CN1090892C - Method for mfg. of double-side conductive metal foil type circuit board and products thereof - Google Patents
Method for mfg. of double-side conductive metal foil type circuit board and products thereof Download PDFInfo
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- CN1090892C CN1090892C CN 97120185 CN97120185A CN1090892C CN 1090892 C CN1090892 C CN 1090892C CN 97120185 CN97120185 CN 97120185 CN 97120185 A CN97120185 A CN 97120185A CN 1090892 C CN1090892 C CN 1090892C
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Abstract
The present invention relates to a method for the manufacture of double-side conductive metal foil type circuit boards and a product thereof. Firstly, conductive graphite with corrosion resistance is printed on copper foil of a basal plate pressed by a film of paper soaking phenolic resin according to a needed circuit shape; only the welding area of each welding peripheral side is exposed; printing ink with corrosion resistance is printed on a welding spot area uncovered by the conductive graphite with corrosion resistance; the uncovered printing ink with corrosion resistance and the conductive graphite area are etched and removed to form the needed circuit shape; after the printing ink with corrosion resistance is removed, the copper foil of each welding area is exposed. A circuit board manufactured by the method of the present invention can obtain a good electrical characteristic only by low cost.
Description
The present invention relates to circuit board and process technology thereof, refer in particular to manufacture method of a kind of double-side conductive metal foil type circuit board and products thereof.
The electronic product of existing low price, for example the electricity computer, it is that base material is pressed into substrate that applied printed circuit board (PCB) common paper is soaked the synthetic film of phenolic resins, again in its one side or two-sided pressing Copper Foil, make required circuit with etching mode and be connected form, the major defect of this structure is a single or double Copper Foil no matter, all must with wire jumper connect two upper thread roads or circuit electric, not only expend cost, and can't be suitable for product as the button cloth claw position shape of electronic computer; Also having a kind of structure is to soak pressing Copper Foil on the substrate of phenolic resins and the circuit surface in papery, in bonding area and the another side button cloth claw position of each all side of holing, prints the electrically conductive graphite of suitable thickness, its main manufacturing process as shown in Figure 1:
(1) cuts out plate: the former material of monoblock circuit substrate is cut into suitable size shape;
(2) bore (dashing) location hole, bore (dashing) suitably non-part through hole of size in each desired location;
(3) copper-clad surface printing etching resisting ink: etching resisting ink is printed on the copper-clad surface of substrate according to the circuit shape that circuit needs;
(4) etching: carry out etching with solvent;
(5) stripping printing ink: with the etching resisting ink removal of solvents on the copper-clad surface;
(6) printing conductive graphite: at the part space required and the opposite side printing conductive graphite of exposed copper foil surface;
(7) solder-mask printing lacquer: form suitable protection at circuit board surface.Except each through hole of PCB surface week side bonding area and other do not need the position of solder-mask printing lacquer;
(8) printing back of the body line: at circuit board surface printing word, pattern or back of the body line;
(9) bore the electric through hole of (dashing) part: (dashing) through hole is bored in the surperficial appropriate location at circuit board;
(10) vacuum suction electrically conductive graphite: at the electric through hole two side periphery vacuum suction electrically conductive graphites of part, make the electric through hole inwall of each part adhere to electrically conductive graphite, form upper and lower two electrical communication;
(11) printing antioxidant:, avoid Copper Foil position oxidation at the position printing antioxidant that exposes of solder joint area Copper Foil of each weld week side;
(12) crush-cutting snap slot: cut snap slot in each cell board week side pressure.
(13) finished product.
The circuit board that above-mentioned processing technology makes, because its whole line impedance is higher, electrical characteristic is difficult for promoting to be improved, and forms the bottleneck on using.
Higher for price, electric characteristic requires harsh product, commonly used with the synthetic substrate of glass fibre film immersion epoxy resin, again in the etching in addition of its two-sided pressing Copper Foil, it mainly makes flow process as shown in Figure 2, comprising: (21) cut out plate, (22) boring, (23) deposition electro-coppering, (24) electro-copperings, (25) two press molds, (26) exposure imaging, (27) second time electroplating copper, (28) the anti-etching tin lead of plating, (29) stripping, (30) etching, (31) tin-lead soldering, (32) nickel plating, (33) gold-plated, (34) solder-mask printing lacquer, (35) printing back of the body line, (36) punch die, (37) finished product.
