CN100545312C - A kind of printed circuit etching liquid - Google Patents
A kind of printed circuit etching liquid Download PDFInfo
- Publication number
- CN100545312C CN100545312C CNB2008100452910A CN200810045291A CN100545312C CN 100545312 C CN100545312 C CN 100545312C CN B2008100452910 A CNB2008100452910 A CN B2008100452910A CN 200810045291 A CN200810045291 A CN 200810045291A CN 100545312 C CN100545312 C CN 100545312C
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- etching
- polyoxyethylene
- ether
- additive
- printed circuit
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Abstract
The invention belongs to printed circuit board manufacturing technology field.The invention provides a kind of economy, practicality, fast, efficient and be easy to the regenerated printed circuit etching liquid.The prescription of this etching solution is: HNO
3(5%～15%), H
2SO
4(8%～20%), Na
2SO
4(1%～6%), additive 0.01～0.2%, wherein additive is to contain composite dose of following one or more tensio-active agents: C
10～C
12Fatty alcohol-polyoxyethylene ether sulfo-succinic acid Carbenoxolone Sodium salt, fatty alcohol polyoxypropylene Soxylat A 25-7, polyoxyethylene (20) dehydration sorbic alcohol mono-laurate, polyoxyethylene alkyl ether sulfate ammonium salt or sodium salt, alkylphenol polyoxyethylene sulfuric ester ammonium salt or sodium salt, fatty alcohol-polyoxyethylene ether, aliphatic acid polyethenoxy ether, polyoxyethylene nonylphenol ether.It is very little to adopt the present invention to produce the printed electronic circuit lateral erosion, and etching solution regeneration is easily, can the long period recycle, liquid waste disposal is easy, and is little to the pollution of environment.
Description
Technical field
The invention belongs to printed circuit board manufacturing technology field, the etching technique during particularly the printed circuit board (pcb) fine-line is made.
Background technology
In the manufacturing processed of printed circuit board, etching solution is put in the copper-clad plate that needs to have carried out figure transfer, the Copper Foil that is not covered by resist layer is etched away, thereby obtain corresponding printed electronic circuit conducting wire.Etching liquid system commonly used at present mainly contains following several:
(1) iron trichloride etching solution
The iron trichloride etching also is to be main component with the iron trichloride, adds the solution system of a certain amount of hydrochloric acid.Characteristics such as this etching reagent is easy to get, and is inexpensive, and molten copper safe level scope is wide, and is easy to operate.But the pollution problem that causes in producing is outstanding especially.So this etching solution withdraws from the status of main etching reagent gradually.
(2) cupric chloride etching solution
This etching solution prescription is simple, and etching speed is fast, molten copper amount, good stability, the product reliability height, can serialization production, the recovery of solution regeneration and copper is easy, can be controlled effectively to the pollution of environment.Produce at present and go up the main this etching reagent that uses.But for fine-line, the lateral erosion that this etching reagent produces is serious, can't obtain qualified fine-line.
(3) hydrogen peroxide-sulfuric acid etchant liquid
This etching solution can be applicable to various resist layers, and etching speed is also high, the reaction easily control, molten copper amount is big, toxicity is little, pollutes little, the recovery waste liquid simple and easy to do.But, be subject to various Effect of Environmental, so in use be subjected to big great limitation because stability of peroxide is relatively poor.
(4) persulfuric acid etching solution
The basal component of this etching solution is persulphate and sulfuric acid.This kind etching solution does not in use have the discharging of " three wastes ".Also be suitable for simultaneously all resist layers of printed board.But the poor stability of this etching reagent more easily decomposes, and etching speed and molten copper amount are low, and lateral erosion is serious, and persulfuric acid price height.Be used in micro-etching agent by improved vitriol etch systems suitably now.
Because development of semiconductor, the packaging density of chip is increasing.This just requires the density of circuit on the carrier pcb board of chip more and more higher, so the development trend that the PCB circuit was made after the making of fine-line also became.And the Copper Foil of etching condition of equivalent thickness, circuit is thin more, and its etching coefficient is more little, and lateral erosion is just big more relatively.
The demand for development etching solution of PCB technology has bigger etching coefficient, avoids producing side etching phenomenon as far as possible; Be in the consideration of bad border protection and economic factors simultaneously, require etching solution have stable chemical property, little to the pollution of environment, easily realize recycle and lower-cost characteristics.
