CN106283145A - A kind of ultrathin circuit board electro-plating method - Google Patents
A kind of ultrathin circuit board electro-plating method Download PDFInfo
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- CN106283145A CN106283145A CN201510250540.XA CN201510250540A CN106283145A CN 106283145 A CN106283145 A CN 106283145A CN 201510250540 A CN201510250540 A CN 201510250540A CN 106283145 A CN106283145 A CN 106283145A
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- circuit board
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- plating method
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Abstract
The present invention relates to a kind of ultrathin circuit board electro-plating method, it is characterised in that comprise the following steps: cleaning, microetch, washing and electro-coppering step.The method for prepare circuit board be thickness be that the thin plate of a diameter of 0.15mm of the thin plate of 0.1mm-0.2mm and boring is particularly effective, the fault rate of thin plate is 0.
Description
Technical field
Patent of the present invention relates to a kind of ultrathin circuit board electro-plating method.
Background technology
Hole copper plating needs flying with the technique edges of clip clamping plates on target, by the guiding of electric current, at chemical drugs
In water, in the environment inflating (uniformity guaranteeing liquid medicine), waving (penetration capacity guaranteeing liquid medicine),
Make hole is electroplated 9-15um copper, to meet the requirement of interlayer conduction.Common plate is under the drive of etching machine roller
Move ahead, the etching solution spray by nozzle, unwanted copper is etched away, completes the making of circuit.
The thickness of common plate is 1.0mm-2.0mm, is 10 times-20 times of this type of ultra thin plate, and this type of is high-accuracy
Degree ultra thin plate, is mostly used for hand-written electric product, usually requires that high transmission speed, and live width line-spacing requires uniformly
Property high, manufacture difficulty is big, and performance and stability, uniformity are required height.Thin plate machinery in electroplating process is appointed
Property is the highest, and in the liquid medicine environment uninterruptedly waved, plate is easily bent, floating, near to or in contact with anode, causes
Burning plate, flap, hole copper do not reach requirement, cause and scrap.This plate minimum feature 0.07mm, etching difficulty is big,
Live width line-spacing requirement cannot be met by existing force, cause functional stabilization the highest.
The shortcoming of prior art:
1) flying the clip on target to be typically to press from both sides slab, for thin plate, the dynamics of clip is inadequate, it is easy to make thin plate
The clip that comes off falls into liquid medicine tank, it is impossible to prepare thin plate (thickness is the circuit board of 0.1mm-0.2mm).
2) fly the technique edges on one side of clip the clamping plates on target, owing to the machinery of thin plate is wilful not, inflating
With under the active force waved, plank is broken off, deforms, and scraps because mechanical damage causes.
3) etching machine cannot drive thin plate to move ahead.
Summary of the invention
The purpose of patent of the present invention is to provide a kind of ultrathin circuit board electro-plating method, it is characterised in that include with
Lower step:
Step one, cleans, is cleaned up by the greasy dirt of the substrate surface holed,
First water rinses, and uses deionized water circulation flushing, then carries out oil removing at 40 DEG C and clean 15min；
Step 2, microetch, at temperature is 35 DEG C, use the first microetch by step one is cleaned complete circuit board
Carrying out microetch in liquid and process 2-3min, then use deionized water circulation flushing 5min, washing pressure is
0.9Kg/cm2, use the second micro-corrosion liquid to carry out microetch afterwards at 40 DEG C and process 4-6min so that electricity after microetch
The roughness Ra of road plate is between 0.45-0.5um；
Step 3, washing
Circuit board through microetch in step 2 is carried out water flushing, uses deionized water circulation flushing at normal temperatures
5-10min, washing pressure is 0.9Kg/cm2；
Step 4, electro-coppering
Electroplate liquid is used to carry out electro-coppering, while plating through the boring surface of the circuit board of washing step 3
Use aerator continuously electroplate liquid inflated and shake process, inflate and shake time of duration and plating
Unanimously, pressure is constant, and the gas inflated is air, and described plating uses the electric current of different densities to electroplate,
The temperature of plating is 45-60 DEG C, and the electric current density that the first stage uses is 8-9ASF, and electroplating time is 5-7min,
The electric current density that second stage uses is 10-12 ASF, and electroplating time is 5-8min, the electricity that the phase III uses
Current density is 12-14 ASF, and electroplating time is 10-15min, and the electric current density that fourth stage uses is 9-11 ASF,
Electroplating time is 15-20min, and the thickness finally preparing boring surface electro-coppering is 15um-20um.
