CN1747629A - Production of duoble-face printing circuit board - Google Patents
Production of duoble-face printing circuit board Download PDFInfo
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- CN1747629A CN1747629A CN 200410074575 CN200410074575A CN1747629A CN 1747629 A CN1747629 A CN 1747629A CN 200410074575 CN200410074575 CN 200410074575 CN 200410074575 A CN200410074575 A CN 200410074575A CN 1747629 A CN1747629 A CN 1747629A
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- insulated substrate
- circuit board
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- processing procedure
- pcb
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Abstract
A process for preparing the dual-surface PCB includes such steps as removing copper foil from the substrate, generating an insulating layer, drilling multiple through holes, plating a layer of chemical copper to become multiple plated through holes, generating a conductor pattern layer, generating an solder-resistant layer, forming multiple windows to expose the contact pads, and coating a protecting layer.
Description
Technical field
The present invention provides a kind of manufacture method of double-sided printed-circuit board, refers to a kind of manufacture method with double-sided printed-circuit board of ultra-fine circuit and elevated track density especially.
Background technology
Most now electronic product all must (printed circuitboard PCB) comes embedding to carry various electronics spare parts by printed circuit board (PCB).So the good and bad or durable degree of the performance of an electronic product is with the good corrupt very big relation that has of quality, the design of printed circuit board (PCB).In the past, the printed circuit board (PCB) industry has been a mature industry, but because the development of electronic product trend " light, thin, short, little " and " many merits, quick, high energy, at a low price ", so also relatively impel printed circuit board (PCB) also to move towards the trend of high density, aperture, fine rule, slim, multilayer.
Generally speaking, the two sides all has the double-sided printed-circuit board of configuration to be widely used on the comparatively complicated electronic equipment of circuit, as intelligent cold air, phone, facsimile machine etc.But because all there is circuit lead on its two sides, so between the circuit of two sides suitable electrical connection must be arranged, " bridge " between sort circuit is called via.That is utilize and to be formed in the printed circuit board (PCB), be full of or the via of coating metal, be connected with the circuit lead on two sides.Therefore the area of double-sided printed-circuit board is bigger one times than single sided board, and because wiring can intermesh (can by one side wherein around to another side), so it is more suitable for being used in than on the more complicated circuit of single sided board.
See also Fig. 1, Fig. 1 is the schematic diagram behind the Laser drill on the known double-sided printed-circuit board.In known techniques, the Laser drill processing procedure all carries out on the substrate 30 (that is copper clad laminate) that is coated with one deck Copper Foil 32, therefore in order to penetrate copper foil layer 32 and substrate 30, the time of the required cost of boring processing procedure is long and energy that use is more, so that cause the aperture of through hole 34 bigger, not only reduce relatively in available space on the circuit board, and when carrying out the processing procedure of subsequent conditioning circuit pattern, also because substrate 30 surfaces have had the copper foil layer 32 of suitable thickness, and then the relative thickness of increase circuit lead, reduce integration, or must carry out lead thinning processing procedure again, increase process complexity, therefore be unfavorable for making the lifting of ultra-fine circuit and line density.
Summary of the invention
Main purpose of the present invention is to provide a kind of manufacture method of double-sided printed-circuit board, with the printed circuit board (PCB) of producing ultra-fine circuit and the density that promotes circuit.
For reaching above-mentioned purpose, the invention provides a kind of manufacture method of double-sided printed-circuit board.At first provide one to remove the copper clad laminate (CCL) of Copper Foil or do not have the insulated substrate of Copper Foil; then carry out boring (drill) processing procedure; in insulated substrate, to make a plurality of through holes (through hole); and then in insulated substrate and each through hole surface coating last layer chemical copper; to form a plurality of vias (plated through hole); on insulated substrate, form wire pattern subsequently; and formation one deck is prevented welding flux layer on insulated substrate; in anti-welding flux layer, form a plurality of openings more at last; expose contact mat (contact pad), and in each contact mat surface coated layer protective layer.