In the existing etching solution, the iron trichloride etching solution because it is seriously polluted, is produced now and is seldom used it to do circuit etching.The cupric chloride etching solution is an etch systems commonly used in producing now, but for the fine-line etching, the lateral erosion of this etching solution is just more serious, can't satisfy requirement on electric performance.Hydrogen peroxide-sulfuric acid system has then limited its use owing to stability of peroxide is relatively poor.The persulfuric acid etching reagent can't satisfy the requirement that our present circuit becomes more meticulous especially.
Summary of the invention
The invention provides a kind of economic, practical, quick, efficient and be easy to the regenerated printed circuit etching liquid.Etching solution can etch the printed electronic circuit circuit apace, and its lateral erosion is very little, is particularly suitable for the making of fine-line (live width≤75 μ m) in the printed circuit board manufacturing.
Technical scheme of the present invention is:
A kind of printed circuit etching liquid is by H
2O, HNO
3, H
2SO
4, Na
2SO
4Form with additive, the mass percent of each component is: HNO
35%～15%, H
2SO
48%～20%, Na
2SO
41%～6%, additive 0.01～0.2%, and all the other are H
2O; Wherein additive is to contain composite dose of following one or more tensio-active agents: C
10～C
12Fatty alcohol-polyoxyethylene ether sulfo-succinic acid Carbenoxolone Sodium salt, fatty alcohol polyoxypropylene Soxylat A 25-7, polyoxyethylene (20) dehydration sorbic alcohol mono-laurate, polyoxyethylene alkyl ether sulfate ammonium salt or sodium salt, alkylphenol polyoxyethylene sulfuric ester ammonium salt or sodium salt, fatty alcohol-polyoxyethylene ether, aliphatic acid polyethenoxy ether, polyoxyethylene nonylphenol ether.
The effect of additive is the wetting property that increases between etching solution and the Copper Foil, improves the exposure level of etching solution and Copper Foil, thereby improves etching speed.
The etching mechanism of printed circuit etching liquid provided by the invention
1, static etching mechanism
Form according to certain prescription etching solution is added in the etching bath, be heated to certain temperature, see the static etching mechanism that the copper-clad plate of carrying out after the figure transfer is placed in the nitric acid etch liquid shown in Figure 1.
Etching solution etching mechanism is by nitric acid in the system and unlapped resist layer Copper Foil generation chemical reaction, metallic copper is oxidized to cupric ion, HNO
3Be reduced into NO gas, produce following reaction: 3Cu+8HNO
3→ 3Cu (NO
3)
2+ 2NO+4H
2O.
In the reaction process, the NO gas of generation plays stirring action between circuit, help the renewal of etching solution like this, is very favorable for vertical etching of Copper Foil.And lateral Copper Foil contains gas owing in the liquid, so play the effect that isolated solution contacts with Copper Foil to a certain extent.
2. dynamic etching mechanism
If what adopt in the etching process is dynamically to spray etching, its dynamic etching process as shown in Figure 2 so;
Nitric acid etch liquid is pressed with certain spray and is vertically down sprayed nitric acid etch solution, solution and unlapped copper generation chemical reaction.Copper and nitric acid generation chemical reaction can generate NO gas.
Because top liquid is spray down vertically,, but overflow along Tong Bi so NO gas is not easy to overflow from the centre.Chemistry takes place because the generation of gas, gas flow make etching solution contact with the Copper Foil of sidewall fully send out and answer, thereby the etching reaction of minimizing sidewall makes side etching quantity lacking very.Stirring action is also played in the existence of gas, makes that new and old etching solution can very fast renewal, thereby improves etched homogeneity.This etching to fine-line all is very favorable.Make the section of circuit become rectangle (as shown in Figure 3) substantially.
The effect and the Temperature Influence of each composition in the printed circuit etching liquid prescription provided by the invention
1, the effect of nitric acid in the etching solution system
Can know that from the introduction of etching solution mechanism nitric acid is that the main reaction agent of this system and Copper Foil react and make the oxidized generation cupric ion of copper.Nitric acid is in certain concentration and can so just improves etching efficiency and reduce etching period with speed and copper reaction faster.
The gaseous product that nitric acid is reduced also makes the solution fast updating, helps vertical etching of Copper Foil.The effusion of gas also is at protection side Copper Foil in fact, in order to avoid by nitric acid etch, thereby reduce lateral erosion, improve the etching coefficient.These making to fine-line are very favorable.
2, vitriolic effect in the etching solution system
Vitriolic adds, and is equivalent to increase H
+Concentration, improved etched speed greatly.The concentration that so just need not increase nitric acid improves the system etch-rate.H in the sulfuric acid
+Can also keep HNO in the solution
3Concentration, HNO like this
3Be unlikely to change because of the carrying out of reaction too big, thereby can improve the stability of system well.
