CN201854502U - Flexible circuit board with reinforcing structure - Google Patents
Flexible circuit board with reinforcing structure Download PDFInfo
- Publication number
- CN201854502U CN201854502U CN2010205876372U CN201020587637U CN201854502U CN 201854502 U CN201854502 U CN 201854502U CN 2010205876372 U CN2010205876372 U CN 2010205876372U CN 201020587637 U CN201020587637 U CN 201020587637U CN 201854502 U CN201854502 U CN 201854502U
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- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- reinforcement element
- sheet body
- insulating sheet
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a flexible circuit board with a reinforcing structure, which comprises an insulating sheet body, an electronic part and a reinforcing element, wherein a plurality of conductive circuits and a plurality of earth points are arranged in the insulating sheet body; the two end parts of the insulating sheet body are respectively provided with a plurality of metal pins; a pin of the electronic part penetrates through one surface of the insulating sheet body and is welded on at least one conductive circuit; the reinforcing element is fixed on the other surface of the insulating sheet body and corresponds to the position of the pin of the electronic part; an opening is arranged on the insulating sheet body, is located between the earth points and the reinforcing element, and is filled with soldering tin; the reinforcing element is welded on the insulating sheet body through the surface mounting technology; and the reinforcing element and the earth points are conducted through the soldering tin. As the surface mounting technology is adopted to mount the reinforcing element on the flexible circuit board, the operating time can be shortened and the processing efficiency can be improved; moreover, the flexible circuit board with the reinforcing structure has the advantages of higher reliability, low cost and better bonding effect.
Description
Technical field
The utility model belongs to the manufacturing technology field of flexible circuit board, particularly a kind of flexible circuit board that has the steel disc reinforced structure in the end that is electrically connected pin.
Background technology
Flexible circuit board is generally used for connecting two electronic installations, the signal of telecommunication is linked to each other, usually flexible circuit board all is made by membrane material, therefore thinner thickness is also very soft, therefore with electronic component (as resistance, when electric capacity etc.) being welded on the flexible circuit board, be easy to make flexible circuit board that bending and distortion take place, therefore often need be at the back side of flexible circuit board, it is the material that the other side of the weld zone of electronic component is sticked on steel disc or other inflexibles, this steel disc simultaneously also with the earth terminal conducting of flexible circuit board, play the effect of ground connection and electromagnetic shielding, as Chinese patent 200820155594.3; Sometimes, this steel disc also can be mounted on the earthing position place on the flexible circuit board separately under the situation that does not need mounted with electronic components, play the effect of ground connection and electromagnetic shielding.
Yet in the prior art, steel disc all is to be attached on the leads ends of flexible circuit board by conducting resinl, the course of processing is: the pin place that at first conducting resinl is attached to flexible circuit board, then steel disc is placed on the conducting resinl, carry out pressing by equipment again, at last flexible circuit board is put into the baking oven baking and taken out after 2.5 hours.Except that conducting resinl drawback with high costs, this mode also has the shortcoming that the activity duration is long, power consumption is many.This mode also has a drawback to be: only can the smooth steel disc of machining shape, and the steel disc of, surface irregularity special for some shapes can't pressing and processing, therefore has certain limitation.
Summary of the invention
The purpose of this utility model provides a kind of flexible circuit board with reinforced structure, and it does not utilize conducting resinl just supporting material can be combined on the flexible circuit board.
For achieving the above object, the technical solution adopted in the utility model is: a kind of flexible circuit board with reinforced structure, it comprises: the insulation lamellar body, be laid with many conducting wires and a plurality of earth point in the described insulation lamellar body, the both ends of described insulation lamellar body have a plurality of metal pins respectively; Reinforcement element, the constituent material of described reinforcement element are metal material, and described reinforcement element is fixed on the side surface of described insulation lamellar body; Has opening on the described insulation lamellar body, described opening is between described earth point and described reinforcement element, be filled with scolding tin in the described opening, and described reinforcement element is welded on the described insulation lamellar body by surface mounting technology, is conducted by scolding tin between described reinforcement element and the described earth point.
Preferably, the constituent material of described reinforcement element is stainless steel or aluminium.
Preferably, the material of described scolding tin is a lead-free solder.
Further, the material of described scolding tin is the SAC scolder.
Because technique scheme utilization, the utility model compared with prior art has following advantage: since adopt in the utility model surface mounting technology with the reinforcement component mounter on flexible circuit board, just can finish processing about 6 minutes, can shorten the activity duration, improve working (machining) efficiency; In addition, it is higher to adopt surface mounting technology also to have reliability, follow the advantage of better effects if, and the conductivity of scolding tin is better than conducting resinl, and price is cheaper, has therefore more saved material cost, has saved power consumption, accomplishes energy-saving and emission-reduction.
Description of drawings
Accompanying drawing 1 is the profile of flexible circuit board of the prior art;
Accompanying drawing 2 is the profile of flexible circuit board of the present utility model;
Wherein: 1, insulation lamellar body; 2, conductor layer; 3, earth point; 4, cover layer; 5, reinforcement element; 6, scolding tin; 7, base material; 8, conducting resinl.
Embodiment
Below in conjunction with drawings and Examples the utility model is further described:
Shown in accompanying drawing 2, a kind of flexible circuit board with reinforced structure, it comprises:
Insulation lamellar body 1, described insulation lamellar body 1 comprises base material 7, conductor layer 2, cover layer 4, described conductor layer 2 is formed with many conducting wires and a plurality of earth point 3 in described insulation lamellar body 1, the both ends of described insulation lamellar body 1 have respectively and are used for a plurality of metal pins (not shown) of plugging with electronic equipment;
Determine the welding position of reinforcement element 5 according to the design needs, on the cover layer 4 at place, welding position, offer opening, described opening is between described earth point 3 and described reinforcement element 5, be filled with scolding tin 6 in the described opening, and described reinforcement element 5 is welded on the described insulation lamellar body 1 by surface mounting technology, is conducted by scolding tin 6 between described reinforcement element 5 and the described earth point 3.The material of described scolding tin is preferably lead-free solder, as the SAC scolder.
