CN103819026A - Resource utilization method of high-concentration ammonia nitrogen waste liquid - Google Patents
Resource utilization method of high-concentration ammonia nitrogen waste liquid Download PDFInfo
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- CN103819026A CN103819026A CN201410085584.7A CN201410085584A CN103819026A CN 103819026 A CN103819026 A CN 103819026A CN 201410085584 A CN201410085584 A CN 201410085584A CN 103819026 A CN103819026 A CN 103819026A
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Abstract
The invention discloses a resource utilization method of a high-concentration ammonia nitrogen waste liquid. The method comprises the steps as follows: 1, impurity removal: after copper in an etching liquid containing copper is recovered, an ion exchange technique is utilized to absorb and recover low-concentration copper ions in residual high-concentration ammonia nitrogen wastewater, and a regenerative copper chloride raw material is obtained after resin dissolving; and an appropriate amount of barium chloride is added in wastewater without copper so as to remove sulfate radical impurities introduced during a copper sulfate production process; and 2, blending: residual wastewater without copper is the high-concentration ammonia nitrogen wastewater, ammonium chloride concentration is adjusted with an addition method or through evaporation and concentration by a multi-effect evaporator, and then an auxiliary etching liquid is blended according to a corresponding formula and is reused for the circuit board industry. With the adoption of the method, not only is an environmental pollution problem caused by heavy metal ions and the high-concentration ammonia nitrogen waste liquid solved, but also the closed cyclic utilization of the etching liquid of the circuit board industry is achieved, the resource is saved, and the environment is protected.
Description
Technical field
The present invention relates to a kind of ammonia nitrogen in high density effluent resource and utilize method, is mainly that after carrying copper for circuit-board industry copper-containing etching waste solution, ammonia nitrogen in high density waste liquid carries out comprehensive utilization of resources.The method is particularly related to the impurity-removing method of high ammonia-nitrogen wastewater, the method is particularly related to ion exchange technique and reclaims the method for the high ammonia-nitrogen wastewater that contains lower concentration copper, relate to the method that uses bariumchloride to remove sulfate radical formation barium sulfate, relate to the method for ammonia nitrogen waste water distillation and concentration, relate to ammonia nitrogen waste water concentrated solution and be deployed into the sub-liquid of alkali etching and the sub-liquid product of single-liquid type acid etching and be back to according to special formulation the method for wiring board industry.
Background technology
Waste printed circuit board etching liquid (also claiming PCB etching waste liquor) comprises acid copper-containing etching waste solution and alkaline copper-containing etching waste solution.Carry copper by printed circuit board copper-containing etching waste solution and produce the products such as copper sulfate, basic copper chloride or copper sponge, if reacted waste water belongs to high ammonia-nitrogen wastewater and do not process, discharge, can cause body eutrophication, polluted water arbitrarily.So the subsequent disposal that printed circuit board copper-containing etching waste solution is carried copper waste water is most important in innoxious, recycling treatment link.
At present, the denitrifying method of ammonia nitrogen waste water has biological nitrification and denitrification method, break point chlorination method, air lift blow-off method, ion exchange method and evaporative crystallization method etc., but these methods are in processing power and be not very desirable on treatment effect, exist and easily cause secondary pollution, waste water need to be processed again, the problems such as energy consumption is high, deficiency in economic performance.Adopt high-efficiency evaporating concentration technique, distilled water is back to the press filtration washing of printed circuit board copper-containing etching waste solution production copper sulfate, basic copper chloride on the one hand, avoid the secondary pollution of distilled water, concentrated solution is without outer row on the other hand, and the ammonium chloride concentrated solution that high-efficient evaporating unit reclaims is back to printed circuit board again according to the sub-liquid of specific formula redistribution alkalize etching or the sub-liquid of single-liquid type acid etching.
