CN216291577U - Multilayer circuit board - Google Patents
Multilayer circuit board Download PDFInfo
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- CN216291577U CN216291577U CN202122583461.4U CN202122583461U CN216291577U CN 216291577 U CN216291577 U CN 216291577U CN 202122583461 U CN202122583461 U CN 202122583461U CN 216291577 U CN216291577 U CN 216291577U
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Abstract
The utility model relates to a multilayer circuit board which comprises a multilayer insulating substrate, wherein conductive ink and insulating ink are printed on the upper surface or/and the lower surface of the insulating substrate to form a printed circuit layer, the multilayer insulating substrate is superposed and pressed into a whole, each layer of insulating substrate is provided with a through hole, and a conductor is filled in the through hole and is used for electrically connecting the printed circuit layer positioned at the upper end of the insulating substrate with the printed circuit layer positioned at the lower end of the insulating substrate. The conductive ink and the insulating ink achieve circuit characteristics, the environment-friendly material is used for replacing the original base material with high energy consumption and high pollution, the conductive performance is realized through the traditional printing process, the open and close circuits are realized through the traditional punching and infiltrating mode, the operation flow is reduced and the production efficiency is improved through the traditional printing process and multilayer overlapping and pressing molding, so that the manufacturing cost is reduced and the environment is more friendly.
Description
Technical Field
The utility model belongs to the technical field of circuit boards, and particularly relates to a multilayer circuit board.
Background
The conventional process for manufacturing a multilayer printed circuit board generally includes the following steps: cutting, inner drawing (including film sticking, exposure and development), inner etching, adhesion pressing, drilling, copper deposition, electroplating, outer drawing (including film sticking, exposure and development), outer etching, outer inspection, resistance welding, exposure, characters, surface coating, appearance, electrical measurement, final inspection, finished inspection and packaging.
The process is complex in flow and long in time consumption, and the required circuit board can be finally manufactured usually in more days. In addition, the copper foil blanking is adopted to process the circuit pattern, and the cost of the copper foil is higher.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the defects of the prior art and provides a multilayer circuit board which reduces the operation flow, improves the production efficiency, reduces the manufacturing cost and is more environment-friendly.
The technical scheme of the utility model is realized as follows: the utility model discloses a multilayer circuit board which comprises a plurality of layers of insulating substrates, wherein circuit layers are printed on the upper surface or/and the lower surface of each insulating substrate, the plurality of layers of insulating substrates are superposed and pressed into a whole, through holes are formed in each layer of insulating substrate, and conductors are filled in the through holes and used for electrically connecting the circuit layers positioned at the upper end of the insulating substrate with the circuit layers positioned at the lower end of the insulating substrate.
Further, the upper surface or/and the lower surface of the insulating substrate is printed with conductive ink and insulating ink to form a printed circuit layer.
Further, the insulating substrate is made of an insulating resin base material.
Furthermore, only one circuit layer is arranged between the insulating substrates.
Further, the upper surface of the uppermost insulating substrate is printed with a circuit layer, and the upper surface of the circuit layer is printed with a surface insulating layer.
Further, a circuit layer is printed on the lower surface of the insulating substrate of the lowermost layer, and a surface insulating layer is printed on the lower surface of the circuit layer.
Further, a surface insulating layer is provided on all the surfaces of the conductive wirings except the part pads on the surface of the printed circuit layer.
Further, the surface insulating layer is a resin coating.
The utility model has at least the following beneficial effects: the multilayer circuit board comprises a plurality of insulating substrates, wherein circuit layers are printed on the upper surface or/and the lower surface of each insulating substrate, the plurality of insulating substrates are superposed and pressed into a whole, each insulating substrate is provided with a through hole, and a conductor is filled in the through hole and is used for electrically connecting the circuit layer at the upper end of the insulating substrate with the circuit layer at the lower end of the insulating substrate. The utility model realizes the conductivity through the traditional printing process, realizes the open and close circuit through the traditional punching infiltration mode, reduces the operation flow, improves the production efficiency, reduces the manufacturing cost, is more environment-friendly, greatly reduces the energy consumption, reduces the production cost, and promotes wider application environment and scene through the traditional printing process and the multilayer overlapping and pressing molding, thereby solving the technical problems of complicated flow, long time consumption, large pollution and high cost of the existing circuit board manufacturing process.
And the upper surface or/and the lower surface of the insulating substrate are printed with conductive ink and insulating ink to form a printed circuit layer. By adopting the scheme, the circuit characteristic is achieved through the conductive ink and the insulating ink, and the original high-energy-consumption and high-pollution base material is replaced by the environment-friendly material.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a multi-layer circuit board provided in an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a multilayer circuit board provided in an embodiment of the present invention.
In the drawing, 1 denotes an insulating substrate, 2 denotes a printed circuit layer, 3 denotes a conductor, and 4 denotes a surface insulating layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; in the description of the present invention, the meaning of "plurality" or "a plurality" is two or more unless otherwise specified.
