KR102395081B1 - Thin film type antenna capable of one-side or double-side contact and method for manufacturing the same - Google Patents

Abstract

The present invention relates to a thin film-type antenna including a flexible printed circuit board (FPCB) and a manufacturing method thereof. More specifically, the thin film-type antenna greatly reduces the number of layers by not using a flexible cupper clad laminate (FCCL).

Description

Thin film type antenna capable of single-sided or double-sided contact and manufacturing method thereof

The present invention relates to a thin film type antenna including a flexible printed circuit board (FPCB) and a method for manufacturing the same, and more particularly, the thin film type antenna includes a flexible cupper clad laminate (FCCL). ) is not used, so the number of layers is significantly reduced.

In general, PCB, which is an abbreviation of Printed circuit board, is called a printed circuit board. It is a board that forms a conductor circuit on the surface or inside of an insulating board to connect components based on the circuit design. Of course, it plays a role of electrically connecting parts to each other and mechanically fixing parts other than the electrical connection function of parts.

Currently, PCBs are used in various electronic products, and in response to the recent demand for miniaturization and weight reduction of electronic products, three-dimensional wiring is possible among the types of PCBs, so miniaturization and weight reduction are possible, and it is strong in heat, there is no wiring error, and assembly is easy. Good and reliable FPCB (Flexible Printed Circuit Board) is widely used as a core part of all electronic products such as cameras, computers, mobile phones, video & audio equipment, printer satellite equipment, military equipment and medical equipment.

Among them, the existing FPCB used as an antenna for cell phones, pads, satellite equipment and military equipment, etc. has a problem in that the copper foil is covered with an insulator, so the width of the copper foil serving as an antenna is limited.

In addition, the conventionally used FPCB forms a pattern through etching using Flexible Cupper Clad Laminate (FCCL), and another film processed thereon is hot-pressed with a coverlay (coverlay). The product is manufactured by laminating through a hot press process.

However, the FCCL as described above has a problem of high cost as a raw material because it is produced through a hot press process after laminating copper on a polyimide (PI)-based film. In addition, in the case of an antenna that requires double-sided contact, a more expensive double-sided FCCL must be used compared to a single-sided FCCL, and a drill process and a copper plating process are added to form a via hole, which increases the price. may occur. In addition, due to the tension of the coverlay film applied to the outer layer to prevent corrosion of the pattern, there is a problem in that it is bent and lifted when attached.

Accordingly, the present inventors developed a method for manufacturing a thin film type antenna without using the FCCL as described above while researching to solve the above problem, and the thin film type antenna manufactured using the same is the existing FCCL It has been found that the number of stacked layers is significantly reduced compared to the antenna using The present invention has been completed.

In this regard, Korean Patent Laid-Open No. 10-2017-0028662 discloses a method for manufacturing an FCCL for a high-speed transmission antenna and an FCCL for a high-speed transmission antenna.

The present invention has been devised to solve the problems of the prior art, and an object of the present invention is to provide a thin film type antenna including a flexible printed circuit board (FPCB).

Another object of the present invention is to provide a method for manufacturing the thin film antenna.

As a technical means for achieving the above-described technical problem, one aspect of the present invention is,

tape (1);

a metal layer 10 laminated on the tape 1; an adhesive layer 20 laminated on the metal layer 10; and a base film layer 30 laminated on the adhesive layer 20; provides a thin film type antenna comprising a.

The metal layer 10 may include a material selected from the group consisting of copper foil, conductive adhesive, and combinations thereof.

The metal layer 10 may have a thickness of 5 μm to 200 μm.

The thickness of the pressure-sensitive adhesive layer 20 may be 1 μm to 20 μm.

The base film layer 30 includes a material selected from the group consisting of polyimide (PI), polyethylene terephthalate (PET), polyester, liquid crystal polymer (LCP), polyethylene naphthalate (PEN), and combinations thereof. may be doing

The thickness of the base film layer 30 may be 1 μm to 20 μm.

The thin film type antenna may further include a corrosion-preventing layer 40 interposed between the tape 1 and the metal layer 10 .

The thickness of the anti-corrosion layer 40 may be 1 μm to 10 μm.

In addition, another aspect of the present invention,

laminating one surface of the metal layer 10 to one surface of the adhesive layer 20; forming a pattern on the other surface of the metal layer 10; and attaching the tape 1 to the other surface of the metal layer 10;

The other surface of the adhesive layer 20 provides a method of manufacturing a thin film type antenna that is bonded to the base film layer (30).

