CN207604001U - FPC plates and the electronic equipment with the FPC plates - Google Patents
FPC plates and the electronic equipment with the FPC plates Download PDFInfo
- Publication number
- CN207604001U CN207604001U CN201721587940.0U CN201721587940U CN207604001U CN 207604001 U CN207604001 U CN 207604001U CN 201721587940 U CN201721587940 U CN 201721587940U CN 207604001 U CN207604001 U CN 207604001U
- Authority
- CN
- China
- Prior art keywords
- pad
- fpc
- recessed portion
- fpc plates
- substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a kind of FPC plates, including FPC substrates, which is characterized in that the front of the FPC substrates includes electroplate lead wire, connect with the electroplate lead wire and the first pad on FPC substrates；The back side of the FPC substrates includes corresponding second pad in position with first pad；First pad is connected with second pad；First pad includes the first recessed portion through thereon, and second pad includes the second recessed portion through thereon, the third recessed portion for connecting first recessed portion and second recessed portion is provided on the substrate.The FPC plates of the utility model can improve the point tin trickling property of pad；Tin point short circuit problem caused by improving pad point tin welding；Enhance the weld strength between FPC plates and Surface Mounted Device.
Description
【Technical field】
The utility model is related to field of circuit boards, particularly a kind of FPC plates and the electronic equipment with the FPC plates.
【Background technology】
It is with flexible insulation base that flexible PCB (Flexible Printed Circuit Board), which is also known as " soft board ",
Printed circuit made of material has the advantages that many rigid printed circuit boards do not have.In addition, flexible print circuit board has list
Face, two-sided and multi-layer board point, mainly using polyimides or mylar as base material, the material thermal resistance is high, dimensional stability
Good, the cover film with having mechanical protection and good electrical insulation performance concurrently forms final products by compacting.With general circuit plate
It compares, FPC plates have height reliability, and excellent pliability has high, the light-weight and thin thickness characteristic of Distribution density, extensively
In the general connection applied to electronic device.
Traditional FPC designs and manufacturing field, when the FPC substrate sides of flexible circuit board have electronic device or structure device
It, can be at the back side of FPC substrates by joint adhesive lamination reinforcement piece, to increase FPC hardness and planarization, convenient for welding during part.Mesh
The preceding supporting material mainly used has：Polyimides (Polyimide, initialism PI), epoxy glass cloth laminated board (FR 4)
Or the metal reinforcement of steel disc, aluminium flake etc., but mainly plane supporting material.Existing FPC by metal pad with for example by
Other functional module groups of words device etc. are connected, and are welded together FPC and receiver by way of tin, but existing pad
Structure be easy to cause tin point short circuit problem, influences product function, and influence making for FPC panel products there are spot welding trickling property is poor
Use the service life.
Therefore, it is necessary to provide a kind of new FPC plates.
【Utility model content】
To solve the above-mentioned problems, the utility model provides a kind of FPC plates, including FPC substrates, which is characterized in that
The front of the FPC substrates includes electroplate lead wire, connect with the electroplate lead wire and the first pad on FPC substrates；It is described
The back side of FPC substrates includes corresponding second pad in position with first pad；First pad and the described second weldering
Disk is connected；First pad includes the first recessed portion through thereon, and second pad is included through second thereon
Recessed portion is provided with the third recessed portion for connecting first recessed portion and second recessed portion on the substrate.
Preferably, positive throwing of the outer contour of first recessed portion and the third recessed portion on second pad
Outer profile of the shadow with second recessed portion overlaps.
Preferably, the front of the FPC substrates further includes and the spaced third pad of first pad.
Preferably, the back side of the FPC substrates includes corresponding 4th pad in position with the third pad.
Preferably, first recessed portion, the second recessed portion, third recessed portion inner wall include the coat of metal.
Preferably, the coat of metal includes copper.
The utility model additionally provides a kind of electronic equipment, including above-mentioned FPC plates and a Surface Mounted Device, the FPC
The positive pad of substrate is welded together with the Surface Mounted Device by way of tin welding.
The beneficial effects of the utility model are：The FPC plates of the utility model can fully increase the trickling area of scolding tin；It protects
The bonding area of pad and Surface Mounted Device has been demonstrate,proved, has thereby enhanced the weld strength between pad and Surface Mounted Device；
Effectively prevent tin point short circuit problem；Reduce the fraction defective of product；Product function is improved, so as to extend FPC panel products
Service life..
