CN105050327A - Manufacturing method for printed circuit board covered with coating copper layers - Google Patents
Manufacturing method for printed circuit board covered with coating copper layers Download PDFInfo
- Publication number
- CN105050327A CN105050327A CN201510392098.4A CN201510392098A CN105050327A CN 105050327 A CN105050327 A CN 105050327A CN 201510392098 A CN201510392098 A CN 201510392098A CN 105050327 A CN105050327 A CN 105050327A
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- CN
- China
- Prior art keywords
- copper
- circuit board
- hole
- printed circuit
- copper foil
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a manufacturing method for a printed circuit board coveried with coating copper layers, and relates to the circuit board production and manufacturing technology field. The manufacturing method comprises the following steps: firstly, a circuit board with a surface covered with copper foil is provided, part of copper is etched in a position, corresponding to a position of the circuit board needing drilling of a through hole, of the copper foil surface, thus a recess groove is formed in the copper foil surface, and the size of the recess groove is more than the hole diameter of through hole; secondly, the through hole in the first step is drilled; thirdly, full plate electroplating is carried out, and thus the surface of the circuit board and the inner wall of the through hole are covered with copper layersl fourthly, the through hole is subjected to resin filling, the resin for filling is subjected to flatting processing, and thus the outer surface of the covering copper layer is flat. The manufacturing method facilitates to remove the filling resin at the dense hole, manufacturing of copper coating is carried out after part of the recess groove is subjected to electrocoppering, and electrocoppering in the recess groove leaves copper reduction allowance for board wearing, and facilities flatting processing of the hole position. In addition, the contact area of the covered copper layer and the surface copper foil of the circuit board are increased, and the bonding strength is high.
Description
Technical field
The present invention relates to board production manufacture technology field, particularly relate to a kind of manufacture method with coated layers of copper printed circuit board.
Background technology
At present, the production method with coated layers of copper printed circuit board is as follows: after common copper-clad plate holes drilled through, and hole copper is plated to certain thickness with the copper of table copper is thick by plate electricity, with resin, hole is filled, after resin solidification, polishing Excess resin, control polishing number of times and subtract copper amount, completing copper-clad and make.There is following defect in this way: complete thick end copper, coated copper and the lid of comprising of the circuit board copper after making and cover copper, the copper of circuit board is thick, is unfavorable for the making of fine-line; And polishing resin process need control polishing number of times and subtract copper amount, in order to avoid polishing excessively.
The patent No. 201310173872.3 discloses a kind of manufacture method with the printed circuit board (PCB) of coated layers of copper and makes, provide a kind of coated copper layer process, it utilizes sputter process, electron beam deposition, chemical vapour deposition or its combining form are losing layer without copper base depositing one deck alkali resistant, pressing one deck Copper Foil on alkali resistant erosion layer afterwards, window and use alkaline etching liquid to remove the Copper Foil needing drill hole, expose alkali resistant erosion layer, substrate is drilled at the place of windowing, parcel hole wall is formed after plate electricity, the copperizing continuously layer of alkali resistant erosion layer and Copper Foil, by hole resin filling, after solidification, make surface smooth through grinding process, complete copper-clad to make.There is following defect in this way: the making of alkali resistant erosion layer needs special equipment, and general factory, without this condition, acquires a certain degree of difficulty during practical application.
Summary of the invention
For the defect of above-mentioned manufacture method, this invention exploits a kind of method of comparatively easy coated layers of copper printed circuit board, leave abundance subtract copper amount to resin polishing, meet reliability requirement and fine-line makes and must ask simultaneously, concrete scheme is as follows:
There is a manufacture method for coated layers of copper printed circuit board, comprise the following steps:
S1 provides a surface to be covered with the circuit board of Copper Foil, and needed for copper foil surface corresponding circuits plate, the position of holes drilled through etches away part copper, makes it form groove at copper foil surface, and the size of described groove is greater than the aperture of described through hole;
S2 gets out the through hole described in step S1;
S3 electric plating of whole board makes circuit board surface, the coated layers of copper of described through-hole wall;
S4 carries out filling holes with resin to through hole, and the resin planarization to consent, make the outer surface of coated layers of copper smooth.