The manufacturing method of the thin film type antenna includes: forming a pattern on the other surface of the metal layer (10); Thereafter, the step of plating the other surface of the metal layer 10 with the anti-corrosion layer 40; will further include, and the tape 1 may be attached to the anti-corrosion layer (40).

The thin film type antenna according to the present invention as described above can reduce the manufacturing cost by significantly reducing the number of stacked antennas by not using FCCL, and the lifting problem due to film tension can be improved.

In addition, the thin film type antenna can be very effective because it can act as a structure in which single-sided or double-sided contact is possible.

1 is a schematic diagram showing a single-sided antenna using FCCL according to a comparative example of the present invention.
2 is a schematic diagram showing a double-sided antenna using FCCL according to a comparative example of the present invention.
3 to 7 are schematic views each showing a thin film type antenna without FCCL according to an embodiment of the present invention.

Hereinafter, the present invention will be described in more detail. However, the present invention may be embodied in various different forms, and the present invention is not limited by the embodiments described herein, and the present invention is only defined by the claims to be described later.

In addition, the terms used in the present invention are only used to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the entire specification of the present invention, 'including' any component means that other components may be further included, rather than excluding other components, unless otherwise stated.

The first aspect of the present application is

tape (1); a metal layer 10 laminated on the tape 1; an adhesive layer 20 laminated on the metal layer 10; and a base film layer 30 laminated on the adhesive layer 20;

It provides a thin film type antenna comprising a.

First, before giving a detailed description of the present invention, if a general FPCB is described, miniaturization and weight reduction are required in all electronic devices, from small home appliances to advanced mobile communication devices such as smartphones, FPCB is used, and among them, it is used for antenna of smartphone. In FPCB for antenna, copper foil is adhered to flexible polyimide to protect the copper foil, which is the main component, and then the coated insulator is pressed to the copper foil through the hot press process. was cut into individual units and used. Although the role of the FPCB and copper foil were protected, as an antenna that receives radio waves, the area of the copper foil was limited and the efficiency was lowered.

On the other hand, the conventionally used FPCB, as shown in FIG. 1, uses a flexible copper clad laminate (Flexible Cupper Clad Laminate, FCCL, 100) including a polyimide 110, a first adhesive 120 and a copper foil 130. Then, a pattern is formed through etching, and another film processed thereon is laminated with a coverlay 200 through a hot press process to manufacture a product.

However, since the FCCL 100 as described above is produced by laminating the copper foil 130 on a polyimide (PI)-based film and then going through a hot press process, there is a problem in that the cost as a raw material is expensive. In addition, in the case of an antenna requiring double-sided contact, as shown in FIG. 2 , a double-sided FCCL 100 that is more expensive than the single-sided FCCL 100 should be used, and a drill for forming a via hole 250 . (drill) process and copper plating process may be added to increase the price. In addition, there is a problem in that the coverlay 200 applied to the outer layer to prevent corrosion of the pattern is bent due to the tension of the film, causing lifting during attachment.

Accordingly, the present invention has developed a thin film type antenna that does not use the FCCL 100 as described above. Hereinafter, the thin film type antenna according to the first aspect of the present application will be described in detail with reference to FIGS. 3 to 7 . 3 to 7 are schematic views each showing a thin film type antenna according to an embodiment of the present invention. Meanwhile, in the present specification, the thin film type antenna according to FIG. 3 will be mainly described, but the thin film type antenna of FIGS. 4 to 7 according to another embodiment will be additionally described. At this time, it should be understood that the thin film type antennas respectively shown in FIGS. 3 to 7 can be appropriately selected, substituted, omitted or modified by those skilled in the art as needed.

In one embodiment of the present application, the thin film type antenna may include a tape (1). In this case, the tape 1 may use a conventional tape that can be applied to an antenna, and the thickness thereof may be 1 μm to 100 μm, and according to an embodiment of the present invention, it may be about 50 μm.

