CN103037640A - Art utilizing common equipment and material to manufacture High Density Interconnect (HDI) laminated plate - Google Patents
Art utilizing common equipment and material to manufacture High Density Interconnect (HDI) laminated plate Download PDFInfo
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- CN103037640A CN103037640A CN201210181598XA CN201210181598A CN103037640A CN 103037640 A CN103037640 A CN 103037640A CN 201210181598X A CN201210181598X A CN 201210181598XA CN 201210181598 A CN201210181598 A CN 201210181598A CN 103037640 A CN103037640 A CN 103037640A
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Abstract
Provided is an art utilizing common equipment and material to manufacture a High Density Interconnect (HDI) laminated plate. The art utilizing common equipment and material to manufacture the HDI laminated plate includes steps: A, conducting reduction process on a copper foil of a double-faced copper-clad plate which is used for lamination; B, conducting machine drilling, copper electroless plating and electroplating process on the plate which is conducted the reduction process; C, adopting a method of graph transferring to make only a single-faced annular ring for a drill hole of the copper-clad plate which is electroplated; D, manufacturing a lateral ply; E, coating the lateral ply by utilizing prepreg low-temperature lamination with resin; F, peeling glass fibers; G, pressing the two kinds of material including the resin and the glass fibers together by aiming at a vacuum hot-pressing; H, eliminating the resin which is in a blind hole through concentrated sulfuric acid; I, conducting normal drilling, copper electroless plating, electroplating, graph transferring, solder resist and surface processes. The art utilizing common equipment and material to manufacture the HDI laminated plate adopts equipment of machine drilling, common copper electroless plating and electroplating and common materials such as prepreg and concentrated sulfuric acid and supplies an economical and practical method for a general circuit board factory to manufacture HDI lamination plate.
Description
Technical field:
The invention belongs to the wiring board manufacture technology field, what be specifically related to is a kind of process of using conventional equipment and material to make laminated plates.
Background technology:
The HDI wiring board is also referred to as high density interconnect plate (High Density Interconnector).Realize that high density interconnect is to realize by the wiring area that reduces live width, reduces the aperture and do not take other layers, wherein the method for lamination is to realize not taking the topmost method in the space of other layers.
Laminated plates is to carry out the interconnected wiring board of interlayer (Build-up Muti-layer) with the method for lamination progressively.Intercommunicating pore between each of laminated plates layer is not see through other layers, owing to do not take the wiring area of other layers, can realize highdensity interconnected; And common blind hole technique can not accomplish to connect simultaneously adjacent layer.
The common production method of HDI laminated plates is to use laser drilling and the heavy copper of blind hole to electroplate to realize the interconnected of interlayer at present, need to use the materials such as the equipment such as laser drilling machine, pulse plating and RCC (attached resin Copper Foil), equipment and material are all very expensive, and the quality control difficulty of blind hole is very large; The degree of depth of laser blind hole, size are limit by laser drill acc power and blind hole plating covering power, are difficult to accomplish the blind hole of large aperture (greater than 0.15mm) and thick-layer spacing (greater than 0.15mm).
Domestic except the very strong wiring board manufacturer of some fund technology, equipment, material and the technology of not production laminated plates of the overwhelming majority, wilderness demand along with portable type electronic product, the demand of the laminated plates that portable electronic products is used also rolls up, and developing a kind of new technology of using conventional equipment and material to make laminated plates is that these circuit board plants institute is expected in a hurry.
Summary of the invention:
For realizing using conventional equipment and material to make laminated plates, the present invention adopts following steps to realize:
The Copper Foil of A, double face copper that lamination is used carries out reduction processing;
B, the plate behind the attenuate copper is carried out machinery get out required blind hole, heavy copper, electroplating processes;
C, employing graph transfer method are only made the single face orifice ring to the boring of the copper-clad plate after electroplating;
D, the used central layer of making laminated plates;
E, 110～120 ℃ of low temperature laminations of prepreg are carried out using after the roughening treatment in the central layer surface;
F, peel off glass fibre after the central layer surface just be coated with one deck semi-solid preparation resin;
G, above 2 kinds of materials are aimed at the vacuum hotpressing pressing;
H, remove resin in the blind hole with the concentrated sulfuric acid;
I, drill through hole, heavy copper, plating, outer graphics transfer, welding resistance, surface treatment normally.
