CN106341942A - Circuit board of quick-charging battery - Google Patents
Circuit board of quick-charging battery Download PDFInfo
- Publication number
- CN106341942A CN106341942A CN201611035866.1A CN201611035866A CN106341942A CN 106341942 A CN106341942 A CN 106341942A CN 201611035866 A CN201611035866 A CN 201611035866A CN 106341942 A CN106341942 A CN 106341942A
- Authority
- CN
- China
- Prior art keywords
- copper
- thickness
- microns
- plate
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 98
- 239000010949 copper Substances 0.000 claims abstract description 54
- 229910052802 copper Inorganic materials 0.000 claims abstract description 54
- 239000011889 copper foil Substances 0.000 claims abstract description 44
- 230000002787 reinforcement Effects 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 239000000853 adhesive Substances 0.000 claims description 30
- 230000001070 adhesive effect Effects 0.000 claims description 30
- 210000002469 basement membrane Anatomy 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 229910000906 Bronze Inorganic materials 0.000 claims 1
- 239000010974 bronze Substances 0.000 claims 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 238000005452 bending Methods 0.000 abstract description 3
- 230000003014 reinforcing effect Effects 0.000 abstract 2
- 239000012528 membrane Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000007747 plating Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Secondary Cells (AREA)
Abstract
The invention discloses a circuit board of a quick-charging battery. The circuit board comprises a PCB substrate, a first reinforcement plate and a second reinforcement plate. The PCB substrate consists of a bending part, a first reinforcing part and a second reinforcing part; a first coverage film, a first copper plated layer, a first copper foil layer, a base membrane, a second copper foil layer and a second copper plated layer are arranged on the PCB substrate successively from top to bottom; and the lower surface of the second copper plated layer of the bending part is plated with a second coverage film. The sum of the thicknesses of the first copper plated layer and the first copper foil layer is 38 microns; and the sum of the thicknesses of the second copper plated layer and second first copper foil layer is 38 microns. According to the invention, the thickness of the copper-clad plate is 38 microns, so that the internal resistance requirement of the circuit board of the quick-charging battery can be met after checking; because of reduction of the thickness of the copper-clad plate, the reinforcement plates are fixed at the two end portions of the circuit board to enhance the strength of the circuit board, so that the strength requirement of the circuit board is met.
Description
Technical field
The present invention relates to pcb production technical field, more particularly, to a kind of circuit board of quick charging battery.
Background technology
Circuit board is pcb (printed circuit board, printed circuit board), the thickness meeting of the copper-clad plate of its substrate
The internal resistance of impact circuit board, wherein, copper-clad plate includes copper foil layer and the copper plate electroplated on copper foil layer, and the thickness of copper-clad plate refers to
Copper foil layer and copper plate thickness sum.
The pcb of different application, the requirement of the thickness of its copper-clad plate to substrate differs, and the thickness of existing copper-clad plate is general
Between 0.05 millimeter to 3.2 mm of thickness.The thickness of copper-clad plate is excessive, undoubtedly can increase production cost, the thickness of copper-clad plate
Too small, the intensity of circuit board cannot meet requirement.
The internal resistance requirement of the circuit board of quick charging battery is higher, and it requires the thickness of copper-clad plate sufficiently small, but existing minimum
The copper-clad plate of thickness, as copper-clad plate are that the internal resistance that still cannot meet the circuit board of quick charging battery when 0.05 requires.
Content of the invention
It is an object of the invention to provide a kind of circuit board of quick charging battery, to solve above technical problem.
For reaching this purpose, the present invention employs the following technical solutions:
A kind of circuit board of quick charging battery, including pcb substrate, the first stiffening plate and the second stiffening plate；Described pcb substrate bag
Include the kink in the middle of described pcb substrate, and the first reinforcement part and the second reinforcement being located at described pcb substrate two ends
Portion, described kink, described first reinforcement part and described second reinforcement part are integrally formed；Described first stiffening plate is fixed on described
The upper surface of the first reinforcement part；Described second stiffening plate is fixed on the upper surface of described second reinforcement part；
Described pcb substrate be disposed with from top to bottom the first cover layer, the first copper plate, the first copper foil layer, basement membrane,
Two copper foil layers and the second copper plate；The lower surface in the pad pasting area of described second copper plate is coated with the second cover layer；Described second
Other regions not covering described second cover layer of the lower surface of copper plate are coated with solder mask；Wherein, described second plating
The pad pasting area of layers of copper is the lower surface of described second copper plate of described kink；
The thickness sum of described first copper plate and described first copper foil layer is 38 microns；Described second copper plate and described
The thickness sum of the second copper foil layer is 38 microns.
