CN104768318A - Flexible-rigid combination circuit board and manufacturing method thereof - Google Patents
Flexible-rigid combination circuit board and manufacturing method thereof Download PDFInfo
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- CN104768318A CN104768318A CN201410002919.4A CN201410002919A CN104768318A CN 104768318 A CN104768318 A CN 104768318A CN 201410002919 A CN201410002919 A CN 201410002919A CN 104768318 A CN104768318 A CN 104768318A
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Abstract
A flexible-rigid combination circuit board comprises a flexible circuit board and a rigid circuit board. The flexible circuit board comprises a mounting part and a bending part. The rigid circuit board is formed on the mounting part of the flexible circuit board, and comprises first and second insulating lamination layers, first and second patterned conductive lines, conductive holes, and first and second patterned insulating coating layers. The first patterned conductive line and the second patterned conductive line are respectively formed on the first insulating lamination layer and the second insulating lamination layer. The conductive holes are electrically connected with the flexible circuit board and the first and second patterned conductive lines, and are filled with insulating filling material. The first patterned insulating coating layer and the second patterned insulating coating layer respectively cover the first patterned conductive line and the second patterned conductive line. The first patterned insulating coating layer and the second patterned insulating coating layer have the same pattern with the first patterned conductive line and the second patterned conductive line respectively. The invention further relates to a manufacturing method of the flexible-rigid combination circuit board.
Description
Technical field
The present invention relates to the manufacture method of circuit board and circuit board, especially a kind of rigid-flexible circuit board and preparation method thereof.
Background technology
Along with the development of science and technology, Soft Bonding circuit board extensively should in electronic product.So-called rigid-flexible circuit board, by a kind of circuit board of the mutually stacked formation of hard circuit board and Flexible Printed Circuit, it combines the characteristic of hard circuit board and flexible circuit board, both ensure that the stability of the assembling of electronic component, turn increases the stability of electric connection, assembling.The built-in conductive layer of described flexible circuit board, for realizing electrically conducting between described hard circuit board and described flexible circuit board, in circuit board making process, need to offer connecting hole at described flexible circuit board, described connecting hole inwall is provided with conductive coating to be communicated with described conductive layer.Damage for avoiding the conductive coating of successive process on described connecting hole and described connecting hole on the impact of successive process, described connecting hole needs to fill after conductive coating is provided with.After described connecting hole has been filled, insulation filling material often protrudes from described flexible circuit board surface, the mode that the insulation filling material of described protrusion often grinds is removed, but, milling tool often has high hardness, easily damage is caused to other parts of described circuit board, cause product yield and stability to decline.
Summary of the invention
In view of this, be necessary to provide have better assembling yield and stable Soft Bonding circuit board with and preparation method thereof.
A kind of rigid-flexible circuit board, comprising:
Flexible circuit board, described flexible circuit board comprises installation portion and kink;
Hard circuit board, described hard circuit board comprises:
First, second pressing layer that insulate, first, second insulation pressing layer described is formed at opposing two surfaces of described flexible circuit board installation portion respectively;
First, second pattern conductive circuit, described first patterned circuit is formed on the first insulation pressing layer, and the second patterned circuit is formed on the second insulation pressing layer;
Conductive hole, described conductive hole runs through described flexible circuit board and first, second insulation pressing layer, described conductive hole hole wall is attached with electric conducting material, is filled with insulation filling material in hole, and described conductive hole is electrically connected described flexible circuit board and first, second pattern conductive circuit described;
First, second patterning insulation coat, described first patterning insulation coat covers the first pattern conductive circuit, second patterning insulation coat covers the second pattern conductive circuit, wherein, described first patterning insulation coat has identical pattern with the first pattern conductive circuit, second patterning insulation coat has identical pattern with the second pattern conductive circuit, and the insulate material of coat of the insulation filling material in described conductive hole and first, second patterning described is identical;
First, second build-up circuit layer, described first build-up circuit layer is electrically connected the first pattern conductive circuit, the described second pattern conductive circuit of the second build-up circuit layer electrical connection.
