CN101935838A - Microetching processing method used before copper deposition of printed circuit board - Google Patents
Microetching processing method used before copper deposition of printed circuit board Download PDFInfo
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- CN101935838A CN101935838A CN 201010246820 CN201010246820A CN101935838A CN 101935838 A CN101935838 A CN 101935838A CN 201010246820 CN201010246820 CN 201010246820 CN 201010246820 A CN201010246820 A CN 201010246820A CN 101935838 A CN101935838 A CN 101935838A
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Abstract
The invention discloses a microetching processing method used before the copper deposition of a printed circuit board, belongs to the technical field of processing of the printed circuit board and aims to provide circuit board processing technology with long using period of microetching solution, low consumption of metal copper and small sewage quantity. The key point of the technical scheme is that: after being subjected to the conventional preprocessing, the printed circuit board which needs to be subjected to the copper deposition is put into a microetching solution tank to be subjected to microetching processing, wherein the microetching depth of a copper layer of the printed circuit board during the microetching processing is controlled in the range of 0.2 to 0.5 micron. The microetching processing method is used for the microetching processing of the printed circuit board.
Description
Technical field
The present invention relates to a kind of treatment process of printed circuit board, more particularly, it relates to the microetch treatment process before the heavy copper of a kind of printed circuit board.
Background technology
The chemical-copper-plating process flow process of printed circuit board is generally: burr removal, slotting frame upper plate, whole hole, two-stage washing, microetch, two-stage washing, preimpregnation, activation, two-stage washing, acceleration, two-stage washing, electroless copper, two-stage washing, ejecting plate change down operation over to.Wherein microetch is one of topmost one link in the electroless copper pretreatment procedure, and its effect is even roughness copper-clad plate surface, guarantees that there is good bonding force on copper-clad plate top layer and chemical copper layer to satisfy the requirement of product electrical property when electroless copper.At present, generally the microetch degree of depth of the microetch liquid medicine of Shi Yonging is controlled at 0.8～2.0 micron, like this because the microetch degree of depth is excessive, causing has wasted a large amount of metallic coppers, directly influence simultaneously production efficiency again, increase the pressure of production cost and sewage disposal, increase the weight of the influence degree of environment.
Summary of the invention
The technical problem to be solved in the present invention is the above-mentioned deficiency at prior art, provides the heavy copper of printed circuit board that a kind of micro-etching solution life cycle is long, metallic copper consumption is low, sewage quantity is few preceding microetch treatment process.
Technical scheme of the present invention is such: the microetch treatment process before the heavy copper of a kind of printed circuit board, after being the pre-treatment of printed circuit board through routine with the heavy copper of needs, put into the microetch liquid bath and carry out the microetch processing, the copper layer microetch degree of depth of printed circuit board was controlled at 0.2～0.5 micron when wherein said microetch was handled.
Further, in the microetch treatment process before the heavy copper of above-mentioned a kind of printed circuit board, described micro-etching solution composition can be every liter and contain 20～40 gram sulfuric acid, 3～25 gram Cu
2+With 40～60 gram Sodium Persulfates; The microetch treatment temp of printed circuit board in above-mentioned micro-etching solution is 25～30 ℃, and the treatment time is 85～95 seconds; Described micro-etching solution adds 1.8kg sulfuric acid and 2.5kg Sodium Persulfate by 100 square metres of printed circuit boards of every microetch.
In the microetch treatment process before the heavy copper of above-mentioned a kind of printed circuit board, described micro-etching solution composition also can be every liter and contain 20～40 gram sulfuric acid, 3～25 gram Cu
2+With 30～50 gram ammonium persulphates; The microetch treatment temp of printed circuit board in above-mentioned micro-etching solution is 25～30 ℃, and the treatment time is 85～95 seconds; Described micro-etching solution adds 1.8kg sulfuric acid and 2kg ammonium persulphate by 100 square metres of printed circuit boards of every microetch.
In the microetch treatment process before the heavy copper of above-mentioned a kind of printed circuit board, described micro-etching solution composition also can be every liter and contain 15～35 gram sulfuric acid, 3～40 gram Cu
2+, 4～8 gram hydrogen peroxide and 0.4～0.8 gram microetch stablizer; The microetch treatment temp of printed circuit board in above-mentioned micro-etching solution is 25～30 ℃, and the treatment time is 85～95 seconds; Described micro-etching solution adds 1.8kg sulfuric acid, 0.7kg hydrogen peroxide and 0.07kg microetch stablizer by 100 square metres of printed circuit boards of every microetch.