Further, in described step S1, Tong Hou≤5.5 μm of bottom portion of groove, if bottom portion of groove copper is thick be less than 5.5 μm, copper sheet has foaming risk; Preferably, described groove is circular, and groove, than monolateral large 90 μm of through hole, because drilling hole position precision and boring aperture precision are 0.076mm, during lower than this value, has the inclined hole of brill and aperture to exceed the risk of size of windowing; Depth of groove is 4-6 μm or 7-9 μm, and depth of groove is crossed can increase the copper-plated difficulty of plating deeply.
The position of holes drilled through needed for copper foil surface corresponding circuits plate etches away the method for part copper: paste dry film at copper foil surface, after exposure, development, the position making dry film correspondence need form groove forms window, then etches the Copper Foil being exposed to the window's position with acidic etching liquid.
Further, described acidic etching liquid carries out etching method to the Copper Foil being exposed to the window's position and is: Cu in the etching cylinder controlling to subtract copper cash
2+concentration 110-150g/L, proportion 1.23-1.33, acidity 1.5-3.8N, temperature 48-52 DEG C, upper Stress control is at 0.8-2.0kg/cm
2, downforce controls at 0.8-1.5kg/cm
2, etching cylinder length is 2m; When being etched to Copper Foil depth of groove value 4-6 μm, circuit board transfer rate in etching cylinder controls at 5.8-6.0m/min; When being etched to Copper Foil depth of groove value 7-9 μm, circuit board transfer rate in etching cylinder controls at 5.5-5.7m/min.
Further, in described step S2, described through hole adopts machine drilling to get out, Kong Jing≤0.2mm; And it should be noted that, this through hole also can do cecutiency buried via hole.
Further, in described step S4, the method of resin planarization is: after filling holes with resin, by circuit board 150 DEG C baking 60min, after resin solidification, circuit board is polished by the following stated abrasive parameters and remove Excess resin 2 times: abrasive band order number 600 order, transfer rate 3m/min, nog plate power 1-1.2kw.The thick about 4-8 μm of the copper polished off by this parameter.
The present invention adopts turn on window, is exposed by the Copper Foil on filling holes with resin position, etches away a part of copper form groove by the mode that chemistry subtracts copper, after through boring, the plating of whole plate, consent, smooth process is made into has coated layers of copper printed circuit board.In this manufacturing process, the control that the degree of depth of groove, chemistry subtract copper etching speed is key point of the present invention, and technique of the present invention can well control the manufacturing process further groove degree of depth; Groove part is after electro-coppering, copper is thick to maintain an equal level with table copper, and the process of planarization nog plate can thinning table copper, but the copper facing of groove part increases the thickness of hole site coated copper, electro-coppering in groove is that nog plate leaves and subtracts copper surplus, therefore, the groove after copper facing is not only conducive to the making of coated copper, also helps the planarization of hole site.In addition, coated layers of copper and circuit board surface Copper Foil contact area increase, and bond strength is stronger.And compare the manufacture method of patent 201310173872.3, method of the present invention is not high to equipment requirement, and available circuit plate production equipment can make.
Accompanying drawing explanation
Fig. 1 is the cutaway view that the surface of the embodiment of the present invention is covered with copper foil circuit board.
Fig. 2 is the cutaway view after Fig. 1 circuit board surface pastes dry film.
Fig. 3 is the cutaway view after Fig. 2 circuit board surface dry film is windowed.
Fig. 4 is the etching of Fig. 3 circuit board, moves back the cutaway view of dry film rearward recess position.
Fig. 5 is the cutaway view after the holes drilled through of Fig. 4 further groove position.
Fig. 6 is the cutaway view of lead to the hole site after circuit board electroplating.
Fig. 7 is the cutaway view in Fig. 6 after through hole filling holes with resin.
Fig. 8 is the cutaway view in Fig. 7 after the smooth process of plug socket resin.