Wherein steps A, B, C and step D, E, F can make simultaneously, in the G step plate of these 2 step gained are aimed at overlapping layers and are pressed into an integral body.
A, B, C step have realized metallization and the single face orifice ring of blind hole;
D, E, F step have realized applying at central layer the adhering resin of one deck semi-solid preparation, and blind hole can directly touch on the break-over disk of central layer by pressing;
The H step has realized purpose that the resin in the blind hole is removed, is beneficial to electro-coppering and reinforces being connected of blind hole and bottom copper sheet.
Description of drawings:
Fig. 1 is laminated plates blind hole of the present invention and buried-hole structure schematic diagram.
Fig. 2 is process chart of the present invention.
Embodiment:
For setting forth specific implementation method of the present invention, the present invention is described in further detail below in conjunction with accompanying drawing:
The Copper Foil of A, double face copper that lamination is used carries out reduction processing, the thickness of insulating layer of double face copper generally is more than the 0.1mm, copper thickness is tried one's best attenuate until local the appearance revealed base material by 18um, and attenuate is in order to reduce the Side erosion amount on outer fine rule road, to reach the purpose that reduces of live width; What used this moment is common copper-clad plate, need not use the special material RCC of laminated plates (attached resin Copper Foil).
B, the plate behind the attenuate copper is carried out machinery get out required blind hole (what get out is through hole), heavy copper, electroplating processes; Can once fold multilayer during machine drilling, to realize the lifting of production efficiency, the hole of at this moment heavy copper, plating is through hole, uses common boring, heavy copper, electroplating device, need not use the equipment such as laser drilling machine, ultrasonic heavy copper, pulse plating.
C, employing graph transfer method are only made the single face orifice ring to the boring of the copper-clad plate after electroplating; This step only need be made the orifice ring with the interconnected side of central layer, and orifice ring is outward insulating substrate; Another side all is copper sheet.
D, the used central layer of making laminated plates; Central layer can be multi-layer sheet, has produced required circuit, hole and break-over disk, and for the orifice ring that guarantees above step made is connected well with the central layer metal, the brown processing is not carried out on the central layer surface, but carries out the microetch roughening treatment.
E, 110～120 ℃ of low temperature laminations of prepreg are carried out using after the roughening treatment in the central layer surface; Prepreg only occurs to flow below the TG temperature and is difficult for occuring cross-linking reaction, by lamination, can fill the semi-solid preparation resin in the hole of central layer.
F, peel off glass fabric after the central layer surface just be coated with one deck semi-solid preparation resin; Peel off glass fabric, stay the semi-solid preparation resin on the central layer surface.
G, above 2 kinds of materials are aimed at the vacuum hotpressing pressing, the semi-solid preparation resin carries out complete cross-linking reaction in this step, and the thin plate of central layer and outside closely is sticked together, and has realized that also orifice ring contacts with the direct of terminal pad of central layer.
H, remove resin in the blind hole with the concentrated sulfuric acid; The resin that the concentrated sulfuric acid flows in the hole after to pressing is stung erosion, and other positions all are the copper layers, and the concentrated sulfuric acid is not stung the erosion effect to the copper layer.
I, drill through hole, heavy copper, plating, outer graphics transfer, welding resistance, surface treatment normally; Before drilling through hole and heavy copper, note not having dust to fall in the blind hole, to prevent from stopping up blind hole, cause the blind hole can't be by electric plated with copper.