The present invention compared with prior art has following advantage:
(1) the present invention can reduce copper raw material consumption by reducing the microetch degree of depth of printed circuit board, cuts down finished cost about 60%.
(2) the present invention can also prolong the duration of service of micro-etching solution, changes micro-etching solution weekly one time by original pact, extends to just to change one time micro-etching solution at least in every month, has reduced the treatment capacity of production waste widely.
Embodiment
Below in conjunction with specific embodiment, the present invention is described in further detail, but does not constitute any limitation of the invention.
Embodiment one
Micro-etching solution composition: 100 liters of deionized waters, 2 kilograms in sulfuric acid, Cu
2+0.3 kilogram, 4 kilograms of Sodium Persulfates, Cu wherein
2+Utilize copper sulfate to obtain, down together.
The treatment process of printed circuit board: the printed circuit board that will need heavy copper is through conventional pre-treatment, be burr removal, insert the frame upper plate, put in order hole and two-stage washing, put into the microetch groove that fills above-mentioned micro-etching solution and carry out the microetch processing, the microetch treatment temp is 25～30 ℃, and the treatment time is 85～95 seconds; And then after routine is handled, carry out electroless copper, conventional processing promptly is two-stage washing, preimpregnation, activation, two-stage washing, acceleration and two-stage washing, is transferred to down operation processing again after the two-stage washing.
Embodiment two
Micro-etching solution composition: 100 liters of deionized waters, 4 kilograms in sulfuric acid, Cu
2+2.5 6 kilograms of kilogram, Sodium Persulfates.
The treatment process of printed circuit board is identical with embodiment one.
Embodiment three
Micro-etching solution composition: 100 liters of deionized waters, 3 kilograms in sulfuric acid, Cu
2+1.5 5 kilograms of kilogram, Sodium Persulfates.
The treatment process of printed circuit board is identical with embodiment one.
Embodiment four
Micro-etching solution composition: 100 liters of deionized waters, 2 kilograms in sulfuric acid, Cu
2+0.3 3 kilograms of kilogram, ammonium persulphates.
The treatment process of printed circuit board is identical with embodiment one.
Embodiment five
Micro-etching solution composition: 100 liters of deionized waters, 4 kilograms in sulfuric acid, Cu
2+2.5 5 kilograms of kilogram, ammonium persulphates.
The treatment process of printed circuit board is identical with embodiment one.
Embodiment six
Micro-etching solution composition: 100 liters of deionized waters, 3 kilograms in sulfuric acid, Cu
2+1.5 4 kilograms of kilogram, ammonium persulphates.
The treatment process of printed circuit board is identical with embodiment one.
Embodiment seven
Micro-etching solution composition: 100 liters of deionized waters, 1.5 kilograms in sulfuric acid, Cu
2+Provide 0.3 kilogram, 0.4 kilogram of hydrogen peroxide, 0.04 kilogram of microetch stablizer, microetch stablizer are the Shenzhen encourages high Fine Chemical Co., Ltd, down together.
The treatment process of printed circuit board is identical with embodiment one.
Embodiment eight
Micro-etching solution composition: 100 liters of deionized waters, 3.5 kilograms in sulfuric acid, Cu
2+4.0 kilogram, 0.8 kilogram of hydrogen peroxide, 0.08 kilogram of microetch stablizer.
The treatment process of printed circuit board is identical with embodiment one.
Embodiment nine
Micro-etching solution composition: 100 liters of deionized waters, 2.5 kilograms in sulfuric acid, Cu
2+2.0 kilogram, 0.6 kilogram of hydrogen peroxide, 0.06 kilogram of microetch stablizer.
The treatment process of printed circuit board is identical with embodiment one.
In the above embodiment of the present invention, in the process that micro-etching solution recycles, also need to add different raw materials, concerning sulfuric acid-Sodium Persulfate system, add 1.8kg sulfuric acid and 2.5kg Sodium Persulfate by 100 square metres of printed circuit boards of every microetch according to different systems.
Concerning sulfuric acid-Sodium Persulfate ammonium system, add 1.8kg sulfuric acid and 2kg ammonium persulphate by 100 square metres of printed circuit boards of every microetch.
Concerning sulfuric acid-dioxygen water system, add 1.8kg sulfuric acid, 0.7kg hydrogen peroxide and 0.07kg microetch stablizer by 100 square metres of printed circuit boards of every microetch.