A manufacture method for rigid-flexible circuit board, comprises the steps:
Form first, second insulation pressing layer in opposing two surfaces of flexible circuit board, described flexible circuit board comprises installation portion and kink;
Form connecting hole in the installation portion of described flexible circuit board, described connecting hole runs through described first, second insulation pressing layer and described flexible circuit board, and first, second insulation pressing layer surface attachment described has electric conducting material;
Form conductive hole, in connecting hole hole wall attachment electric conducting material;
Form the first pattern conductive circuit, the first patterning insulation coat on the first insulation pressing layer, form the second pattern conductive circuit, the second patterning insulation coat on the second insulation pressing layer;
Wherein, form first, second patterned circuit and first, the process of the second patterning insulation coat is: the electric conducting material adhered on the first insulating barrier is formed the first insulation coat, the electric conducting material adhered to is formed the second insulation coat for described second insulating barrier, described first, second insulation coat fills up described conductive hole internal clearance, described first, second insulation coat is photosensitive material, first is obtained by image transfer and etching, second patterning insulation coat, again with described first, second patterning insulation coat is etch stop layer, first is obtained by etching described electric conducting material, second patterned circuit,
Form first, second build-up circuit layer, described first build-up circuit layer is electrically connected the first pattern conductive circuit, the described second pattern conductive circuit of the second build-up circuit layer electrical connection;
Form opening to appear the kink of described flexible circuit board, form Rigid Flex.
Compared to prior art, described rigid-flexible circuit board and preparation method thereof, supplement concordant at the protrusion place feed supplement layer of insulation filling material, therefore, after insulation filling material baking-curing, do not need grinding and directly can carry out next step processing procedure, due to without the need to grinding, the damage of effects on surface coating can be avoided, ensure assembling yield and the stability of Soft Bonding circuit.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the rigid-flexible circuit board of embodiment of the present invention.
Fig. 2 is the flow chart of rigid-flexible circuit board manufacture method of the present invention.
Fig. 3 to Figure 16 is the rigid-flexible circuit board manufacture method schematic diagram of Fig. 2.
Main element symbol description
| Rigid-flexible circuit board | 100 |
| Flexible circuit board | 10 |
| First installation portion | 10A |
| Second installation portion | 10B |
| Kink | 10C |
| Flexible substrate | 11 |
| First internal layer circuit layer | 12 |
| Second internal layer circuit layer | 13 |
| First protective layer | 14 |
| Second protective layer | 15 |
| First glue-line | 16 |
| Second glue-line | 17 |
| First insulation pressing layer | 18 |
| Second insulation pressing layer | 19 |
| First conductive hole | 101 |
| Second conductive hole | 102 |
| Electric conducting material | 1031 |
| First conductive layer | 1032a |
| First pattern conductive circuit | 1032 |
| Second conductive layer | 1033a |
| Second pattern conductive circuit | 1033 |
| Insulation filling material | 104 |
| Depressed part | 1041 |
| First insulation coat | 105a |
| First patterning insulation coat | 105 |
| Second insulation coat | 106a |
| Second patterning insulation coat | 106 |
| Hard circuit board | 20 |
| First build-up circuit layer | 201 |
| Second build-up circuit layer | 202 |
| 3rd insulation pressing layer | 21 |
| First stiffening plate | 22 |
| 3rd pattern conductive circuit | 23 |
| Perforate | 24 |
| Connecting conductive layer | 25 |
| Solder mask | 26 |
| 4th insulation pressing layer | 27 |
| Second stiffening plate | 28 |
| 4th pattern conductive circuit | 29 |
Following embodiment will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
Refer to Fig. 1, the rigid-flexible circuit board 100 of embodiment of the present invention comprises a flexible circuit board 10 and multiple hard circuit board 20 be stacked and placed on described flexible circuit board 10.
Described flexible circuit board 10 for connect described hard circuit board 20 and between described hard circuit board 20 transmission of electric signals.Described flexible circuit board 10 comprises the kink 10C of a first installation portion 10A and in one end at the other end the second installation portion 10B and between described first installation portion 10A and described second installation portion 10B.Described first installation portion 10A and described second installation portion 10B is for installing described hard circuit board 20, and described kink 10C is the part that described flexible circuit board 10 is exposed to outside described hard circuit board 20.
