CN100391320C - Method forp roducing multilayer printed circuit board - Google Patents
Method forp roducing multilayer printed circuit board Download PDFInfo
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- CN100391320C CN100391320C CNB2005100348720A CN200510034872A CN100391320C CN 100391320 C CN100391320 C CN 100391320C CN B2005100348720 A CNB2005100348720 A CN B2005100348720A CN 200510034872 A CN200510034872 A CN 200510034872A CN 100391320 C CN100391320 C CN 100391320C
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- printed circuit
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Abstract
The present invention discloses a production method for a multilayer printed circuit board, which mainly comprises the steps that through holes are drilled in a multilayer printed circuit board etched with printed circuits on the inner layer and the outer layer; glue slag on the walls of the through holes is removed by using a chemical method; after grinding, cleaning, and weld-preventing printed treatment, a printed example which is arranged in advance and has glue injection holes in corresponding positions covers the multilayer printed circuit board for injecting liquid conductive copper glue into the corresponding through holes by the glue injection holes; then, the obtained multilayer printed circuit board is heated; the conductive copper glue in the through holes is solidified to form conducting wires connecting all the layers of the circuit board. After the production method of the present invention is adopted, the production efficiency is greatly increased, the environmental pollution can be reduced, and the manufactured product has stable performance. The present invention is especially suitable for the scale production and the manufacture of four-layer printed circuit boards.
Description
Technical field
The present invention relates to a kind of production method of printed substrate, relate in particular to a kind of method of producing multilayer printed circuit board.
Background technology
The IT technology is in for a period of time progress at full speed recently, apparent in view a bit is exactly to show as: the hardware product in this field develops towards the direction of multi-functional, high reliability, miniaturization gradually, this just requires to use the core devices printed substrate in these hardware products also will adapt to this trend, only use individual layer or two-layer printed circuit plate then often to be difficult to satisfy above-mentioned designing requirement, for this reason, the application of multilayer board is more and more wider.
In the production technology of multilayer printed circuit board, a particular problem that need to solve is: the electrical connection between printed substrate will stablize, reliably, to realize multilayer printed circuit board basic function as a whole, simultaneously, still to take into account the development trend of above-mentioned miniaturization, precise treatment.The basic skills of these electronic devices and components is between layer that is communicated with and the layer: the relevant position boring in multilayer printed circuit board is also filled conductor, promptly described usually " through hole " in this hole.At present, for realizing through hole, the technology category of employing mainly is divided into two kinds: a kind of is in the mode of electroplating the hole wall metallization to be made each layer of through hole connection conducting, and promptly usually said PTH electroplates heavy process for copper; Also have and a kind ofly in above-mentioned through hole, concentrate elargol exactly on to realize being electrically connected promptly usually said STH, elargol perforation technology with certain electric conductivity.
The major defect of the mode of electroplating is: production processes such as pre-treatment are more, it is also longer to electroplate required man-hour, production efficiency is lower, more seriously, it is bigger to electroplate the electric weight that is consumed, also can produce a large amount of industrial wastewaters simultaneously, all suitable harm can be arranged environment and practitioner's health;
Though the elargol perforation can overcome above-mentioned defective, but owing in colloid, there is " silver ion is free " phenomenon (being called for short " silver moves "), the silver ion that plays a major role in conducting process can be to the periphery diffusion of hole wall, cause the electric conductivity of elargol in the hole to descend, resistance raises, therefore the lowest high-current value that can carry is too small, and this defective is when needs carrying or transmitting high-frequency signal, and is particularly evident; The phenomenon of above-mentioned " silver moves " also causes the reduction of insulation property of the insulator of through hole periphery simultaneously, this kind phenomenon As time goes on, can be more and more serious, therefore, when the spacing of each through hole is less, closeer, and be easy to produce abnormality such as high-frequency noise interference when in perimeter circuit, needing transmitting high-frequency signal, make reliability, the stability of the multilayer printed circuit board made all can be affected.In the practice, the minimum value of the through hole distance of the printed substrate that use elargol perforation technology is made generally is not less than 1.4mm, and maximum load voltage is generally below DC50V/Via; The aforementioned disadvantages of elargol perforation technology makes this technology generally can only use in the two-layer printed circuit plate, for multilayer, especially the production of printed substrate more than four layers or four layers because " silver moves " phenomenon and through hole are longer, does not have practical space basically.