Experimental example 1
The contrast experiment: the microetch degree of depth of the present invention and traditional microetch degree of depth are to the influence of binding force of cladding material
(1) heat stress test: according to the IPC-TM-650 testing sequence: the printed circuit board of getting the microetch degree of depth and be 0.2～0.5 micron and 0.8～2.0 micron is tested, the tin furnace temperature is set in 288 ℃, printed circuit board wicking 10 seconds in the tin stove, to be cooledly to room temperature, repeat, so circulation is 3 times, find no layering by cutting into slices between the analysis printed circuit board Copper Foil, phenomenons such as foaming, particular case is as follows:
288 ℃, 1 wicking 10 seconds, layering does not all appear in the printed circuit board of two kinds of different microetch degree of depth, phenomenons such as foaming;
288 ℃, 2 wickings 10 seconds, layering does not all appear in the printed circuit board of two kinds of different microetch degree of depth, phenomenons such as foaming;
288 ℃, 3 wickings 10 seconds, layering does not all appear in the printed circuit board of two kinds of different microetch degree of depth, phenomenons such as foaming.
(2) sticking power test: the printed circuit board of getting the microetch degree of depth respectively and be 0.2～0.5 micron and 0.8～2.0 micron is tested, be close to printed circuit board plate face with the 3M adhesive tape, with one approximately perpendicular to the violent adhesive tape of once tearing rapidly of the pulling force of printed circuit board plate face, separate bubbling does not appear in the copper layer.
Conclusion: judge that according to the IPC-TM-650 standard when microetch degree of depth was 0.2～0.5 micron, the bonding force between the copper plate was good, satisfied the requirement of printed circuit board quality fully.
Claims (7)
1. the microetch treatment process before the heavy copper of a printed circuit board, after being the pre-treatment of printed circuit board through routine with the heavy copper of needs, put into the microetch liquid bath and carry out the microetch processing, it is characterized in that the copper layer microetch degree of depth of printed circuit board was controlled at 0.2～0.5 micron when described microetch was handled.
2. the microetch treatment process before the heavy copper of a kind of printed circuit board according to claim 1 is characterized in that every liter contains 20～40 gram sulfuric acid, 3～25 gram Cu in the described micro-etching solution composition
2+With 40～60 gram Sodium Persulfates; The microetch treatment temp of printed circuit board in above-mentioned micro-etching solution is 25～30 ℃, and the treatment time is 85～95 seconds.
3. the microetch treatment process before the heavy copper of a kind of printed circuit board according to claim 1 is characterized in that every liter contains 20～40 gram sulfuric acid, 3～25 gram Cu in the described micro-etching solution composition
2+With 30～50 gram ammonium persulphates; The microetch treatment temp of printed circuit board in above-mentioned micro-etching solution is 25～30 ℃, and the treatment time is 85～95 seconds.
4. the microetch treatment process before the heavy copper of a kind of printed circuit board according to claim 1 is characterized in that every liter contains 15～35 gram sulfuric acid, 3～40 gram Cu in the described micro-etching solution composition
2+, 4～8 gram hydrogen peroxide and 0.4～0.8 gram microetch stablizer; The microetch treatment temp of printed circuit board in above-mentioned micro-etching solution is 25～30 ℃, and the treatment time is 85～95 seconds.
5. the microetch treatment process before the heavy copper of a kind of printed circuit board according to claim 2 is characterized in that described micro-etching solution adds 1.8kg sulfuric acid and 2.5kg Sodium Persulfate by 100 square metres of printed circuit boards of every microetch.
6. the microetch treatment process before the heavy copper of a kind of printed circuit board according to claim 3 is characterized in that described micro-etching solution adds 1.8kg sulfuric acid and 2kg ammonium persulphate by 100 square metres of printed circuit boards of every microetch.
7. the microetch treatment process before the heavy copper of a kind of printed circuit board according to claim 4 is characterized in that described micro-etching solution adds 1.8kg sulfuric acid, 0.7kg hydrogen peroxide and 0.07kg microetch stablizer by 100 square metres of printed circuit boards of every microetch.