" high-concentration ammonia nitrogen waste water treatment method " that Chinese patent CN1367147A discloses, it is characterized in that first in waste water, adding alkaline compound agent unslaked lime and calcium peroxide, aeration 1 hour after stirring reaction, add again sodium hydroxide and Sodium peroxoborate, aeration 1 hour after stirring reaction, add again aluminium salt or Ferric Salt Flocculants, aeration 0.5-1 hour after stirring, last sedimentation under the effect that adds polymeric flocculant, separation.But the main drawback that this technique exists is that each step reagent adds rear reaction aeration, causes a large amount of ammonia nitrogen gas to fly away in air, cures the symptoms, not the disease, still contaminate environment.
" preparation method of regenerated alkaline etching supplementary liquid and the apparatus system thereof " that Chinese patent CN1156766A discloses, it is characterized in that alkaline etching waste liquid for producing acidic copper chloride waste etching solution to neutralize, generation basic copper chloride precipitation, through press filtration, its filtered liquid is carried out after ammonium chloride and the adjustment of additive ammonium phosphate content, be that blank pipe carries out the logical ammonia of secondary by PE, make after filtration regenerated alkaline etching supplementary liquid.But this technique does not purify filtered liquid, contains SO
4 2-and a small amount of Cu
2+deng impurity, the quality of the sub-liquid of etching will be badly influenced; In addition this patent only can be deployed into the sub-liquid of a kind of alkali etching.
Summary of the invention
The technical problem to be solved in the present invention is to avoid above-mentioned prior art weak point and a kind of propose recycling of ammonia nitrogen in high density waste liquid method.The ammonia nitrogen in high density waste liquid that the method is carried circuit-board industry copper-containing etching waste solution recovery printed circuit board copper-containing etching waste solution after the products such as copper production copper sulfate, basic copper chloride or copper sponge carries out comprehensive utilization of resources, is particularly suitable for the ammonia nitrogen in high density waste liquid of the type to carry out batch processing.
The technical scheme that the present invention solve the technical problem employing comprises the steps:
A kind of ammonia nitrogen in high density effluent resource utilizes method.It is characterized in that comprising the steps:
(A) removal of impurities: carry the ammonia nitrogen in high density waste liquid producing after copper for copper-containing etching waste solution, adopt ion exchange technique to reclaim the cupric ion of lower concentration; Waste water after copper removal adds appropriate bariumchloride (BaCl2) again and removes the sulfate radical foreign matter of introducing;
(B) allotment: the above-mentioned waste water through purifying is by outer addition or multiple-effect evaporator evaporation concentration adjustment ammonium chloride concentration, then be deployed into the sub-liquid of etching according to corresponding formula and be back to circuit-board industry.
In described step (A), (1) in the time of the copper-containing wastewater that uses ion exchange technique absorption residue not reclaim, what remove resin of copper employing is that its carrier components is mainly piperazine aminodithioformic acid type resin, and contained waste liquid is 0.5-2min in the residence time of ion exchange column; (2) in the time resolving ion exchange column, select 10-20% analytical pure resolving hydrochloric acid resin, obtain cupric chloride liquid, for neutralization reaction; (3) remove the SO42-in waste water by adding a certain amount of BaCl2, after pressure filter press filtration, isolate BaSO4 product.
In described step (B), it is 280-350g/L that (1) above-mentioned waste water through purifying is adjusted ammonium chloride concentration by outer addition or multiple-effect evaporator evaporation concentration; (2) in the time of evaporation ammonia nitrogen waste water, adopt negative-pressure cyclic evaporation unit, evaporation unit adopts mechanical compressor to carry out loop compression to steam, and vaporization temperature is between 100-118 ℃.
In described step (B), be deployed into the sub-liquid of etching according to corresponding formula and be back to circuit-board industry.The sub-liquid formula of alkali etching of allotment is: the dense waste liquid 800-840L of ammonia nitrogen in high density of 280-330g/L, 98% liquefied ammonia 180L, food carbon 12.5kg, additive 3kg, its weight ratio: Sulfothiorine: phosphoric acid composite salt: ammonium thiosulfate is 1:1:1.
