CN112739064A - Circuit board and browning process thereof - Google Patents
Circuit board and browning process thereof Download PDFInfo
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- CN112739064A CN112739064A CN202011385743.7A CN202011385743A CN112739064A CN 112739064 A CN112739064 A CN 112739064A CN 202011385743 A CN202011385743 A CN 202011385743A CN 112739064 A CN112739064 A CN 112739064A
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- copper
- plate
- hole
- resin plug
- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The application provides a circuit board and a browning process thereof. The browning process of the circuit board comprises the following steps: drilling the plate to form a through hole in the plate; carrying out copper deposition operation on the plate after drilling to form a first copper layer on the plate; molding a resin plug piece to form a through hole; carrying out copper slurry pouring operation on the through hole of the plate after the copper deposition operation; inserting the resin plug piece into the through hole of the plate, so that the copper paste part overflows to the surface of the resin plug piece through the through hole; providing a copper covering body, and enabling the copper covering body to be matched with the step hole; and mounting the copper covering body in the step hole, so that the copper covering body is connected with the resin plug piece through copper paste. Because the second copper layer covers the surface of the first copper layer and the copper covering body on the two sides of the plate respectively, the browning layer is only formed on the surface of the second copper layer, the situation that browning cannot be carried out in the copper paste plug holes of the circuit board is avoided, and the pressing binding force of the circuit board is greatly improved.
Description
Technical Field
The invention relates to the technical field of circuit board production, in particular to a circuit board and a browning process thereof.
Background
The conductive copper paste is a composition comprising copper powder, thermosetting resin and solvent, has the characteristics of high reliability, high conductivity and the like, and plays an important role in the hole plugging process of a circuit board. The brown oxidation is used as the first step of the laminating process of the circuit board and is an essential process in the circuit board pressing process. The browning is that the copper surface is subjected to certain microetching by a chemical method to generate a microcosmic uneven surface shape and increase the contact area of the copper surface, and the microetched copper surface reacts with an inner layer bonding agent to generate an organic metal conversion film so as to enhance the bonding force of the inner layer copper and resin, thereby enhancing the thermal shock resistance and the delamination resistance of the circuit board. Therefore, the difference of browning effect can directly determine the pressing bonding force between the copper surface and the prepreg, and when the bonding force is insufficient, medium delamination is easily caused in pressing, and even the production plate is scrapped.
However, in the traditional brown oxidation process of the circuit board, in the brown oxidation process of the circuit board, the situation that brown oxidation cannot be performed exists in the copper paste plug hole of the circuit board, so that the press bonding force of the circuit board is poor, and the circuit board is scrapped due to board explosion in the copper paste plug hole.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a circuit board with good circuit board pressing and bonding force and a browning process thereof.
The purpose of the invention is realized by the following technical scheme:
a browning process of a circuit board comprises the following steps:
drilling a plate to form a through hole in the plate;
carrying out copper deposition operation on the plate after drilling to enable the plate to be provided with a first copper layer, wherein a step hole communicated with the through hole is formed in the first copper layer, and the diameter of the step hole is larger than that of the through hole;
molding a resin plug piece, so that a through hole is formed in the resin plug piece;
carrying out copper slurry pouring operation on the through hole of the plate after the copper deposition operation;
plugging the resin plug piece into the through hole of the plate, so that the copper paste part overflows to the surface of the resin plug piece through the through hole;
providing a copper covering body, and enabling the copper covering body to be matched with the step hole;
mounting the copper covering body in the step hole, and connecting the copper covering body with the resin plug piece through copper paste;
carrying out copper reduction operation on the plate subjected to the hole plugging operation so as to reduce the thickness of the first copper layer of the plate;
performing plate plating operation on the plate subjected to the copper reduction operation to enable a first copper layer of the circuit board and the surface of the copper covering body, which is far away from the resin plug body, to be respectively formed with a second copper layer;
and performing brown oxidation treatment on the plate after the plate plating operation.
In one embodiment, the maximum diameter of the resin plug is adapted to the through hole.
In one embodiment, the resin plug is of a frustum structure.
In one embodiment, the thickness of the copper cladding is greater than or equal to the depth of the stepped hole.
In one embodiment, the number of the resin plugs and the copper covering bodies is two, and the two resin plugs and the two copper covering bodies are arranged in one-to-one correspondence; the number of the step holes is two, the two step holes are respectively arranged on two sides of the plate, and each resin plug is respectively arranged in the corresponding step hole.
In one embodiment, the step of plugging the resin plug into the through hole of the plate and enabling the copper paste part to overflow to the surface of the resin plug through the through hole is specifically as follows: inserting the two resin plug pieces into the through holes from two sides of the plate respectively, so that copper paste parts respectively overflow to the surfaces of the resin plug pieces through the through holes of the two resin plug pieces;
the step of mounting the copper cover body in the stepped hole so that the copper cover body is connected to the resin plug member through copper paste includes:
mounting one of the copper overlays in one of the stepped holes;
turning the circuit board for 180 degrees;
and installing another copper covering body in another step hole.
In one embodiment, the thickness of the second copper layer is equal to the thickness of the first copper layer after thinning.
In one embodiment, before the step of performing the brown oxidation treatment on the plate after the plate plating operation and after the step of performing the plate plating operation on the plate after the copper reduction operation, the brown oxidation process further includes:
carrying out inner layer circuit treatment on the plate after the plate plating operation so as to process an inner layer circuit on the surface of the plate;
the method for performing brown oxidation treatment on the plate after plate plating operation comprises the following steps: and performing brown oxidation treatment on the plate after the inner-layer line treatment.
In one embodiment, the step of performing a copper reduction operation on the plate after the plugging operation comprises:
respectively pasting dry films on two sides of the plate after hole plugging operation;
carrying out exposure and development operation on the plate with the dry film attached to the plate so as to remove the dry film corresponding to the first copper layer to be thinned;
etching the dry film after the developing operation to reduce the thickness of the first copper layer of the plate;
and removing the dry film on the surface of the plate after etching.
A brown oxidation treatment is carried out on the circuit board by adopting the brown oxidation process of the circuit board in any embodiment.