According to the difference of circuit structure form on described flexible circuit board 10, described flexible circuit board 10 can be one side soft board or double surface soft board, and in present embodiment, described flexible circuit board 10 is double surface soft board.Particularly, described flexible circuit board 10 comprises 13, one, the second internal layer circuit layer that 12, one, the first internal layer circuit layer that a flexible substrate 11, is positioned at described flexible substrate 11 1 side surface is positioned at described flexible substrate 11 opposite side surface and covers the second protective layer 15 that the first protective layer 14 of described first internal layer circuit layer 12 and cover described second internal layer circuit layer 13.Described flexible substrate 11 is made up of insulating material, such as, and polyimides (Polyimide:PI) or PETG (Polythylene terephthalate:PET).Described first internal layer circuit layer 12 and described second internal layer circuit layer 13 adopt high conductivity material to make, and in present embodiment, described first internal layer circuit layer 12 and described second internal layer circuit layer 13 are Copper Foil.Described first protective layer 14 and described second protective layer 15 adopt insulation flexible material to make; be respectively used to protect described first internal layer circuit layer 12 and described second internal layer circuit layer 13 from destruction and pollute; in present embodiment, described first protective layer 14 and described second protective layer 15 are PI, PET or polyester film (Mylar).First glue-line 16 is provided with between described first protective layer 14 and described first internal layer circuit layer 12; be provided with second glue-line 17 between described second protective layer 15 and described second internal layer circuit layer 13, described first protective layer 14 and described second protective layer 15 are fixed on described first internal layer circuit layer 12 and described second internal layer circuit layer 13 surface respectively by described first glue-line 16 and described second glue-line 17.Described flexible substrate 11, described first internal layer circuit layer 12, described second internal layer circuit layer 13, described first protective layer 14, described second protective layer 15, described first glue-line 16 and described second glue-line 17 all run through described first installation portion 10A, described second installation portion 10B and described kink 10C.
Described hard circuit board 20 is used as the part that described rigid-flexible circuit board 100 connects, installs other electronic component (not shown), and according to different connections, installation requirements, described hard circuit board 20 can do quantitative change.In present embodiment, described hard circuit board 20 is two, is arranged at the first installation portion 10A and the second installation portion 10B of described flexible circuit board 10 respectively.Described two hard circuit boards 20 have similar structure, below for be arranged at described first installation portion 10A hard circuit board 20 its concrete structure is described:
Described hard circuit board 20 comprise one be formed on described first protective layer 14 first insulation pressing layer 18 and one be formed on described second protective layer 15 second insulation pressing layer 19.Described first insulation pressing layer 18 and described second insulation pressing layer 19 expose the described kink 10C of described flexible circuit board 10 respectively, in other words, described first insulation pressing layer 18 and described second insulation pressing layer 19 cover the described first installation portion 10A of described flexible circuit board 10 and described second installation portion 10B.Described first insulation pressing layer 18 and described second insulation pressing layer 19 are made up of the enhancing base material being soaked with resin material in advance, and in present embodiment, described resin material is epoxy resin, and described enhancing base material is glass fibre.
Described hard circuit board 20 comprises the second conductive hole 102 that first conductive hole 101 being opened in described first installation portion 10A and are opened in described second installation portion 10B.Described first conductive hole 101 and described second conductive hole 102 are all through to described first internal layer circuit layer 12 and described second internal layer circuit layer 13.According to different demands; described first conductive hole 101 and described second conductive hole 102 can be through hole or blind hole; in present embodiment; described first conductive hole 101 and described second conductive hole 102 are through hole, and it runs through described first insulation pressing layer 18, described first protective layer 14, described first glue-line 16, described first internal layer circuit layer 12, described flexible substrate 11, described second internal layer circuit layer 13, described second glue-line 17, described second protective layer 15 and described second insulation pressing layer 19.The hole wall of described first conductive hole 101 and described second conductive hole 102 is attached with electric conducting material 1031.
Described hard circuit board 20 comprises one and is formed at the second pattern conductive circuit 1033 that the described first insulation first pattern conductive circuit 1032 on pressing layer 18 surface and are formed at described second insulation pressing layer 19.Described first pattern conductive circuit 1032 and described second pattern conductive circuit 1033 are connected with described electric conducting material 1031 respectively.
In present embodiment, the material of described electric conducting material 1031, described first pattern conductive circuit 1032 and described second pattern conductive circuit 1033 is identical, is copper.