In described step (B), be deployed into the sub-liquid of etching according to corresponding formula and be back to circuit-board industry, the sub-liquid formula of single-liquid type acid etching of allotment is: the ammonia nitrogen in high density concentrated solution 430-530L of 280-330g/L, 31% hydrochloric acid 400L, tap water 70-170L, additive 2kg is ammonium nitrate: one or more of tensio-active agent glycerin fatty acid ester, lipid acid sorb smooth (sapn), polysorbate (tween), its weight ratio is 3:1.
Compared with the existing technology, the beneficial effect of the method for the recycling of a kind of ammonia nitrogen in high density waste liquid of the present invention is:
1, adopt ion exchange resin to remove process for copper and contrast the heavy process for copper of traditional sodium sulphite, resin copper removal can not cause secondary environmental pollution, and resin is regenerated and reused after resolving, obtain Cupric Chloride Solution and can directly be reused for neutralization reaction production fodder additives.Piperazine aminodithioformic acid type resin copper removal rate of the present invention is up to 99.7%.
2, ammonia nitrogen waste water adopts high-efficiency evaporating concentration technique, avoid discharge water ammonia nitrogen to pollute again, the waste liquid evaporating after testing ammonia nitrogen concentration below 10ppm, direct reuse is produced copper sulfate in printed circuit board copper-containing etching waste solution, the press filtration washing of basic copper chloride, concentrated solution is without outer row on the other hand, the sub-liquid of alkali etching or the sub-liquid of single-liquid type acid etching that the ammonium chloride concentrated solution that high-efficient evaporating unit reclaims becomes high-quality according to specific formula redistribution are back to printed circuit board again, realize wastewater zero discharge, reduce ammonia nitrogen waste water and process energy consumption, the object of increasing economic efficiency.
3, the method has realized the utilization of wiring board industry etching solution closed loop cycle, has solved a great problem of the high ammonia nitrogen effluent resource of industry.
4, the high-concentration ammonia nitrogenous wastewater being applicable to after circuit-board industry copper-containing etching waste solution in enormous quantities is carried recycles.
5, being deployed into additive in the sub-liquid formula of single-liquid type acid etching is the additive (weight ratio of researching and developing voluntarily, ammonium nitrate: tensio-active agent glycerin fatty acid ester, lipid acid sorb smooth (sapn), polysorbate (tween) one or more=3:1) can effectively prevent from the crystalline deposit of single liquid etching solution from having solved the old problem of single-liquid type acid etching liquid ubiquity crystalline deposit in industry.
Accompanying drawing explanation
Fig. 1 is schema of the present invention.
Embodiment
Below in conjunction with embodiment, the present invention is described in further detail, not as limiting the scope of the present invention.After circuit-board industry copper-containing etching waste solution is carried copper, ammonia nitrogen in high density component of effluent is as following table 1.
Table 1 ammonia nitrogen in high density component of effluent table.
Step 1: removal of impurities.
(1) it is highly 1 meter that 16 cubes of the copper-containing wastewaters of collecting slowly drop to, volume is in the resin post of 12 cubic metres, waste liquid is 1 minute in the residence time of resin column, by collecting after ion exchange column without copper ammonia nitrogen waste water, is 0.8ppm after testing without copper content in copper waste water;
(2) use 5% analytical pure salt slow acid to be added drop-wise in resin column, hydrochloric acid is 1 minute in the residence time of resin column, by obtaining cupric chloride liquid after ion exchange column, generates copper sludge precipitation for neutralization reaction;
(3) detect without the SO in copper waste water
4 2+content is 55g/L, adds the BaCl of 1908kg
2, sulfate concentration is down to below 1.0g/L.Remove most of sulfate radical foreign matter, can avoid a large amount of existence of sulfate radical to affect the sub-liquid quality of etching of follow-up allotment.It is for sale that the precipitation generating obtains barium sulfate product through pressure filter press filtration.
Ammonia nitrogen in high density component of effluent table after table 2 removal of impurities.
? | Cu 2+(g/L) | Ammonia nitrogen (g/L) | Na +(g/L) | PH value | SO 4 2+(g/L) |
Ammonia nitrogen in high density waste liquid | 0.0008 | 32.5 | 0.8 | 4.5 | 1.0 |
Step 2: allotment.