Washing described in step one is for using deionized water circulation flushing, and washing pressure is 0.9Kg/cm2, enter
The water yield is 7-8L/min, and washing time is 2-7min.
Oil removing described in step one is cleaned and is used degreaser to clean, and described degreaser is by butyl glycol ether, dihydroxy
Acetic acid ether, aminotrimethylene phosphoric acid, chelating agen, polypropylene glycerol aether, fatty alcohol-polyoxyethylene ether, different
Structure alcohol ether phosphate and water composition, the mass ratio of each component of described degreaser, butyl glycol ether: dihydroxy acetic acid
Ether: aminotrimethylene phosphoric acid: chelating agen: polypropylene glycerol aether: fatty alcohol-polyoxyethylene ether: isomery alcohol
Ether phosphoric acid fat: water=1-4: 1-2: 0.3-0.5: 1-1.2: 2-2.7: 2-2.5: 3-5: 90-95.
Described chelating agen is selected from zeolite.
Described first micro-corrosion liquid is made up of sodium peroxydisulfate solution, concentrated sulphuric acid and water, and its mass ratio is 2: 0.5: 20；
Described second micro-corrosion liquid is by persulfuric acid, phosphoric acid, sodium peroxydisulfate solution, 3-sulfydryl-1-propane sulfonic acid sodium salt, excessively one
Potassium acid sulfate complex salt and water composition, its mass ratio is 2: 1.7: 5: 4: 2.5: 35.
Described electroplate liquid is by copper sulfate pentahydrate 50-80g/L, sodium hypophosphite 15-30g/L, sulphuric acid
100-170g/L, cobaltous sulfate 15-25g/L, chloride ion 50-80ppm, diamyl succinate sodium sulfonate 5-10g/L
With crystallization fining agent 0.1-0.3ppm composition.
Described crystallization fining agent is selected from 2-mercaptobenzothiazole or 2-mercaptobenzimidazole.
In step 4, vibration frequency is 15-18 beat/min, and often vibrations stop the 10-15 second in 30 seconds.
The thickness of circuit board described in step one is 0.1mm-0.2mm；A diameter of 0.15mm of boring.
Beneficial effect:
1, the method applied in the present invention for prepare circuit board be thickness be 0.1mm-0.2mm thin plate and
The thin plate of a diameter of 0.15mm of boring is particularly effective, and the fault rate of thin plate is 0；
2, use two kinds of micro-corrosion liquids carry out microetch process, such microetch better effectively, finally make micro-
The roughness Ra of erosion is at 0.45--0.5um, and two kinds of described micro-corrosion liquids can recycle, it is not necessary to row
Put, environmental protection and green can be accomplished, and copper surface is carried out microetch cleaning and roughening, to help to improve copper table
The adhesion in face so that the uniformity on surface when later stage copper facing；
3, different current parameters is used to be conducive to copper facing to crystallize during plating so that crystalline arrangement is more orderly,
Ductility is more preferable, fills and leads up effective, and the electric current density of front three phases is gradually increased so that deposition is gradually increased,
Copper-plated thickness increases sharply, the highest current density of phase III, and the time is the longest, and the plating in this stage is used
In the stability ensureing that plating is lasting, but plating now there is also certain depression degree, and fourth stage uses
The electric current density being gradually lowered is electroplated, and the time is longer than first stage and second stage, and the phase III is close,
For compensating the depression degree of early stage, thus ensure copper-plated flatness in the circuit board, and promote each rank
The compactness of section copper electroplating layer strengthens；
4, inflate and can strengthen the convection current of electroplate liquid, supplement metal ion in time.The upper limit of electric current density can be improved.
Increase cathodic polarization value so that it is more careful to crystallize simultaneously.
5, while inflating, use the mode of vibrations, the flatness of circuit board copper plating can be improved, additionally beat
The pressure of gas is constant, reduce fracture, bend, the phenomenon such as distortion produces；Through great many of experiments, find vibrations frequency
Rate is 15-18 beat/min, and often vibrations stop the vibration mode of 10-15 second for 30 seconds so that put copper-plated flatness
The highest, indefectible, have been used up shaking continuous vibration mode apparently higher than employing.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is expanded on further.