In addition, multiple-plate making: be just can make multi-layer sheet by substrate and the pressing of P/P resin material elder generation.Be each layer conducting in the middle of making up and down, so need to bore through hole, resin material often has paste shape to produce when high speed rotating is holed at this moment.Therefore the plate after the boring must be done the de-smear chemical treatment, carries out the perforation normal flow again.
Summary of the invention
For overcoming the defective of above-mentioned prior art, technical problem to be solved by this invention is intended to provide a kind of finished product performance that can make more stable, more the production method of the multilayer printed circuit board of compliance with environmental protection requirements.
For solving the problems of the technologies described above, the present invention proposes a kind of technology manufacture method of new multilayer printed circuit board, specifically comprises the following steps:
A. etching there are the internal substrate of circuit and resin material to carry out pressing and increase layer;
B. etched circuit on outermost layer substrate;
C. through hole is bored in the position that needs to connect connection on the multilayer printed circuit board of above-mentioned gained;
D. after multilayer printed circuit board after will holing ground, cleans and carries out forward and backward anti-welding printing, row cleaned again;
E., the printing model that consistent glue is used is set in advance, described printing model with described multilayer printed circuit board on the correspondence position of each through hole be provided with and pass through hole for injecting glue;
F. on the multilayer printed circuit board of above-mentioned gained, cover described printing model, and make the described hole for injecting glue of passing through aim at corresponding through hole, more aqueous conductivity copper glue is injected corresponding through hole by the described hole for injecting glue of respectively passing through;
G. the multilayer printed circuit board to above-mentioned gained heats, so that the conductivity copper adhesive curing in described through hole becomes the lead that connects between each layer wiring board.
Further, behind above-mentioned step c, can further remove the glue slag that when boring through hole, produces by chemically treated method.
The product that above-mentioned employed conductivity copper glue preferably adopts Tatsuta company to produce is called the conductivity copper glue of DD-paste TH9910.
After adopting said method,, avoided the complicated every pretreatment procedure of electroplating technology, can not produce the industrial wastewater that causes environmental pollution easily owing to do not re-use mode sedimentation copper product in through hole of plating; The conductivity copper glue that perforation adopts does not have the elargol material may produce the phenomenon of " silver moves " yet; the more important thing is that the mode that adopts the printing perforation realizes conductivity copper glue injection through hole to be electrically connected; production efficiency improves greatly; and; the process sequences of special " first etched circuit bores through hole again " of adopting makes prepared finished product performance more stable; be particularly suitable for multilayer printed circuit board, especially the large-scale production of four layers of printed substrate, manufacturing.
Purpose of the present invention, feature and advantage will be elaborated in conjunction with the accompanying drawings by following embodiment.
Description of drawings
Fig. 1 is the tangent plane structural representation of four layers of printed substrate;
Fig. 2 is four layers of printed substrate after boring through hole, the tangent plane structural representation when not removing de-smear;
Fig. 3 is the tangent plane structural representation of four layers of printed substrate after chemistry removes de-smear shown in Figure 2;
Fig. 4 is to use the main technique flow chart of the method for the invention.
Concrete execution mode
With reference to Fig. 4, with four layers of printed substrate is example, the production process of multilayer printed circuit board of the present invention or key step are: at first carry out pressing at the internal substrate that etching is had circuit and resin material and increase layer to make the multilager base plate with one, two layer of printed wire, be usually said repeatedly plate pressing of carrying out, generally be separated by between each layer wiring board by insulator; Make structure multilayer printed circuit board as shown in Figure 1 with common printing etch process at two outer surface Etched Printed Circuits of this multilager base plate again, dash area is Copper Foil or each layer printed circuit among the figure, be resin material or intermediate insulation body between each shade, also show the position view of following through hole simultaneously among Fig. 1;
Through hole is bored in the position that needs to connect connection on the multilayer printed circuit board of above-mentioned gained; Like this, the position that joins mutually at internal substrate and through hole may form as shown in Figure 2 otch tangent plane structural representation, dash area is internal layer Copper Foil or interior layer printed circuit among the figure, and the irregular portion bit representation may be attached to the glue slag of through hole inwall, and dotted line represents to run through the position of hole wall.For the perforation that makes the prepared multilayer printed circuit board of the present invention is electrically connected more stable, reliably, evenly, the glue slag that printed substrate produces when avoiding holing covers the copper foil material of through hole periphery and has influence on the conductive effect of these positions, can adopt this moment chemically treated method to remove the glue slag that when boring through hole, produces, specifically can adopt: expanded and part gets loose with the glue slag to use earlier leavening agent, remove de-smear with oxidants such as liquor potassic permanganate and auxiliary process commonly used again, make through hole notch features multilayer printed circuit board as schematically shown in Figure 3, be beneficial to following when concentrating conductivity copper glue on, obtain concentrating on relatively uniformly effect, and then can obtain the more superior printed substrate of performance.