Compared with the prior art, the invention has at least the following advantages:
firstly, drilling a plate to form a through hole; then carrying out copper deposition operation on the drilled plate to enable the plate to be provided with a first copper layer, wherein a step hole communicated with the through hole is formed in the first copper layer, and the diameter of the step hole is larger than that of the through hole; then molding a resin plug piece to form a through hole on the resin plug piece; then carrying out copper slurry filling operation on the through hole of the plate after the copper deposition operation, so that the through hole is filled with copper slurry; then plugging the resin plug piece into the through hole of the plate, so that the copper paste part overflows to the surface of the resin plug piece through the through hole, namely the copper paste part overflows to the end face of the resin plug piece, which is adjacent to the surface of the plate; then providing a copper covering body, and enabling the copper covering body to be matched with the step hole; then installing the copper covering body in the step hole, connecting the copper covering body with the resin plug piece through copper paste, and firmly connecting the copper covering body with the resin plug piece after the copper paste is solidified; then, carrying out copper reduction operation on the plate subjected to the hole plugging operation so as to reduce the thickness of the first copper layer of the plate; then, plate plating operation is carried out on the plate subjected to the copper reducing operation, so that second copper layers are respectively formed on the first copper layers on the two sides of the plate and the surface, away from the resin plug body, of the copper-clad cover body, and the second copper layers are respectively covered on the first copper layers of the circuit board and the surface of the copper-clad cover body; and finally, performing browning treatment on the plate after the plate plating operation, wherein the second copper layer is respectively covered on the surfaces of the first copper layer and the copper covering body on the two sides of the plate, so that the browning layer is only formed on the surface of the second copper layer, the situation that browning cannot be performed in the copper paste plug hole of the circuit board is avoided, and the pressing binding force of the circuit board is greatly improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a flow diagram of a browning process for a circuit board according to an embodiment;
FIG. 2 is a schematic structural diagram of a circuit board obtained by browning treatment of the browning process of the circuit board shown in FIG. 1;
fig. 3 is a cross-sectional view of the connection of the intermediate conductive post and the copper covering body of the circuit board shown in fig. 2;
FIG. 4 is a schematic structural view of a resinous plug of the intermediate conductive post of FIG. 3;
FIG. 5 is a schematic structural diagram of a circuit board according to another embodiment;
fig. 6 is a flow chart of step S107 of the browning process of the wiring board shown in fig. 1.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The application provides a browning process of a circuit board, which comprises the following steps: drilling a plate to form a through hole in the plate; carrying out copper deposition operation on the plate after drilling to enable the plate to be provided with a first copper layer, wherein a step hole communicated with the through hole is formed in the first copper layer, and the diameter of the step hole is larger than that of the through hole; molding a resin plug piece, so that a through hole is formed in the resin plug piece; carrying out copper slurry pouring operation on the through hole of the plate after the copper deposition operation; plugging the resin plug piece into the through hole of the plate, so that the copper paste part overflows to the surface of the resin plug piece through the through hole; providing a copper covering body, and enabling the copper covering body to be matched with the step hole; mounting the copper covering body in the step hole, and connecting the copper covering body with the resin plug piece through copper paste; carrying out copper reduction operation on the plate subjected to the hole plugging operation so as to reduce the thickness of the first copper layer of the plate; performing plate plating operation on the plate subjected to the copper reduction operation to enable a first copper layer of the circuit board and the surface of the copper covering body, which is far away from the resin plug body, to be respectively formed with a second copper layer; and performing brown oxidation treatment on the plate after the plate plating operation.
The browning process of the circuit board comprises the steps of firstly, drilling a plate to form a through hole; then carrying out copper deposition operation on the drilled plate to enable the plate to be provided with a first copper layer, wherein a step hole communicated with the through hole is formed in the first copper layer, and the diameter of the step hole is larger than that of the through hole; then molding a resin plug piece to form a through hole on the resin plug piece; then carrying out copper slurry filling operation on the through hole of the plate after the copper deposition operation, so that the through hole is filled with copper slurry; then plugging the resin plug piece into the through hole of the plate, so that the copper paste part overflows to the surface of the resin plug piece through the through hole, namely the copper paste part overflows to the end face of the resin plug piece, which is adjacent to the surface of the plate; then providing a copper covering body, and enabling the copper covering body to be matched with the step hole; then installing the copper covering body in the step hole, connecting the copper covering body with the resin plug piece through copper paste, and firmly connecting the copper covering body with the resin plug piece after the copper paste is solidified; then, carrying out copper reduction operation on the plate subjected to the hole plugging operation so as to reduce the thickness of the first copper layer of the plate; then, carrying out plate plating operation on the plate subjected to the copper reducing operation, so that second copper layers are formed on the first copper layers on the two sides of the plate and the surface, away from the resin plug body, of the copper-clad cover body respectively, and the second copper layers are covered on the first copper layers on the two sides of the plate and the surface of the copper-clad cover body respectively; and finally, performing browning treatment on the plate after the plate plating operation, wherein the second copper layer is respectively covered on the surfaces of the first copper layer and the copper covering body on the two sides of the plate, so that the browning layer is only formed on the surface of the second copper layer, the situation that browning cannot be performed in the copper paste plug hole of the circuit board is avoided, and the pressing binding force of the circuit board is greatly improved.
Fig. 1 is a flow chart of a browning process of a circuit board according to an embodiment.
The browning process of the circuit board of an embodiment is used for conducting browning treatment on the circuit board. In one embodiment, the browning process includes some or all of the following steps:
s101, drilling is conducted on the plate, and a through hole is formed in the plate.
Referring to fig. 2 together, in the present embodiment, the plate member 100 is drilled to form a through-hole 110.
S103, carrying out copper deposition operation on the drilled plate to enable the plate to be formed with a first copper layer.
Referring to fig. 2, in the present embodiment, a copper deposition operation is performed on the drilled plate 100, so that the plate is formed with a first copper layer 200 formed with a stepped hole 120 communicating with the through hole 110, and the diameter of the stepped hole is greater than that of the through hole. Of course, the first copper layer 200 can also be formed on the inner wall of the board with the through hole 110 and the step hole 120. Further, the plate after drilling is subjected to copper deposition through an electroless copper plating process, so that the plate forms a first copper layer. Specifically, the through hole and the stepped hole are circular holes, so that the shapes of the through hole and the stepped hole are simpler. In other embodiments, the through hole and the step hole can also be elliptical holes, so that the processing difficulty of the through hole and the step hole is low.