The present invention adopts the equipment of power auger through hole, the heavy copper plating of through hole, does not need the equipment of the heavy copper plating of laser blind hole, blind hole of general laminated plates; This method uses the method for copper-clad plate and semi-solid preparation resin-coating to substitute the RCC material; This method uses the concentrated sulfuric acid to process the interior glue slag of blind hole, does not need to use plasma de-smear equipment; These equipment and material are the most frequently used equipment of circuit board plant and material, provide an economical and practical method for general circuit board plant enters high-end wiring board manufacturing field (HDI laminated plates).
The present invention is the description to the process of single order lamination, can carry out according to the present invention the manufacturing of multistage laminated plates; Make the field at wiring board, the present invention will change at concrete execution mode and range of application, so this description should not be construed as limitation of the present invention.
Claims (6)
1. technique of using conventional equipment and material to make the HDI laminated plates, its feature may further comprise the steps:
The Copper Foil of A, double face copper that lamination is used carries out reduction processing;
B, the plate behind the attenuate copper is carried out machinery get out required blind hole, heavy copper, electroplating processes;
C, employing graph transfer method are only made the single face orifice ring to the boring of the copper-clad plate after electroplating;
D, the used central layer of making laminated plates;
E, 110～120 ℃ of low temperature laminations of prepreg are carried out using after the roughening treatment in the central layer surface;
F, peel off glass fibre after the central layer surface just be coated with one deck semi-solid preparation resin;
G, above 2 kinds of materials are aimed at the vacuum hotpressing pressing;
H, remove resin in the blind hole with the concentrated sulfuric acid;
I, drill through hole, heavy copper, plating, outer graphics transfer, welding resistance, surface treatment normally.
2. making flow process according to claim 1 is characterized in that the blind hole for the treatment of lamination among the step B adopts the mechanical method that gets out.
3. the single face orifice ring of blind hole among the step C according to claim 1, another side keeps whole copper sheets.
4. step e according to claim 1 is used the hole of low temperature lamination prepreg filling central layer and at central layer surface-coated one deck prepreg.
5. step G according to claim 1, by semi-solid preparation resin-bonding central layer and the lamination thin plate that applies, central layer and treat not have between the lamination thin plate obstruct of glass fabric.
6. step H according to claim 1 adopts the resin in the concentrated sulfuric acid removal hole, and there is the protection of copper layer other positions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210181598.XA CN103037640B (en) | 2012-06-05 | 2012-06-05 | Art utilizing common equipment and material to manufacture High Density Interconnect (HDI) laminated plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210181598.XA CN103037640B (en) | 2012-06-05 | 2012-06-05 | Art utilizing common equipment and material to manufacture High Density Interconnect (HDI) laminated plate |
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| Publication Number | Publication Date |
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| CN103037640A true CN103037640A (en) | 2013-04-10 |
| CN103037640B CN103037640B (en) | 2015-07-22 |
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| CN201210181598.XA Expired - Fee Related CN103037640B (en) | 2012-06-05 | 2012-06-05 | Art utilizing common equipment and material to manufacture High Density Interconnect (HDI) laminated plate |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104093277A (en) * | 2014-07-11 | 2014-10-08 | 景旺电子科技(龙川)有限公司 | Method for improving cutter breaking condition in hole drilling process of thick copper plate |
