CN104560459A - Sandwich panel swelling agent and preparation method thereof - Google Patents
Sandwich panel swelling agent and preparation method thereof Download PDFInfo
- Publication number
- CN104560459A CN104560459A CN201510023577.9A CN201510023577A CN104560459A CN 104560459 A CN104560459 A CN 104560459A CN 201510023577 A CN201510023577 A CN 201510023577A CN 104560459 A CN104560459 A CN 104560459A
- Authority
- CN
- China
- Prior art keywords
- pure water
- preparation
- sodium hydroxide
- sandwich panel
- swelling agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Detergent Compositions (AREA)
Abstract
The invention discloses a sandwich panel swelling agent and a preparation method thereof. The sandwich panel swelling agent comprises the following components in volume fraction: 10%-12% of pure water, 80%-83% of dimethylformamide, 3%-5% of sodium hydroxide and 3%-5% of an additive. The preparation method comprises the following steps: controlling the temperature at 30-40 DEG C, adding a part of pure water into a stirring tank, adding dimethylformamide in proportion, and stirring; then adding analytically pure sodium hydroxide, and stirring; adding the additive, and stirring; adding pure water until the liquid level reaches a liquid level scale mark; sampling to analyze the content of each component in the prepared mixed liquid, correcting to a specified value by virtue of pure water, and reserving and sealing the sample. The sandwich panel swelling agent has very good swelling and processing effects to a PCB, is toxic free and harmless and does not pollute the environment; furthermore, in whole preparation process, the operation is simple and controllable, and the practicability is good; the sandwich panel swelling agent is suitable for large-scale industrial production.
Description
Technical field
The invention belongs to industrial cleaning agent technical field, be specifically related to a kind of multi-ply wood raising agent and preparation method thereof.
Background technology
PCB (Printed Circuit Board), Chinese is printed circuit board, and being called for short printed board, is one of vitals of electronic industry.Almost often kind of electronics, little of electronic watch, counter, arrive computer greatly, communication electronic device, military issue weapons system, as long as there are the electronic devices and components such as unicircuit, in order to the electric interconnection between them, all will use printed board.
In the pcb board process for processing having through hole, a key link is had to be exactly hole metallization flow process, this process makes non-conductive insulated vias be converted into active conductive through hole, and the method that existing pcb board makes hole conducting is PTH (electroless copper plating through hole) technique, its technical process is: copper → secondary countercurrent rinsing city washing → blanking is washed → sunk in material loading → bulk → secondary or three stage countercurrents rinsing → de-smear → recovery hot water wash → secondary countercurrent rinsing → neutralization/reduction → secondary countercurrent rinsing → whole hole/alkaline degreasing → secondary or three stage countercurrents rinsing → microetch alligatoring → secondary countercurrent rinsing → preimpregnation → activation → secondary countercurrent rinsing city washing → shortization → secondary countercurrent rinsing city.
In bulk treatment process, use special bulk treatment agent, disclosed in raising agent, patent is more, but little for the information of repeatedly raising agent special on pcb board disclosure.
Summary of the invention
The object of the invention is to provide a kind of multi-ply wood raising agent being specifically designed to the bulk process of printed circuit board.
In order to realize object of the present invention, the technical scheme of employing is:
A kind of multi-ply wood raising agent, is characterized in that, by volume mark meter, comprising:
As preferred technical scheme: described pure water hardness is 30PPM.
As preferred technical scheme: described sodium hydroxide is analytical pure sodium hydroxide.
As preferred technical scheme: described additive is polyoxyethylene glycol.PEG-4000, PEG-6000, PEG8000 be PEG6000 more preferably.
A preparation method for multi-ply wood raising agent, is characterized in that, comprises step:
Control temperature is 30 ~ 40 DEG C, and the amount according to preparation gets out the stirred pot that has fluid level scale line,
1., a part of pure water is added in stirred pot, add dimethyl formamide in proportion, stir more than 6 hours;
2. add analytical pure sodium hydroxide, again, stir more than 2 hours;
3., add PEG6000, stir more than 2 hours;
4., rest part pure water is added in stirred pot, reach fluid level scale line to liquid level;
5., the content of each component in the above-mentioned obtained mixed solution of sampling analysis, correct to prescribed value with pure water, keep sample and seal up for safekeeping.
Dimethyl formamide (DMF), DMF; Dimethylformamide; N, N-Dimethylformamide; DMF; CAS:68-12-2.A kind of transparent liquid, can and water and majority of organic solvent dissolve each other.It is the common solvent of chemical reaction.
The beneficial effect that the present invention has:
Have good bulk treatment effect to pcb board, this multilayer raising agent is nontoxic, does not pollute the environment.And whole preparation process is simple to operate controlled, practicality is good, is easy to large-scale industrial production.