Preferably, the thickness of described first copper plate and described second copper plate is equal, is 13 microns；
The thickness of described first copper foil layer and described second copper foil layer is equal, is 25 microns.
Preferably, described first copper foil layer and described second copper foil layer are electrolytic copper foil；
The upper surface of described first copper foil layer is electroplate with described first copper plate；The lower surface plating of described second copper foil layer
There is described second copper plate.
Preferably, described first cover layer includes the first cover layer and the first adhesive linkage；Described second cover layer includes
Second cover layer and the second adhesive linkage；
The thickness of described first cover layer and described second cover layer is equal, is 12.5 microns；Described first glues
Connect layer and the thickness of described second adhesive linkage is equal, be 30 microns.
Preferably, described first stiffening plate includes fr4 stiffening plate and the 3rd adhesive linkage；Described second stiffening plate includes pi and mends
Strong plate and the 4th adhesive linkage；
The thickness of described fr4 stiffening plate is 600 microns；The thickness of described pi stiffening plate is 200 microns；
The thickness of described 3rd adhesive linkage and described 4th adhesive linkage is equal, is 25 microns.
Preferably, described first adhesive linkage, the thickness of described second adhesive linkage are 30 microns.
Preferably, described basement membrane is adopted as pi film, and its thickness is 20 microns.
Preferably, the thickness of described solder mask is 30 microns.
Beneficial effects of the present invention: the thickness of the copper-clad plate of the present embodiment adopts 38 microns, can meet after inspection and fill soon
The internal resistance of the circuit board of battery requires, and due to reducing the thickness of copper-clad plate, therefore fixes a benefit respectively at the both ends of circuit board
Strong plate with the intensity of intensifier circuit plate, to meet the intensity requirement of circuit board.
Brief description
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
Have technology description in required use accompanying drawing be briefly described it should be apparent that, drawings in the following description be only this
Some embodiments of invention, for those of ordinary skill in the art, without having to pay creative labor, also may be used
So that other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is a kind of overlooking structure figure of the circuit board of quick charging battery provided in an embodiment of the present invention.
Fig. 2 is a kind of side block diagram of the circuit board of quick charging battery provided in an embodiment of the present invention.
In figure:
10th, pcb substrate；11st, kink；12nd, the first reinforcement part；13rd, the second reinforcement part；14th, basement membrane；151st, the first Copper Foil
Layer；152nd, the second copper foil layer；161st, the first copper plate；162nd, the second copper plate；1621st, pad pasting area；17th, the first cover layer；
171st, the first cover layer；172nd, the first adhesive linkage；18th, the second cover layer；181st, the second cover layer；182nd, the second bonding
Layer；19th, welding resistance oil；20th, the first stiffening plate；21st, fr4 stiffening plate；22nd, the 3rd adhesive linkage；30th, the second stiffening plate；31st, pi reinforcement
Plate；32nd, the 4th adhesive linkage.
Specific embodiment
For enabling the goal of the invention of the present invention, feature, advantage more obvious and understandable, below in conjunction with the present invention
Accompanying drawing in embodiment, is clearly and completely described it is clear that disclosed below to the technical scheme in the embodiment of the present invention
Embodiment be only a part of embodiment of the present invention, and not all embodiment.Based on the embodiment in the present invention, this area
All other embodiment that those of ordinary skill is obtained under the premise of not making creative work, broadly falls into present invention protection
Scope.
Further illustrate technical scheme below in conjunction with the accompanying drawings and by specific embodiment.
Refer to Fig. 1, Fig. 1 is a kind of overlooking structure figure of the circuit board of quick charging battery provided in an embodiment of the present invention.
This circuit board includes pcb substrate 10, the first stiffening plate 20 and the second stiffening plate 30.