A kind of ultrathin circuit board electro-plating method, it is characterised in that comprise the following steps:
Step one, cleans, is cleaned up by the greasy dirt of the substrate surface holed,
First water rinses, and uses deionized water circulation flushing, then carries out oil removing at 40 DEG C and clean 15min；
Step 2, microetch, at temperature is 35 DEG C, use the first microetch by step one is cleaned complete circuit board
Carrying out microetch in liquid and process 2-3min, then use deionized water circulation flushing 5min, washing pressure is
0.9Kg/cm2, use the second micro-corrosion liquid to carry out microetch afterwards at 40 DEG C and process 4-6min so that electricity after microetch
The roughness Ra of road plate is between 0.45-0.5um；
Step 3, washing
Circuit board through microetch in step 2 is carried out water flushing, uses deionized water circulation flushing at normal temperatures
5-10min, washing pressure is 0.9Kg/cm2；
Step 4, electro-coppering
Electroplate liquid is used to carry out electro-coppering, while plating through the boring surface of the circuit board of washing step 3
Use aerator continuously electroplate liquid inflated and shake process, inflate and shake time of duration and plating
Unanimously, pressure is constant, and the gas inflated is air, and described plating uses the electric current of different densities to electroplate,
The temperature of plating is 45-60 DEG C, and the electric current density that the first stage uses is 8-9ASF, and electroplating time is 5-7min,
The electric current density that second stage uses is 10-12 ASF, and electroplating time is 5-8min, the electricity that the phase III uses
Current density is 12-14 ASF, and electroplating time is 10-15min, and the electric current density that fourth stage uses is 9-11 ASF,
Electroplating time is 15-20min, and the thickness finally preparing boring surface electro-coppering is 15um-20um.
Washing described in step one is for using deionized water circulation flushing, and washing pressure is 0.9Kg/cm2, enter
The water yield is 7-8L/min, and washing time is 2-7min.
Oil removing described in step one is cleaned and is used degreaser to clean, and described degreaser is by butyl glycol ether, dihydroxy
Acetic acid ether, aminotrimethylene phosphoric acid, chelating agen, polypropylene glycerol aether, fatty alcohol-polyoxyethylene ether, different
Structure alcohol ether phosphate and water composition, the mass ratio of each component of described degreaser, butyl glycol ether: dihydroxy acetic acid
Ether: aminotrimethylene phosphoric acid: chelating agen: polypropylene glycerol aether: fatty alcohol-polyoxyethylene ether: isomery alcohol
Ether phosphate: water=1-4: 1-2: 0.3-0.5: 1-1.2: 2-2.7: 2-2.5: 3-5: 90-95.
Described chelating agen is selected from zeolite.
Described first micro-corrosion liquid is made up of sodium peroxydisulfate solution, concentrated sulphuric acid and water, and its mass ratio is 2: 0.5: 20；
Described second micro-corrosion liquid is by persulfuric acid, phosphoric acid, sodium peroxydisulfate solution, 3-sulfydryl-1-propane sulfonic acid sodium salt, excessively one
Potassium acid sulfate complex salt and water composition, its mass ratio is 2: 1.7: 5: 4: 2.5: 35.
Described electroplate liquid is by copper sulfate pentahydrate 50-80g/L, sodium hypophosphite 15-30g/L, sulphuric acid
100-170g/L, cobaltous sulfate 15-25g/L, chloride ion 50-80ppm, diamyl succinate sodium sulfonate 5-10g/L
With crystallization fining agent 0.1-0.3ppm composition.
Described crystallization fining agent is selected from 2-mercaptobenzothiazole or 2-mercaptobenzimidazole.
In step 4, vibration frequency is 15-18 beat/min, and often vibrations stop the 10-15 second in 30 seconds.
The thickness of circuit board described in step one is 0.1mm-0.2mm；A diameter of 0.15mm of boring.
Should be understood that these embodiments are merely to illustrate the present invention rather than limit the scope of the present invention.In addition should
Understanding, after having read the content that the present invention lectures, the present invention can be made various changing by those skilled in the art
Moving or amendment, these equivalent form of values fall within the application appended claims limited range equally.
