CN106283146A - A kind of circuit board electroplating method - Google Patents
A kind of circuit board electroplating method Download PDFInfo
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- CN106283146A CN106283146A CN201510250567.9A CN201510250567A CN106283146A CN 106283146 A CN106283146 A CN 106283146A CN 201510250567 A CN201510250567 A CN 201510250567A CN 106283146 A CN106283146 A CN 106283146A
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- circuit board
- acid
- electroplating method
- microetch
- washing
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Abstract
The present invention relates to a kind of circuit board electroplating method, it is characterised in that comprise the following steps: cleaning, microetch, washing and electro-coppering step.The method for prepare circuit board be thickness be that the thin plate of a diameter of 0.15mm of the thin plate of 0.1mm-0.2mm and boring is particularly effective, the fault rate of thin plate is 0.
Description
Technical field
Patent of the present invention relates to a kind of circuit board electroplating method.
Background technology
Hole copper plating needs flying with the technique edges of clip clamping plates on target, by the guiding of electric current, at chemical drugs
In water, in the environment inflating (uniformity guaranteeing liquid medicine), waving (penetration capacity guaranteeing liquid medicine),
Make hole is electroplated 9-15um copper, to meet the requirement of interlayer conduction.Common plate is under the drive of etching machine roller
Move ahead, the etching solution spray by nozzle, unwanted copper is etched away, completes the making of circuit.
The thickness of common plate is 1.0mm-2.0mm, is 10 times-20 times of this type of ultra thin plate, and this type of is high-accuracy
Degree ultra thin plate, is mostly used for hand-written electric product, usually requires that high transmission speed, and live width line-spacing requires uniformly
Property high, manufacture difficulty is big, and performance and stability, uniformity are required height.Thin plate machinery in electroplating process is appointed
Property is the highest, and in the liquid medicine environment uninterruptedly waved, plate is easily bent, floating, near to or in contact with anode, causes
Burning plate, flap, hole copper do not reach requirement, cause and scrap.This plate minimum feature 0.07mm, etching difficulty is big,
Live width line-spacing requirement cannot be met by existing force, cause functional stabilization the highest.
The shortcoming of prior art:
1) flying the clip on target to be typically to press from both sides slab, for thin plate, the dynamics of clip is inadequate, it is easy to make thin plate
The clip that comes off falls into liquid medicine tank, it is impossible to prepare thin plate (thickness is the circuit board of 0.1mm-0.2mm).
2) fly the technique edges on one side of clip the clamping plates on target, owing to the machinery of thin plate is wilful not, inflating
With under the active force waved, plank is broken off, deforms, and scraps because mechanical damage causes.
3) etching machine cannot drive thin plate to move ahead.
Summary of the invention
The purpose of patent of the present invention is to provide a kind of circuit board electroplating method, it is characterised in that include following step
Rapid:
Step one, cleans, is cleaned up by the greasy dirt of the substrate surface holed,
First water rinses, and uses deionized water circulation flushing, then carries out oil removing at 40 DEG C and clean 15min；
Step 2, microetch, use alkalescence and acid etching liquid to carry out microetch process
By step one is cleaned complete circuit board use at temperature is 35 DEG C alkalescence micro-corrosion liquid in carry out microetch
Processing 4-6min, then use deionized water circulation flushing 6-10min, washing pressure is 0.9Kg/cm2, afterwards
Use acid etching liquid to carry out microetch at 40 DEG C and process 5-7min so that the roughness Ra of circuit board after microetch
Between 0.45-0.5um；
Step 3, washing
Circuit board through microetch in step 2 is carried out water flushing, uses deionized water circulation flushing at normal temperatures
5-10min, washing pressure is 0.9Kg/cm2；
Step 4, electro-coppering
Electroplate liquid is used to carry out electro-coppering, while plating through the boring surface of the circuit board of washing step 3
Use aerator continuously electroplate liquid inflated and shake process, inflate and shake time of duration and plating
Unanimously, pressure is constant, and the gas inflated is air, and described plating uses the electric current of different densities to electroplate,
The temperature of plating is 45-60 DEG C, and the electric current density that the first stage uses is 8-9ASF, and electroplating time is 5-7min,
The electric current density that second stage uses is 10-12ASF, and electroplating time is 5-8min, the electricity that the phase III uses
Current density is 12-14ASF, and electroplating time is 10-15min, and the electric current density that fourth stage uses is 9-11ASF,
Electroplating time is 15-20min, and the thickness finally preparing boring surface electro-coppering is 15um-20um.