(1) be 1. 31% hydrochloric acid by slowly adding concentration in the ammonia nitrogen in high density waste liquid after above-mentioned removal of impurities, allotment is 3.0 without copper waste water pH value; 2. the ammonia nitrogen in high density waste liquid of the deployed pH value of heating evaporation, controls vaporization temperature between 110-118 ℃, collects the steam condensate after evaporation, after detecting, finds that distilled water ammonia nitrogen concentration is 6ppm; 3. ammonia nitrogen in high density waste liquid evaporation falls after 30-40%, stops heating, obtains ammonium chloride concentrated solution ammonia-nitrogen content at 280-330g/L.
(2) get ammonia nitrogen in high density waste liquid 800L, add the liquefied ammonia of 180L98%, food charcoal 12.5kg, additive (weight ratio, Sulfothiorine: phosphoric acid composite salt: ammonium thiosulfate=1:1:1) 3kg, obtains the sub-liquid 1000L of alkali etching.
(3) get ammonia nitrogen in high density waste liquid 600L, add the liquefied ammonia of 400L31%, additive (weight ratio, ammonium nitrate: tensio-active agent glycerin fatty acid ester, lipid acid sorb smooth (sapn), polysorbate (tween) one or more=3:1) 2kg, obtain the sub-liquid 1000L of single-liquid type acid etching.
Circuit-board industry ammonia nitrogen in high density waste liquid is deployed into high-quality by the method for the recycling of a kind of ammonia nitrogen in high density waste liquid of process the present invention the sub-liquid of alkali etching or the sub-liquid of single-liquid type acid etching are back to printed circuit board again, realized wastewater zero discharge, have reduced the object that ammonia nitrogen waste water is processed energy consumption, improved economic benefit.
The above case study on implementation has only been expressed the preferred embodiment of the present invention, it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention, it should be noted that, for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention; Therefore, all equivalents and modifications of doing with the claims in the present invention scope, all should belong to the covering scope of the claims in the present invention.
Claims (5)
1. an ammonia nitrogen in high density effluent resource utilizes method.It is characterized in that comprising the steps:
(A) removal of impurities: carry the ammonia nitrogen in high density waste liquid producing after copper for copper-containing etching waste solution, adopt ion exchange technique to reclaim the cupric ion of lower concentration; Waste water after copper removal adds appropriate bariumchloride again and removes the sulfate radical foreign matter of introducing;
(B) allotment: the above-mentioned waste water through purifying is by outer addition or multiple-effect evaporator evaporation concentration adjustment ammonium chloride concentration, then be deployed into the sub-liquid of etching according to corresponding formula and be back to circuit-board industry.
2. a kind of ammonia nitrogen in high density effluent resource according to claim 1 utilizes method, it is characterized in that: in described step (A), (1) in the time of the copper-containing wastewater that uses ion exchange technique absorption residue not reclaim, what remove resin of copper employing is that its carrier components is mainly piperazine aminodithioformic acid type resin, and contained waste liquid is 0.5-2min in the residence time of ion exchange column; (2) in the time resolving ion exchange column, select 10-20% analytical pure resolving hydrochloric acid resin, obtain cupric chloride liquid, for neutralization reaction; (3) remove the SO42-in waste water by adding a certain amount of BaCl2, after pressure filter press filtration, isolate BaSO4 product.
3. a kind of ammonia nitrogen in high density effluent resource according to claim 1 utilizes method, it is characterized in that:
In described step (B), it is 280-350g/L that (1) above-mentioned waste water through purifying is adjusted ammonium chloride concentration by outer addition or multiple-effect evaporator evaporation concentration; (2) in the time of evaporation ammonia nitrogen waste water, adopt negative-pressure cyclic evaporation unit, evaporation unit adopts mechanical compressor to carry out loop compression to steam, and vaporization temperature is between 100-118 ℃.