Be filled with insulation filling material 104 respectively in described first conductive hole 101 and described second conductive hole 102, described insulation filling material 104 two ends protrude from the surface of described first pattern conductive circuit 1032 and described second pattern conductive circuit 1033 respectively.The two ends end face indent of described insulation filling material 104, forms a depressed part 1041 respectively.In present embodiment, described insulation filling material 104 is photosensitive resin ink.Described first pattern conductive circuit 1032 surface is provided with a first patterning insulation coat 105, and described first patterning insulation coat 105 is parallel to described first pattern conductive circuit 1032 and to protrude the operative tip of described first pattern conductive circuit 1032 concordant with described insulation filling material 104.Described second pattern conductive circuit 1033 surface is provided with a second patterning insulation coat 106, and described second patterning insulation coat 106 is parallel to described second pattern conductive circuit 1033 and to protrude the operative tip of described second pattern conductive circuit 1033 concordant with described insulation filling material 104.In present embodiment, the material of described first patterning insulation coat 105 and described second patterning insulation coat 106 is identical with described insulation filling material 104.
Described hard circuit board 20 also comprise one be formed in described first patterning insulation coat 105 on the first build-up circuit layer 201 and one be formed at described second patterning insulation coat 106 on the second build-up circuit layer 202.Described first build-up circuit layer 201 is electrically connected to described first pattern conductive circuit 1032, and described second build-up circuit layer 2021 is electrically connected to described second pattern conductive circuit 1033.
Described first build-up circuit layer 201 comprises a 3rd insulation pressing layer 21, be pressed on described first pattern conductive circuit 1032 and is arranged at the 3rd pattern conductive circuit 23 that described 3rd insulation first stiffening plate 22 on pressing layer 21 surface and are arranged at described first stiffening plate 22 outer surface.In present embodiment, material and described first pressing layer 18 that insulate of described 3rd insulation pressing layer 21 is identical.Described first stiffening plate 22 is for increasing the intensity of described hard circuit board 20, in present embodiment, the material of described first stiffening plate 22 is epoxy resin board, be appreciated that, according to difference to the demand of the intensity of described hard circuit board 20, the thickness of described first stiffening plate 22, the number of plies and material all can do suitable change, in addition, described first stiffening plate 22 also can be removed, and directly described 3rd pattern conductive circuit 23 is arranged at described 3rd insulation pressing layer 21 surface.Described hard circuit board 20 offers the perforate 24 that runs through described first stiffening plate 22, described 3rd insulation pressing layer 21 and described first patterning insulation coat 105.The madial wall of described perforate 24 is formed with a connecting conductive layer 25, described connecting conductive layer 25 connects described first pattern conductive circuit 1032 and described 3rd pattern conductive circuit 23.Described hard circuit board 20 also comprises the solder mask 26 that covers described 3rd pattern conductive circuit 23 and described connecting conductive layer 25, for the protection of described 3rd pattern conductive circuit 23 and described connecting conductive layer 25.
Described second build-up circuit layer 202 has similar structure with described second build-up circuit layer 201, comprises a 4th insulation pressing layer 27, be pressed on described second pattern conductive circuit 1033 and is arranged at the 4th pattern conductive circuit 29 that second stiffening plate 28 on described 4th insulation pressing layer 27 surface and are arranged at described second stiffening plate 28 outer surface.To adopt between described 4th pattern conductive circuit 29 and described second pattern conductive circuit 1033 and described first pattern conductive circuit 1032 is electrically connected to each other in mode similar between described 3rd pattern conductive circuit 23, no longer describe in detail.
The hard circuit board 20 be arranged on described second installation portion 10B has similar structure with the hard circuit board 20 be arranged on described first installation portion 10A, describes in detail no longer one by one.