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201010246820 CN101935838A (en) | 2010-08-01 | 2010-08-01 | Microetching processing method used before copper deposition of printed circuit board |
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| CN 201010246820 CN101935838A (en) | 2010-08-01 | 2010-08-01 | Microetching processing method used before copper deposition of printed circuit board |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102787316A (en) * | 2012-08-30 | 2012-11-21 | 长沙牧泰莱电路技术有限公司 | Micro-etching solution for PCB (printed circuit board) electroplating and preparation method of micro-etching solution |
| CN103013523A (en) * | 2012-12-13 | 2013-04-03 | 北京七星华创电子股份有限公司 | Etching agent as well as preparation method and application thereof |
| CN105916311A (en) * | 2016-05-19 | 2016-08-31 | 湖北龙腾电子科技有限公司 | PCB resistance welding pretreatment method |
| CN106283146A (en) * | 2015-05-13 | 2017-01-04 | 深圳统信电路电子有限公司 | A kind of circuit board electroplating method |
| CN106283145A (en) * | 2015-05-13 | 2017-01-04 | 深圳统信电路电子有限公司 | A kind of ultrathin circuit board electro-plating method |
| CN108998795A (en) * | 2018-09-19 | 2018-12-14 | 珠海特普力高精细化工有限公司 | A kind of application method in organic acid etching liquid and its assist side manufacture |
| CN109536961A (en) * | 2018-11-12 | 2019-03-29 | 深圳市中科东明表面处理新材料技术有限公司 | The preparation method of etching solution and etching solution |
| CN112831774A (en) * | 2019-11-25 | 2021-05-25 | 惠东县建祥电子科技有限公司 | Copper deposition method suitable for copper-clad plate |
| CN115928071A (en) * | 2022-12-02 | 2023-04-07 | 江西荣晖电子有限公司 | Pretreatment method of copper foil for PCB |
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| US4917758A (en) * | 1988-05-20 | 1990-04-17 | Mitsubishi Gas Chemical Company, Inc. | Method for preparing thin copper foil-clad substrate for circuit boards |
| CN1448537A (en) * | 2002-03-28 | 2003-10-15 | 陈平助 | Nonconductor surface metallization method |
| CN1854342A (en) * | 2005-04-26 | 2006-11-01 | 李德良 | Method for controlling concentration of peroxide and copper in microetching liquid and its circulative usage |
| CN101338436A (en) * | 2008-08-08 | 2009-01-07 | 东莞生益电子有限公司 | Pretreatment process of half-tap hole gold immersion plate |
| CN101445833A (en) * | 2008-12-31 | 2009-06-03 | 云南大学 | Method for detecting copper-resistant gene pcoA in swine escherichia coli |
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| US4917758A (en) * | 1988-05-20 | 1990-04-17 | Mitsubishi Gas Chemical Company, Inc. | Method for preparing thin copper foil-clad substrate for circuit boards |
| CN1448537A (en) * | 2002-03-28 | 2003-10-15 | 陈平助 | Nonconductor surface metallization method |
| CN1854342A (en) * | 2005-04-26 | 2006-11-01 | 李德良 | Method for controlling concentration of peroxide and copper in microetching liquid and its circulative usage |
| CN101338436A (en) * | 2008-08-08 | 2009-01-07 | 东莞生益电子有限公司 | Pretreatment process of half-tap hole gold immersion plate |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102787316A (en) * | 2012-08-30 | 2012-11-21 | 长沙牧泰莱电路技术有限公司 | Micro-etching solution for PCB (printed circuit board) electroplating and preparation method of micro-etching solution |
| CN103013523A (en) * | 2012-12-13 | 2013-04-03 | 北京七星华创电子股份有限公司 | Etching agent as well as preparation method and application thereof |
| CN103013523B (en) * | 2012-12-13 | 2014-05-14 | 北京七星华创电子股份有限公司 | Etching agent as well as preparation method and application thereof |
| CN106283146A (en) * | 2015-05-13 | 2017-01-04 | 深圳统信电路电子有限公司 | A kind of circuit board electroplating method |
| CN106283145A (en) * | 2015-05-13 | 2017-01-04 | 深圳统信电路电子有限公司 | A kind of ultrathin circuit board electro-plating method |
| CN105916311A (en) * | 2016-05-19 | 2016-08-31 | 湖北龙腾电子科技有限公司 | PCB resistance welding pretreatment method |
| CN108998795A (en) * | 2018-09-19 | 2018-12-14 | 珠海特普力高精细化工有限公司 | A kind of application method in organic acid etching liquid and its assist side manufacture |
| CN109536961A (en) * | 2018-11-12 | 2019-03-29 | 深圳市中科东明表面处理新材料技术有限公司 | The preparation method of etching solution and etching solution |
| CN109536961B (en) * | 2018-11-12 | 2021-03-30 | 深圳市中科东明表面处理新材料技术有限公司 | Etching solution and preparation method thereof |
| CN112831774A (en) * | 2019-11-25 | 2021-05-25 | 惠东县建祥电子科技有限公司 | Copper deposition method suitable for copper-clad plate |
| CN115928071A (en) * | 2022-12-02 | 2023-04-07 | 江西荣晖电子有限公司 | Pretreatment method of copper foil for PCB |
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Application publication date: 20110105 |