4. a kind of ammonia nitrogen in high density effluent resource according to claim 1 utilizes method, it is characterized in that:
In described step (B), be deployed into the sub-liquid of etching according to corresponding formula and be back to circuit-board industry.The sub-liquid formula of alkali etching of allotment is: the dense waste liquid 800-840L of ammonia nitrogen in high density of 280-330g/L, 98% liquefied ammonia 180L, food carbon 12.5kg, additive 3kg, its weight ratio: Sulfothiorine: phosphoric acid composite salt: ammonium thiosulfate is 1:1:1.
5. a kind of ammonia nitrogen in high density effluent resource according to claim 1 utilizes method, it is characterized in that: in described step (B), be deployed into the sub-liquid of etching according to corresponding formula and be back to circuit-board industry, the sub-liquid formula of single-liquid type acid etching of allotment is: the ammonia nitrogen in high density concentrated solution 430-530L of 280-330g/L, 31% hydrochloric acid 400L, tap water 70-170L, additive 2kg, for ammonium nitrate: one or more of tensio-active agent glycerin fatty acid ester, lipid acid sorb smooth (sapn), polysorbate (tween), its weight ratio is 3:1.
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Cited By (6)
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CN104310441A (en) * | 2014-10-10 | 2015-01-28 | 山东诺贝丰化学有限公司 | Reaction heat comprehensive utilization system and reaction heat comprehensive utilization method in coproduction of potassium nitrate and ammonium chloride |
CN104692573A (en) * | 2015-04-14 | 2015-06-10 | 江西晨光新材料有限公司 | Wastewater treatment method in process of synthesizing bis-[gamma-triethoxysilylpropyl]-tetrasulfide through aqueous phase method |
CN106746114A (en) * | 2016-12-18 | 2017-05-31 | 南通江山农药化工股份有限公司 | The production method of amide-type by-product industrial ammonium chloride |
CN107043185A (en) * | 2017-06-19 | 2017-08-15 | 深圳慧欣环境技术有限公司 | A kind of circuitboard etching waste liquid ammonia nitrogen processing method for resource recovery and system |
CN109534856A (en) * | 2018-12-21 | 2019-03-29 | 深圳市星河环境技术有限公司 | A method of the total nitrogen zero-emission suitable for tin removal waste liquor |
CN111908499A (en) * | 2020-07-21 | 2020-11-10 | 王水平 | Method and device for preparing copper oxide and ammonium chloride by combining waste acid and alkaline etching solution |
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CN101760200A (en) * | 2009-11-09 | 2010-06-30 | 广东奥美特集团有限公司 | Alkaline etching solution |
CN102107978A (en) * | 2010-12-23 | 2011-06-29 | 惠州市奥美特环境科技有限公司 | Method for resource utilization and innocent treatment of etching waste liquid containing copper in circuit board industry |
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Cited By (7)
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CN104310441A (en) * | 2014-10-10 | 2015-01-28 | 山东诺贝丰化学有限公司 | Reaction heat comprehensive utilization system and reaction heat comprehensive utilization method in coproduction of potassium nitrate and ammonium chloride |
CN104692573A (en) * | 2015-04-14 | 2015-06-10 | 江西晨光新材料有限公司 | Wastewater treatment method in process of synthesizing bis-[gamma-triethoxysilylpropyl]-tetrasulfide through aqueous phase method |
CN106746114A (en) * | 2016-12-18 | 2017-05-31 | 南通江山农药化工股份有限公司 | The production method of amide-type by-product industrial ammonium chloride |
CN107043185A (en) * | 2017-06-19 | 2017-08-15 | 深圳慧欣环境技术有限公司 | A kind of circuitboard etching waste liquid ammonia nitrogen processing method for resource recovery and system |
CN109534856A (en) * | 2018-12-21 | 2019-03-29 | 深圳市星河环境技术有限公司 | A method of the total nitrogen zero-emission suitable for tin removal waste liquor |
CN109534856B (en) * | 2018-12-21 | 2021-03-05 | 深圳市星河环境技术有限公司 | Method suitable for zero emission of total nitrogen in tin stripping waste liquid |
CN111908499A (en) * | 2020-07-21 | 2020-11-10 | 王水平 | Method and device for preparing copper oxide and ammonium chloride by combining waste acid and alkaline etching solution |
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Application publication date: 20140528 |