Claims (9)
1. a ultrathin circuit board electro-plating method, it is characterised in that comprise the following steps:
Step one, cleans, is cleaned up by the greasy dirt of the substrate surface holed,
First water rinses, and uses deionized water circulation flushing, then carries out oil removing at 40 DEG C and clean 15min；
Step 2, microetch, at temperature is 35 DEG C, use the first microetch by step one is cleaned complete circuit board
Liquid carries out microetch and processes 2-3min, then uses deionized water circulation flushing 5min, and washing pressure is
0.9Kg/cm2, use the second micro-corrosion liquid to carry out microetch afterwards at 40 DEG C and process 4-6min so that electricity after microetch
The roughness Ra of road plate is between 0.45-0.5um；
Step 3, washing
Circuit board through microetch in step 2 is carried out water flushing, uses deionized water circulation flushing at normal temperatures
5-10min, washing pressure is 0.9Kg/cm2；
Step 4, electro-coppering
Electroplate liquid is used to carry out electro-coppering, while plating through the boring surface of the circuit board of washing step 3
Use aerator continuously electroplate liquid inflated and shake process, inflate and shake time of duration and plating
Unanimously, pressure is constant, and the gas inflated is air, and described plating uses the electric current of different densities to electroplate,
The temperature of plating is 45-60 DEG C, and the electric current density that the first stage uses is 8-9ASF, and electroplating time is 5-7min,
The electric current density that second stage uses is 10-12ASF, and electroplating time is 5-8min, the electricity that the phase III uses
Current density is 12-14ASF, and electroplating time is 10-15min, and the electric current density that fourth stage uses is 9-11ASF,
Electroplating time is 15-20min, and the thickness finally preparing boring surface electro-coppering is 15um-20um.
2. a kind of ultrathin circuit board electro-plating method as claimed in claim 1, it is characterised in that institute in step one
The washing stated is for using deionized water circulation flushing, and washing pressure is 0.9Kg/cm2, inflow is
7-8L/min, washing time is 2-7min.
3. a kind of ultrathin circuit board electro-plating method as claimed in claim 1, it is characterised in that step one institute
The oil removing stated is cleaned and is used degreaser to clean, and described degreaser is by butyl glycol ether, dihydroxy acetic acid ether, amino
Trimethylene phosphoric acid, chelating agen, polypropylene glycerol aether, fatty alcohol-polyoxyethylene ether, isomery alcohol ether phosphate
Form with water, the mass ratio of each component of described degreaser, butyl glycol ether: dihydroxy acetic acid ether: amino trimethylene
Methyl acid phosphate: chelating agen: polypropylene glycerol aether: fatty alcohol-polyoxyethylene ether: isomery alcohol ether phosphate: water
=1-4: 1-2: 0.3-0.5: 1-1.2: 2-2.7: 2-2.5: 3-5: 90-95.
4. a kind of ultrathin circuit board electro-plating method as claimed in claim 3, it is characterised in that described chelating
Agent is selected from zeolite.
5. a kind of ultrathin circuit board electro-plating method as claimed in claim 1, it is characterised in that step 2 institute
Stating the first micro-corrosion liquid to be made up of sodium peroxydisulfate solution, concentrated sulphuric acid and water, its mass ratio is 2: 0.5: 20；Described
Second micro-corrosion liquid is by persulfuric acid, phosphoric acid, sodium peroxydisulfate solution, 3-sulfydryl-1-propane sulfonic acid sodium salt, permonosulphuric acid
Hydrogen potassium complex salt and water composition, its mass ratio is 2: 1.7: 5: 4: 2.5: 35.
6. a kind of ultrathin circuit board electro-plating method as claimed in claim 1, it is characterised in that in step 4
Described electroplate liquid by copper sulfate pentahydrate 50-80g/L, sodium hypophosphite 15-30g/L, sulphuric acid 100-170g/L,
Cobaltous sulfate 15-25g/L, chloride ion 50-80ppm, diamyl succinate sodium sulfonate 5-10g/L and crystallization refinement
Agent 0.1-0.3ppm forms.
7. a kind of ultrathin circuit board electro-plating method as claimed in claim 6, it is characterised in that in step 4
Described crystallization fining agent is selected from 2-mercaptobenzothiazole or 2-mercaptobenzimidazole.
8. a kind of ultrathin circuit board electro-plating method as claimed in claim 1, it is characterised in that in step 4,
Vibration frequency is 15-18 beat/min, and often vibrations stop the 10-15 second in 30 seconds.
9. a kind of ultrathin circuit board electro-plating method as claimed in claim 1, it is characterised in that in step one
The thickness of described circuit board is 0.1mm-0.2mm；A diameter of 0.15mm of boring.
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| CN201510250540.XA CN106283145A (en) | 2015-05-13 | 2015-05-13 | A kind of ultrathin circuit board electro-plating method |
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| CN201510250540.XA CN106283145A (en) | 2015-05-13 | 2015-05-13 | A kind of ultrathin circuit board electro-plating method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106987873A (en) * | 2017-05-31 | 2017-07-28 | 东莞市诚志电子有限公司 | A kind of nickel plating process for electroplating bright nickeline |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106987873A (en) * | 2017-05-31 | 2017-07-28 | 东莞市诚志电子有限公司 | A kind of nickel plating process for electroplating bright nickeline |
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