The present invention provides a kind of manufacture method of printed circuit board (PCB) in addition, and this manufacture method includes the following step: an insulated substrate is provided; Carry out a boring processing procedure, in this insulated substrate, to form a plurality of through holes; In sidewall surfaces coating one deck chemical copper of this insulated substrate and these through holes, to form a plurality of vias; Form a wire pattern in this insulated substrate surface, this wire pattern comprises at least one contact mat.
Because the present invention is in an insulated substrate that removes the copper clad laminate (CCL) of Copper Foil or do not have the Copper Foil processing procedure of holing, copper clad laminate (CCL) thin thickness that its substrate thickness is more known, so can reduce the time and the energy of the required cost of boring, and can reduce the aperture of via and the time of etching Copper Foil, the density that is beneficial to produce the printed circuit board (PCB) of ultra-fine circuit and promotes circuit.
Description of drawings
Fig. 1 is the schematic diagram behind the Laser drill on the known double-sided printed-circuit board.
Fig. 2 to Fig. 8 is a double-sided printed-circuit board manufacture method schematic diagram of the present invention.
Symbol description:
30,50～insulated substrate
32,52～Copper Foil
34,54～through hole
56～chemical copper
57～via
58～photoresistance pattern
60～electro-coppering
62～anti-welding flux layer
64～opening
65～contact mat
66～protective layer
Embodiment
Your, see also following about detailed description of the present invention and accompanying drawing in order to make juror a nearlyer step understand feature of the present invention and technology contents.Yet appended graphic only for reference and aid illustration usefulness is not to be used for the present invention is limited.
Please refer to Fig. 2 to Fig. 8, Fig. 2 to Fig. 8 is a double-sided printed-circuit board manufacture method schematic diagram of the present invention.At first, one copper clad laminate (Copper clad laminate is provided, CCL), this copper clad laminate includes an insulated substrate and at least one Copper Foil covers the insulated substrate surface, and a top for example shown in Figure 2 and below all are coated with the insulated substrate 50 of one deck Copper Foil 52.Carry out an etch process then, the Copper Foil 52 on insulated substrate 50 surfaces is removed, only stay insulated substrate 50, as shown in Figure 3.The present invention also can directly use the insulated substrate of a no Copper Foil, replaces copper clad laminate (CCL), so more can save the etch process of a removal Copper Foil.
Then as shown in Figure 4, on insulated substrate 50, carry out a Laser drill processing procedure, in insulated substrate 50, to produce a plurality of through holes 54.Another embodiment forms the hole (via) that is positioned at circuit between each layer circuit board in order to conducting.
As shown in Figure 5, subsequently a surface coarsening processing procedure is carried out on insulated substrate 50 and each through hole 54 surface,, and then promote chemical copper the adhesion of insulated substrate 50 with each through hole 54 surface with the roughness of increase insulated substrate 50 with each through hole 54 surface.And then in the sidewall surfaces formation one deck chemical copper 56 of insulated substrate 50, to form a plurality of vias 57, as shown in Figure 5 with each through hole 54.
As shown in Figure 6, subsequently a photoresistance pattern 58 is transferred to insulated substrate 50 two sides, be used as shade (mask), and then carry out an electroplating process, with the surface that do not covered by photoresistance pattern 58 in insulated substrate 50 surfaces and the sidewall of each through hole 54, form one deck copper electroplating layer 60 as circuit, this circuit includes at least one contact mat (contact pad) 65.
Then as shown in Figure 7, carry out a removing photoresistance (strip) processing procedure, a stripping processing procedure for example, in order to remove the photoresistance pattern 58 on the insulated substrate 50, and then insulated substrate 50 carried out an etch process, originally be positioned under the photoresistance pattern 58 to remove, because of removing the chemical copper layers 56 that photoresistance pattern 58 backs expose.Generally speaking, the thickness of Copper Foil 52 is about 10～12 μ m usually, and the thickness of chemical copper layer 56 only is about 0.1～1 μ m usually, the thickness of the two differs very great disparity, yet Copper Foil 52 is removed on insulated substrate of the present invention 50 surfaces in advance, chemical copper layer 56 is only arranged, therefore when carrying out this etch process, aforesaid copper electroplating layer 60 surfaces and side are also simultaneously etched, that is to say, the present invention reduces all copper layer thickness on insulated substrate 50 surfaces especially, makes this etch process only need remove thickness and gets final product far below the chemical copper layer 56 of Copper Foil 52, therefore, aforesaid copper electroplating layer 60 (circuit) surface and the etched thickness of side greatly reduce, so not only can make more fine rule Lu Yike reduction line-spacing, significantly improve the density of wiring, and then produce the circuit board that meets the compact demand of present appliance and electronic.