Washing described in step one is for using deionized water circulation flushing, and washing pressure is 0.9Kg/cm2, enter
The water yield is 7-8L/min, and washing time is 2-7min.
Oil removing described in step one is cleaned and is used degreaser to clean, and described degreaser is by butyl glycol ether, dihydroxy
Acetic acid ether, aminotrimethylene phosphoric acid, chelating agen, polypropylene glycerol aether, fatty alcohol-polyoxyethylene ether, different
Structure alcohol ether phosphate and water composition, the mass ratio of each component of described degreaser, butyl glycol ether: dihydroxy acetic acid
Ether: aminotrimethylene phosphoric acid: chelating agen: polypropylene glycerol aether: fatty alcohol-polyoxyethylene ether: isomery alcohol
Ether phosphate: water=1-4: 1-2: 0.3-0.5: 1-1.2: 2-2.7: 2-2.5: 3-5: 90-95.
Described chelating agen is selected from zeolite.
Described in step 2, alkalescence micro-corrosion liquid is made up of pure water, ammonia, ammonium chloride and hydrogen peroxide, described pure water: ammonia
Water: the volume ratio of hydrogen peroxide is 1-2: 1-2: 0.1-0.5, the mass ratio of described ammonia and ammonium chloride is
1-3: 0.1-0.2, the pH value of described alkalescence micro-corrosion liquid is 8；Described acid etching liquid by persulfuric acid, phosphoric acid,
Sodium peroxydisulfate solution, 3-sulfydryl-1-propane sulfonic acid sodium salt, potassium hydrogen persulfate composite salts and water composition, its quality
Ratio is 2: 1.7: 5: 4: 2.5: 35.
Electroplate liquid described in step 4 is by copper sulfate pentahydrate 50-80g/L, sodium hypophosphite 15-30g/L, sulfur
Acid 100-170g/L, cobaltous sulfate 15-25g/L, chloride ion 50-80ppm, diamyl succinate sodium sulfonate 5-10
G/L and crystallization fining agent 0.1-0.3ppm composition.
Fining agent is crystallized selected from 2-mercaptobenzothiazole or 2-mercaptobenzimidazole described in step 4.
In step 4, vibration frequency is 15-18 beat/min, and often vibrations stop the 10-15 second in 30 seconds.
The thickness of circuit board described in step one is 0.1mm-0.2mm；A diameter of 0.15mm of boring.
Beneficial effect:
1, the method applied in the present invention for prepare circuit board be thickness be 0.1mm-0.2mm thin plate and
The thin plate of a diameter of 0.15mm of boring is particularly effective, and the fault rate of thin plate is 0；
2, use two kinds of micro-corrosion liquids to carry out microetch process, first after alkalescence micro-corrosion liquid, use acid etching liquid so that
The best results of microetch, far above the effect being used alone a kind of micro-corrosion liquid.Employing is drawn through great many of experiments
The best results of microetch when the pH value of alkalescence micro-corrosion liquid is 8, during if greater than 8, lateral erosion can increase, when little
In 8 time, and the cooperation of later stage acid etching liquid can make the effect of microetch not reach requirement, affect the plating in later stage
Copper effect.Therefore the best results of microetch when pH value is 8, finally makes the roughness Ra of microetch exist
0.45--0.5um, and two kinds of described micro-corrosion liquids can recycle, it is not necessary to discharge, environmental protection can be accomplished
And green, and copper surface is carried out microetch cleaning and roughening, to help to improve the adhesion on copper surface so that
The uniformity on surface when later stage copper facing；
3, different current parameters is used to be conducive to copper facing to crystallize during plating so that crystalline arrangement is more orderly,
Ductility is more preferable, fills and leads up effective, and the electric current density of front three phases is gradually increased so that deposition is gradually increased,
Copper-plated thickness increases sharply, the highest current density of phase III, and the time is the longest, and the plating in this stage is used
In the stability ensureing that plating is lasting, but plating now there is also certain depression degree, and fourth stage uses
The electric current density being gradually lowered is electroplated, and the time is longer than first stage and second stage, and the phase III is close,
For compensating the depression degree of early stage, thus ensure copper-plated flatness in the circuit board, and promote each rank
The compactness of section copper electroplating layer strengthens；
4, inflate and can strengthen the convection current of electroplate liquid, supplement metal ion in time.The upper limit of electric current density can be improved.