Though the circuit board of this manufacture method manufacturing can obtain preferable circuit feature, its manufacturing cost is higher, is about the several times that papery is soaked the circuit board of the synthetic film of phenolic resins, is not suitable for the product of common low price.
In a word, all there is the defective of manufacturing cost height and electrical characteristic difference in the circuit board of electronic product at present, and the production cost of circuit board is reduced and the electrical characteristic raising, just becomes the difficult problem that urgent need solves.
The object of the present invention is to provide manufacture method of a kind of double-side conductive metal foil type circuit board and products thereof, overcome the defective of prior art, reach the degree of difficulty that reduces production operation, reduce production costs, reduce the impedance of circuit and the purpose of enhancement electrical characteristic.
The object of the present invention is achieved like this: a kind of manufacture method of double-side conductive metal foil type circuit board is characterized in that: it comprise the steps: (one) cut out that plate, (two) bore or on location hole, (three) copper-clad surface printing anticorrosive conducting graphite, (four) printing etching resisting ink, (five) etching, (six) stripping printing ink, (seven) solder-mask printing lacquer, (eight) printing back of the body line, (nine) bore or towards the electric through hole of part, (ten) vacuum suction electrically conductive graphite, (11) printing antioxidant, (12) crush-cutting snap slot, (13) finished product;
Printing anticorrosive conducting graphite is according to the required circuit shape of circuit on should (three) copper-clad surface, anticorrosive conducting graphite is printed on the copper-clad surface of circuit substrate, each is default bore or punching week side bonding area and needing reveal except the circuit position of copper;
Should (four) the printing etching resisting ink be in described (three) each bore or punching week side do not print the bonding area of anticorrosive conducting graphite and need to reveal on the circuit position of copper and print etching resisting ink;
Should (five) etching be to remove the Copper Foil that does not print anticorrosive conducting graphite and etching resisting ink position on this substrate with solvent attack;
Should (six) stripping printing ink be described etching resisting ink to be removed with solvent;
Being somebody's turn to do (seven) solder-mask printing lacquer be at circuit board surface solder-mask printing lacquer, respectively except the bonding area of all sides of brill or punching;
Should (ten) vacuum suction electrically conductive graphite be to use the vacuum suction mode, and make electrically conductive graphite absorption fill each and bore or the punching inwall, circuit board two upper thread roads were formed connected state.
The substrate of described circuit board forms for the film compacting of soaking phenolic resins with paper.Behind the described solder-mask printing lacquer, represent the back of the body line of various symbols, literary composition in the circuit board surface printing.
A kind of double-side conductive metal foil type circuit board is characterized in that: the substrate of described circuit board forms for the film compacting of soaking phenolic resins with paper; Which is provided with most part through holes and electric through hole; Copper foil layer is located at the two sides of this substrate, and circuit extends distribution according to need, and in each part through hole week side formation solder joint area; The anticorrosive conducting graphite linings is printed on the described circuit copper foil layer, and is distributed in the interior perimeter surface of this electric through hole, but does not cover described solder joint area; Anti-welding enamelled coating is printed in the outer surface of integrated circuit plate, but the electrically conductive graphite position that does not cover described solder joint area and need to contact with the outside.
Major advantage of the present invention is:
1, manufacture method of the present invention is the electrically conductive graphite of elder generation with corrosion stability, being printed on papery with the circuit shape soaks on the Copper Foil of phenolic resins substrate, the solder joint area that only exposes all sides of each welding hole or plane welding, making between etching resisting ink and electrically conductive graphite has small size overlapping, the non-need that does not cover etching resisting ink and electrically conductive graphite removed with the etching of Copper Foil area, form required circuit shape, after removing etching resisting ink again, can expose each solder joint area, because not with etching resisting ink and separately printing of electrically conductive graphite, the error that is connected between the copper that reduces the single face copper-clad surface and electrically conductive graphite, electrically conductive graphite one-step print with corrosion stability forms all circuits, can reduce the degree of difficulty of production operation effectively, reduce production costs significantly.