Simultaneously,, also have corrosive nature, so also accelerated the etching of Copper Foil for the fresh copper that newly exposes because sulfuric acid also has corrodibility.
3, the effect of sodium sulfate in the etching solution system
Sodium sulfate plays the effect of accelerated reaction speed in etching process.Can quicken the speed of reaction of copper and nitric acid, shorten the etched time widely.
4, the effect of additive
Improve the wetting property between etching solution and the Copper Foil, can improve the exposure level of etching solution and Copper Foil like this, for the another fixed promoter action of etched speed.
5, Temperature Influence
Temperature has very big influence to etching.When temperature was too high, speed of reaction was big, and the too high etchant resist that makes of simultaneous temperature comes off easily.But temperature is too low, and speed of reaction is too little, loses time, and is unfavorable to producing.So,, select a suitable temperature range for temperature.The suitable etch temperature of printed circuit etching liquid provided by the invention is 50～60 ℃.
The preparation process of printed circuit etching liquid provided by the invention is very simple, and according to printed circuit etching liquid prescription provided by the invention, order adds HNO in deionized water
3, H
2SO
4, Na
2SO
4Get final product with additive.It should be noted that because the main component of etching solution is a strong acid, so should be noted that safety, especially HNO during preparation
3And H
2SO
4Should slowly add in the deionized water.In addition, printed circuit etching liquid provided by the invention can prepare in real time according to the particular case of printed electronic circuit board assembly line, promptly in the etching bath of printed electronic circuit board assembly line, requires to add earlier deionized water according to prescription, and order adds HNO then
3, H
2SO
4, Na
2SO
4Get final product with additive.
What need supplementary notes is that the oxidisability of printed circuit etching liquid provided by the invention is more intense, so must select suitable material when using etchant resist.Experiment draws and uses dry film against corrosion is not all right, and it can react with nitric acid.Etchant resist can select photic liquid resist or Ni-Au layer to do resist layer.Experiment finds that printed circuit etching liquid provided by the invention does not have special requirement to copper-clad plate, and flexibility coat copper plate and rigidity copper-clad plate can be used.
Beneficial effect of the present invention:
1, printed circuit etching liquid composition provided by the invention is simple, cheap.
2, the content influence of sodium sulfate in etch systems etched speed, so adding sodium sulfate composition what can pass through, can control etched speed well.
3, main component nitric acid can be with very fast speed and Copper Foil generation chemical reaction in the nitric acid etch system, and etched speed is fast, has saved etching period widely.
4, nitric acid etch liquid is very desirable for the etching of fine-line.Since the agitaion of gas, the shielding effect of gas, the difference that can reduce the lateral erosion on fine rule road well and dwindle the different zones etch-rate.The reel to reel that is very suitable for the flexible printed board serialization produces.
5, the adding of the complex additive of negatively charged ion and nonionogenic tenside improves the wetting property between etching solution and the Copper Foil, can improve the exposure level of etching solution and Copper Foil like this, for the another fixed promoter action of etched speed.
6, etching machines adopts the etch system device of sealing, and toward device the inside bubbling air, the nitrogen protoxide of generation can generate NO with airborne oxygen reaction
2, NO
2Come back to etch systems with the liquid generation nitric acid reaction that refluxes and proceed reaction.Make the system nitric acid content relatively stable like this.
7, because Cu
2+Existence do not influence the nitric acid system etching, so can wait Cu
2+Change etching solution to content when big, avoid handling continually etching bath, save lot of manpower and material resources.
8, because the etching solution that uses is easy to regenerate and recycle while Cu
2+Can regain effectively again, thereby reduce pollution on the environment effectively.
Figure of description
Fig. 1 is the static etching mechanism synoptic diagram of etching solution of the present invention.
Fig. 2 is the dynamic etching mechanism synoptic diagram of etching solution of the present invention.
Fig. 3 is the printed electronic circuit synoptic diagram after the etching solution etching of the present invention.
Embodiment
Embodiment one
Preparation nitric acid etch liquid:
(1) deionized water of adding 100ml in etching bath is measured about 27.47ml 65% nitric acid and is added in the etching bath, adds a spot of deionized water again.
(2) measure the vitriol oil of about 23.19ml 98%, gently join in the etching bath, add in the process of the vitriol oil stirred solution constantly.
(3) anhydrous sodium sulphate that adds 15.90g stirs and makes the anhydrous sodium sulphate dissolving fully in etching bath.
(4) adding concentration is 10% additive 1.00ml.