Refer to Fig. 2, the Rigid Flex manufacture method of embodiment of the present invention comprises the following steps:
Step S1, see also Fig. 3, a flexible circuit board 10 is provided, described flexible circuit board 10 comprises a first installation portion 10A, a second installation portion 10B and the kink 10C be connected with described first installation portion 10A and the second installation portion 10B, described flexible circuit board 10 comprises a flexible substrate 11, a first internal layer circuit layer 12 being positioned at described flexible substrate 11 1 side surface, a second internal layer circuit layer 13 being positioned at described flexible substrate 11 opposite side surface, one covers the first protective layer 14 of described first internal layer circuit layer 12 and the second protective layer 15 of a described second internal layer circuit layer 13 of covering.First glue-line 16 is provided with between described first protective layer 14 and described first internal layer circuit layer 12; be provided with second glue-line 17 between described second protective layer 15 and described second internal layer circuit layer 13, described first protective layer 14 and described second protective layer 15 are fixed on described first internal layer circuit layer 12 and described second internal layer circuit layer 13 surface respectively by described first glue-line 16 and described second glue-line 17.
Step S2, sees also Fig. 4, in described flexible circuit board 10 both side surface the first insulation pressing layer 18 and the second insulation pressing layer 19 respectively.In present embodiment, described first insulation pressing layer 18 is pressed on described first protective layer 14 surface, and described second insulation pressing layer 19 is pressed on described second protective layer 15 surface.Described first insulation pressing layer 18 and described second insulation pressing layer 19 are made up of the enhancing base material being soaked with resin material in advance, and in present embodiment, described resin material is epoxy resin, and described enhancing base material is glass fibre.After pressing completes, described enhancing base material is also fixed on described first protective layer 14 and described second protective layer 15 surface by described resin material solidification.
Step S3, sees also Fig. 5, offers connecting hole.Described connecting hole can adopt perforating cutter or laser to offer.In present embodiment, the quantity of described connecting hole is two, is respectively the first connecting hole 101a being opened in described first installation portion 10A and the second connecting hole 101b being opened in described second installation portion 10B.According to different demands; described first connecting hole 101a and described second connecting hole 102a can be through hole or blind hole; in present embodiment; described first connecting hole 101a and described second connecting hole 102a is through hole, and it runs through described first insulation pressing layer 18, described first protective layer 14, described first glue-line 16, described first internal layer circuit layer 12, described flexible substrate 11, described second internal layer circuit layer 13, described second glue-line 17, described second protective layer 15 and described second insulation pressing layer 19.
Step S4, sees also Fig. 6, in the hole wall attachment electric conducting material 1031 of described first connecting hole 101a and described second connecting hole 102a, forms the first conductive hole 101 and the second conductive hole 102.
Step S5, forms the first conductive layer 1032a and the second conductive layer 1033a respectively at described first insulation pressing layer 18 and described second insulation pressing layer 19 surface.Described first conductive layer 1032a and described second conductive layer 1033a is electrically connected by described electric conducting material 1031.In present embodiment, described electric conducting material 1031, described first conductive layer 1032a and described second conductive layer 1033a adopt plating mode to be formed.
Step S6, sees also Fig. 7, fills insulation filling material 104 in described connecting hole, and in present embodiment, described insulation filling material 104 is photosensitive resin ink.
Step S7, sees also Fig. 8, to insulate coat 105a and second insulation coat 106a respectively at formation first on described first conductive layer 1032a and described second conductive layer 1033a.Described first insulation coat 105a is parallel to described first conductive layer 1032a and to protrude the operative tip of described first conductive layer 1032a concordant with described insulation filling material 104, and described second insulation coat 106a is parallel to described second conductive layer 1033a and to protrude the operative tip of described second conductive layer 1033a concordant with described insulation filling material 104.In present embodiment, the material of described first insulation coat 105a and described second insulation coat 106a is identical with described insulation filling material 104.
Step S8, sees also Fig. 9, toasts to solidify described insulation filling material 104, described first insulation coat 105a and described second insulation coat 106a.Thickness due to described insulation filling material 104 is greater than described first insulation coat 105a and described second insulation coat 106a, therefore, after hardening, the shrinkage amplitude of described insulation filling material 104 is greater than the shrinkage amplitude of described first insulation coat 105a and described second insulation coat 106a, and described insulation filling material 104 forms a depressed part 1041 respectively relative to described first insulation coat 105a and described second insulation coat 106a.