2, the double-side conductive metal foil type circuit board product made from method of the present invention, its copper foil surface is directly printed the electrically conductive graphite of corrosion stability, can reduce the impedance of circuit effectively, promotes its electrical characteristic.
3, the product made from method of the present invention, the evenness of golden finger is preferable under its electrically conductive graphite, overcome Copper Foil area under the electrically conductive graphite in the past when less, the whole surface of golden finger can form center projections, can reduce the contact impedance of hot pressing conducting film between the electrically conductive graphite golden finger effectively, promote the contact quality of whole button.
The present invention is further described below in conjunction with preferred embodiment and accompanying drawing:
Fig. 1 is the making flow chart of circuit board commonly used;
Fig. 2 is the making flow chart of another kind of circuit board commonly used;
Fig. 3 is the making flow chart of circuit board of the present invention;
Fig. 4 is the schematic diagram of circuit board of the present invention;
Consult Fig. 3, it is that the flow chart of substrate manufacture circuit board comprises the steps: that (one) cuts out plate, (two) and bores printing anticorrosive conducting graphite on (dashing) location hole, (three) copper-clad surface, (four) printing etching resisting ink, (five) etching, (six) stripping printing ink, (seven) solder-mask printing lacquer, (eight) printing back of the body line, (nine) and bore the electric through hole of (dashing) part, (ten) vacuum suction electrically conductive graphite, (11) and print antioxidant, (12) crush-cutting snap slot, (13) finished product that the present invention soaks phenolic resins with paper.
Wherein printing anticorrosive conducting graphite is that anticorrosive conducting graphite is printed on the substrate according to the circuit shape that circuit needs on (three) copper-clad surface, but each in part perforation week face down bonding connect area and need to reveal except the circuit position of copper; (4) the printing etching resisting ink is not print the bonding area of anticorrosive conducting graphite and need print etching resisting ink on the circuit position of dew copper in each brill (dashing) hole week side; (5) etching is to remove the full Copper Foil of etching resisting ink portion that does not print anticorrosive conducting graphite on the substrate with solvent attack; (6) stripping printing ink is with solvent the etching resisting ink on the copper-clad surface to be removed; (7) the solder-mask printing lacquer is at circuit board surface solder-mask printing lacquer, but except the bonding area of each brill (dashing) hole week side; (10) the vacuum suction electrically conductive graphite is the suction type with vacuum, makes electrically conductive graphite be inhaled and fill the inwall that each bores (dashing) hole, makes the two sides circuit formation connected state of circuit board.Other steps are identical with the step of prior art Fig. 1, so do not repeat.
Manufacture method of the present invention is that first electrically conductive graphite with corrosion stability is printed on the Copper Foil of papery immersion phenolic resins substrate with the circuit shape, the solder joint area that only exposes all sides of each welding hole or plane welding, changed the technology of traditional method with etching resisting ink and twice printing of electrically conductive graphite, be connected error between the copper that has significantly reduced the single face copper-clad surface and electrically conductive graphite, electrically conductive graphite one-step print with corrosion stability forms the degree of difficulty that all circuits can reduce production operation effectively, reduce production costs significantly, simultaneously because copper foil surface directly prints the electrically conductive graphite of corrosion stability, can reduce the impedance of circuit effectively, promote the electrical characteristic of circuit board.
Consult Fig. 4; two side surfaces that the structure of circuit board of the present invention is included in substrate 4 need extension cloth to be provided with copper foil layer 42 according to circuit; and most part through holes 41 and electric through hole 45 connections two copper foil layers 42 have been provided on the substrate 4; republish anticorrosive conducting graphite linings 43 on copper foil layer 42 surfaces; this anticorrosive conducting graphite linings 43 also stretches into the interior perimeter surface that is distributed in electric through hole 45; and anticorrosive conducting graphite linings 43 tops republish anti-welding enamelled coating 44; to protect aforementioned anticorrosive conducting graphite linings 43 and copper foil layer 43; part through hole 41 can be fixed for plant type part 461 inserts and be welded on the copper foil layer 42, and has chip type part 462 can be directly welded between two copper foil layers 42 on substrate 4 surfaces in addition.