And S105, forming a resin plug piece, and enabling the resin plug piece to be provided with a through hole.
Referring to fig. 2 and 3 together, in the present embodiment, a resin plug member 310 is molded such that it is formed with a through-hole 312, i.e., the through-hole is completely penetrated in an axial direction of the resin plug member, so that subsequent copper paste can overflow from one end surface of the resin plug member to the other end surface of the resin plug member through the through-hole.
And S107, carrying out copper slurry pouring operation on the through holes of the plate after the copper deposition operation.
Referring to fig. 2, in this embodiment, the through hole of the plate after the copper deposition operation is subjected to a copper slurry filling operation, so that the copper slurry is filled in a predetermined depth position of the inner wall of the through hole. The copper paste is poured into the through hole 110 in advance, so that the copper paste is in contact with the inner wall of the through hole 110 in advance, the connection between the copper paste and the inner wall of the through hole 110 is more tight and firm, and the improvement of the conductivity of the through hole 110 is facilitated.
S109, plugging the resin plug piece into the through hole of the plate, and enabling the copper paste part to overflow to the surface of the resin plug piece through the through hole.
Referring to fig. 2 and 3 together, in the present embodiment, the resin plug 310 is plugged into the through-hole of the plate member such that a portion of the copper paste overflows through the through-hole to the surface of the resin plug, even though the copper paste can overflow from one end face of the resin plug to the other end face of the resin plug through the through-hole.
S111, providing a copper covering body, and enabling the copper covering body to be matched with the step hole.
Referring to fig. 2 together, in the present embodiment, a copper covering body 600 is provided to fit the copper covering body to the stepped hole 210, even if the outer size of the copper covering body is fitted to the stepped hole, thereby reliably connecting the copper covering body to the inner wall of the stepped hole. It can be understood that the surface of the copper covering is covered with the copper layer, so that the copper covering has conductivity, and the copper covering can be electrically connected with the copper layer on the surface of the board body.
S113, mounting the copper covering body in the step hole, and connecting the copper covering body with the resin plug piece through copper paste.
Referring to fig. 2 and 3 together, in the present embodiment, the copper covering body 600 is installed in the stepped hole 210, so that the copper covering body is connected with the resin plug member through copper paste, even if the copper covering body 600 is connected with the resin plug member through the copper paste overflowing the end surface of the resin plug member 310 by curing, the copper paste is cured to form a copper paste block 320, so that the copper covering body 600 is firmly connected with the resin plug member 310 through the copper paste block 320, and the copper covering body is electrically conducted through the cured copper paste, thereby ensuring the electrical conductivity of the through hole.
S115, carrying out copper reducing operation on the plate subjected to the hole plugging operation so as to reduce the thickness of the first copper layer of the plate.
In this embodiment, the plate after the hole plugging operation is subjected to a copper reducing operation to reduce the thickness of the first copper layer 200 of the plate, so as to avoid the excessive thickness of the first copper layers 200 on both sides of the plate.
And S117, performing plate plating operation on the plate subjected to the copper reducing operation to enable a first copper layer of the circuit board and the surface of the copper covering body, which is far away from the resin plug body, to be respectively formed with a second copper layer.
Referring to fig. 2 and 3, in this embodiment, the board after the copper reduction operation is plated to form a second copper layer 400 on the surfaces of the first copper layer 200 and the copper covering body 600 of the circuit board, which are away from the resin plug body 320, respectively, even if the second copper layer 400 is formed and covered on the surface of the board, the copper covering body is firmly connected with the first copper layer through the second copper layer, so that the connection strength between the copper covering body and the first copper layer is further improved, and the conductivity between the copper covering body and the copper layer on the surface of the board is ensured.
S119, performing brown oxidation treatment on the plate after the plate plating operation.
Referring to fig. 2, in the present embodiment, the plate after the plate plating operation is subjected to a browning treatment, so that a browning layer is formed on the surface of the second copper layer 400, i.e., a browning layer 500 is formed on the surface of the plate.
The browning process of the circuit board comprises the steps of firstly, drilling a plate to form a through hole; then carrying out copper deposition operation on the drilled plate to enable the plate to be provided with a first copper layer, wherein a step hole communicated with the through hole is formed in the first copper layer, and the diameter of the step hole is larger than that of the through hole; then molding a resin plug piece to form a through hole on the resin plug piece; then carrying out copper slurry filling operation on the through hole of the plate after the copper deposition operation, so that the through hole is filled with copper slurry; then plugging the resin plug piece into the through hole of the plate, so that the copper paste part overflows to the surface of the resin plug piece through the through hole, namely the copper paste part overflows to the end face of the resin plug piece, which is adjacent to the surface of the plate; then providing a copper covering body, and enabling the copper covering body to be matched with the step hole; then installing the copper covering body in the step hole, connecting the copper covering body with the resin plug piece through copper paste, and firmly connecting the copper covering body with the resin plug piece after the copper paste is solidified; then, carrying out copper reduction operation on the plate subjected to the hole plugging operation so as to reduce the thickness of the first copper layer of the plate; then, carrying out plate plating operation on the plate subjected to the copper reducing operation, so that second copper layers are formed on the first copper layers on the two sides of the plate and the surface, away from the resin plug body, of the copper-clad cover body respectively, and the second copper layers are covered on the first copper layers on the two sides of the plate and the surface of the copper-clad cover body respectively; and finally, performing browning treatment on the plate after the plate plating operation, wherein the second copper layer is respectively covered on the surfaces of the first copper layer and the copper covering body on the two sides of the plate, so that the browning layer is only formed on the surface of the second copper layer, the situation that browning cannot be performed in the copper paste plug hole of the circuit board is avoided, and the pressing binding force of the circuit board is greatly improved.