Embodiment
In order to more fully understand technology contents of the present invention, below in conjunction with specific embodiment technical scheme of the present invention being introduced further and illustrating.
Embodiment
Adopt preventing wrinkle method typesetting to multi-layer sheet and carry out lamination treatment, obtain circuit board as shown in Figure 1, circuit board comprises the Copper Foil 2 on substrate 1 two surfaces relative to being positioned at substrate;
As shown in Figure 2, circuit board two sides after super roughening treatment is pasted dry film 3; As shown in Figure 3, after exposure, development, the position making dry film correspondence need form groove forms circular window 31 and exposes end copper, monolateral large 90 μm of holes drilled through needed for the monolateral ratio of window (required holes drilled through aperture 0.3mm).
Circuit board after above-mentioned process is placed in the Copper Foil subtracting copper cash etching certain depth; Control Cu in etching cylinder
2+concentration 110-150g/L, proportion 1.23-1.33, acidity 1.5-3.8N, temperature 48-52 DEG C, upper Stress control is at 0.8-2.0kg/cm
2, downforce controls at 0.8-1.5kg/cm
2, etching cylinder length is 2m; As shown in Figure 4, when being etched to Copper Foil groove 21 depth value 4-6 μm, circuit board transfer rate in etching cylinder controls at 5.8-6.0m/min; When being etched to Copper Foil groove 21 depth value 7-9 μm, circuit board transfer rate in etching cylinder controls at 5.5-5.7m/min.
Return dry film, and utilize borehole data machine drilling to get out groove location through hole 11 (as shown in Figure 5).
Outer heavy copper backlight test need reach more than 9.5 grades; Then electric plating of whole board coated copper 4 (as shown in Figure 6), according to wrapcopper requirement, secondary standard >=5 μm, thick 12 ± 5 μm of electro-coppering; Grade III Standard >=12 μm, thick 18 ± 5 μm of electro-coppering; Outer graphics plating again, windows through hole position, window large 0.1mm more monolateral than through hole; Through hole copper is electroplated onto customer requirement copper thick (as shown in Figure 6);
Adopt vacuum resin hole plugging machine after moving back film, resin 5 (as shown in Figure 7) will be filled up in through hole; After filling holes with resin, by circuit board 150 DEG C baking 60min, after resin solidification, circuit board is polished by the following stated abrasive parameters and remove Excess resin 2 times: abrasive band order number 600 order, transfer rate 3m/min, nog plate power 1-1.2kw.
The above only further illustrates technology contents of the present invention with embodiment, so that reader is easier to understand, but does not represent embodiments of the present invention and is only limitted to this, and any technology done according to the present invention extends or recreation, all by protection of the present invention.
Claims (8)
1. there is a manufacture method for coated layers of copper printed circuit board, it is characterized in that, comprise the following steps:
S1 provides a surface to be covered with the circuit board of Copper Foil, and needed for copper foil surface corresponding circuits plate, the position of holes drilled through etches away part copper, makes it form groove at copper foil surface, and the size of described groove is greater than the aperture of described through hole;
S2 gets out the through hole described in step S1;
S3 electric plating of whole board makes circuit board surface, the coated layers of copper of described through-hole wall;
S4 carries out filling holes with resin to through hole, and the resin planarization to consent, make the outer surface of coated layers of copper smooth.
2. the manufacture method with coated layers of copper printed circuit board according to claim 1, is characterized in that, in described step S1, the copper of bottom portion of groove is thick≤and 5.5 μm.
3. the manufacture method with coated layers of copper printed circuit board according to claim 2, is characterized in that, described groove is circular, and groove is than monolateral large 90 μm of through hole.
4. the manufacture method with coated layers of copper printed circuit board according to claim 3, is characterized in that, the degree of depth of described groove is 4-6 μm or 7-9 μm.
5. the manufacture method with coated layers of copper printed circuit board according to claim 4, it is characterized in that, in described step S1, the position of holes drilled through needed for copper foil surface corresponding circuits plate etches away the method for part copper: paste dry film at copper foil surface, after exposure, development, the position making dry film correspondence need form groove forms window, then etches the Copper Foil being exposed to the window's position with acidic etching liquid.