As shown in Figure 8; evenly form the anti-welding flux layer 62 of one deck prior to insulated substrate 50 surfaces; utilize for example etched mode again; anti-welding flux layer 62 in contact mat 65 tops forms opening 64; to expose contact mat 65; form one decks at last again (Organic Solder Preservative, the OSP) protective layer 66 that material constituted such as grade are finished the processing procedure of double-sided printed-circuit board of the present invention by nickel (Ni)/gold (Au) or organic solderability preservative in contact mat 65 surface.
It should be noted that the present invention also is applicable to multilayer circuit board, the Copper Foil of its last layer and basecoat is removed, proceed aforesaid fabrication steps then.In addition, also can be again with organizing the circuit plank finished via aforementioned processing procedure with superimposed more, be made into multilayer circuit board.
Compared to known techniques, the present invention carries out the Laser drill processing procedure in an insulated substrate that removes the copper clad laminate (CCL) of Copper Foil or do not have a Copper Foil, copper clad laminate (CCL) thin thickness that its substrate thickness is more known, therefore can significantly reduce the time and the energy of the required cost of boring, and can effectively reduce the aperture of via and the time of the wire pattern that conventional etch has Copper Foil, the density that is beneficial to produce the printed circuit board (PCB) of ultra-fine circuit and promotes circuit.
Claims (18)
1, a kind of manufacture method of double-sided printed-circuit board, this manufacture method includes the following step:
Provide a copper clad laminate, and this copper clad laminate includes an insulated substrate and at least one Copper Foil covers this insulated substrate surface;
Carry out an etch process, remove this Copper Foil on this insulated substrate surface;
Carry out a boring processing procedure, in this insulated substrate, to form a plurality of through holes;
In the sidewall surfaces coating last layer chemical copper of this insulated substrate and these through holes, to form a plurality of vias;
Form a wire pattern in this insulated substrate surface, this wire pattern comprises at least one contact mat;
Form the anti-welding flux layer of one deck in this insulated substrate surface, and in this anti-welding flux layer, form at least one opening, to expose this contact mat;
In this contact mat surface coated layer protective layer.
2, the manufacture method of double-sided printed-circuit board according to claim 1, wherein this boring processing procedure is to be a Laser drill processing procedure.
3, the manufacture method of double-sided printed-circuit board according to claim 1, wherein before this chemical copper of coating, other includes this insulated substrate is carried out a surface-treated step, in order to increase the adhesion of this insulated substrate surface and this chemical copper.
4, the manufacture method of double-sided printed-circuit board according to claim 3, wherein this surface treatment is to be a surface coarsening processing procedure.
5, the manufacture method of double-sided printed-circuit board according to claim 1, the step that wherein forms this wire pattern includes in addition:
With a photoresistance pattern transfer to this insulated substrate surface;
Sidewall surfaces formation one deck electro-coppering in this insulated substrate surface with these through holes;
Carry out a removing photoresistance processing procedure;
This insulated substrate is carried out an etch process, to remove this chemical copper layer that comes out.
6, the manufacture method of double-sided printed-circuit board according to claim 5, wherein this removing photoresistance processing procedure is to be a stripping processing procedure, in order to remove this photoresistance pattern.
7, the manufacture method of double-sided printed-circuit board according to claim 1, wherein the material of this protective layer is to be nickel.
8, the manufacture method of double-sided printed-circuit board according to claim 1, wherein the material of this protective layer is to be gold.
9. the manufacture method of a printed circuit board (PCB), this manufacture method includes the following step:
One insulated substrate is provided;
Carry out a boring processing procedure, in this insulated substrate, to form a plurality of through holes;
In sidewall surfaces coating one deck chemical copper of this insulated substrate and these through holes, to form a plurality of vias;
Form a wire pattern in this insulated substrate surface, this wire pattern comprises at least one contact mat.