(5) add deionized water to 500ml, it is 5% that preparation obtains the 500ml concentration of nitric acid, and sulfuric acid concentration is 8%, and the anhydrous slufuric acid na concn is 3%, and additive concentration is 0.02% nitric acid etch liquid.
Regulate the temperature to 50 ℃ of etching solution, selecting copper thickness is 18 μ m, is of a size of 5cm x 5cm, is the copper-clad plate of 80 μ m through the figure transfer live width.This copper-clad plate is put into carries out etching in the etching bath.After 40 minutes, circuit etching is finished.Measuring live width is 65.86 μ m, and metallurgical microscopic shows that the section of conducting wire in echelon.
Embodiment two
Step preparation 500ml concentration of nitric acid according to embodiment one is 7%, and sulfuric acid concentration is 12%, and the anhydrous slufuric acid na concn is 3%, and additive concentration is 0.05% nitric acid etch liquid.The control etch temperature is 60 ℃.Selecting copper thickness is 18 μ m, is of a size of 5cmx 5cm, is the copper-clad plate of 50 μ m through the figure transfer live width.This copper-clad plate is put into carries out etching in the etching bath.After 15 minutes, circuit etching is finished.Measuring live width is 36.43 μ m, and metallurgical microscopic shows that the section of conducting wire in echelon.
Embodiment three
Step preparation 500ml concentration of nitric acid according to embodiment one is 7%, and sulfuric acid concentration is 10%, and the anhydrous slufuric acid na concn is 3%, and additive concentration is 0.07% nitric acid etch liquid.The control etch temperature is 60 ℃.Selecting copper thickness is 18 μ m, is of a size of 5cmx 5cm, is the copper-clad plate of 80 μ m through the figure transfer live width.This copper-clad plate is put into carries out etching in the etching bath.After 8 minutes, circuit etching is finished.Measuring live width is 74.23 μ m, and metallurgical microscopic shows that the section of conducting wire in echelon.
Embodiment four
Step preparation 5000ml concentration of nitric acid according to embodiment one is 9%, and sulfuric acid concentration is 8%, and the anhydrous slufuric acid na concn is 3%, and additive concentration is 0.1% nitric acid etch liquid.The control etch temperature is 60 ℃.Selecting copper thickness is 18 μ m, is of a size of 5cm x 5cm, is the copper-clad plate of 80 μ m through the figure transfer live width.Adopt the mode of spray to carry out etching.After 2 minutes, circuit etching is finished.Measuring live width is 78.23 μ m, and metallurgical microscopic shows that the section of conducting wire in echelon.
Embodiment five
Step preparation 5000ml concentration of nitric acid according to embodiment one is 9%, and sulfuric acid concentration is 10%, and the anhydrous slufuric acid na concn is 3%, and additive concentration is 0.1% 1 nitric acid etch liquid.The control etch temperature is 50 ℃.Selecting copper thickness is 18 μ m, is of a size of 5cm x 5cm, is the copper-clad plate of 50 μ m through the figure transfer live width.Adopt the mode of spray to carry out etching.After 2 minutes, circuit etching is finished.Measuring live width is 47.44 μ m, and metallurgical microscopic shows that the section of conducting wire in echelon.
Embodiment six
Step preparation 500ml concentration of nitric acid according to embodiment one is 9%, and sulfuric acid concentration is for being 10%, and the anhydrous slufuric acid na concn is for being 5%, and additive concentration is 0.12% nitric acid etch liquid.The control etch temperature is 50 ℃.Selecting copper thickness is 18 μ m, is of a size of 5cm x 5cm, is the copper-clad plate of 80 μ m through the figure transfer live width.This copper-clad plate is put into carries out etching in the etching bath.After 5 minutes, circuit etching is finished.Measuring live width is 72.44 μ m, and metallurgical microscopic shows that the section of conducting wire in echelon.
Embodiment seven
Step preparation 5000ml concentration of nitric acid according to embodiment one is 9%, and sulfuric acid concentration is 12%, and the anhydrous slufuric acid na concn is 5%, the nitric acid etch liquid of additive concentration 0.12%.Etch temperature is 50 ℃.Selecting copper thickness is 18 μ m, is of a size of 5cm x 5cm, is the copper-clad plate of 50 μ m through the figure transfer live width.Adopt the mode of spray to carry out etching.Circuit is finished with regard to etching behind one fen half.Measuring live width is 46.12 μ m, and metallurgical microscopic shows that the section of conducting wire in echelon.