, the pcb substrate 10 of this circuit board includes the present embodiment taking the circuit board of a quick charging battery that I takes charge of production as a example
First reinforcement part 12, kink 11 and the second reinforcement part 13, kink 11, the first reinforcement part 12 become with the second reinforcement part 13 one
Type.
It should be noted that the circuit board described in the embodiment of the present invention has a kink 11, this kink 11 is in bending
Shape, but should not be construed as limitation of the invention, kink 11 can also be other shapes, and it need not be mended on circuit board one
Strong part.
Specifically, the first stiffening plate 20 is fixed on the upper surface of the first reinforcement part 12；Second stiffening plate 30 is fixed on second
The upper surface of reinforcement part 13.
Please continue to refer to Fig. 2, Fig. 2 is a kind of side-looking structure of the circuit board of quick charging battery provided in an embodiment of the present invention
Figure.
Pcb substrate 10 be disposed with from top to bottom the first cover layer 17, the first copper plate 161, the first copper foil layer 151,
Basement membrane 14, the second copper foil layer 152 and the second copper plate 162；The lower surface of second copper plate 162 in kink 11 region, that is, paste
The lower surface in film area 1621 is coated with the second cover layer 18；The lower surface of the second copper plate 162 be not covered with the second cover layer
18 other regions are coated with solder mask 19.
More specifically, the thickness sum of the first copper plate 161 and the first copper foil layer 151 is 38 microns；Second copper plate 162
It is 38 microns with the thickness sum of the second copper foil layer 152.After testing, when the thickness of copper-clad plate need to be 38 microns, its internal resistance
The internal resistance demand of quick charging battery can be met, and carry out after reinforcement, not interfering with the intensity of circuit board through stiffening plate, therefore copper-clad plate
Thickness to select 38 microns be a preferably embodiment, wherein, copper-clad plate refers to copper plate and this two-layer of copper foil layer.
Specifically, the thickness of the first copper plate 161 and the second copper plate 162 is equal, is 13 microns；First copper foil layer
151 and second copper foil layer 152 thickness equal, be 25 microns.
In the present embodiment, the first copper foil layer 151 and the second copper foil layer 152 are electrolytic copper foil.The upper table of the first copper foil layer 151
Face is electroplate with the first copper plate 161；The lower surface of the second copper foil layer 152 is electroplate with the second copper plate 162.
Using copper plate and the copper foil layer of same shape, can conveniently process；The thickness of copper-clad plate is defined as 38 microns
When, after testing, when the thickness of copper plate is between 13-20, the electrical property of pcb substrate 10 is preferable.
Optimum, the thickness of the first copper plate 161 and the second copper plate 162 is 13 microns.Because copper plate is to pass through
It is plated on copper foil layer, therefore thickness of coated copper layer selection is excessive, the time of plating can be increased, affect production efficiency, right through testing
The thickness of the first copper plate 161 and the second copper plate 162 is 13 microns to ratio, compares the first copper plate 161 and the second copper plate
162 thickness is 20 microns, and electroplating efficiency improves 30%, and production efficiency is significantly improved.
Specifically, the first cover layer 17 includes the first cover layer 171 and the first adhesive linkage 172；Second cover layer 18 wraps
Include the second cover layer 181 and the second adhesive linkage 182.
The thickness of the first cover layer 171 and the second cover layer 181 is equal, is 12.5 microns；First adhesive linkage 172
Equal with the thickness of the second adhesive linkage 182, it is 30 microns.
First cover layer 171 and the second cover layer 181 all using pi (polyimide, polyimides) film, using phase
The cover layer of stack pile same size, can conveniently produce, and reduce the wrong probability of patch.
Preferably, the first stiffening plate 20 includes fr4 stiffening plate 21 and the 3rd adhesive linkage 22；Second stiffening plate 30 includes pi and mends
Strong plate 31 and the 4th adhesive linkage 32.Wherein, the thickness of fr4 stiffening plate 21 is 600 microns；The thickness of pi stiffening plate 31 is micro- for 200
Rice；The thickness of the 3rd adhesive linkage 22 and the 4th adhesive linkage 32 is equal, is 25 microns.