Claims (4)
1, a kind of manufacture method of double-side conductive metal foil type circuit board is characterized in that: it comprise the steps: (one) cut out that plate, (two) bore or on location hole, (three) copper-clad surface printing anticorrosive conducting graphite, (four) printing etching resisting ink, (five) etching, (six) stripping printing ink, (seven) solder-mask printing lacquer, (eight) printing back of the body line, (nine) bore or towards the electric through hole of part, (ten) vacuum suction electrically conductive graphite, (11) printing antioxidant, (12) crush-cutting snap slot, (13) finished product;
Printing anticorrosive conducting graphite is according to the required circuit shape of circuit on should (three) copper-clad surface, anticorrosive conducting graphite is printed on the copper-clad surface of circuit substrate, each is default bore or punching week side bonding area and needing reveal except the circuit position of copper;
Should (four) the printing etching resisting ink be in described (three) each bore or punching week side do not print the bonding area of anticorrosive conducting graphite and need to reveal on the circuit position of copper and print etching resisting ink;
Should (five) etching be to remove the Copper Foil that does not print anticorrosive conducting graphite and etching resisting ink position on this substrate with solvent attack;
Should (six) stripping printing ink be described etching resisting ink to be removed with solvent;
Being somebody's turn to do (seven) solder-mask printing lacquer be at circuit board surface solder-mask printing lacquer, respectively except the bonding area of all sides of brill or punching;
Should (ten) vacuum suction electrically conductive graphite be to use the vacuum suction mode, and make electrically conductive graphite absorption fill each and bore or the punching inwall, circuit board two upper thread roads were formed connected state.
2, manufacture method according to claim 1 is characterized in that: the substrate of described circuit board forms for the film compacting of soaking phenolic resins with paper.
3, manufacture method according to claim 1 is characterized in that: behind the described solder-mask printing lacquer, represent the back of the body line of various symbols, literary composition in the circuit board surface printing.
4, a kind of double-side conductive metal foil type circuit board made from the described method of claim 1 is characterized in that: the substrate of described circuit board forms for the film compacting of soaking phenolic resins with paper; Which is provided with most part through holes and electric through hole; Copper foil layer is located at the two sides of this substrate, and circuit extends distribution according to need, and in each part through hole week side formation solder joint area; The anticorrosive conducting graphite linings is printed on the described circuit copper foil layer, and is distributed in the interior perimeter surface of this electric through hole, but does not cover described solder joint area; Anti-welding enamelled coating is printed in the outer surface of integrated circuit plate, but the electrically conductive graphite position that does not cover described solder joint area and need to contact with the outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 97120185 CN1090892C (en) | 1997-11-19 | 1997-11-19 | Method for mfg. of double-side conductive metal foil type circuit board and products thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 97120185 CN1090892C (en) | 1997-11-19 | 1997-11-19 | Method for mfg. of double-side conductive metal foil type circuit board and products thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1217629A CN1217629A (en) | 1999-05-26 |
| CN1090892C true CN1090892C (en) | 2002-09-11 |
Family
ID=5175805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 97120185 Expired - Fee Related CN1090892C (en) | 1997-11-19 | 1997-11-19 | Method for mfg. of double-side conductive metal foil type circuit board and products thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1090892C (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6500349B2 (en) * | 2000-12-26 | 2002-12-31 | Oak-Mitsui, Inc. | Manufacture of printed circuits using single layer processing techniques |
| US8002948B2 (en) | 2002-04-24 | 2011-08-23 | Sipix Imaging, Inc. | Process for forming a patterned thin film structure on a substrate |
| CN101621895B (en) * | 2008-06-30 | 2011-05-25 | 比亚迪股份有限公司 | Manufacture method of soft circuit board |
| CN102111953B (en) * | 2009-12-24 | 2012-10-31 | 北大方正集团有限公司 | Printed circuit board (PCB) and manufacturing method thereof |
| TWI496528B (en) * | 2013-10-31 | 2015-08-11 | Wistron Corp | A Metal Shell For Dissipating Electrostatic And Coating Method?Of The Same |
-
1997
- 1997-11-19 CN CN 97120185 patent/CN1090892C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1217629A (en) | 1999-05-26 |
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