10. the manufacture method of printed circuit board (PCB) according to claim 9, wherein this boring processing procedure is a Laser drill processing procedure.
11. the manufacture method of printed circuit board (PCB) according to claim 9, wherein before this chemical copper of coating, other includes this insulated substrate is carried out a surface-treated step, in order to increase the adhesion of this insulated substrate surface and this chemical copper.
12. the manufacture method of printed circuit board (PCB) according to claim 11, wherein this surface treatment is to be a surface coarsening processing procedure.
13. the manufacture method of printed circuit board (PCB) according to claim 9, the step that wherein forms this wire pattern includes in addition:
With a photoresistance pattern transfer to this insulated substrate surface;
Sidewall surfaces in this insulated substrate and these through holes forms one deck electro-coppering;
Carry out a removing photoresistance processing procedure;
This insulated substrate is carried out an etch process, to remove this chemical copper layer that comes out.
14. the manufacture method of printed circuit board (PCB) according to claim 13, wherein this removing photoresistance processing procedure is to be a stripping processing procedure, in order to remove this photoresistance pattern.
15. the manufacture method of printed circuit board (PCB) according to claim 9, wherein after this insulated substrate surface formed a wire pattern, this manufacture method included the following step in addition:
Form the anti-welding flux layer of one deck in this insulated substrate surface, and in this anti-welding flux layer, form at least one opening, to expose this contact mat;
In this contact mat surface coated layer protective layer.
16. the manufacture method of printed circuit board (PCB) according to claim 15, wherein the material of this protective layer is to be nickel.
17. the manufacture method of printed circuit board (PCB) according to claim 15, wherein the material of this protective layer is to be gold.
18. the manufacture method of printed circuit board (PCB) according to claim 9, wherein this insulated substrate is the copper clad laminate that removes Copper Foil for.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410074575 CN1747629A (en) | 2004-09-07 | 2004-09-07 | Production of duoble-face printing circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410074575 CN1747629A (en) | 2004-09-07 | 2004-09-07 | Production of duoble-face printing circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1747629A true CN1747629A (en) | 2006-03-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410074575 Pending CN1747629A (en) | 2004-09-07 | 2004-09-07 | Production of duoble-face printing circuit board |
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| CN (1) | CN1747629A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101886761A (en) * | 2010-06-12 | 2010-11-17 | 友达光电股份有限公司 | LED light source module |
| CN102832138A (en) * | 2011-06-15 | 2012-12-19 | 景硕科技股份有限公司 | Method for forming packaging substrate with ultrathin seed layer |
| CN104768325A (en) * | 2014-01-08 | 2015-07-08 | 南亚电路板股份有限公司 | Printed circuit board and manufacturing method thereof |
| CN105050327A (en) * | 2015-07-06 | 2015-11-11 | 深圳崇达多层线路板有限公司 | Manufacturing method for printed circuit board covered with coating copper layers |
| CN105398143A (en) * | 2015-12-25 | 2016-03-16 | 广东生益科技股份有限公司 | Making method of ultrafine line printed circuit board |
-
2004
- 2004-09-07 CN CN 200410074575 patent/CN1747629A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101886761A (en) * | 2010-06-12 | 2010-11-17 | 友达光电股份有限公司 | LED light source module |
| CN101886761B (en) * | 2010-06-12 | 2012-08-01 | 友达光电股份有限公司 | LED light source module |
| CN102832138A (en) * | 2011-06-15 | 2012-12-19 | 景硕科技股份有限公司 | Method for forming packaging substrate with ultrathin seed layer |
| CN104768325A (en) * | 2014-01-08 | 2015-07-08 | 南亚电路板股份有限公司 | Printed circuit board and manufacturing method thereof |
| CN104768325B (en) * | 2014-01-08 | 2018-03-23 | 南亚电路板股份有限公司 | Printed circuit board and manufacturing method thereof |
| CN105050327A (en) * | 2015-07-06 | 2015-11-11 | 深圳崇达多层线路板有限公司 | Manufacturing method for printed circuit board covered with coating copper layers |
| CN105398143A (en) * | 2015-12-25 | 2016-03-16 | 广东生益科技股份有限公司 | Making method of ultrafine line printed circuit board |
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