Embodiment eight
Step preparation 500ml concentration of nitric acid according to embodiment one is 9%, and sulfuric acid concentration is 12%, and the anhydrous slufuric acid na concn is 6%, and additive concentration is 0.12% 500ml nitric acid etch liquid.The control etch temperature is 50 ℃.Selecting copper thickness is 18 μ m, is of a size of 5cm x 5cm, is the copper-clad plate of 50 μ m through the figure transfer live width.This copper-clad plate is put into carries out etching in the etching bath.After 5 minutes, circuit etching is finished.Measuring live width is 69.93 μ m, and metallurgical microscopic shows that the section of conducting wire in echelon.
Claims (1)
1, a kind of printed circuit etching liquid is by H
2O, HNO
3, H
2SO
4, Na
2SO
4Form with additive, the mass percent of each component is: HNO
35%～15%, H
2SO
48%～20%, Na
2SO
41%～6%, additive 0.01～0.2%, and all the other are H
2O; Wherein additive is to contain following composite dose greater than a kind of tensio-active agent: C
10～C
12Fatty alcohol-polyoxyethylene ether sulfo-succinic acid Carbenoxolone Sodium salt, fatty alcohol polyoxypropylene Soxylat A 25-7, polyoxyethylene (20) dehydration sorbic alcohol mono-laurate, polyoxyethylene alkyl ether sulfate ammonium salt or sodium salt, alkylphenol polyoxyethylene sulfuric ester ammonium salt or sodium salt, fatty alcohol-polyoxyethylene ether, aliphatic acid polyethenoxy ether, polyoxyethylene nonylphenol ether.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2008100452910A CN100545312C (en) | 2008-01-29 | 2008-01-29 | A kind of printed circuit etching liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2008100452910A CN100545312C (en) | 2008-01-29 | 2008-01-29 | A kind of printed circuit etching liquid |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101225520A CN101225520A (en) | 2008-07-23 |
| CN100545312C true CN100545312C (en) | 2009-09-30 |
Family
ID=39857717
Family Applications (1)
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|---|---|---|---|
| CNB2008100452910A Expired - Fee Related CN100545312C (en) | 2008-01-29 | 2008-01-29 | A kind of printed circuit etching liquid |
Country Status (1)
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| CN (1) | CN100545312C (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101845631A (en) * | 2010-06-03 | 2010-09-29 | 深圳市创智成功科技有限公司 | Nickel-removing solution for adverse chemical nickel plating layer of printed circuit board and preparation method thereof and method for removing adverse chemical nickel plating layer |
| CN104060267A (en) * | 2014-07-17 | 2014-09-24 | 深圳市卓力达电子有限公司 | Chemical etching method used for metal molybdenum plate |
| CN104120428B (en) * | 2014-08-08 | 2016-07-20 | 苏州天承化工有限公司 | A kind of capable of circulation again with the microetch chemical treatment medicament on copper and copper alloy surface |
| CN104862677B (en) * | 2015-05-13 | 2017-08-11 | 电子科技大学 | A kind of method that activation PCB circuit surfaces realize chemical nickel plating |
| CN105369251A (en) * | 2015-12-16 | 2016-03-02 | 无锡吉进环保科技有限公司 | Etching liquid for circuit board based on nano sulfur dioxide |
| CN105957809B (en) * | 2016-06-06 | 2018-10-30 | 浙江振有电子股份有限公司 | A kind of HDI plates fast-etching combined additive |
| CN106618598A (en) * | 2016-11-15 | 2017-05-10 | 惠州市力道电子材料有限公司 | Tungsten alloy micro-needle electrode capable of limiting piercing depth, preparation method thereof, and blood glucose monitoring device |
| CN106757028B (en) * | 2016-12-29 | 2019-09-20 | 通富微电子股份有限公司 | The preparation method of etching solution, semiconductor packing device and semiconductor packing device |
| CN115268198B (en) * | 2022-08-03 | 2023-09-22 | 江阴通利光电科技有限公司 | Wide-viewing angle Fresnel anti-light screen and production method thereof |
| CN117488302B (en) * | 2023-10-18 | 2024-06-07 | 珠海市板明科技有限公司 | Circuit etching solution |
-
2008
- 2008-01-29 CN CNB2008100452910A patent/CN100545312C/en not_active Expired - Fee Related
Non-Patent Citations (4)
| Title |
|---|
| Cu溶解溶液. 蔡积庆.印制电路信息，第10期. 2000 |
| Cu溶解溶液. 蔡积庆.印制电路信息，第10期. 2000 * |
| 铜及其合金的化学抛光. 吴水清.电镀与涂饰，第4期. 1990 |
| 铜及其合金的化学抛光. 吴水清.电镀与涂饰，第4期. 1990 * |
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|---|---|
| CN101225520A (en) | 2008-07-23 |
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