Step S9, sees also Figure 10, etches described first conductive layer 1032a and described second conductive layer 1033a and forms the first pattern conductive circuit 1032 and the second pattern conductive circuit 1033 respectively.Particularly, in etching process, the mask (not shown) with predetermined pierced pattern is adopted to cover on described first conductive layer 1032a and described second conductive layer 1033a, in described mask, fill etching liquid again to remove the redundance of described first conductive layer 1032a and described second conductive layer 1033a, form described first pattern conductive circuit 1032 and the second pattern conductive circuit 1033.In this enforcement, described first insulation coat 105a and described second insulation coat 106a can serve as described mask, exposure imaging mode is adopted to form pierced pattern respectively at described first insulation coat 105a and described second insulation coat 106a, to form the first patterning insulating coating 105 and the second patterning insulating coating 106, described first patterning insulating coating 105 and described second patterning insulating coating 106 have the pattern identical with described first pattern conductive circuit 1032 and the second pattern conductive circuit 1033 respectively.Above-mentioned production method can save and make mask in addition, after having etched, also can save the step of moving back film simultaneously.
Step S10, please refer to Figure 11,3rd insulation pressing layer 21 and the 4th insulation pressing layer 27 are set respectively at described first patterning insulation coat 105 and described second patterning insulation coat 106 surface, the 3rd insulation pressing layer 21 described in pressing and described 4th insulation pressing layer 27.In present embodiment, the material of described 3rd insulation pressing layer 21 and described 4th insulation pressing layer 27 pressing layer 18 and described second pressing layer 19 that insulate that insulate with described first is respectively identical.
Step S11, please refer to Figure 12, respectively on described 3rd insulation pressing layer 21 and described 4th insulation pressing layer 27, first stiffening plate 22 and second stiffening plate 28 are set, described first stiffening plate 22 is pressed on described 3rd insulation pressing layer 21 surface, and described second stiffening plate 28 is pressed on described 4th insulation pressing layer 27 surface.In present embodiment, described first stiffening plate 22 and described second stiffening plate 28 are epoxy resin board.
Step S12, please refer to Figure 13, on described first stiffening plate 22, offer perforate 24, described perforate 24 runs through described first stiffening plate 22, described 3rd insulation pressing layer 21 and described first patterning insulation coat 105 and extends to described first pattern conductive circuit 1032.
Step S13, please refer to Figure 14, interior side-wall surface in described first stiffening plate 22 surface formation the 3rd pattern conductive circuit 23 and in described perforate 24 forms connecting conductive layer 25, described 3rd pattern conductive circuit 23 is connected with described connecting conductive layer 25, and described connecting conductive layer 25 is connected with described first pattern conductive circuit 1032 simultaneously.In present embodiment, described 3rd pattern conductive circuit 23 and described connecting conductive layer 25 adopt plating mode to be formed.Described 3rd insulation pressing layer 21, described first stiffening plate 22 and described 3rd pattern conductive circuit 23 forms the first build-up circuit layer 201.
Step S14, please refer to Figure 15, is coated with solder mask 26 on described 3rd pattern conductive circuit 23 and described connecting conductive layer 25.
Step S12-S14 only describes the mode of the electrical connection of the generation type of described 3rd pattern conductive circuit 23 and itself and the first pattern conductive circuit 1032, similar method is equally applicable to form the 4th pattern conductive circuit 29 on the second stiffening plate 28, to form the 4th build-up circuit layer 202, be not described in detail.
Step S15, please refer to Figure 16, makes opening with the kink 10C of flexible circuit board described in exposed portion 10.
It should be noted that, in above-mentioned rigid-flexible circuit manufacture method, if only structure hard circuit board need be folded in the side of described flexible circuit board 10, then step S2 is in step S13, described second insulation pressing layer 19 and described second pattern conductive circuit 1032 can omit, described connecting hole can be blind hole, therefore described second patterning insulation coat 106 and described 4th build-up circuit layer 202 can also omit.
In addition, according to the difference to Rigid Flex changing firmness requirements, step S11 can omit, and described perforate 24 is through to described first pattern conductive circuit 1032 from described 3rd insulation pressing layer 21, and described 3rd pattern conductive circuit 23 is directly formed at described 3rd insulation pressing layer 21 surface.
Described rigid-flexible circuit board and preparation method thereof, supplement concordant at the protrusion place feed supplement layer of insulation filling material, therefore, after insulation filling material baking-curing, do not need grinding and directly can carry out next step processing procedure, due to without the need to grinding, the damage of effects on surface coating can be avoided, ensure assembling yield and the stability of Soft Bonding circuit.