In one embodiment of the present application, the thin film antenna may include a metal layer 10 laminated on the tape 1 . In this case, the metal layer 10 may include a material selected from the group consisting of a copper foil, a conductive adhesive, and combinations thereof. At this time, the copper foil may preferably be composed of an electrolytic foil, and the reason is that the rolled foil made through the process of heating thick copper to a specific temperature to make it easy to process and pressing it with both rolls to make it thin is a FPCB requiring a thin copper foil. Not only is it cost-effective because a lot of thinning processes are added, but also because the copper atoms on the surface are uniformly arranged and smooth because the process of making it thin by pressing with a roll is smooth. It does not stick well, so the lifespan may be shortened. However, in the case of electrolytic foil plating copper using sulfuric acid (electrolytic method), it is necessary to make thin copper foil by stacking thin copper atoms on a roll one by one using a redox reaction. In FCPB, electrolytic foil that is stacked atomically is more cost-effective than rolled foil that thins thick copper foil, and adhesive or ink adheres or is applied better when attaching insulators or applying ink using the rough surface feature. Product life may be extended. On the other hand, the conductive adhesive may preferably be a silver paste (silver paste) used.

In one embodiment of the present application, the thickness of the metal layer 10 may be 5 μm to 200 μm, preferably 5 μm to 30 μm, and according to an embodiment of the present invention, 12 μm or It may be 18 μm.

In one embodiment of the present application, a pattern may be formed on one surface and/or the other surface of the metal layer 10 . This is a pattern to be applied to the antenna, and the shape of the pattern may be appropriately selected and formed according to the type of the applied antenna.

In one embodiment of the present application, the thin film type antenna may include an adhesive layer 20 laminated on the metal layer 10 . At this time, the adhesive layer 20 is a configuration interposed to bond the metal layer 10 and the base film layer 30 to be described later, and the thickness of the pressure-sensitive adhesive layer 20 may be 1 μm to 20 μm. And, according to an embodiment of the present invention, it may be about 10 μm. Meanwhile, the type of adhesive used for the adhesive layer 20 may be used without limitation as long as it is an adhesive commonly used in the art.

In one embodiment of the present application, the thin film antenna may include a base film layer 30 laminated on the adhesive layer 20 . In this case, the base film layer 30 is used as an insulator, and is made of polyimide (PI), polyethylene terephthalate (PET), polyester, liquid crystal polymer (LCP), polyethylene naphthalate (PEN), and combinations thereof. It may include a material selected from the group consisting of, preferably, polyimide (PI) or polyethylene terephthalate (PET).

In one embodiment of the present application, the thickness of the base film layer 30 may be 1 μm to 20 μm, preferably 10 μm to 15 μm, and according to an embodiment of the present invention, about 12.5 μm.

In one embodiment of the present application, the thin film antenna, the tape (1) and the metal layer (10) interposed between the corrosion-resistant layer (40); may further include. That is, when the metal layer 10 is exposed to the outside, it may be easily corroded by contact with oxygen in the air depending on circumstances. To prevent this, the anti-corrosion layer 40 may be interposed. Meanwhile, as shown in FIG. 3 , the metal layer 10 may have one end protruding in the longitudinal direction compared to the tape 1 , the adhesive layer 20 , and the base film layer 30 . In this case, the anti-corrosion layer 40 may be additionally formed on one surface (upper side) and the other surface (lower side) of the portion in which the metal layer 10 is protruded, respectively.

In one embodiment of the present application, the material of the anti-corrosion layer 40 may be nickel (Ni) and/or gold (Au), and preferably, high-ductility nickel (Ni) may be used. In addition, the thickness of the anti-corrosion layer 40 may be 1 μm to 10 μm, and according to an embodiment of the present invention may be about 3 μm to 7 μm.

Hereinafter, a thin film type antenna according to another embodiment of the present application will be described with reference to FIGS. 4 to 7 , respectively. Meanwhile, since the description of each layer in the thin film antenna shown in FIGS. 4 to 7 is the same as that described above, a detailed description thereof will be omitted.

In another embodiment of the present application, the thin film type antenna may include a tape 1; a base film layer 30 laminated on the tape 1; an adhesive layer 20 laminated on the base film layer 30; a metal layer 10 laminated on the adhesive layer 20; It may include an adhesive layer 20 laminated on the metal layer and a base film layer 30 laminated on the adhesive layer 20 . In this case, the metal layer 10 may have one end protruding in the longitudinal direction compared to the tape 1, the adhesive layer 20 and the base film layer 30, and the corrosion prevention layer 40 is formed to protrude. It may be formed on one surface (upper) and the other surface (lower) of the metal layer 10, respectively. At this time, the anti-corrosion layer 40 formed on the other surface (lower side) may be formed only from the other surface (lower side) of the metal layer 1 to the boundary between the tape 1 and the base film layer 30 .

