CN104093277A - Method for improving cutter breaking condition in hole drilling process of thick copper plate - Google Patents
Method for improving cutter breaking condition in hole drilling process of thick copper plate Download PDFInfo
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- CN104093277A CN104093277A CN201410329926.5A CN201410329926A CN104093277A CN 104093277 A CN104093277 A CN 104093277A CN 201410329926 A CN201410329926 A CN 201410329926A CN 104093277 A CN104093277 A CN 104093277A
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- thick copper
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- copper coin
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Abstract
The invention discloses a method for improving cutter breaking condition in the hole drilling process of a thick copper plate. The method comprises the steps that A, a circuit film of the position where holes need to be drilled is designed to be blank, and meanwhile a solder resist film of the position where holes need to be drilled is designed to be windowed; B, during counterpoint, MARK points of lines are used for conducting counterpoint; C, through treatment of developing, etching and film removing, copper sheets at pore ring positions are etched. According to the method for improving the cutter breaking condition in the hole drilling process of the thick copper plate, the film for manufacturing a circuit is redesigned, the position where the holes need to be drilled is designed to be blank, meanwhile, the solder resist film of the position where the holes needs to be drilled is designed to be windowed, after counterpoint and exposure, the copper sheets at the pore ring positions are etched, the overall hardness of plates is lowered, so that subsequent hole drilling is conducted conveniently, and the phenomenon of cuter breaking is reduced. According to the method, only the circuit film and the solder resist film need to be designed, the production cycle is greatly shortened, and the production efficiency is improved.
Description
Technical field
The present invention relates to printed wiring board technical field, relate in particular to a kind of method of improving thick copper coin boring breaking.
Background technology
Along with the fast development of circuit industry, the utilization of multi-layer sheet, the laminating plate of thick copper aluminium is more and more wider, and to complete the making of this series products, performance requirement to machine is also more and more higher, when conventional rig is holed to this type of sheet material, breaking phenomenon is more frequent, is not suitable for batch making, reduce production efficiency, also affected product quality.
Therefore, prior art has yet to be improved and developed.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, the object of the present invention is to provide a kind of method of improving thick copper coin boring breaking, be intended to solve existing thick copper coin easy problem that breaking occurs in the time of boring.
Technical scheme of the present invention is as follows:
A method of improving thick copper coin boring breaking, wherein, comprises step:
A, blank to needing the circuit film of bore position to design windows to the welding resistance film design that needs bore position simultaneously;
B, in the time of contraposition, carry out contraposition with the MARK point of circuit;
C, through development, etching and striping processing, etch away the copper sheet at orifice ring position.
The method of the thick copper coin boring of described improvement breaking, wherein, in step C, adopts 2 etched modes to carry out etching to thick copper coin.
The method of the thick copper coin boring of described improvement breaking, wherein, speed when etching is 700 ~ 900mm/min.
The method of the thick copper coin boring of described improvement breaking, wherein, speed when etching is 800mm/min.
The method of the thick copper coin boring of described improvement breaking, wherein, in the time of contraposition, tolerance is no more than 3mil.
The method of the thick copper coin boring of described improvement breaking, wherein, in described step C, washes out the ink on surface, orifice ring position by development treatment.
Beneficial effect: the present invention redesigns by the film in the time making circuit, blank in the design of the position of need boring, the welding resistance film design that needs boring sites in curing is windowed simultaneously, after contraposition, exposure, in etching line, the copper sheet at orifice ring position is etched away, reduce the integral hardness of plate, holed so that follow-up, reduced the generation of breaking phenomenon.The present invention, owing to only need circuit, the welding resistance film being designed, has shortened the production cycle greatly, has improved production efficiency.
Brief description of the drawings
Fig. 1 is the flow chart of a kind of method preferred embodiment that improves thick copper coin boring breaking of the present invention.
Embodiment
The invention provides a kind of method of improving thick copper coin boring breaking, for making object of the present invention, technical scheme and effect clearer, clear and definite, below the present invention is described in more detail.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Refer to Fig. 1, Fig. 1 is the flow chart of a kind of method preferred embodiment that improves thick copper coin boring breaking of the present invention, and as shown in the figure, it comprises step:
S101, blank to needing the circuit film of bore position to design windows to the welding resistance film design that needs bore position simultaneously;
S102, in the time of contraposition, carry out contraposition with the MARK point of circuit;
S103, through development, etching and striping processing, etch away the copper sheet at orifice ring position.