Zones of different on the circuit board of battery needs the stiffening plate of different qualities to carry out reinforcement, and in the present embodiment, fr4 mends
Strong plate 21 also known as glass mat, its durability is good, curved intensity is good；Pi stiffening plate 31 price is high, but its flame resistance is good.Fr4 mends
The thickness of strong plate 21 is 600 microns, and the thickness of pi stiffening plate 31 is 200 microns, is just met for intensity and the size requirements of product.
Preferably, basement membrane 14 is adopted as pi film, and its thickness is 20 microns.
Preferably, the thickness of described solder mask is 30 microns.
In description of the invention it is to be understood that term " on ", the orientation of instruction such as D score or position relationship be based on
Orientation shown in the drawings or position relationship, are for only for ease of the description present invention and simplify description, rather than instruction or hint institute
The device referring to or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to this
Bright restriction.It should be noted that the present embodiment is mainly on the basis of Fig. 2 to the explanation in orientation or description.
The above, above example only in order to technical scheme to be described, is not intended to limit；Although with reference to front
State embodiment the present invention has been described in detail, it will be understood by those within the art that: it still can be to front
State the technical scheme described in each embodiment to modify, or equivalent is carried out to wherein some technical characteristics；And these
Modification or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (8)
1. a kind of circuit board of quick charging battery is it is characterised in that include pcb substrate, the first stiffening plate and the second stiffening plate；Described
Pcb substrate includes the kink in the middle of the described pcb substrate, and be located at described pcb substrate two ends the first reinforcement part and
Second reinforcement part, described kink, described first reinforcement part and described second reinforcement part are integrally formed；Described first stiffening plate is solid
Upper surface due to described first reinforcement part；Described second stiffening plate is fixed on the upper surface of described second reinforcement part；
Described pcb substrate is disposed with the first cover layer, the first copper plate, the first copper foil layer, basement membrane, the second bronze medal from top to bottom
Layers of foil and the second copper plate；The lower surface in the pad pasting area of described second copper plate is coated with the second cover layer；Described second copper facing
Other regions not covering described second cover layer of the lower surface of layer are coated with solder mask；Wherein, described second copper plate
Pad pasting area be described kink described second copper plate lower surface；
The thickness sum of described first copper plate and described first copper foil layer is 38 microns；Described second copper plate and described second
The thickness sum of copper foil layer is 38 microns.
2. circuit board according to claim 1 is it is characterised in that the thickness of described first copper plate and described second copper plate
Degree is equal, is 13 microns；
The thickness of described first copper foil layer and described second copper foil layer is equal, is 25 microns.
3. circuit board according to claim 2 is it is characterised in that described first copper foil layer and described second copper foil layer are electricity
Solution Copper Foil；
The upper surface of described first copper foil layer is electroplate with described first copper plate；The lower surface of described second copper foil layer is electroplated
State the second copper plate.
4. circuit board according to claim 3 is it is characterised in that described first cover layer includes the first cover layer and
One adhesive linkage；Described second cover layer includes the second cover layer and the second adhesive linkage；
The thickness of described first cover layer and described second cover layer is equal, is 12.5 microns；Described first adhesive linkage
Equal with the thickness of described second adhesive linkage, it is 30 microns.
5. circuit board according to claim 4 is it is characterised in that described first stiffening plate includes fr4 stiffening plate and the 3rd
Adhesive linkage；Described second stiffening plate includes pi stiffening plate and the 4th adhesive linkage；
The thickness of described fr4 stiffening plate is 600 microns；The thickness of described pi stiffening plate is 200 microns；
The thickness of described 3rd adhesive linkage and described 4th adhesive linkage is equal, is 25 microns.
6. circuit board according to claim 5 is it is characterised in that the thickness of described first adhesive linkage, described second adhesive linkage
Degree is 30 microns.
7. it is characterised in that described basement membrane is adopted as pi film, its thickness is 20 microns to circuit board according to claim 6.