The course of processing of the present utility model is: at first, select earth point 3 in the zone of predetermined installation reinforcement element 5 on insulation lamellar body 1, the insulating material that covers on the above-mentioned earth point 3 is got rid of the formation opening; Then, in opening place print solder paste; By surface mounting technology reinforcement element 5 is attached on the insulation sheet material 1 again, make the tin cream fusing by Reflow Soldering then, and reinforcement element and the welding of insulation sheet material is fixing, reinforcement element 5 just can pass through scolding tin 6 and earth point 3 conductings like this, thereby plays the effect of ground connection.The whole course of processing can be finished in about about 10 minutes, and efficient is very high.
The foregoing description only is explanation technical conceive of the present utility model and characteristics, and its purpose is to allow the personage who is familiar with this technology can understand content of the present utility model and enforcement according to this, can not limit protection range of the present utility model with this.All equivalences of being done according to the utility model spirit change or modify, and all should be encompassed within the protection range of the present utility model.
Claims (4)
1. flexible circuit board with reinforced structure, it comprises
The insulation lamellar body is laid with many conducting wires and earth point in the described insulation lamellar body, and the both ends of described insulation lamellar body have a plurality of metal pins respectively;
Reinforcement element, the constituent material of described reinforcement element are metal material, and described reinforcement element is fixed on the side surface of described insulation lamellar body;
It is characterized in that: have opening on the described insulation lamellar body, described opening is between described earth point and described reinforcement element, be filled with scolding tin in the described opening, and described reinforcement element is welded on the described insulation lamellar body by surface mounting technology, is conducted by scolding tin between described reinforcement element and the described earth point.
2. the flexible circuit board with reinforced structure according to claim 1 is characterized in that: the constituent material of described reinforcement element is stainless steel or aluminium.
3. the flexible circuit board with reinforced structure according to claim 1 is characterized in that: the material of described scolding tin is a lead-free solder.
4. the flexible circuit board with reinforced structure according to claim 3 is characterized in that: the material of described scolding tin is the SAC scolder.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010205876372U CN201854502U (en) | 2010-11-02 | 2010-11-02 | Flexible circuit board with reinforcing structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010205876372U CN201854502U (en) | 2010-11-02 | 2010-11-02 | Flexible circuit board with reinforcing structure |
Publications (1)
Publication Number | Publication Date |
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CN201854502U true CN201854502U (en) | 2011-06-01 |
Family
ID=44096879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2010205876372U Expired - Fee Related CN201854502U (en) | 2010-11-02 | 2010-11-02 | Flexible circuit board with reinforcing structure |
Country Status (1)
Country | Link |
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CN (1) | CN201854502U (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104661428A (en) * | 2013-11-22 | 2015-05-27 | 上海和辉光电有限公司 | Double-sided flexible circuit board and manufacturing method thereof |
CN105142332A (en) * | 2015-09-18 | 2015-12-09 | 刘炜 | Flexible circuit board possessing conductive reinforcement structure and processing technology thereof |
CN105578720A (en) * | 2015-12-29 | 2016-05-11 | 广东欧珀移动通信有限公司 | Flexible circuit board and mobile terminal |
CN107241860A (en) * | 2017-06-16 | 2017-10-10 | 淳华科技(昆山)有限公司 | Soft printed circuit board reinforcement applying method |
CN111698357A (en) * | 2020-03-27 | 2020-09-22 | 青岛海信移动通信技术股份有限公司 | Mobile terminal |
CN113066727A (en) * | 2021-03-19 | 2021-07-02 | 深圳市汇顶科技股份有限公司 | Chip assembly manufacturing method, chip assembly and electronic equipment |
-
2010
- 2010-11-02 CN CN2010205876372U patent/CN201854502U/en not_active Expired - Fee Related
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104661428A (en) * | 2013-11-22 | 2015-05-27 | 上海和辉光电有限公司 | Double-sided flexible circuit board and manufacturing method thereof |
CN105142332A (en) * | 2015-09-18 | 2015-12-09 | 刘炜 | Flexible circuit board possessing conductive reinforcement structure and processing technology thereof |
CN105142332B (en) * | 2015-09-18 | 2018-03-13 | 刘炜 | A kind of FPC and its processing technology with conductive reinforced structure |
CN105578720A (en) * | 2015-12-29 | 2016-05-11 | 广东欧珀移动通信有限公司 | Flexible circuit board and mobile terminal |
CN105578720B (en) * | 2015-12-29 | 2018-07-06 | 广东欧珀移动通信有限公司 | Flexible PCB and mobile terminal |
US10779401B2 (en) | 2015-12-29 | 2020-09-15 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Flexible printed circuit board and mobile terminal |
CN107241860A (en) * | 2017-06-16 | 2017-10-10 | 淳华科技(昆山)有限公司 | Soft printed circuit board reinforcement applying method |
CN111698357A (en) * | 2020-03-27 | 2020-09-22 | 青岛海信移动通信技术股份有限公司 | Mobile terminal |
CN113066727A (en) * | 2021-03-19 | 2021-07-02 | 深圳市汇顶科技股份有限公司 | Chip assembly manufacturing method, chip assembly and electronic equipment |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110601 Termination date: 20161102 |