Further, speed when etching is 700 ~ 900mm/min, even more preferably adopts the speed of 800mm/min to carry out etching.
Specifically, in step S103, adopt 2 etched modes to carry out etching to thick copper coin.For the unclean plank of etching, when etching for the second time, speed is put into maximum as far as possible, avoids having influence on live width, line-spacing, for example, adopt the speed of 900mm/min.Need 100% to carry out visual inspection for the pcb board after etching, can cross and move back film (striping).
In addition, in the time of contraposition, require tolerance to be no more than 3mil.
In step S103, wash out the ink on surface, orifice ring position by development treatment.
Development treatment is wherein to remove unexposed dry film by chemical method, exposes copper to be etched, and etching is to etch away by chemical method the copper exposing in the section of developing, and striping is to remove the residue dry film on plate face with highly basic, exposes needed circuit.
The composition of the section of developing liquid used can be the sodium carbonate of 1% mass percent, and temperature is at 30 ~ 40 DEG C; Etched liquid can adopt copper chloride, its copper content is 125 ~ 175g/L, its with respect to copper proportion be 1.24 ~ 1.33, temperature when etching is controlled at 40 ~ 55 DEG C, excess Temperature can cause that HCl volatilizees too much and cause solution proportion imbalance, the higher destruction that also can cause machine damage and corrosion preventing layer of another temperature, preferably, be controlled at 45 DEG C, for etching period, 1oz Copper Foil etching required time is 1.72min, and 1/2 Copper Foil etching required time is 0.89min; The composition of the liquid of striping section use be 2.5% mass percent KOH, its treatment temperature is at 55 DEG C.
The mode of in the past improving breaking is all to adopt the mode of adding via hole to hole substantially, need to carry out tool changing, and carry out at twice and add via hole, and efficiency is slow.The present invention is by the film of making when circuit is rinsed to design, and in the position of need boring design blank, and the design of the welding resistance film is windowed, after contraposition, exposure-processed, in etching line, copper sheet is herein etched away, reduced the integral thickness of plate, be convenient to follow-up boring.
In sum, the present invention redesigns by the film in the time making circuit, blank in the design of the position of need boring, the welding resistance film design that needs boring sites in curing is windowed simultaneously, after contraposition, exposure, in etching line, the copper sheet at orifice ring position is etched away, reduce the integral hardness of plate, hole so that follow-up, reduced the generation of breaking phenomenon.The present invention, owing to only need circuit, the welding resistance film being designed, has shortened the production cycle greatly, has improved production efficiency.
Should be understood that, application of the present invention is not limited to above-mentioned giving an example, and for those of ordinary skills, can be improved according to the above description or convert, and all these improvement and conversion all should belong to the protection range of claims of the present invention.
Claims (6)
1. a method of improving thick copper coin boring breaking, is characterized in that, comprises step:
A, blank to needing the circuit film of bore position to design windows to the welding resistance film design that needs bore position simultaneously;
B, in the time of contraposition, carry out contraposition with the MARK point of circuit;
C, through development, etching and striping processing, etch away the copper sheet at orifice ring position.
2. the method for the thick copper coin boring of improvement according to claim 1 breaking, is characterized in that, in step C, adopts 2 etched modes to carry out etching to thick copper coin.
3. the method for the thick copper coin boring of improvement according to claim 1 breaking, is characterized in that, speed when etching is 700 ~ 900mm/min.
4. the method for the thick copper coin boring of improvement according to claim 3 breaking, is characterized in that, speed when etching is 800mm/min.
5. the method for the thick copper coin boring of improvement according to claim 1 breaking, is characterized in that, in the time of contraposition, tolerance is no more than 3mil.