In another embodiment of the present application, the thin film type antenna, as shown in Figure 5, the tape (1); an anti-corrosion layer 40 laminated on the tape 1; a metal layer 10 laminated on the anti-corrosion layer 40; an adhesive layer 20 laminated on the metal layer; and a base film layer 30 laminated on the adhesive layer 20 . In this case, the tape 1, the metal layer 10, and the corrosion-resistant layer 40 may have one end protruding in the longitudinal direction compared to the adhesive layer 20 and the base film layer 30, and the metal layer ( 10) may be that the anti-corrosion layer 40 is additionally formed on one surface (upper) of the protruding portion.

In another embodiment of the present application, the thin film type antenna, as shown in Figure 6, the tape (1); a base film layer 30 laminated on the tape 1; an adhesive layer 20 laminated on the base film layer 30; a metal layer 10 laminated on the adhesive layer 20; It may include an adhesive layer 20 laminated on the metal layer and a base film layer 30 laminated on the adhesive layer 20 . In this case, the tape 1, the metal layer 10, and the adhesive layer 20 and the base film layer 30 laminated adjacent to the tape 1 are the adhesive layer laminated on the metal layer 10 ( 20) and one end of the base film layer 30 may be formed to protrude in the longitudinal direction. In this case, the anti-corrosion layer 40 may be additionally formed on one surface (upper portion) of the portion where the metal layer 10 is protruded.

In another embodiment of the present application, the thin film type antenna may include, as shown in FIG. 7 , a tape 1; a metal layer 10 laminated on the tape 1; a corrosion prevention layer 40 laminated on the metal layer; an adhesive layer 20 laminated on the anti-corrosion layer 40; and a base film layer 30 laminated on the adhesive layer 20 . In this case, one end of the tape 1 , the metal layer 10 , and the corrosion-resistant layer 40 may be formed to protrude in the longitudinal direction compared to the adhesive layer 20 and the base film layer 30 . In this case, the anti-corrosion layer 40 may be additionally formed on one surface (upper portion) of the portion where the anti-corrosion layer 40 is formed.

The second aspect of the present application is

laminating one surface of the metal layer 10 to one surface of the adhesive layer 20; forming a pattern on the other surface of the metal layer 10; and attaching the tape 1 to the other surface of the metal layer 10;

The other surface of the adhesive layer 20 provides a method of manufacturing a thin film type antenna that is bonded to the base film layer (30).

Although a detailed description of the overlapping parts of the first aspect of the present application is omitted, the description of the first aspect of the present application may be equally applied even if the description thereof is omitted in the second aspect.

Hereinafter, the manufacturing method of the thin film type antenna according to the second aspect of the present application will be described in detail step by step.

First, in one embodiment of the present application, the method of manufacturing the thin film type antenna may include a step of laminating one surface of the metal layer 10 to one surface of the adhesive layer 20 .

In one embodiment of the present application, the other surface of the adhesive layer 20 may be bonded to the base film layer (30). In this case, the base film layer 30 is used as an insulator, and is made of polyimide (PI), polyethylene terephthalate (PET), polyester, liquid crystal polymer (LCP), polyethylene naphthalate (PEN), and combinations thereof. It may include a material selected from the group consisting of, preferably, polyimide (PI) or polyethylene terephthalate (PET).

In one embodiment of the present application, the thickness of the base film layer 30 may be 1 μm to 20 μm, preferably 10 μm to 15 μm, and according to an embodiment of the present invention, about 12.5 μm.

In one embodiment of the present application, the metal layer 10 may include a material selected from the group consisting of a copper foil, a conductive adhesive, and combinations thereof. At this time, the copper foil may preferably be composed of an electrolytic foil, and the reason is that the rolled foil made through the process of heating thick copper to a specific temperature to make it easy to process and pressing it with both rolls to make it thin is a FPCB requiring a thin copper foil. Not only is it cost-effective because a lot of thinning processes are added, but also because the copper atoms on the surface are uniformly arranged and smooth because the process of making it thin by pressing with a roll is smooth. It does not stick well, so the lifespan may be shortened. However, in the case of electrolytic foil plating copper using sulfuric acid (electrolytic method), it is necessary to make thin copper foil by stacking thin copper atoms on a roll one by one using a redox reaction. In FCPB, electrolytic foil that is stacked atomically is more cost-effective than rolled foil that thins thick copper foil, and adhesive or ink adheres or is applied better when attaching insulators or applying ink using the rough surface feature. Product life may be extended. On the other hand, the conductive adhesive may preferably be a silver paste (silver paste) used.