Embodiment
Below in conjunction with embodiment, the invention will be further described, but protection scope of the present invention is not only confined to embodiment.
Embodiment 1
Control temperature is 30 ~ 40 DEG C, and the amount according to preparation gets out the stirred pot that has fluid level scale line,
1., to get 80L hardness be that 30PPM pure water adds in stirred pot, adds 800L dimethyl formamide in proportion, stir 6 hours;
2. add 30L analytical pure sodium hydroxide, again, stir 2 hours;
3., add 30L PEG6000, stir 2 hours;
4. getting the above-mentioned pure water of 20L, again adds in stirred pot, reaches fluid level scale line to liquid level;
5., the content of each component in the above-mentioned obtained mixed solution of sampling analysis, reach prescribed value, keep sample and seal up for safekeeping.
Embodiment 2
Control temperature is 30 ~ 35 DEG C, and the amount according to preparation gets out the stirred pot that has fluid level scale line,
1., to get 100L hardness be that 30PPM pure water adds in stirred pot, adds 820L dimethyl formamide in proportion, stir 7 hours;
2. add 40L analytical pure sodium hydroxide, again, stir 3 hours;
3., add 40L PEG6000, stir 3 hours;
4. getting the above-mentioned pure water of 10L, again adds in stirred pot, reaches fluid level scale line to liquid level;
5., the content of each component in the above-mentioned obtained mixed solution of sampling analysis, then add the above-mentioned pure water of 5L, sampling analysis again, reaches prescribed value, keeps sample and seals up for safekeeping.
Embodiment 3
Control temperature is 30 ~ 38 DEG C, and the amount according to preparation gets out the stirred pot that has fluid level scale line,
1., to get 100L hardness be that 30PPM pure water adds in stirred pot, adds 830L dimethyl formamide in proportion, stir 6 hours;
2. add 50L analytical pure sodium hydroxide, again, stir 3 hours;
3., add 50L PEG6000, stir 2 hours;
4. getting the above-mentioned pure water of 10L, again adds in stirred pot, reaches fluid level scale line to liquid level;
5., the content of each component in the above-mentioned obtained mixed solution of sampling analysis, then add the above-mentioned pure water of 10L, sampling analysis again, reaches prescribed value, keeps sample and seals up for safekeeping.
Last it is noted that above embodiment only in order to illustrate the present invention and and unrestricted technical scheme described in the invention; Therefore, although this specification sheets with reference to each above-mentioned embodiment to present invention has been detailed description, those of ordinary skill in the art should be appreciated that and still can modify to the present invention or equivalent to replace; And all do not depart from technical scheme and the improvement thereof of the spirit and scope of the present invention, it all should be encompassed in right of the present invention.
Claims (5)
1. a multi-ply wood raising agent, is characterized in that, by volume mark meter, comprising:
2. a kind of multi-ply wood raising agent according to claim 1, is characterized in that: described pure water hardness is 30PPM.
3. a kind of multi-ply wood raising agent according to claim 2, is characterized in that: described sodium hydroxide is analytical pure sodium hydroxide.
4. a kind of multi-ply wood raising agent according to claim 2, is characterized in that: described additive is polyoxyethylene glycol.
5. a preparation method for multi-ply wood raising agent, is characterized in that, comprises step:
Control temperature is 30 ~ 40 DEG C, and the amount according to preparation gets out the stirred pot that has fluid level scale line,
1., a part of pure water is added in stirred pot, add dimethyl formamide in proportion, stir more than 6 hours;
2. add analytical pure sodium hydroxide, again, stir more than 2 hours;
3., add PEG6000, stir more than 2 hours;
4., rest part pure water is added in stirred pot, reach fluid level scale line to liquid level;
5., the content of each component in the above-mentioned obtained mixed solution of sampling analysis, correct to prescribed value with pure water, keep sample and seal up for safekeeping.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510023577.9A CN104560459A (en) | 2015-01-19 | 2015-01-19 | Sandwich panel swelling agent and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510023577.9A CN104560459A (en) | 2015-01-19 | 2015-01-19 | Sandwich panel swelling agent and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104560459A true CN104560459A (en) | 2015-04-29 |
Family