Increase cathodic polarization value so that it is more careful to crystallize simultaneously.
5, while inflating, use the mode of vibrations, the flatness of circuit board copper plating can be improved, additionally beat
The pressure of gas is constant, reduce fracture, bend, the phenomenon such as distortion produces；Through great many of experiments, find vibrations frequency
Rate is 15-18 beat/min, and often vibrations stop the vibration mode of 10-15 second for 30 seconds so that put copper-plated flatness
The highest, indefectible, have been used up shaking continuous vibration mode apparently higher than employing.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is expanded on further.
A kind of circuit board electroplating method, it is characterised in that comprise the following steps:
Step one, cleans, is cleaned up by the greasy dirt of the substrate surface holed,
First water rinses, and uses deionized water circulation flushing, then carries out oil removing at 40 DEG C and clean 15min；
Step 2, microetch, use alkalescence and acid etching liquid to carry out microetch process
By step one is cleaned complete circuit board use at temperature is 35 DEG C alkalescence micro-corrosion liquid in carry out microetch
Processing 4-6min, then use deionized water circulation flushing 6-10min, washing pressure is 0.9Kg/cm2, afterwards
Use acid etching liquid to carry out microetch at 40 DEG C and process 5-7min so that the roughness Ra of circuit board after microetch
Between 0.45-0.5um；
Step 3, washing
Circuit board through microetch in step 2 is carried out water flushing, uses deionized water circulation flushing at normal temperatures
5-10min, washing pressure is 0.9Kg/cm2；
Step 4, electro-coppering
Electroplate liquid is used to carry out electro-coppering, while plating through the boring surface of the circuit board of washing step 3
Use aerator continuously electroplate liquid inflated and shake process, inflate and shake time of duration and plating
Unanimously, pressure is constant, and the gas inflated is air, and described plating uses the electric current of different densities to electroplate,
The temperature of plating is 45-60 DEG C, and the electric current density that the first stage uses is 8-9ASF, and electroplating time is 5-7min,
The electric current density that second stage uses is 10-12ASF, and electroplating time is 5-8min, the electricity that the phase III uses
Current density is 12-14ASF, and electroplating time is 10-15min, and the electric current density that fourth stage uses is 9-11ASF,
Electroplating time is 15-20min, and the thickness finally preparing boring surface electro-coppering is 15um-20um.
Washing described in step one is for using deionized water circulation flushing, and washing pressure is 0.9Kg/cm2, enter
The water yield is 7-8L/min, and washing time is 2-7min.
Oil removing described in step one is cleaned and is used degreaser to clean, and described degreaser is by butyl glycol ether, dihydroxy
Acetic acid ether, aminotrimethylene phosphoric acid, chelating agen, polypropylene glycerol aether, fatty alcohol-polyoxyethylene ether, different
Structure alcohol ether phosphate and water composition, the mass ratio of each component of described degreaser, butyl glycol ether: dihydroxy acetic acid
Ether: aminotrimethylene phosphoric acid: chelating agen: polypropylene glycerol aether: fatty alcohol-polyoxyethylene ether: isomery alcohol
Ether phosphate: water=1-4: 1-2: 0.3-0.5: 1-1.2: 2-2.7: 2-2.5: 3-5: 90-95.
Described chelating agen is selected from zeolite.