In one of them embodiment, the maximum diameter of resin stopper with through-hole looks adaptation, promptly the maximum diameter of resin stopper with the internal diameter of through-hole equals, makes resin stopper and through-hole transition cooperation, avoids causing the problem that the plate warp when leading to the equipment because of the resin stopper is too big, or causes the problem that easily overflows in the copper thick liquid curing process because of the resin stopper undersize, and then makes the resin stopper better block up the through-hole.
Referring to fig. 2 to 4, in one embodiment, the resin plug is of a frustum structure, so that in the process of plugging the resin plug into the through hole 110, copper paste in the through hole 110 can quickly enter a gap between the resin plug and the inner wall of the through hole 110, and thus a copper paste block formed by curing the copper paste is connected to the resin plug to form a frustum structure, so that the resin plug is connected with the inner wall of the through hole 110 through the copper paste block. It is understood that in other embodiments, the resin plugs are not limited to the frustum structure, but may be conical structures.
Further, after the step S113 of mounting the copper cover body in the stepped hole so that the copper cover body is connected to the resin plug by copper paste, and before the step S115 of performing a copper reduction operation on the plate after the tap hole operation, the brown oxidation process further includes: carry out the solidification operation to the plate, make the copper thick liquid solidification form the copper thick liquid piece, make copper cover body and resin plug member reliably be connected, avoid follow-up behind the consent operation the plate subtracts the in-process of copper operation and touches the copper cover body and lead to the situation that the copper cover body drops.
Further, the step of mounting the copper covering body in the stepped hole to connect the copper covering body with the resin plug member through copper paste is specifically: will copper cover body install in it is downthehole, make copper cover body pass through copper thick liquid with the resin plug member is connected to make copper thick liquid part impress on the inner wall in copper cover body and step hole, make like this between copper cover body and the resin plug member, all cover between copper cover body and the step hole inner wall and have copper thick liquid, treat copper thick liquid solidification back, make copper cover body firmly be connected with resin plug member and step hole inner wall respectively, avoid the situation that copper cover body pine takes off better, can reduce simultaneously after heavy copper operation the control degree of difficulty of the copper thick liquid volume of copper thick liquid operation is gone into to the through-hole of plate, unnecessary copper thick liquid volume can be impressed between the inner wall in copper cover body and step hole, avoids pouring the too much situation that overflows the step hole of copper thick liquid volume better.
As shown in fig. 4, further, the end of the resin plug connected to the copper paste block is provided with an annular groove 316, and the copper paste block is partially formed in the annular groove, so that the connection between the resin plug and the copper paste block is firmer, and the interference range for allowing the copper paste to be poured into the through hole is increased. Furthermore, the number of the annular grooves is multiple, and the annular grooves are distributed at intervals along the axial direction of the resin plug piece, so that the connection between the resin plug piece and the copper pulp block is firmer. It is understood that the number of the annular grooves is not limited to a plurality but may be one in other embodiments. In one embodiment, the annular groove is spirally formed around the resin plug in the circumferential direction, so that the copper paste block is better connected to the resin plug.
Furthermore, the resin plug piece is connected to the end part of the copper paste block to form an annular convex edge, and the copper paste block is coated and cured on the annular convex edge, so that the resin plug piece is firmly connected with the copper paste block. Further, the cross-section of annular chimb is L nature, makes difficult breaking away from between copper thick liquid piece and the annular chimb, and then makes copper thick liquid piece and annular chimb be connected more firmly.
Certainly, in the process of filling resin into the plate after the copper paste pouring operation, there may be a situation that the copper paste overflows the through hole 110 and is accumulated at the position of the first copper layer 200 of the circuit board 10 near the periphery of the through hole 110, and then the effect of forming the second copper layer 400 on the surface of the first copper layer 200 is poor, that is, the amount of the copper paste poured into the through hole 110 needs to be controlled more accurately when the copper paste pouring operation is performed on the plate after the copper paste pouring operation, and meanwhile, the precision requirement on the outline of the shape of the resin plug is higher, and the manufacturing difficulty of the circuit board 10 is increased. In order to reduce the manufacturing difficulty of the circuit board 10, as shown in fig. 4, further, the end of the resin plug 310 away from the copper slurry block 320 is provided with a slurry containing groove 313, the slurry containing groove is respectively communicated with the through hole 110 and the through hole 312, in the process of plugging the resin plug into the through hole 110, if the copper slurry overflows to a position corresponding to the slurry containing groove, the copper slurry can enter the slurry containing groove to be cured, so that the situation that the copper slurry overflows the through hole 110 is greatly reduced, thus the amount of the copper slurry poured into the through hole 110 when the copper slurry pouring operation is performed on the board after the copper deposition operation does not need to be controlled more accurately, and meanwhile, the requirement on the accuracy of the outline of the shape of the resin plug is lower. In order to make the copper thick liquid spill over to can get into fast when holding the position that the dressing trough corresponds and hold the dressing trough, furtherly, resin plug member 310 deviate from the tip of copper thick liquid piece still set up with hold the open slot 314 of dressing trough intercommunication, the open slot is greater than the width of holding the dressing trough along the radial extending direction's of resin plug member's cross section width, makes the copper thick liquid spill over to can get into fast when holding the position that the dressing trough corresponds and hold the dressing trough in. In this embodiment, the entering direction of the open slot along the copper slurry is in a shrinking shape, so that the entering speed along the open slot is gradually reduced when the copper slurry overflows to the position corresponding to the slurry containing slot, and the situation that the copper slurry overflows in the slurry containing slot is better avoided. Furthermore, the cross section of the open slot along the entering direction of the copper slurry is in a trapezoid shape, so that the copper slurry entering the open slot has better buffering performance, and the situation that the copper slurry overflows from the slurry accommodating slot is better avoided. Furthermore, a plurality of parallel buffer strip grooves are formed in the peripheral wall of the open groove along the entering direction of the copper slurry, so that the part of the copper slurry entering the open groove enters the buffer strip grooves, the buffer performance of the open groove is further improved, and the situation that the copper slurry overflows into the slurry accommodating groove is better avoided. Furthermore, the number of the open grooves is multiple, and the open grooves are distributed at intervals along the circumferential direction of the resin plug piece, so that the situation that copper slurry overflows from the slurry containing groove is better avoided. Furthermore, the end part of the resin plug 310, which is far away from the copper slurry block 320, is further provided with a holding groove 315, and the holding groove is respectively communicated with the through hole 312 and the plurality of open grooves 314, so that the copper slurry entering the open grooves can also flow into the holding groove through the open grooves, and the situation that the copper slurry overflows into the slurry holding groove is better avoided.