After finishing above-mentioned operation, also need: after multilayer printed circuit board after will holing grinds, cleans and carries out forward and backward anti-welding printing, go aided processes such as cleaning again;
Can also be provided with, make the printing model that consistent glue is used in advance, this printing model with described multilayer printed circuit board on the correspondence position of each through hole be provided with and pass through hole for injecting glue;
Above-mentioned printing model is covered on the multilayer printed circuit board of gained, and make the pass through hole for injecting glue of printing on the model aim at corresponding through hole on the multilayer printed circuit board, more aqueous conductivity copper glue is injected corresponding through hole by respectively passing through hole for injecting glue; This technical process may be summarized to be: printing perforation, its process efficiency heavy process for copper of existing plating of comparing has the raising of very big amplitude;
Multilayer printed circuit board to above-mentioned gained heats again, so that the conductivity copper adhesive curing in described through hole becomes the lead that connects between each layer wiring board.
The product that the conductivity copper glue that the present invention concentrated on preferably adopts Tatsuta company to produce is called the conductivity copper glue of DD-paste TH9910, it is strong, stable that this conductivity copper glue has conductivity, viscosity is low, be difficult for generation when concentrating on and may block the good characteristics such as bubble of conducting function, the electric conductivity of made thus multilayer printed circuit board is also comparatively satisfied
Significant contribution of the present invention is: broken through in the manufacture craft of multilayer printed circuit board, be difficult to be suitable for: in through hole, directly concentrate on, the outmoded notion of filled conductive colloid, on the contrary, but be particularly suitable for multilayer printed circuit board, especially the scale of four layers of printed substrate, high efficiency production, manufacturing, and compare with the manufacturing that the existing extensively plating sedimentation process of employing carries out four layers of printed substrate, economic benefit is quite obvious; On the other hand, change the process sequences that existing " boring earlier; after etching printed wire " is " first etch printing circuit; back brill through hole ", avoided the harmful effect to the through hole inwall of follow-up etch process, row is aided with the remove photoresist technology of slag of chemistry again, can obtain internal diameter through hole relatively uniformly, therefore, the manufactured goods performance is stable especially, reliable.In the practice, the minimum value of the through hole distance of the printed substrate that use the present invention makes can reach 1.1mm, maximum load voltage can reach DC100V/Via, moment, but the maximum loaded current was about 1A, bad manufactured goods rate also is effectively controlled, and the heavy process for copper of more existing elargol perforation technology and plating all has than significant progress.
Claims (4)
1. the production method of a multilayer printed circuit board specifically comprises the following steps:
A. etching there are the internal substrate of circuit and resin material to carry out pressing and increase layer;
B. etched circuit on outermost layer substrate;
C. through hole is bored in the position that needs to connect connection on the multilayer printed circuit board of above-mentioned gained;
D. after multilayer printed circuit board after will holing ground, cleans and carries out forward and backward anti-welding printing, row cleaned again;
E., the printing model that consistent glue is used is set in advance, described printing model with described multilayer printed circuit board on the correspondence position of each through hole be provided with and pass through hole for injecting glue;
F. on the multilayer printed circuit board of above-mentioned gained, cover described printing model, and make the described hole for injecting glue of passing through aim at corresponding through hole, more aqueous conductivity copper glue is injected corresponding through hole by the described hole for injecting glue of respectively passing through;
G. the multilayer printed circuit board to above-mentioned gained heats, so that the conductivity copper adhesive curing in described through hole becomes the lead that connects between each layer wiring board.