Described in step 2, alkalescence micro-corrosion liquid is made up of pure water, ammonia, ammonium chloride and hydrogen peroxide, described pure water: ammonia
Water: the volume ratio of hydrogen peroxide is 1-2: 1-2: 0.1-0.5, the mass ratio of described ammonia and ammonium chloride is
1-3: 0.1-0.2, the pH value of described alkalescence micro-corrosion liquid is 8；Described acid etching liquid by persulfuric acid, phosphoric acid,
Sodium peroxydisulfate solution, 3-sulfydryl-1-propane sulfonic acid sodium salt, potassium hydrogen persulfate composite salts and water composition, its quality
Ratio is 2: 1.7: 5: 4: 2.5: 35.
Electroplate liquid described in step 4 is by copper sulfate pentahydrate 50-80g/L, sodium hypophosphite 15-30g/L, sulfur
Acid 100-170g/L, cobaltous sulfate 15-25g/L, chloride ion 50-80ppm, diamyl succinate sodium sulfonate 5-10
G/L and crystallization fining agent 0.1-0.3ppm composition.
Fining agent is crystallized selected from 2-mercaptobenzothiazole or 2-mercaptobenzimidazole described in step 4.
In step 4, vibration frequency is 15-18 beat/min, and often vibrations stop the 10-15 second in 30 seconds.
The thickness of circuit board described in step one is 0.1mm-0.2mm；A diameter of 0.15mm of boring.
Should be understood that these embodiments are merely to illustrate the present invention rather than limit the scope of the present invention.In addition should
Understanding, after having read the content that the present invention lectures, the present invention can be made various changing by those skilled in the art
Moving or amendment, these equivalent form of values fall within the application appended claims limited range equally.
Claims (9)
1. a circuit board electroplating method, it is characterised in that comprise the following steps:
Step one, cleans, is cleaned up by the greasy dirt of the substrate surface holed,
First water rinses, and uses deionized water circulation flushing, then carries out oil removing at 40 DEG C and clean 15min；
Step 2, microetch, use alkalescence and acid etching liquid to carry out microetch process
Alkalescence micro-corrosion liquid is used to carry out at microetch at temperature is 35 DEG C by step one is cleaned complete circuit board
Reason 4-6min, then uses deionized water circulation flushing 6-10min, and washing pressure is 0.9Kg/cm2, exist afterwards
Use acid etching liquid to carry out microetch at 40 DEG C and process 5-7min so that after microetch, the roughness Ra of circuit board exists
Between 0.45-0.5um；
Step 3, washing
Circuit board through microetch in step 2 is carried out water flushing, uses deionized water circulation flushing at normal temperatures
5-10min, washing pressure is 0.9Kg/cm2；
Step 4, electro-coppering
Electroplate liquid is used to carry out electro-coppering, while plating through the boring surface of the circuit board of washing step 3
Use aerator continuously electroplate liquid inflated and shake process, inflate and shake time of duration and plating
Unanimously, pressure is constant, and the gas inflated is air, and described plating uses the electric current of different densities to electroplate,
The temperature of plating is 45-60 DEG C, and the electric current density that the first stage uses is 8-9ASF, and electroplating time is 5-7min,
The electric current density that second stage uses is 10-12ASF, and electroplating time is 5-8min, the electricity that the phase III uses
Current density is 12-14ASF, and electroplating time is 10-15min, and the electric current density that fourth stage uses is 9-11ASF,
Electroplating time is 15-20min, and the thickness finally preparing boring surface electro-coppering is 15um-20um.
2. a kind of circuit board electroplating method as claimed in claim 1, it is characterised in that described in step one
Washing is for using deionized water circulation flushing, and washing pressure is 0.9Kg/cm2, inflow is 7-8L/min, punching
The time of washing is 2-7min.
3. a kind of circuit board electroplating method as claimed in claim 1, it is characterised in that described in step one
Oil removing is cleaned and is used degreaser to clean, and described degreaser is by butyl glycol ether, dihydroxy acetic acid ether, amino trimethylene
Methyl acid phosphate, chelating agen, polypropylene glycerol aether, fatty alcohol-polyoxyethylene ether, isomery alcohol ether phosphate and water
Composition, the mass ratio of each component of described degreaser, butyl glycol ether: dihydroxy acetic acid ether: aminotrimethylene
Phosphoric acid: chelating agen: polypropylene glycerol aether: fatty alcohol-polyoxyethylene ether: isomery alcohol ether phosphate: water
=1-4: 1-2: 0.3-0.5: 1-1.2: 2-2.7: 2-2.5: 3-5: 90-95.