As shown in fig. 2, in order to firmly connect the second copper layer with the copper cladding, in one embodiment, the thickness of the copper cladding 600 is greater than or equal to the depth of the stepped hole 210, so that the second copper layer is better formed on the surface of the copper cladding, and the second copper layer is firmly connected with the copper cladding. In this embodiment, the thickness of the copper covering body is equal to the depth of the stepped hole, so that the copper covering body is flush with the surface of the first copper layer after being installed in the stepped hole, which is beneficial to subsequent reliable copper reduction operation, such as flat dry film pasting operation on the surface of the first copper layer 200.
As shown in fig. 5, of course, in other embodiments, the thickness of the copper covering body may also be greater than the depth of the stepped hole, that is, the copper covering body protrudes from the surface of the first copper layer, and after the circuit board 10 is pressed, the second copper layer 400 and the first copper layer 200 are pressed to slightly deform the resin plug, so that the resin plug is more firmly connected in the through hole 110, and the press-fit connection force of the circuit board 10 is further improved.
It is understood that the through-hole 110 may be a blind buried hole or a through-hole on the wiring board 10. For the blind buried hole, only one resin plug piece and the copper covering body need to be plugged into the opening of the through hole on one side of the plate. And for the through hole, the opening of the through hole at two sides of the plate is respectively plugged with the resin plug piece and the copper covering body.
In one embodiment, the number of the resin plugs and the number of the copper covering bodies are two, and the two resin plugs and the two copper covering bodies are arranged in one-to-one correspondence. The number of the step holes is two, the two step holes are respectively arranged on two sides of the plate, and each resin plug is respectively arranged in the corresponding step hole.
In one embodiment, the step of plugging the resin plug into the through hole of the plate and enabling the copper paste part to overflow to the surface of the resin plug through the through hole is specifically as follows: and filling the two resin plug pieces into the through holes from the two sides of the plate respectively, so that the copper paste part overflows to the surface of the resin plug piece through the through holes of the two resin plug pieces respectively.
Further, the step of mounting the copper cover body in the stepped hole so that the copper cover body is connected to the resin plug by copper paste includes: mounting one of the copper overlays in one of the stepped holes; turning the circuit board for 180 degrees; and installing the other copper covering body in the other step hole, enabling each resin plug piece to be respectively installed in the corresponding step hole, and enabling the two copper covering bodies to be respectively connected with the corresponding resin plug pieces.
It can be understood that when the plate member is drilled, a high temperature is generated in a short time, so that resin residues remain on the inner wall of the through hole 110, that is, epoxy resin drilling stains are formed on the inner wall of the through hole 110, and further, before the step of performing the copper deposition operation on the drilled plate member and after the step of performing the drilling treatment on the plate member, the browning process further includes: and performing secondary drilling treatment on the position of the plate corresponding to the through hole 110 to remove epoxy resin drilling dirt generated by high temperature generated on the hole wall during primary drilling, and avoiding the problem of poor bonding force between the resin drilling dirt and the hole wall of the through hole 110.
In one embodiment, the thickness of the second copper layer 400 is equal to the thickness of the thinned first copper layer 200, so that the second copper layer 400 is reliably formed on the surface of the first copper layer 200, and the subsequent first copper layer 200 and the second copper layer 400 are reliably pressed, thereby avoiding the problem that the first copper layer 200 and the second copper layer 400 are prone to cracking due to different thicknesses in the pressing process, and improving the manufacturing yield of the circuit board 10.
In one embodiment, before the step of performing the brown oxidation treatment on the plate after the plate plating operation and after the step of performing the plate plating operation on the plate after the copper reduction operation, the brown oxidation process further includes: and carrying out inner-layer line treatment on the plate after the plate plating operation so as to process an inner-layer line on the surface of the plate and reduce the material consumption required by the browning treatment of the plate. In this embodiment, the step of performing browning treatment on the plate after the plate plating operation specifically includes: and performing brown oxidation treatment on the plate subjected to the inner-layer line treatment.
As shown in fig. 6, in one embodiment, the step S107 of performing the copper reducing operation on the plate after the plugging operation includes:
S107A, respectively pasting dry films on two sides of the plate subjected to hole plugging operation;
S107B, carrying out exposure and development operation on the plate with the dry film attached to remove the dry film corresponding to the first copper layer 200 to be thinned, so that the first copper layer 200 to be thinned is in an exposed state;
S107C, etching the dry film after the developing operation to reduce the thickness of the first copper layer 200 on the two sides of the plate;
and S107D, removing the dry film on the surface of the etched plate.
In order to make the thickness of the second copper layer 400 formed on the surface of the first copper layer 200 better meet the copper thickness requirement of the circuit board 10, in one embodiment, the thickness of the first copper layer 200 after thinning is 18 μm to 24 μm, so that the thickness of the second copper layer 400 formed on the surface of the first copper layer 200 better meets the copper thickness requirement of the circuit board 10. In this embodiment, the thickness of the first copper layer 200 after thinning is 22 μm, so that the thickness of the first copper layer 200 after thinning is moderate.
As shown in fig. 2 to 4, the present application further provides a circuit board 10, and the brown oxidation process of the circuit board 10 according to any of the above embodiments is adopted to perform brown oxidation treatment on the circuit board 10. In one embodiment, the circuit board 10 includes a board 100, a first copper layer 200, an intermediate conductive post 300, a copper covering 600, a second copper layer 400, and a browning layer 500. The plate member is provided with a through hole 110. The number of the first copper layers is two, the two first copper layers are respectively formed on two opposite side surfaces of the first plate, and each first copper layer is provided with a step hole 210 communicated with the through hole. It fills in to lead electrical pillar in the through-hole in the middle of, it includes copper thick liquid piece 320 and two resin plug parts 310, each to lead electrical pillar 300 in the middle of the centre the through-hole 312 has been seted up to the resin plug part, two the resin plug part sets up relatively, and two the resin plug part respectively with the both ends of copper thick liquid piece are connected, the copper thick liquid piece is worn to locate each in the through-hole and with the resin plug part is connected, just the partial protrusion of copper thick liquid piece in each the resin plug part deviate from corresponding the tip of resin plug part makes the both ends of leading electrical pillar in the middle and middle part all have the copper thick liquid piece of electric conductivity, and then makes the middle whole better electric conductivity that has of.
