CN101760200A - Alkaline etching solution - Google Patents
Alkaline etching solution Download PDFInfo
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- CN101760200A CN101760200A CN200910193757A CN200910193757A CN101760200A CN 101760200 A CN101760200 A CN 101760200A CN 200910193757 A CN200910193757 A CN 200910193757A CN 200910193757 A CN200910193757 A CN 200910193757A CN 101760200 A CN101760200 A CN 101760200A
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Abstract
The invention relates to alkaline etching solution, which adopts a chemical method to etch on a double-sided printed circuit board. The components and contents thereof of the alkaline etching solution are as follows: 25-27.5 percent of ammonium chloride, 45-50 percent of ammonia of 20 percent, 0.15-0.25 percent of additive and 24-29 percent of water. The additive is hyposulphite or mixture of ammonium phosphate and ammonium hydrogen carbonate, and the water is tap water, soft water or deionized water. The invention has the advantages of high etching efficiency, no precipitation, high etching rate, stable etching and low lateral erosion.
Description
Technical field
The present invention relates to utilize chemical process to make the etching solution that forms circuit on the printed-wiring board (PWB), relate in particular to a kind of chemical process etched alkaline etching liquid on the printed on both sides wiring board that utilizes.
Background technology
Etching is an operation necessary in the printed-wiring board (PWB) production process, and etching work procedure normally cooperates etching solution to finish by etching machine, and etching solution comprises etching mother liquor and the sub-liquid of etching, and the sub-liquid of etching mother liquor and etching is to be combined by multipleization and thing.Etching work procedure is very crucial in the production process of printed-wiring board (PWB), and etching work procedure is well-done and poor, directly the quality and the performance of the whole printed circuit board (PCB) of influence.There is following problem in common alkaline etching liquid: erosion copper speed is low, and the etch-rate instability, and lateral erosion is big.
Summary of the invention
Technical problem to be solved: the object of the invention provides a kind of etching efficiency height, copper capacity height, stable alkaline etching liquid.
Technical scheme: each component of the present invention and content are: ammonium chloride 25%～27.5%, 20% ammoniacal liquor 45%～50%, additive 0.15%～0.25%, water 24%～29%.
Preferably, ammonium chloride 26%, 20% ammoniacal liquor 47%, additive 0.2%, water 26.8%.
More than all percentage ratios be weight percentage.
Additive is a Sulfothiorine, or the mixture of ammonium phosphate and bicarbonate of ammonia, and water is tap water, soft water, deionized water.
The present invention is dissolved raw material fully and is got final product stirring in each quantitative raw material adding agitated pool.
The present invention compared with prior art has following advantage:
Etching efficiency height of the present invention does not precipitate, and erosion copper speed is high and stablize, and lateral erosion is little, and is soluble in water, simple to operate.Materials such as polyvinyl chloride, silicon rubber, titanium all there is not erosion.Alkaline etching liquid is mainly used in the etching of double-sided wiring board.Be applicable to the etching of accurate wiring board, be specially adapted to high-accuracy inner plating and lamina rara externa etching, have excellent stability and soup, can be applicable to the anti-etching resistance layer that comprises dry film.
Embodiment
Below all percentage ratios be weight percentage.
Embodiment 1
Each component of present embodiment and content are: ammonium chloride 25%, and concentration 20% ammoniacal liquor 50%, additive is a Sulfothiorine 0.25%, tap water 24.75%.Ammonium chloride can be the agricultural level, also can be technical grade.Ammoniacal liquor is technical grade.Stir in each quantitative raw material adding agitated pool, raw material is dissolved fully get final product.
Embodiment 2
Each component of present embodiment and content are: ammonium chloride 27.5%, 20% ammoniacal liquor 45%, additive are the mixture 0.15% of ammonium phosphate and bicarbonate of ammonia, soft water 27.35%.
Embodiment 3
Each component of present embodiment and content are: ammonium chloride 25.78%, 20% ammoniacal liquor 45%, additive is a Sulfothiorine 0.22%, deionized water 29%.