Referring to fig. 1 and 2, an embodiment of the present invention provides a multilayer circuit board, including a multilayer insulating substrate 1 (i.e., two or more layers), where circuit layers are printed on an upper surface or/and a lower surface of the insulating substrate 1, the multilayer insulating substrate 1 is laminated and integrated, through holes are formed in each layer of the insulating substrate 1, and conductors 3 are filled in the through holes and used for electrically connecting a printed circuit layer 2 at an upper end of the insulating substrate 1 with a printed circuit layer 2 at a lower end of the insulating substrate 1.
Further, the upper surface or/and the lower surface of the insulating substrate 1 is printed with conductive ink and insulating ink to form a printed circuit layer 2.
Further, the material of the insulating substrate 1 is an insulating resin base material.
Further, only one printed circuit layer 2 is provided between the insulating substrates 1.
Further, a circuit layer is printed on the upper surface of the uppermost insulating substrate 1, and a surface insulating layer 4 is printed on the upper surface of the printed circuit layer 2.
Further, a circuit layer is printed on the lower surface of the insulating substrate 1 at the lowermost layer, and a surface insulating layer 4 is printed on the lower surface of the printed circuit layer 2.
The surface insulating layer is screen-printed on the circuit layer for insulating the surface conductive circuit from the outside.
Further, the surface insulating layer 4 is a resin coating layer, and is generally coated on all surfaces of the conductive circuit except the component pads.
The manufacturing method of the multilayer circuit board comprises the following steps:
1) printing positioning patterns on a plurality of insulating substrates 1 to determine the positions of through holes;
2) punching through holes at the through hole positions determined by the insulating substrates 1 according to the printed positioning patterns;
3) filling a conductor 3 in the through hole of each insulating substrate;
4) printing conductive ink and insulating ink on the upper surface or/and the lower surface of each insulating substrate 1 according to design requirements to form a printed circuit layer 2;
5) after the circuit layers are printed on the respective insulating substrates 1, the insulating substrates 1 are stacked and pressed together, and the conductor 3 filled in the through hole of each insulating substrate electrically connects the printed circuit layer located at the upper end of the insulating substrate to the printed circuit layer 2 located at the lower end.
6) And surface insulating layers 4 are printed on the surfaces of the printed circuit layers 2 on the upper surface and the lower surface of the integrated circuit board structure.
The multilayer circuit board uses brand new materials to replace original high-energy-consumption and high-pollution base materials, realizes conductivity through the traditional printing process, achieves circuit characteristics through novel materials (conductive ink and insulating ink), realizes open and close circuits through the traditional punching and infiltrating mode, realizes multilayer superposition by the same technology, namely adopts novel insulating resin materials and electric conductor 3 materials, reduces operation flows and improves production efficiency through the traditional printing process and multilayer superposition press molding, thereby reducing manufacturing cost and being environment-friendly.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (8)
1. A multilayer circuit board, characterized by: the insulating substrate comprises a plurality of insulating substrates, circuit layers are printed on the upper surface or/and the lower surface of each insulating substrate, the insulating substrates are stacked and pressed into a whole, through holes are formed in each insulating substrate, and electric conductors are filled in the through holes and used for electrically connecting the circuit layers at the upper end and the lower end of each insulating substrate.
2. The multilayer circuit board of claim 1, wherein: and the upper surface or/and the lower surface of the insulating substrate are printed with conductive ink and insulating ink to form a printed circuit layer.
3. The multilayer circuit board of claim 1, wherein: the insulating substrate is made of an insulating resin base material.
4. The multilayer circuit board of claim 1, wherein: only one circuit layer is arranged between the insulating substrates.
5. The multilayer circuit board of claim 1, wherein: the upper surface of the uppermost insulating substrate is printed with a circuit layer, and the upper surface of the circuit layer is printed with a surface insulating layer.
6. The multilayer circuit board of claim 1, wherein: the lower surface of the insulating substrate at the lowermost layer is printed with a circuit layer, and the lower surface of the circuit layer is printed with a surface insulating layer.
7. The multilayer circuit board of claim 5 or 6, wherein: the surface insulating layer is arranged on all the surfaces of the conducting circuits except the part bonding pads on the surface of the printed circuit board.
8. The multilayer circuit board of claim 5 or 6, wherein: the surface insulating layer is a resin coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122583461.4U CN216291577U (en) | 2021-10-26 | 2021-10-26 | Multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122583461.4U CN216291577U (en) | 2021-10-26 | 2021-10-26 | Multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216291577U true CN216291577U (en) | 2022-04-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122583461.4U Active CN216291577U (en) | 2021-10-26 | 2021-10-26 | Multilayer circuit board |
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| CN (1) | CN216291577U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114007346A (en) * | 2021-10-26 | 2022-02-01 | 武汉天喻信息产业股份有限公司 | Multilayer circuit board manufacturing method and multilayer circuit board |
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2021
- 2021-10-26 CN CN202122583461.4U patent/CN216291577U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114007346A (en) * | 2021-10-26 | 2022-02-01 | 武汉天喻信息产业股份有限公司 | Multilayer circuit board manufacturing method and multilayer circuit board |
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