The number of the copper covers 600 is two, and the two copper covers are a first copper cover 610 and a second copper cover 620, respectively. The first copper covering body is covered in the step hole of one of the first copper layers, and the first copper covering body is connected with the copper paste block protruding out of the end portion of the corresponding resin plug. The second copper covering body is covered in the step hole of the other first copper layer, and the first copper covering body is connected with the copper paste block protruding out of the end part of the corresponding resin plug piece. In this embodiment, the first copper covering body and the second copper covering body are respectively covered in the step holes of the two first copper layers, and the first copper covering body and the second copper covering body are respectively electrically connected with the copper paste blocks protruding from the two ends of the middle conductive column. The number of the second copper layers is two, the two second copper layers are formed on the surfaces, deviating from the first copper layers, of the plate respectively, and the two second copper layers further cover the first copper covering bodies and the second copper covering bodies respectively. The number of the browning layers is two, and the two browning layers are formed on one surfaces, away from the corresponding first copper layers, of the two second copper layers respectively.
The two resin plug pieces are oppositely arranged in the through hole, the two resin plug pieces are respectively connected with two ends of the copper pulp block, the copper pulp block is arranged in each through hole in a penetrating mode and is connected with the resin plug piece, the copper pulp block is respectively and reliably connected with the two resin plug pieces, the copper pulp block and the two resin plug pieces are both positioned in the through hole, the first copper covering body is covered in the step hole of one first copper layer and is connected with the copper pulp block protruding out of the end portion of the corresponding resin plug piece, the first copper covering body is respectively connected with one first copper layer and the copper pulp block protruding out of the end portion of the corresponding resin plug piece, and meanwhile the first copper layer is electrically connected with the copper pulp block through the first copper covering body; similarly, the second copper covering body is respectively connected with the other first copper layer and the copper paste block protruding out of the end part of the corresponding resin plug piece, and the first copper layers are electrically connected with the copper paste block through the second copper covering body, so that the first copper layers respectively positioned at two sides of the plate are electrically connected; because two the second copper layer is formed in two respectively deviating from of first copper layer the surface of plate, and two the second copper layer still covers respectively in first copper cover with second copper cover makes through-hole and two step holes all be located between two second copper layers, again because two brown oxide layers are formed respectively in the one side that deviates from first copper layer of two second copper layers, make brown oxide layer only need the shaping in second copper layer surface can, avoided the copper thick liquid consent of circuit board the situation that can't brown oxide in, improved pressfitting circuit board cohesion greatly, and then improved the life of circuit board.
As shown in fig. 2, in one embodiment, the first copper covering body 610 and the second copper covering body 620 are respectively flush with a surface of the corresponding first copper layer 200 away from the board 100, which is beneficial for smoothly attaching a dry film to the surface of the first copper layer 200 during a subsequent copper reduction operation.
As shown in fig. 5, it is understood that in other embodiments, the first copper covering body and the second copper covering body are not limited to being flush with a surface of the corresponding first copper layer facing away from the board member, respectively. In one embodiment, the first copper covering body and the second copper covering body respectively protrude from the corresponding surfaces of the first copper layers, which face away from the board, and after the circuit board 10 is pressed, the second copper layer 400 and the first copper layer 200 are pressed to slightly deform the intermediate conductive pillar 300, the first copper covering body 610 and the second copper covering body 620, so that the intermediate conductive pillar 300 is more firmly connected in the through hole 110, and the press-fit bonding force of the circuit board 10 is further improved.
In one embodiment, the diameters of the first copper covering body and the second copper covering body are respectively equal to the inner diameters of the corresponding stepped holes, so that the first copper covering body and the second copper covering body are respectively tightly connected with the corresponding stepped holes, and the first copper covering body or the second copper covering body is prevented from falling off.
In one embodiment, as shown in fig. 4, each of the resin plugs is of a frustum structure, so that during the process of plugging the resin plug into the through hole 110, the copper paste block in the through hole 110 can quickly enter and be cured and formed in the gap between the resin plug and the inner wall of the through hole 110, so that the copper paste block is connected to the resin plug to form the frustum structure, and the resin plug is connected with the inner wall of the through hole 110 through the copper paste block. It is understood that in other embodiments, the resin plugs are not limited to the frustum structure, but may be conical structures.
In one of them embodiment, the maximum diameter of each resin stopper with through-hole looks adaptation, promptly the maximum diameter of resin stopper with the internal diameter of through-hole equals, makes resin stopper and through-hole transition fit, avoids causing the problem that the plate warp when leading to the equipment because of the resin stopper is too big, or causes the problem that the in-process of copper thick liquid solidification formation copper thick liquid piece overflows easily because of the resin stopper is too little, and then makes the resin stopper better block the through-hole.
Furthermore, each resin plug piece is connected to the end part of the copper slurry block and provided with an annular groove, and the copper slurry block is partially formed in the annular groove, so that the connection between each resin plug piece and the copper slurry block is firmer, and the interference range of the copper slurry amount allowed to be poured into the through hole of the formed copper slurry block is enlarged. Furthermore, the number of the annular grooves is multiple, and the annular grooves are distributed at intervals along the axial direction of the resin plug pieces, so that the connection between each resin plug piece and the copper pulp block is firmer. It is understood that the number of the annular grooves is not limited to a plurality but may be one in other embodiments. In one embodiment, the annular groove is spirally formed around the resin plug in the circumferential direction, so that the copper paste block is better connected to the resin plug.
Furthermore, each resin plug piece is connected to the end part of the copper paste block to form an annular convex edge, and the copper paste block is coated and solidified on the annular convex edge, so that the resin plug pieces are firmly connected with the copper paste block. Further, the cross-section of annular chimb is L nature, makes difficult breaking away from between copper thick liquid piece and the annular chimb, and then makes copper thick liquid piece and annular chimb be connected more firmly.