Embodiment 4
Present embodiment ammonium chloride 26%, 20% ammoniacal liquor 47%, additive are the mixture 0.2% of ammonium phosphate and bicarbonate of ammonia, tap water 26.8%.
Embodiment 5
Each component of present embodiment and content are: ammonium chloride 26%, 20% ammoniacal liquor 49.78%, additive is a Sulfothiorine 0.22%, deionized water 24%.
Claims (3)
1. alkaline etching liquid is characterized in that each component and content are:
Ammonium chloride 25%～27.5%,
20% ammoniacal liquor 45%～50%,
Additive 0.15%～0.25%,
Water 24%～29%,
All percentage ratios are weight percentage.
2. a kind of alkaline etching liquid according to claim 1 is characterized in that ammonium chloride 26%, 20% ammoniacal liquor 47%, additive 0.2%, and water 26.8%, all percentage ratios are weight percentage.
3. a kind of alkaline etching liquid according to claim 1 and 2 is characterized in that: additive is a Sulfothiorine, or the mixture of ammonium phosphate and bicarbonate of ammonia, and water is tap water, soft water, deionized water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910193757A CN101760200A (en) | 2009-11-09 | 2009-11-09 | Alkaline etching solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910193757A CN101760200A (en) | 2009-11-09 | 2009-11-09 | Alkaline etching solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101760200A true CN101760200A (en) | 2010-06-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910193757A Pending CN101760200A (en) | 2009-11-09 | 2009-11-09 | Alkaline etching solution |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101760200A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103819026A (en) * | 2014-03-10 | 2014-05-28 | 惠州Tcl环境科技有限公司 | Resource utilization method of high-concentration ammonia nitrogen waste liquid |
| CN107227462A (en) * | 2016-03-24 | 2017-10-03 | 达兴材料股份有限公司 | Alkaline etching solution composition and etching method using same |
| CN107740105A (en) * | 2017-11-09 | 2018-02-27 | 佛山市华希盛化工有限公司 | A kind of alkaline etching liquid and preparation method thereof |
| CN109136929A (en) * | 2018-10-29 | 2019-01-04 | 深圳市中南环保科技控股有限公司 | Environment-friendly highly efficient alkaline etching liquid |
| CN113088974A (en) * | 2021-04-08 | 2021-07-09 | 广东连发助剂厂有限公司 | Alkaline copper etching solution and production process thereof |
| CN113652694A (en) * | 2021-06-24 | 2021-11-16 | 广东桐鸣环保科技有限公司 | Copper plating layer stripping liquid and stripping method |
-
2009
- 2009-11-09 CN CN200910193757A patent/CN101760200A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103819026A (en) * | 2014-03-10 | 2014-05-28 | 惠州Tcl环境科技有限公司 | Resource utilization method of high-concentration ammonia nitrogen waste liquid |
| CN107227462A (en) * | 2016-03-24 | 2017-10-03 | 达兴材料股份有限公司 | Alkaline etching solution composition and etching method using same |
| CN107740105A (en) * | 2017-11-09 | 2018-02-27 | 佛山市华希盛化工有限公司 | A kind of alkaline etching liquid and preparation method thereof |
| CN109136929A (en) * | 2018-10-29 | 2019-01-04 | 深圳市中南环保科技控股有限公司 | Environment-friendly highly efficient alkaline etching liquid |
| CN113088974A (en) * | 2021-04-08 | 2021-07-09 | 广东连发助剂厂有限公司 | Alkaline copper etching solution and production process thereof |
| CN113088974B (en) * | 2021-04-08 | 2022-05-10 | 广东连发助剂厂有限公司 | Alkaline copper etching solution and production process thereof |
| CN113652694A (en) * | 2021-06-24 | 2021-11-16 | 广东桐鸣环保科技有限公司 | Copper plating layer stripping liquid and stripping method |
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Application publication date: 20100630 |