In one embodiment of the present application, the laminated metal layer 10 may have a thickness of 5 μm to 200 μm, preferably 5 μm to 30 μm, and according to an embodiment of the present invention, 12 μm or 18 μm.

In one embodiment of the present application, the adhesive layer 20 is a configuration included to bond the metal layer 10 and the base film layer 30, and the thickness of the adhesive layer 20 is 1 μm to 20 μm. may be, and according to an embodiment of the present invention may be about 10 μm. Meanwhile, the type of adhesive used for the adhesive layer 20 may be used without limitation as long as it is an adhesive commonly used in the art.

In one embodiment of the present application, the method of manufacturing the thin film antenna includes forming a pattern on one side and/or the other side of the metal layer 10 before laminating the metal layer 10 on the adhesive layer 20; It may further include. That is, in the case of the conventionally used FCCL 100 , since the metal layer 10 , the adhesive layer 20 and the base film layer 30 are laminated, it is not easy to form a pattern on the metal layer 10 . didn't However, the method of manufacturing a thin film type antenna according to the present invention has the advantage of forming a pattern on both sides of the metal layer 10 alone, and then laminating it on the adhesive layer 20 . can On the other hand, the pattern is a pattern to be applied to the antenna, and the shape of the pattern may be appropriately selected and formed according to the type of the applied antenna.

Next, in one embodiment of the present application, the method for manufacturing the thin film type antenna may include forming a pattern on the other surface of the metal layer 10 . That is, as described above, before laminating the metal layer 10 to the adhesive layer 20, a pattern may be formed on the other surface in advance, but since the other surface is open after lamination, the pattern can be formed even after lamination. can At this time, as described above, the pattern is a pattern for application to the antenna, and the shape of the pattern may be appropriately selected and formed according to the type of antenna to be applied, and the method of forming the pattern is also commonly used in the art. Since the method used may be adopted, a detailed description below will be omitted.

Next, in one embodiment of the present application, the method for manufacturing the thin film antenna may include attaching the tape 1 to the other surface of the metal layer 10 .

In one embodiment of the present application, the tape 1 may use a conventional tape that can be applied to an antenna, and the thickness thereof may be 1 μm to 100 μm, and according to an embodiment of the present invention, about 50 μm.

On the other hand, in one embodiment of the present application, the manufacturing method of the thin film type antenna comprises the steps of forming a pattern on the other surface of the metal layer (10); Thereafter, plating the other surface of the metal layer 10 with the anti-corrosion layer 40; will further include, in which case, the tape 1 may be attached to the anti-corrosion layer 40.

In one embodiment of the present application, when the metal layer 10 is exposed to the outside, it may be easily corroded by contact with oxygen in the air depending on circumstances. In order to prevent this, the corrosion prevention layer 40 may be plated. there is. Meanwhile, as shown in FIG. 3 , the metal layer 10 may have one end protruding in the longitudinal direction compared to the tape 1 , the adhesive layer 20 , and the base film layer 30 . In this case, the anti-corrosion layer 40 may be additionally formed on one surface (upper side) and the other surface (lower side) of the portion in which the metal layer 10 is protruded, respectively.

In one embodiment of the present application, the material of the anti-corrosion layer 40 may be nickel (Ni) and/or gold (Au), and preferably, high-ductility nickel (Ni) may be used. In addition, the thickness of the anti-corrosion layer 40 may be 1 μm to 10 μm, and according to an embodiment of the present invention may be about 3 μm to 7 μm.

In another embodiment of the present application, the method for manufacturing the thin film type antenna may be manufactured in the form shown in FIGS. 4 to 7 . In this case, in the method of manufacturing the thin film antenna, a metal layer 10 is laminated on one surface of the adhesive layer 20 having the other surface bonded to the base film layer 30 , and a pattern is formed on the other surface of the metal layer 10 . After forming, the layer shown in each figure may be laminated or plated on the other surface of the metal layer 10 (in the case of the anti-corrosion layer 40).