Be understandable that, those skilled in the art also can do other change etc. and be used in design of the present invention, as long as it does not depart from technique effect of the present invention in spirit of the present invention.These changes done according to the present invention's spirit, all should be included within the present invention's scope required for protection.
Claims (9)
1. a rigid-flexible circuit board, comprising:
Flexible circuit board, described flexible circuit board comprises installation portion and kink;
Hard circuit board, described hard circuit board comprises:
First, second pressing layer that insulate, first, second insulation pressing layer described is formed at opposing two surfaces of described flexible circuit board installation portion respectively;
First, second pattern conductive circuit, described first patterned circuit is formed on the first insulation pressing layer, and the second patterned circuit is formed on the second insulation pressing layer;
Conductive hole, described conductive hole runs through described flexible circuit board and first, second insulation pressing layer, described conductive hole hole wall is attached with electric conducting material, is filled with insulation filling material in hole, and described conductive hole is electrically connected described flexible circuit board and first, second pattern conductive circuit described;
First, second patterning insulation coat, described first patterning insulation coat covers the first pattern conductive circuit, second patterning insulation coat covers the second pattern conductive circuit, wherein, described first patterning insulation coat has identical pattern with the first pattern conductive circuit, second patterning insulation coat has identical pattern with the second pattern conductive circuit, and the insulate material of coat of the insulation filling material in described conductive hole and first, second patterning described is identical;
First, second build-up circuit layer, described first build-up circuit layer is electrically connected the first pattern conductive circuit, the described second pattern conductive circuit of the second build-up circuit layer electrical connection.
2. rigid-flexible circuit board according to claim 1, is characterized in that: described first build-up circuit layer comprises:
3rd insulation pressing layer, described 3rd insulation pressing layer is pressed on described first patterning insulation coat, and fills up the gap of described first patterning insulation coat and the first pattern conductive circuit;
3rd pattern conductive circuit, described 3rd pattern conductive circuit is formed on described 3rd insulation pressing layer, and is electrically connected described first pattern conductive circuit.
3. rigid-flexible circuit board according to claim 1, is characterized in that: described second build-up circuit layer comprises:
4th insulation pressing layer, described 4th insulation pressing layer is pressed on described second patterning insulation coat, and fills up the gap of described second patterning insulation coat and the second pattern conductive circuit;
4th pattern conductive circuit, described 4th pattern conductive circuit is formed on described second insulation pressing layer, and is electrically connected described second pattern conductive circuit.
4. rigid-flexible circuit board according to claim 1, is characterized in that: described flexible circuit board comprises:
Flexible substrate;
Two internal layer circuit layers, described two internal layer circuit layers are formed at flexible substrate both sides;
Two protective layers, described two protective layers are covered in described two internal layer circuit layers respectively;
Two glue-lines, described two glue-lines bonding described two internal layer circuit layers and two protective layers respectively.
5. rigid-flexible circuit board according to claim 1, is characterized in that: the insulate material of coat of the insulation filling material in described conductive hole and first, second patterning described is identical, is photoresist ink.
6. rigid-flexible circuit board according to claim 1, is characterized in that: first, second insulation coat described covers the part of described conductive hole respectively to conductive hole sunken inside, respectively forms a depressed part.
7. a manufacture method for rigid-flexible circuit board, comprising:
Form first, second insulation pressing layer in opposing two surfaces of flexible circuit board, described flexible circuit board comprises installation portion and kink;
Form connecting hole in the installation portion of described flexible circuit board, described connecting hole runs through described first, second insulation pressing layer and described flexible circuit board, and first, second insulation pressing layer surface attachment described has electric conducting material;
Form conductive hole, in connecting hole hole wall attachment electric conducting material;
Form the first pattern conductive circuit, the first patterning insulation coat on the first insulation pressing layer, form the second pattern conductive circuit, the second patterning insulation coat on the second insulation pressing layer;
Wherein, form first, second patterned circuit and first, the process of the second patterning insulation coat is: the electric conducting material adhered on the first insulating barrier is formed the first insulation coat, the electric conducting material adhered to is formed the second insulation coat for described second insulating barrier, described first, second insulation coat fills up described conductive hole internal clearance, described first, second insulation coat is photosensitive material, first is obtained by image transfer and etching, second patterning insulation coat, again with described first, second patterning insulation coat is etch stop layer, first is obtained by etching described electric conducting material, second patterned circuit,
Form first, second build-up circuit layer, described first build-up circuit layer is electrically connected the first pattern conductive circuit, the described second pattern conductive circuit of the second build-up circuit layer electrical connection;
Form opening to appear the kink of described flexible circuit board, form Rigid Flex.
