN201854502U (en) * | 2010-11-02 | 2011-06-01 | 淳华科技(昆山)有限公司 | Flexible circuit board with reinforcing structure |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108684143A (en) * | 2018-06-05 | 2018-10-19 | 深圳市信维通信股份有限公司 | The production method of wireless charging flexible PCB |
| CN114690928A (en) * | 2020-12-30 | 2022-07-01 | 京东方科技集团股份有限公司 | Touch display device |
| CN114040590A (en) * | 2021-10-22 | 2022-02-11 | 重庆康佳光电技术研究院有限公司 | Double-sided circuit substrate, display panel and preparation method thereof |
| CN114040590B (en) * | 2021-10-22 | 2023-06-16 | 重庆康佳光电技术研究院有限公司 | Double-sided circuit substrate, display panel and preparation method of display panel |
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Application publication date: 20150527 |
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