Certainly, in the process of forming the copper paste block by the copper paste pouring operation, there may be a situation that the copper paste overflows the through hole 110 and is accumulated at the peripheral position of the first copper layer 200 of the circuit board 10 adjacent to the step hole, and then the effect of forming the second copper layer 400 on the surface of the first copper layer 200 is poor, that is, the amount of the copper paste poured into the through hole 110 needs to be controlled more accurately when the copper paste pouring operation is performed on the plate subjected to the copper deposition operation, and meanwhile, the precision requirement on the outline of the shape of the resin plug piece is higher, and the manufacturing difficulty of the circuit board 10 is increased. In order to reduce the manufacturing difficulty of the circuit board 10, as shown in fig. 4, further, a slurry containing groove 313 is formed in an end portion of each resin plug 310, which is away from the copper slurry block, and the slurry containing groove is respectively communicated with the through hole 110 and the through hole 312, when the resin plug is plugged into the through hole 110, if the copper slurry overflows to a position corresponding to the slurry containing groove, the copper slurry can enter the slurry containing groove to be cured, so that the situation that the copper slurry overflows the through hole 110 is greatly reduced, so that the amount of the copper slurry poured into the through hole 110 when the copper slurry pouring operation is performed on a board subjected to the copper deposition operation does not need to be controlled relatively accurately, and meanwhile, the requirement on the precision of the outline of the shape of the resin plug is low. In order to make the copper thick liquid spill over to can get into fast when holding the position that the dressing trough corresponds, furtherly, the tip that deviates from the copper thick liquid piece of each resin stopper 310 still seted up with hold the open slot 314 of dressing trough intercommunication, the width of the radial extending direction of the cross section of open slot edge resin stopper is greater than the width of holding the dressing trough, make the copper thick liquid spill over to can get into fast when holding the position that the dressing trough corresponds and hold the dressing trough in. In this embodiment, the entering direction of the open slot along the copper slurry is in a shrinking shape, so that the entering speed along the open slot is gradually reduced when the copper slurry overflows to the position corresponding to the slurry containing slot, and the situation that the copper slurry overflows in the slurry containing slot is better avoided. Furthermore, the cross section of the open slot along the entering direction of the copper slurry is in a trapezoid shape, so that the copper slurry entering the open slot has better buffering performance, and the situation that the copper slurry overflows from the slurry accommodating slot is better avoided. Furthermore, a plurality of parallel buffer strip grooves are formed in the peripheral wall of the open groove along the entering direction of the copper slurry, so that the part of the copper slurry entering the open groove enters the buffer strip grooves, the buffer performance of the open groove is further improved, and the situation that the copper slurry overflows into the slurry accommodating groove is better avoided. Furthermore, the number of the open grooves is multiple, and the open grooves are distributed at intervals along the circumferential direction of the resin plug piece, so that the situation that copper slurry overflows from the slurry containing groove is better avoided. Furthermore, the holding tank 315 has still been seted up to the tip that deviates from the copper thick liquid piece of each resin plug member 310, and the holding tank communicates with through hole and a plurality of open slot respectively, makes the copper thick liquid that gets into in the open slot can also flow into the holding tank through the open slot in, avoids the copper thick liquid to spill over the situation that holds the thick liquid inslot better.
As shown in fig. 3, in one embodiment, the copper paste block 320 includes a copper paste block main body 322, a first penetrating portion 324 and a second penetrating portion 326, and the copper paste block main body is connected to the first penetrating portion and the second penetrating portion, respectively. First portion of wearing to establish through one in the through-hole of resin plug member with the resin plug member is connected, just first portion of wearing to establish protrusion in corresponding the position of resin plug member with first copper cover body is connected, makes first copper cover body and protrusion in corresponding the tip of resin plug member copper thick liquid piece is connected. The portion of wearing to establish of second through another in the through-hole of resin plug member with the resin plug member is connected, just the portion protrusion in corresponding is worn to establish by the second the position of resin plug member with the second copper cover body is connected, makes second copper cover body and protrusion in corresponding the tip of resin plug member the copper thick liquid piece is connected.
In one embodiment, the copper paste block main body, the first penetrating portion and the second penetrating portion are integrally formed, so that the copper paste block main body is reliably connected with the first penetrating portion and the second penetrating portion respectively, and the structure of the copper paste block is compact. In this embodiment, the copper paste block main body, the first penetrating portion and the second penetrating portion are integrally formed by curing.
It is understood that, in other embodiments, the copper paste block main body, the first through hole and the second through hole are not limited to being integrally formed. In one embodiment, the copper paste block body is glued with the first penetrating portion and the second penetrating portion respectively, so that the copper paste block body is firmly connected with the first penetrating portion and the second penetrating portion respectively.
In one embodiment, the diameter of each stepped hole is larger than that of the through hole, so that a stepped hole structure is formed at the communication position of the through hole and the stepped hole, and thus, part of the copper paste block can be molded on the inner wall of the stepped hole in the process of assembling the intermediate conductive pillar in the through hole.
As shown in fig. 2, in order to reduce the manufacturing difficulty of the circuit board 10, the through hole 110 and the two stepped holes 210 are circular holes, and the diameters of the through hole 110 and the two stepped holes 210 are equal, so that the shape of the through hole 110 is simple and is easy to machine and mold.
In order to more securely connect each second copper layer 400 to the surface of the corresponding first copper layer 200 facing away from the plate 100, in one embodiment, each second copper layer 400 is also crimped to the surface of the corresponding first copper layer 200 facing away from the plate 100, such that each second copper layer 400 is more securely connected to the surface of the corresponding first copper layer 200 facing away from the plate 100.