4. a kind of circuit board electroplating method as claimed in claim 3, it is characterised in that described chelating agen selects
From zeolite.
5. a kind of circuit board electroplating method as claimed in claim 1, it is characterised in that alkali described in step 2
Property micro-corrosion liquid is made up of pure water, ammonia, ammonium chloride and hydrogen peroxide, described pure water: ammonia: the volume of hydrogen peroxide
Ratio is for 1-2: 1-2: 0.1-0.5, and the mass ratio of described ammonia and ammonium chloride is 1-3: 0.1-0.2, described alkalescence
The pH value of micro-corrosion liquid is 8；Described acid etching liquid is by persulfuric acid, phosphoric acid, sodium peroxydisulfate solution, 3-sulfydryl
-1-propane sulfonic acid sodium salt, potassium hydrogen persulfate composite salts and water composition, its mass ratio is 2: 1.7: 5: 4: 2.5: 35.
6. a kind of circuit board electroplating method as claimed in claim 1, it is characterised in that described in step 4
Electroplate liquid is by copper sulfate pentahydrate 50-80g/L, sodium hypophosphite 15-30g/L, sulphuric acid 100-170g/L, sulfur
Acid cobalt 15-25g/L, chloride ion 50-80ppm, diamyl succinate sodium sulfonate 5-10g/L and crystallization fining agent
0.1-0.3ppm forms.
7. a kind of circuit board electroplating method as claimed in claim 6, it is characterised in that described in step 4
Crystallization fining agent is selected from 2-mercaptobenzothiazole or 2-mercaptobenzimidazole.
8. a kind of circuit board electroplating method as claimed in claim 1, it is characterised in that in step 4, shake
Dynamic frequency is 15-18 beat/min, and often vibrations stop the 10-15 second in 30 seconds.
9. a kind of circuit board electroplating method as claimed in claim 1, it is characterised in that described in step one
The thickness of circuit board is 0.1mm-0.2mm；A diameter of 0.15mm of boring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510250567.9A CN106283146A (en) | 2015-05-13 | 2015-05-13 | A kind of circuit board electroplating method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510250567.9A CN106283146A (en) | 2015-05-13 | 2015-05-13 | A kind of circuit board electroplating method |
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| CN106283146A true CN106283146A (en) | 2017-01-04 |
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| CN201510250567.9A Pending CN106283146A (en) | 2015-05-13 | 2015-05-13 | A kind of circuit board electroplating method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110284163A (en) * | 2019-07-31 | 2019-09-27 | 广州三孚新材料科技股份有限公司 | Copper plating solution for solar cell and preparation method thereof |
| CN111519218A (en) * | 2020-06-09 | 2020-08-11 | 麦德美科技（苏州）有限公司 | Electroplating process for through hole of printed circuit board |
| CN115125593A (en) * | 2022-06-01 | 2022-09-30 | 生益电子股份有限公司 | Application of chelating agent in PCB preparation |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110284163A (en) * | 2019-07-31 | 2019-09-27 | 广州三孚新材料科技股份有限公司 | Copper plating solution for solar cell and preparation method thereof |
| CN110284163B (en) * | 2019-07-31 | 2020-08-04 | 广州三孚新材料科技股份有限公司 | Copper plating solution for solar cell and preparation method thereof |
| CN111519218A (en) * | 2020-06-09 | 2020-08-11 | 麦德美科技（苏州）有限公司 | Electroplating process for through hole of printed circuit board |
| CN115125593A (en) * | 2022-06-01 | 2022-09-30 | 生益电子股份有限公司 | Application of chelating agent in PCB preparation |
| CN115125593B (en) * | 2022-06-01 | 2023-12-05 | 生益电子股份有限公司 | Application of chelating agent in PCB preparation |
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Application publication date: 20170104 |