8. the manufacture method of a kind of rigid-flexible circuit board according to claim 7, is characterized in that: form described first build-up circuit layer and comprise:
Pressing the 3rd insulate pressing layer on described first patterning insulation coat, and fills up the gap of described first patterning insulation coat and the first pattern conductive circuit;
Form the 3rd pattern conductive circuit on described 3rd insulation pressing layer, and be electrically connected described first pattern conductive circuit.
9. the manufacture method of a kind of rigid-flexible circuit board according to claim 7, is characterized in that: described second build-up circuit layer comprises:
Pressing the 4th insulate pressing layer on described second patterning insulation coat, and fills up the gap of described second patterning insulation coat and the second pattern conductive circuit;
Form the 4th pattern conductive circuit on described second insulation pressing layer, and be electrically connected described second pattern conductive circuit.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410002919.4A CN104768318B (en) | 2014-01-06 | 2014-01-06 | Rigid-flexible circuit board and preparation method thereof |
| TW103101687A TWI507100B (en) | 2014-01-06 | 2014-01-16 | Flex-rigid compound printed circuit board and method for manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410002919.4A CN104768318B (en) | 2014-01-06 | 2014-01-06 | Rigid-flexible circuit board and preparation method thereof |
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| Publication Number | Publication Date |
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| CN104768318A true CN104768318A (en) | 2015-07-08 |
| CN104768318B CN104768318B (en) | 2017-08-22 |
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| TW (1) | TWI507100B (en) |
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| CN108762578A (en) * | 2018-06-12 | 2018-11-06 | 信利光电股份有限公司 | A kind of metal grill touch screen and its preparation process |
| CN108932081A (en) * | 2018-09-30 | 2018-12-04 | 信利光电股份有限公司 | A kind of metal grill touch screen and preparation method thereof |
| CN109195312A (en) * | 2018-09-14 | 2019-01-11 | 江西合力泰科技有限公司 | Stiffening plate and the method for improving stiffening plate etching precision |
| CN115483508A (en) * | 2021-05-31 | 2022-12-16 | 华为技术有限公司 | Battery protection plate, battery pack, and electronic apparatus |
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| CN108934130B (en) * | 2017-05-24 | 2020-04-14 | 庆鼎精密电子（淮安）有限公司 | Manufacturing method of rigid-flexible circuit board |
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| CN102137543A (en) * | 2010-01-22 | 2011-07-27 | 揖斐电株式会社 | Flex-rigid wiring board and method for manufacturing the same |
| US20110180306A1 (en) * | 2010-01-22 | 2011-07-28 | Ibiden Co., Ltd. | Flex-rigid wiring board and method for manufacturing the same |
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| CN108762578A (en) * | 2018-06-12 | 2018-11-06 | 信利光电股份有限公司 | A kind of metal grill touch screen and its preparation process |
| CN109195312A (en) * | 2018-09-14 | 2019-01-11 | 江西合力泰科技有限公司 | Stiffening plate and the method for improving stiffening plate etching precision |
| CN109195312B (en) * | 2018-09-14 | 2024-04-09 | 江西合力泰科技有限公司 | Stiffening plate and method for improving etching precision of stiffening plate |
| CN108932081A (en) * | 2018-09-30 | 2018-12-04 | 信利光电股份有限公司 | A kind of metal grill touch screen and preparation method thereof |
| CN115483508A (en) * | 2021-05-31 | 2022-12-16 | 华为技术有限公司 | Battery protection plate, battery pack, and electronic apparatus |
Also Published As
| Publication number | Publication date |
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| CN104768318B (en) | 2017-08-22 |
| TWI507100B (en) | 2015-11-01 |
| TW201528887A (en) | 2015-07-16 |
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