Compared with the prior art, the invention has at least the following advantages:
firstly, drilling a plate to form a through hole; then carrying out copper deposition operation on the drilled plate to enable the plate to be provided with a first copper layer, wherein a step hole communicated with the through hole is formed in the first copper layer, and the diameter of the step hole is larger than that of the through hole; then molding a resin plug piece to form a through hole on the resin plug piece; then carrying out copper slurry filling operation on the through hole of the plate after the copper deposition operation, so that the through hole is filled with copper slurry; then plugging the resin plug piece into the through hole of the plate, so that the copper paste part overflows to the surface of the resin plug piece through the through hole, namely the copper paste part overflows to the end face of the resin plug piece, which is adjacent to the surface of the plate; then providing a copper covering body, and enabling the copper covering body to be matched with the step hole; then installing the copper covering body in the step hole, connecting the copper covering body with the resin plug piece through copper paste, and firmly connecting the copper covering body with the resin plug piece after the copper paste is solidified; then, carrying out copper reduction operation on the plate subjected to the hole plugging operation so as to reduce the thickness of the first copper layer of the plate; then, carrying out plate plating operation on the plate subjected to the copper reducing operation, so that second copper layers are formed on the first copper layers on the two sides of the plate and the surface, away from the resin plug body, of the copper-clad cover body respectively, and the second copper layers are covered on the first copper layers on the two sides of the plate and the surface of the copper-clad cover body respectively; and finally, performing browning treatment on the plate after the plate plating operation, wherein the second copper layer is respectively covered on the surfaces of the first copper layer and the copper covering body on the two sides of the plate, so that the browning layer is only formed on the surface of the second copper layer, the situation that browning cannot be performed in the copper paste plug hole of the circuit board is avoided, and the pressing binding force of the circuit board is greatly improved.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A browning process of a circuit board is characterized by comprising the following steps:
drilling a plate to form a through hole in the plate;
carrying out copper deposition operation on the plate after drilling to enable the plate to be provided with a first copper layer, wherein a step hole communicated with the through hole is formed in the first copper layer, and the diameter of the step hole is larger than that of the through hole;
molding a resin plug piece, so that a through hole is formed in the resin plug piece;
carrying out copper slurry pouring operation on the through hole of the plate after the copper deposition operation;
plugging the resin plug piece into the through hole of the plate, so that the copper paste part overflows to the surface of the resin plug piece through the through hole;
providing a copper covering body, and enabling the copper covering body to be matched with the step hole;
mounting the copper covering body in the step hole, and connecting the copper covering body with the resin plug piece through copper paste;
carrying out copper reduction operation on the plate subjected to the hole plugging operation so as to reduce the thickness of the first copper layer of the plate;
performing plate plating operation on the plate subjected to the copper reduction operation to enable a first copper layer of the circuit board and the surface of the copper covering body, which is far away from the resin plug body, to be respectively formed with a second copper layer;
and performing brown oxidation treatment on the plate after the plate plating operation.
2. The browning process of a circuit board according to claim 1, wherein the maximum diameter of the resin plug is adapted to the through hole.
3. The brown oxidation process of the wiring board of claim 2, wherein the resin plug is of a frustum configuration.
4. The brown oxidation process of the wiring board of claim 1, wherein the thickness of the copper covering is greater than or equal to the depth of the stepped hole.
5. The browning process of a circuit board according to claim 1, wherein the number of the resin plugs and the number of the copper covering bodies are both two, and the two resin plugs are arranged in one-to-one correspondence with the two copper covering bodies; the number of the step holes is two, the two step holes are respectively arranged on two sides of the plate, and each resin plug is respectively arranged in the corresponding step hole.
6. The browning process of a circuit board according to claim 5, wherein the step of plugging the resin plug into the through hole of the plate so that the copper paste partially overflows to the surface of the resin plug through the through hole is specifically as follows: inserting the two resin plug pieces into the through holes from two sides of the plate respectively, so that copper paste parts respectively overflow to the surfaces of the resin plug pieces through the through holes of the two resin plug pieces;
the step of mounting the copper cover body in the stepped hole so that the copper cover body is connected to the resin plug member through copper paste includes:
mounting one of the copper overlays in one of the stepped holes;
turning the circuit board for 180 degrees;
and installing another copper covering body in another step hole.
7. The browning process of claim 1, wherein the thickness of the second copper layer is equal to the thickness of the first copper layer after thinning.
8. The browning process of the wiring board of claim 1, wherein before the step of subjecting the board after the plating operation to the browning treatment and after the step of subjecting the board after the copper reduction operation to the plating operation, the browning process further comprises:
carrying out inner layer circuit treatment on the plate after the plate plating operation so as to process an inner layer circuit on the surface of the plate;
the method for performing brown oxidation treatment on the plate after plate plating operation comprises the following steps: and performing brown oxidation treatment on the plate after the inner-layer line treatment.
9. The browning process of the circuit board according to claim 1, wherein the step of performing a copper reduction operation on said plate after plugging comprises:
respectively pasting dry films on two sides of the plate after hole plugging operation;
carrying out exposure and development operation on the plate with the dry film attached to the plate so as to remove the dry film corresponding to the first copper layer to be thinned;
etching the dry film after the developing operation to reduce the thickness of the first copper layer of the plate;
and removing the dry film on the surface of the plate after etching.
10. A wiring board characterized in that the browning process of the wiring board according to any one of claims 1 to 9 is performed on the wiring board.
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| CN114040564A (en) * | 2021-11-10 | 2022-02-11 | 珠海方正科技多层电路板有限公司 | Preparation method of circuit board and circuit board |
| CN114368853A (en) * | 2021-12-17 | 2022-04-19 | 广东臻鼎环境科技有限公司 | Method for recycling brown oxidation waste liquid of circuit board |
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| CN111405754A (en) * | 2020-04-20 | 2020-07-10 | 四会富仕电子科技股份有限公司 | Copper-embedded blind buried hole substrate and production method thereof |
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| JP2000174404A (en) * | 1998-12-09 | 2000-06-23 | Matsushita Electric Ind Co Ltd | Circuit-board connecting material, its manufacture, and manufacture of multilayer circuit board using the connecting material |
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| CN114040564A (en) * | 2021-11-10 | 2022-02-11 | 珠海方正科技多层电路板有限公司 | Preparation method of circuit board and circuit board |
| CN114040564B (en) * | 2021-11-10 | 2023-10-27 | 珠海方正科技多层电路板有限公司 | Circuit board preparation method and circuit board |
| CN114368853A (en) * | 2021-12-17 | 2022-04-19 | 广东臻鼎环境科技有限公司 | Method for recycling brown oxidation waste liquid of circuit board |
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