【Description of the drawings】
Fig. 1 is the positive structure diagram of the FPC plates of the prior art；
Fig. 2 is the positive structure diagram of the FPC plates of the utility model；
Fig. 3 is the structure diagram at the back side of the FPC plates of the utility model.
【Specific embodiment】
The utility model is described in further detail below by specific embodiment combination Fig. 1, Fig. 2 and Fig. 3, so as to
The advantages of better understood when the embodiment of the utility model and its various aspects.Below in an example, following tool is provided
The purpose of body embodiment is easy for becoming apparent from thorough explanation rather than to the utility model to the content of the utility model
Limitation.
With reference to Fig. 1, existing FPC plates are connected with other functional module groups of such as receiver etc. by metal pad, passed through
The mode of point tin welds together FPC and receiver.The FPC plates include FPC substrates, which includes 10 He of FPC main bodys
The connecting place of the FPC ends 20 being connected with the FPC main bodys 10, FPC main bodys 10 and FPC ends 20 includes rounded corner, wherein, FPC
End 20 is included positioned at positive first pad 30 and third pad 40 and the second pad and the 4th pad positioned at the back side, the
One pad 30 and third pad 40 are pasted as the tie point of electronic circuit and Surface Mounted Device in FPC plates for face of weld
Surface Mounted Device is electrically connected to the electronic circuit in FPC plates by arrangement.
As Figure 2-3, the utility model provides a kind of flexible printed circuit board (FPC), which includes FPC substrates,
The FPC substrates include FPC main bodys 10 and the FPC ends 20 being connected with the FPC main bodys 10, wherein, FPC main bodys 10 and FPC ends
20 connecting place includes rounded corner；FPC ends 20 include be located at positive first pad 30 of FPC plates and third pad 40, first
Pad 30 and third pad 40 are for face of weld Mounted Device, i.e., in the positive pad and Surface Mounted Device of FPC substrates
Welded together by way of tin welding.In the present embodiment, Surface Mounted Device is receiver.In addition, FPC substrates
Multiple through holes are further included, these through holes are distributed in the different location of FPC plates with purposes according to actual needs.
Specifically, the front of FPC substrates includes electroplate lead wire, is connect with electroplate lead wire and positioned at the first weldering of FPC ends
Disk 30 and third pad 40, wherein, the first pad 30 and third pad 40 are arranged on the two side areas of FPC ends 20；FPC substrates
The back side include and corresponding second pad 30 ' in position of the first pad 30 and third pad 40 and the 4th pad 40 '；First
Pad 30 and third pad 40 are connected, and shape is corresponding with the second pad 30 ' and the 4th pad 40 ' respectively；First weldering
Disk 30 includes the first recessed portion 301 through thereon, and the second pad 30 ' is including running through the second recessed portion 301 ' thereon, substrate
On be provided with the third recessed portion (not shown) for connecting first recessed portion 301 and second recessed portion 301 '.
In the present embodiment, the outer contour of the first recessed portion 301 and third recessed portion on the second pad 30 ' just
It projects the outer profile with the second recessed portion 301 ' to overlap, i.e. the first recessed portion 301, the second recessed portion 301 ', third recessed portion
Shape it is identical and penetrate through.
It should be noted that the first pad 30 and third pad 40 can be different, and the pad on the front of FPC substrates
Quantity and position are without being limited thereto, and above-mentioned these are only used as preferred example, it is impossible to be understood as the restriction to the utility model.Cause
This, is carried out the explanation of pad structure for example with the first pad 30 and the second pad 30 ', is omitted to third pad 40 and the 4th
The explanation of pad 40 '.
In the present embodiment, the first pad 30 and the second pad 30 ' are located at the front and back of FPC substrates respectively, the
One pad 30 and the second pad 30 ' are including respectively including the first recessed portion 301 and the second recessed portion 301 ', first recessed portion
301 and second recessed portion 301 ' be separately positioned on the edge of the first pad 30 and the second pad 30 ' so that pad after molding is big
It causes to be in hook-shaped, but not limited to this, can also be other shapes.