ID=53077543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510023577.9A Pending CN104560459A (en) | 2015-01-19 | 2015-01-19 | Sandwich panel swelling agent and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104560459A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106010830A (en) * | 2016-07-05 | 2016-10-12 | 昆山艾森半导体材料有限公司 | Water-based leavening agent for PCB and use method of water-based leavening agent |
| CN106591907A (en) * | 2016-10-14 | 2017-04-26 | 江门崇达电路技术有限公司 | Copper plating method for PCB production process |
| CN113088410A (en) * | 2021-03-26 | 2021-07-09 | 广州皓悦新材料科技有限公司 | Amide horizontal copper deposition swelling agent and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1140973A (en) * | 1995-06-01 | 1997-01-22 | 日立化成工业株式会社 | Process for producing multilayer printed circuit boards |
| CN1384158A (en) * | 2001-02-23 | 2002-12-11 | 希普雷公司 | Resin material for decoration and sweller for deterging and eliminating the resin material |
| CN1717159A (en) * | 2005-05-23 | 2006-01-04 | 松维线路板（深圳）有限公司 | Method forp roducing multilayer printed circuit board |
| CN1875090A (en) * | 2003-10-27 | 2006-12-06 | 和光纯药工业株式会社 | Cleaning agent for substrate and cleaning method |
-
2015
- 2015-01-19 CN CN201510023577.9A patent/CN104560459A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1140973A (en) * | 1995-06-01 | 1997-01-22 | 日立化成工业株式会社 | Process for producing multilayer printed circuit boards |
| CN1384158A (en) * | 2001-02-23 | 2002-12-11 | 希普雷公司 | Resin material for decoration and sweller for deterging and eliminating the resin material |
| CN1875090A (en) * | 2003-10-27 | 2006-12-06 | 和光纯药工业株式会社 | Cleaning agent for substrate and cleaning method |
| CN1717159A (en) * | 2005-05-23 | 2006-01-04 | 松维线路板（深圳）有限公司 | Method forp roducing multilayer printed circuit board |
Non-Patent Citations (2)
| Title |
|---|
| 安徽省节能减排检测信息中心: "《固定资产投资项目能评文件编制实务》", 30 November 2014, 安徽科学技术出版社 * |
| 王冠熙: "《家用洗衣机原理、使用与维修》", 28 February 1994, 电子工业出版社 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106010830A (en) * | 2016-07-05 | 2016-10-12 | 昆山艾森半导体材料有限公司 | Water-based leavening agent for PCB and use method of water-based leavening agent |
| CN106591907A (en) * | 2016-10-14 | 2017-04-26 | 江门崇达电路技术有限公司 | Copper plating method for PCB production process |
| CN113088410A (en) * | 2021-03-26 | 2021-07-09 | 广州皓悦新材料科技有限公司 | Amide horizontal copper deposition swelling agent and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104560459A (en) | Sandwich panel swelling agent and preparation method thereof | |
| Chen et al. | Lead during the leaching process of copper from waste printed circuit boards by five typical ionic liquid acids | |
| KR101513344B1 (en) | Method for chemically plating gold surface of capacitive touch screen | |
| SE0701681L (en) | Etching and recycling process | |
| TW200724561A (en) | Method for producing an aqueous dispersion containing a complex of poly(3, 4-dialkoxythiophene) and a polyanion | |
| CN103695653B (en) | A kind of method of noble metal on wet underwater welding circuit board | |
| US20150212156A1 (en) | Method and apparatus for valid encoding | |
| CN104372176A (en) | Method for extracting gold, silver and palladium from waste mobile phone | |
| CN104411107A (en) | PCB electrogilding technology | |
| CN102605360B (en) | Chemical silvering solution based on imidazolium ionic liquid and silvering method | |
| Jha et al. | Opportunities for an en-route to polymer inclusion membrane approach from conventional hydrometallurgical recycling of WPCBs: a mini-review | |
| CN101760200A (en) | Alkaline etching solution | |
| CN104152874A (en) | Printed circuit board chemical copper plating activation solution | |
| Jellesen et al. | Investigation of electronic corrosion at device level | |
| CN101139714A (en) | Copper etching liquid composition and production method thereof | |
| CN103849861B (en) | A kind of method of carrying out on Copper substrate surface without cyanogen replacement ag plating | |
| Goosey et al. | Materials used in manufacturing electrical and electronic products | |
| WO2014131401A3 (en) | Hydrometallurgical process for recovery of metals and/or semimetals from waste materials containing compound semiconductor materials and/or back contact materials and/or transparent electrically conducting oxides (tcos) | |
| CN104312234B (en) | Computer main board fire retardant | |
| CN104427778A (en) | Gold plating method for printed circuit board | |
| CN203866055U (en) | Treatment plant capable of increasing cupric ion standard in waste water of PCB industry | |
| CN204858127U (en) | One time connection mode circuit board connects cartridge to put | |
| CN203707381U (en) | Conveyer for conveying LVDS signals | |
| Choi et al. | Functional Inks for Printed Electronics | |
| CN204069471U (en) | A kind of PCB structure helping heat radiation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150429 |