| CN104735926A (en) * | 2013-12-18 | 2015-06-24 | 深南电路有限公司 | Resin hole filling method for circuit board |
| CN104902701A (en) * | 2014-03-05 | 2015-09-09 | 深南电路有限公司 | Circuit board processing method and circuit board having single-surface hole ring |
| CN106231801A (en) * | 2016-08-19 | 2016-12-14 | 深圳崇达多层线路板有限公司 | For the technique making pottery plate HDI plate |
| CN109661125A (en) * | 2017-10-12 | 2019-04-19 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and preparation method thereof |
| CN111182739A (en) * | 2020-01-16 | 2020-05-19 | 深圳市志金电子有限公司 | Circuit board preparation method |
| CN111246670A (en) * | 2020-01-21 | 2020-06-05 | 惠州中京电子科技有限公司 | Method for manufacturing thin plate or soft plate through macroporous resin hole plugging |
| CN114828460A (en) * | 2022-06-15 | 2022-07-29 | 长沙牧泰莱电路技术有限公司 | Glue filling method for thick copper printed circuit board |
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| US20080251193A1 (en) * | 2004-10-08 | 2008-10-16 | Matsushita Electric Industrial Co., Ltd. | Method of Manufacturing Multi-Layer Circuit Board |
| CN101790288A (en) * | 2009-01-22 | 2010-07-28 | 上海美维科技有限公司 | Manufacturing method of novel printed circuit board |
| CN102427685A (en) * | 2011-11-22 | 2012-04-25 | 深圳崇达多层线路板有限公司 | Manufacturing process of HDI (High Density Interconnection) board |
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2012
- 2012-06-05 CN CN201210181598.XA patent/CN103037640B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080251193A1 (en) * | 2004-10-08 | 2008-10-16 | Matsushita Electric Industrial Co., Ltd. | Method of Manufacturing Multi-Layer Circuit Board |
| CN101790288A (en) * | 2009-01-22 | 2010-07-28 | 上海美维科技有限公司 | Manufacturing method of novel printed circuit board |
| CN102427685A (en) * | 2011-11-22 | 2012-04-25 | 深圳崇达多层线路板有限公司 | Manufacturing process of HDI (High Density Interconnection) board |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104735926A (en) * | 2013-12-18 | 2015-06-24 | 深南电路有限公司 | Resin hole filling method for circuit board |
| CN104735926B (en) * | 2013-12-18 | 2017-12-29 | 深南电路有限公司 | A kind of filling holes with resin method for circuit board |
| CN104902701A (en) * | 2014-03-05 | 2015-09-09 | 深南电路有限公司 | Circuit board processing method and circuit board having single-surface hole ring |
| CN104902701B (en) * | 2014-03-05 | 2019-03-05 | 深南电路有限公司 | A kind of circuit board processing method and the circuit board with single side orifice ring |
| CN104093277A (en) * | 2014-07-11 | 2014-10-08 | 景旺电子科技(龙川)有限公司 | Method for improving cutter breaking condition in hole drilling process of thick copper plate |
| CN106231801A (en) * | 2016-08-19 | 2016-12-14 | 深圳崇达多层线路板有限公司 | For the technique making pottery plate HDI plate |
| CN109661125A (en) * | 2017-10-12 | 2019-04-19 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and preparation method thereof |
| US11140785B2 (en) | 2017-10-12 | 2021-10-05 | Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd. | Flexible printed circuit board |
| CN109661125B (en) * | 2017-10-12 | 2021-11-16 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and manufacturing method thereof |
| CN111182739A (en) * | 2020-01-16 | 2020-05-19 | 深圳市志金电子有限公司 | Circuit board preparation method |
| CN111246670A (en) * | 2020-01-21 | 2020-06-05 | 惠州中京电子科技有限公司 | Method for manufacturing thin plate or soft plate through macroporous resin hole plugging |
| CN111246670B (en) * | 2020-01-21 | 2023-10-13 | 惠州中京电子科技有限公司 | Manufacturing method of sheet or soft board macroporous resin plug hole |
| CN114828460A (en) * | 2022-06-15 | 2022-07-29 | 长沙牧泰莱电路技术有限公司 | Glue filling method for thick copper printed circuit board |
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| CN103037640B (en) | 2015-07-22 |
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Address after: 102600 Beijing city Daxing District Huangcun Village West East Patentee after: KDS TECHNOLOGY CO., LTD. Patentee after: Wuhan Kaidisite Technology Co., Ltd. Address before: 102600 Beijing city Daxing District Huangcun Village West East Patentee before: Beijing Kds Co., Ltd. Patentee before: Wuhan Kaidisite Technology Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150722 Termination date: 20160605 |