In the present embodiment, the inner wall of the first recessed portion 301, the second recessed portion 301 ' and third recessed portion includes metal
Coating, which includes copper, it is also possible to include other metals of gold, silver etc..
In addition, the area of the first pad 30 and the second pad 30 ' is less than the area of existing pad, and first pad
30th, the hook formation that the second pad 30 ' and the FPC substrates being clipped between the first pad 30 and the second pad 30 ' are formed fully increases
The big trickling area of scolding tin, does not easily cause tin point short circuit problem, therefore improve a tin trickling property.In a soldering termination process
In, due to fully increasing the trickling area of scolding tin, so scolding tin can fully be covered with entire pad by the notch section of pad,
It ensure that the bonding area of pad and Surface Mounted Device, and it is strong to enhance the welding between pad and Surface Mounted Device
Degree, therefore product function is improved, so as to extend the service life of FPC panel products.In addition, the pad structure of the utility model
Also effectively prevent tin point short circuit problem.
It should be noted that the pad of the utility model can be naked copper be coated with or doped with such as gold, silver, copper, iron,
The electric conductor of at least one of tin, aluminium and lead conductive metallic material can specifically be formed by traditional approach such as chemical etchings.
The utility model additionally provides a kind of electronic equipment with above-mentioned FPC plates, and electronic equipment further includes surface patch
Arrangement, the positive pad of FPC substrates are welded together with Surface Mounted Device by way of tin welding.
Compared with prior art, the FPC plates of the utility model can fully increase the trickling area of scolding tin, effectively prevent
Tin point short circuit problem, and ensure that the bonding area of pad and Surface Mounted Device, thereby enhance pad and surface mount
Weld strength between component；Reduce the fraction defective of product；Product function is improved, so as to extend making for FPC panel products
Use the service life.
It should be noted here that for those of ordinary skill in the art, design is created not departing from the utility model
Under the premise of, various modifications and variations can be made, but these belong to the scope of protection of the utility model.
Claims (7)
1. a kind of FPC plates, including FPC substrates, which is characterized in that the front of the FPC substrates includes electroplate lead wire and the electricity
Plate lead connection and the first pad on FPC substrates；The back side of the FPC substrates includes the position phase with first pad
Corresponding second pad；First pad is connected with second pad；First pad is included through the thereon
One recessed portion, second pad include the second recessed portion through thereon, and it is recessed that connection described first is provided on the substrate
The third recessed portion of concave portion and second recessed portion.
2. FPC plates according to claim 1, which is characterized in that first recessed portion and the third recessed portion it is outer
Outer profile of orthographic projection of the contour line on second pad with second recessed portion overlaps.
3. FPC plates according to claim 2, which is characterized in that the front of the FPC substrates further includes and the described first weldering
The spaced third pad of disk.
4. FPC plates according to claim 3, which is characterized in that the back side of the FPC substrates includes and the third pad
Corresponding 4th pad in position.
5. FPC plates according to claim 2, which is characterized in that first recessed portion, the second recessed portion, third recess
The inner wall in portion includes the coat of metal.
6. FPC plates according to claim 5, which is characterized in that the coat of metal includes copper.
7. a kind of electronic equipment, including claim 1-6 any one of them FPC plates, which is characterized in that further include surface patch
Arrangement, the positive pad of the FPC substrates are welded together with the Surface Mounted Device by way of tin welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721587940.0U CN207604001U (en) | 2017-11-23 | 2017-11-23 | FPC plates and the electronic equipment with the FPC plates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721587940.0U CN207604001U (en) | 2017-11-23 | 2017-11-23 | FPC plates and the electronic equipment with the FPC plates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207604001U true CN207604001U (en) | 2018-07-10 |
Family
ID=62760961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721587940.0U Expired - Fee Related CN207604001U (en) | 2017-11-23 | 2017-11-23 | FPC plates and the electronic equipment with the FPC plates |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207604001U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021134402A1 (en) * | 2019-12-31 | 2021-07-08 | 瑞声声学科技(深圳)有限公司 | Conductive connector |
-
2017
- 2017-11-23 CN CN201721587940.0U patent/CN207604001U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021134402A1 (en) * | 2019-12-31 | 2021-07-08 | 瑞声声学科技(深圳)有限公司 | Conductive connector |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180710 Termination date: 20211123 |