6. the method for the thick copper coin boring of improvement according to claim 1 breaking, is characterized in that, in described step C, washes out the ink on surface, orifice ring position by development treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410329926.5A CN104093277A (en) | 2014-07-11 | 2014-07-11 | Method for improving cutter breaking condition in hole drilling process of thick copper plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410329926.5A CN104093277A (en) | 2014-07-11 | 2014-07-11 | Method for improving cutter breaking condition in hole drilling process of thick copper plate |
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| CN104093277A true CN104093277A (en) | 2014-10-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410329926.5A Pending CN104093277A (en) | 2014-07-11 | 2014-07-11 | Method for improving cutter breaking condition in hole drilling process of thick copper plate |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105792526A (en) * | 2016-04-01 | 2016-07-20 | 广州兴森快捷电路科技有限公司 | Method of making blind slot of double-sided board |
| CN107770964A (en) * | 2017-10-18 | 2018-03-06 | 开平依利安达电子第三有限公司 | A kind of wiring board piercing process |
| CN109788650A (en) * | 2019-02-01 | 2019-05-21 | 奥士康精密电路（惠州）有限公司 | A kind of ameliorative way of super thick copper sheet PTH plug-in unit hole bur |
| CN112867264A (en) * | 2021-01-31 | 2021-05-28 | 惠州中京电子科技有限公司 | Method for riveting and positioning thick copper plate |
| CN113099613A (en) * | 2021-03-29 | 2021-07-09 | 福建福强精密印制线路板有限公司 | Secondary drilling explosion-proof method for circuit board |
| CN113556877A (en) * | 2021-07-20 | 2021-10-26 | 全成信电子（深圳）股份有限公司 | Process for rapidly treating small holes after etching of inner layer circuit |
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| US6222136B1 (en) * | 1997-11-12 | 2001-04-24 | International Business Machines Corporation | Printed circuit board with continuous connective bumps |
| CN101553090A (en) * | 2009-05-08 | 2009-10-07 | 深圳市博敏电子有限公司 | Method for printing solder resist on the PTFE substrate |
| CN103037640A (en) * | 2012-06-05 | 2013-04-10 | 北京凯迪思电路板有限公司 | Art utilizing common equipment and material to manufacture High Density Interconnect (HDI) laminated plate |
| CN103068167A (en) * | 2012-12-20 | 2013-04-24 | 景旺电子科技(龙川)有限公司 | Method for resolving copper sheet delaminating problem in drilling metal substrate thick copper plate independent pad |
| CN103607848A (en) * | 2013-11-27 | 2014-02-26 | 广东成德电路股份有限公司 | Method for improving solder resist alignment accuracy of printed-circuit board |
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2014
- 2014-07-11 CN CN201410329926.5A patent/CN104093277A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6222136B1 (en) * | 1997-11-12 | 2001-04-24 | International Business Machines Corporation | Printed circuit board with continuous connective bumps |
| CN101553090A (en) * | 2009-05-08 | 2009-10-07 | 深圳市博敏电子有限公司 | Method for printing solder resist on the PTFE substrate |
| CN103037640A (en) * | 2012-06-05 | 2013-04-10 | 北京凯迪思电路板有限公司 | Art utilizing common equipment and material to manufacture High Density Interconnect (HDI) laminated plate |
| CN103068167A (en) * | 2012-12-20 | 2013-04-24 | 景旺电子科技(龙川)有限公司 | Method for resolving copper sheet delaminating problem in drilling metal substrate thick copper plate independent pad |
| CN103607848A (en) * | 2013-11-27 | 2014-02-26 | 广东成德电路股份有限公司 | Method for improving solder resist alignment accuracy of printed-circuit board |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105792526A (en) * | 2016-04-01 | 2016-07-20 | 广州兴森快捷电路科技有限公司 | Method of making blind slot of double-sided board |
| WO2017167256A1 (en) * | 2016-04-01 | 2017-10-05 | 广州兴森快捷电路科技有限公司 | Method for manufacturing blind groove on double-sided board |
| CN107770964A (en) * | 2017-10-18 | 2018-03-06 | 开平依利安达电子第三有限公司 | A kind of wiring board piercing process |
| CN109788650A (en) * | 2019-02-01 | 2019-05-21 | 奥士康精密电路（惠州）有限公司 | A kind of ameliorative way of super thick copper sheet PTH plug-in unit hole bur |
| CN112867264A (en) * | 2021-01-31 | 2021-05-28 | 惠州中京电子科技有限公司 | Method for riveting and positioning thick copper plate |
| CN112867264B (en) * | 2021-01-31 | 2024-08-02 | 惠州中京电子科技有限公司 | Method for riveting and positioning thick copper plate |
| CN113099613A (en) * | 2021-03-29 | 2021-07-09 | 福建福强精密印制线路板有限公司 | Secondary drilling explosion-proof method for circuit board |
| CN113556877A (en) * | 2021-07-20 | 2021-10-26 | 全成信电子（深圳）股份有限公司 | Process for rapidly treating small holes after etching of inner layer circuit |
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Application publication date: 20141008 |