2. the production method of multilayer printed circuit board as claimed in claim 1 is characterized in that:
Behind above-mentioned step c, also remove the glue slag that when boring through hole, produces by chemically treated method.
3. the production method of multilayer printed circuit board as claimed in claim 2 is characterized in that:
Described chemically treated method is: expanded and part gets loose with the glue slag to use earlier leavening agent, removes de-smear with liquor potassic permanganate and auxiliary process again.
4. as the production method of claim 1,2 or 3 described multilayer printed circuit boards, the product that wherein employed conductivity copper glue adopts Tatsuta company to produce is called the conductivity copper glue of DD-paste TH9910.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100348720A CN100391320C (en) | 2005-05-23 | 2005-05-23 | Method forp roducing multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100348720A CN100391320C (en) | 2005-05-23 | 2005-05-23 | Method forp roducing multilayer printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN1717159A CN1717159A (en) | 2006-01-04 |
| CN100391320C true CN100391320C (en) | 2008-05-28 |
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| CNB2005100348720A Expired - Fee Related CN100391320C (en) | 2005-05-23 | 2005-05-23 | Method forp roducing multilayer printed circuit board |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101730388B (en) * | 2008-10-14 | 2012-07-25 | 富葵精密组件(深圳)有限公司 | Circuit board and manufacturing method thereof |
| CN101951737A (en) * | 2010-09-25 | 2011-01-19 | 东莞佶升电路板有限公司 | Manufacture method of multilayered circuit board |
| CN102137544A (en) * | 2011-03-18 | 2011-07-27 | 昆山金利表面材料应用科技股份有限公司 | Conductive structure of conductive circuit |
| CN103419518B (en) * | 2012-05-22 | 2015-12-09 | 上海仪电电子印刷科技有限公司 | A kind of method preparing field type display back electrode plate of electronic ink |
| CN104560459A (en) * | 2015-01-19 | 2015-04-29 | 通山瑞邦电子科技有限公司 | Sandwich panel swelling agent and preparation method thereof |
| WO2018082362A1 (en) * | 2016-11-03 | 2018-05-11 | 成都柔电云科科技有限公司 | Method for fabricating epidermal electrode |
| CN106793524A (en) * | 2017-02-10 | 2017-05-31 | 昆山元茂电子科技有限公司 | The manufacture method of printed circuit board (PCB) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1384701A (en) * | 2001-05-07 | 2002-12-11 | 索尼公司 | Multi-layered printed circuit board and its making process |
| US20030208740A1 (en) * | 2000-11-10 | 2003-11-06 | Tourne Joseph A.A.M. | System and method for monitoring and improving dimensional stability and registration accuracy of multi-layer PCB manufacture |
| CN1538803A (en) * | 2003-04-18 | 2004-10-20 | 联能科技（深圳）有限公司 | Manufacturing method of multilayer printed circuit board |
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- 2005-05-23 CN CNB2005100348720A patent/CN100391320C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030208740A1 (en) * | 2000-11-10 | 2003-11-06 | Tourne Joseph A.A.M. | System and method for monitoring and improving dimensional stability and registration accuracy of multi-layer PCB manufacture |
| CN1384701A (en) * | 2001-05-07 | 2002-12-11 | 索尼公司 | Multi-layered printed circuit board and its making process |
| CN1538803A (en) * | 2003-04-18 | 2004-10-20 | 联能科技（深圳）有限公司 | Manufacturing method of multilayer printed circuit board |
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| CN1717159A (en) | 2006-01-04 |
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Owner name: SHENZHEN SUNGWEI ELECTRONICS CO., LTD. Free format text: FORMER NAME: SUNGWEI INDUSTRIES CO., LTD. |
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| CP01 | Change in the name or title of a patent holder |
Address after: 518104, Guangdong, Shenzhen province Baoan District manhole town, Sha Tau Industrial Zone Patentee after: Shenzhen Sungwei Electronic Co., Ltd. Address before: 518104, Guangdong, Shenzhen province Baoan District manhole town, Sha Tau Industrial Zone Patentee before: Songwei circuit board (Shenzhen) Co., Ltd. |
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Inventor after: Wei Jiazheng Inventor after: Dong Minggui Inventor before: Dong Minggui |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080528 Termination date: 20200523 |
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| CF01 | Termination of patent right due to non-payment of annual fee |