Meanwhile, since the specific structure and shape of the thin film antenna shown in FIGS. 4 to 7 have been described above in the first aspect of the present application, a detailed description below will be omitted.

Hereinafter, embodiments of the present invention will be described in detail so that those of ordinary skill in the art can easily carry out the present invention. However, the present invention may be embodied in several different forms and is not limited to the embodiments described herein.

Example. Manufacture of thin film antenna

As shown in FIG. 3, a thin film type antenna was manufactured.

To this end, first, a copper foil or silver paste composed of an electrolytic foil was laminated on a 12.5 μm thick polyimide (PI) or polyethylene terephthalate (PET) processed (with an adhesive layer having a thickness of 10 μm attached). At this time, the thickness of the copper foil or silver paste was 12 μm or 18 μm.

Thereafter, a necessary antenna pattern is formed on the copper foil or silver paste by etching, and after corrosion prevention treatment through nickel (Ni) plating (thickness of nickel layer: 3 μm to 7 μm), the processed tape (thickness of tape: 50) μm) to prepare a thin film antenna.

Meanwhile, the total thickness of the finally manufactured thin film antenna was about 90 μm to 100 μm.

Comparative Example 1. Preparation of single-sided antenna using FCCL

As shown in FIG. 1, a conventional single-sided antenna using FCCL was prepared.

At this time, the thickness of each layer of the single-sided antenna was as follows.

- Tape (1): 50 μm

- Polyimide (110): 12.5 μm

- first adhesive 120: 10 μm to 15 μm

- Copper foil 130: 12 μm or 18 μm

- second adhesive 210: 15 μm

- Coverlay (200): 12.5 μm

Meanwhile, the total thickness of the prepared single-sided antenna was about 130 μm to 140 μm.

Comparative Example 2. Preparation of double-sided antenna using FCCL

As shown in FIG. 2, a double-sided antenna using a conventional FCCL was prepared.

In this case, the thickness of each layer of the double-sided antenna was the same as in Comparative Example 1.

On the other hand, the total thickness of the prepared double-sided antenna was about 160 μm to 170 μm.

Above, the present invention has been described in detail with preferred embodiments with reference to the drawings, but the scope of the technical idea of the present invention is not limited to these drawings and examples. Accordingly, various modifications or equivalent ranges of embodiments may exist within the scope of the technical spirit of the present invention. Therefore, the scope of the technical idea according to the present invention should be interpreted by the claims, and the technical idea within the equivalent or equivalent scope should be interpreted as belonging to the scope of the present invention.

1: tape
10: metal layer
20: adhesive layer
30: base film layer
40: anti-corrosion layer
100: Flexible copper clad laminated film (FCCL)
110: polyimide
120: first adhesive
130: copper foil
200: coverlay
210: second adhesive
220: nickel
230: gold
250: via hole

Claims (10)

tape (1);
a metal layer 10 laminated on the tape 1;
an adhesive layer 20 laminated on the metal layer 10; and
and a base film layer 30 laminated on the adhesive layer 20;
The metal layer 10 is a material selected from the group consisting of copper foil, conductive adhesive, and combinations thereof,
When the metal layer 10 is a copper foil, the metal layer 10 is an electrolytic foil,
Further comprising an anti-corrosion layer 40 interposed between the tape 1 and the metal layer 10 Thin film antenna.

delete According to claim 1,
The thickness of the metal layer 10 is a thin film antenna that is 5 μm to 200 μm.
According to claim 1,
The thickness of the adhesive layer 20 is a thin film type antenna of 1 μm to 20 μm.
According to claim 1,
The base film layer 30 includes a material selected from the group consisting of polyimide (PI), polyethylene terephthalate (PET), polyester, liquid crystal polymer (LCP), polyethylene naphthalate (PEN), and combinations thereof. A thin film type antenna.
According to claim 1,
The thickness of the base film layer 30 is a thin film type antenna of 1 μm to 20 μm.
delete According to claim 1,
The thickness of the anti-corrosion layer 40 is a thin film type antenna of 1 μm to 10 μm.
laminating one surface of the metal layer 10 to one surface of the adhesive layer 20;
forming a pattern on the other surface of the metal layer 10;
plating the anti-corrosion layer 40 on the other surface of the metal layer 10 on which the pattern is formed; and
attaching the tape (1) to the anti-corrosion layer (40);
A method of manufacturing a thin film type antenna comprising a.
delete

Images