8. circuit board according to claim 7 is it is characterised in that the thickness of described solder mask is 30 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611035866.1A CN106341942A (en) | 2016-11-18 | 2016-11-18 | Circuit board of quick-charging battery |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611035866.1A CN106341942A (en) | 2016-11-18 | 2016-11-18 | Circuit board of quick-charging battery |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106341942A true CN106341942A (en) | 2017-01-18 |
Family
ID=57841580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611035866.1A Pending CN106341942A (en) | 2016-11-18 | 2016-11-18 | Circuit board of quick-charging battery |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106341942A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110602889A (en) * | 2019-10-21 | 2019-12-20 | 深圳市中基自动化有限公司 | Contact circuit board process for lithium battery formation |
| CN112040657A (en) * | 2020-09-22 | 2020-12-04 | 深圳崇达多层线路板有限公司 | Manufacturing method of special-shaped step plate |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003204130A (en) * | 2002-01-07 | 2003-07-18 | Achilles Corp | Flexible printed circuit board |
| WO2010147059A1 (en) * | 2009-06-18 | 2010-12-23 | Jx日鉱日石金属株式会社 | Electronic circuit, method for forming same, and copper-clad laminate for electronic circuit formation |
| CN202425191U (en) * | 2012-01-12 | 2012-09-05 | 深圳市爱升精密电路科技有限公司 | Thick-gold electro-plated battery flexible circuit board |
| CN202435708U (en) * | 2011-12-16 | 2012-09-12 | 欣兴同泰科技（昆山）有限公司 | Flexible circuit board |
| CN203984772U (en) * | 2014-01-23 | 2014-12-03 | 扬州华盟电子有限公司 | A kind of keyboard of notebook computer switching flex circuit application |
| CN204069481U (en) * | 2014-07-18 | 2014-12-31 | 深圳市爱升精密电路科技有限公司 | A kind of battery protection wiring board with overcoat and solder mask structure |
| CN105636333A (en) * | 2015-12-29 | 2016-06-01 | 广东欧珀移动通信有限公司 | Flexible printed circuit board and mobile terminal |
| CN105704946A (en) * | 2016-03-22 | 2016-06-22 | 深圳崇达多层线路板有限公司 | Fabrication method for printed circuit board with golden finger coated with gold on four surfaces |
| CN206164971U (en) * | 2016-11-18 | 2017-05-10 | 东莞市五株电子科技有限公司 | Circuit board of fast rechargable battery |
-
2016
- 2016-11-18 CN CN201611035866.1A patent/CN106341942A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003204130A (en) * | 2002-01-07 | 2003-07-18 | Achilles Corp | Flexible printed circuit board |
| WO2010147059A1 (en) * | 2009-06-18 | 2010-12-23 | Jx日鉱日石金属株式会社 | Electronic circuit, method for forming same, and copper-clad laminate for electronic circuit formation |
| CN202435708U (en) * | 2011-12-16 | 2012-09-12 | 欣兴同泰科技（昆山）有限公司 | Flexible circuit board |
| CN202425191U (en) * | 2012-01-12 | 2012-09-05 | 深圳市爱升精密电路科技有限公司 | Thick-gold electro-plated battery flexible circuit board |
| CN203984772U (en) * | 2014-01-23 | 2014-12-03 | 扬州华盟电子有限公司 | A kind of keyboard of notebook computer switching flex circuit application |
| CN204069481U (en) * | 2014-07-18 | 2014-12-31 | 深圳市爱升精密电路科技有限公司 | A kind of battery protection wiring board with overcoat and solder mask structure |
| CN105636333A (en) * | 2015-12-29 | 2016-06-01 | 广东欧珀移动通信有限公司 | Flexible printed circuit board and mobile terminal |
| CN105704946A (en) * | 2016-03-22 | 2016-06-22 | 深圳崇达多层线路板有限公司 | Fabrication method for printed circuit board with golden finger coated with gold on four surfaces |
| CN206164971U (en) * | 2016-11-18 | 2017-05-10 | 东莞市五株电子科技有限公司 | Circuit board of fast rechargable battery |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110602889A (en) * | 2019-10-21 | 2019-12-20 | 深圳市中基自动化有限公司 | Contact circuit board process for lithium battery formation |
| CN112040657A (en) * | 2020-09-22 | 2020-12-04 | 深圳崇达多层线路板有限公司 | Manufacturing method of special-shaped step plate |
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Application publication date: 20170118 |
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