6. the manufacture method with coated layers of copper printed circuit board according to claim 5, is characterized in that, described acidic etching liquid carries out etching method to the Copper Foil being exposed to the window's position and is: Cu in the etching cylinder controlling to subtract copper cash
2+concentration 110-150g/L, proportion 1.23-1.33, acidity 1.5-3.8N, temperature 48-52 DEG C, upper Stress control is at 0.8-2.0kg/cm
2, downforce controls at 0.8-1.5kg/cm
2, etching cylinder length is 2m, and circuit board transfer rate in etching cylinder controls at 5.5-6.0m/min.
7. the manufacture method with coated layers of copper printed circuit board according to claim 1, is characterized in that, in described step S2, described through hole adopts machine drilling to get out, Kong Jing≤0.2mm.
8. the manufacture method with coated layers of copper printed circuit board according to claim 1, it is characterized in that, in described step S4, the method of resin planarization is: after filling holes with resin, by circuit board 150 DEG C baking 60min, after resin solidification, circuit board is polished by the following stated abrasive parameters and remove Excess resin 2 times: abrasive band order number 600 order, transfer rate 3m/min, nog plate power 1-1.2kw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510392098.4A CN105050327A (en) | 2015-07-06 | 2015-07-06 | Manufacturing method for printed circuit board covered with coating copper layers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510392098.4A CN105050327A (en) | 2015-07-06 | 2015-07-06 | Manufacturing method for printed circuit board covered with coating copper layers |
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| Publication Number | Publication Date |
|---|---|
| CN105050327A true CN105050327A (en) | 2015-11-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510392098.4A Pending CN105050327A (en) | 2015-07-06 | 2015-07-06 | Manufacturing method for printed circuit board covered with coating copper layers |
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| CN (1) | CN105050327A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107135615A (en) * | 2017-04-27 | 2017-09-05 | 开平依利安达电子第三有限公司 | A kind of thick copper printed circuit board (PCB) and drilling method |
| CN109168251A (en) * | 2018-11-23 | 2019-01-08 | 开平依利安达电子第三有限公司 | A kind of pcb board with probe aperture |
| CN112739064A (en) * | 2020-12-02 | 2021-04-30 | 惠州市特创电子科技股份有限公司 | Circuit board and browning process thereof |
| CN112752408A (en) * | 2020-12-02 | 2021-05-04 | 惠州市特创电子科技股份有限公司 | Circuit board assembly |
| CN114745853A (en) * | 2022-03-30 | 2022-07-12 | 金禄电子科技股份有限公司 | Hole machining method for ultra-thick copper plate |
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2015
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Non-Patent Citations (1)
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107135615A (en) * | 2017-04-27 | 2017-09-05 | 开平依利安达电子第三有限公司 | A kind of thick copper printed circuit board (PCB) and drilling method |
| CN109168251A (en) * | 2018-11-23 | 2019-01-08 | 开平依利安达电子第三有限公司 | A kind of pcb board with probe aperture |
| CN112739064A (en) * | 2020-12-02 | 2021-04-30 | 惠州市特创电子科技股份有限公司 | Circuit board and browning process thereof |
| CN112752408A (en) * | 2020-12-02 | 2021-05-04 | 惠州市特创电子科技股份有限公司 | Circuit board assembly |
| CN112752408B (en) * | 2020-12-02 | 2021-12-07 | 惠州市特创电子科技股份有限公司 | Circuit board assembly |
| CN112739064B (en) * | 2020-12-02 | 2021-12-07 | 惠州市特创电子科技股份有限公司 | Circuit board and browning process thereof |
| CN114745853A (en) * | 2022-03-30 | 2022-07-12 | 金禄电子科技股份有限公司 | Hole machining method for ultra-thick copper plate |
| CN114745853B (en) * | 2022-03-30 | 2023-07-21 | 金禄电子科技股份有限公司 | Hole processing method of ultra-thick copper plate |
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Application publication date: 20151111 |
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