CN104105361B - A kind of method of circuit board selective electroplating conductive hole - Google Patents
A kind of method of circuit board selective electroplating conductive hole Download PDFInfo
- Publication number
- CN104105361B CN104105361B CN201410190917.2A CN201410190917A CN104105361B CN 104105361 B CN104105361 B CN 104105361B CN 201410190917 A CN201410190917 A CN 201410190917A CN 104105361 B CN104105361 B CN 104105361B
- Authority
- CN
- China
- Prior art keywords
- hole
- copper
- conductive
- circuit board
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 50
- 238000009713 electroplating Methods 0.000 title claims abstract description 47
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 124
- 239000010949 copper Substances 0.000 claims abstract description 101
- 229910052802 copper Inorganic materials 0.000 claims abstract description 101
- 239000010410 layer Substances 0.000 claims abstract description 57
- 238000005260 corrosion Methods 0.000 claims abstract description 23
- 239000011241 protective layer Substances 0.000 claims abstract description 18
- 239000011888 foil Substances 0.000 claims abstract description 15
- 239000007788 liquid Substances 0.000 claims description 48
- 239000003814 drug Substances 0.000 claims description 45
- 239000000463 material Substances 0.000 claims description 40
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 27
- 239000003292 glue Substances 0.000 claims description 23
- 238000005530 etching Methods 0.000 claims description 16
- 238000011161 development Methods 0.000 claims description 13
- 229920006267 polyester film Polymers 0.000 claims description 13
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 238000003618 dip coating Methods 0.000 claims description 4
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 abstract description 4
- 238000003912 environmental pollution Methods 0.000 abstract description 2
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 23
- 239000011889 copper foil Substances 0.000 description 23
- 238000007747 plating Methods 0.000 description 23
- 238000004519 manufacturing process Methods 0.000 description 22
- 238000013461 design Methods 0.000 description 18
- 238000012360 testing method Methods 0.000 description 18
- 238000005553 drilling Methods 0.000 description 15
- 238000005516 engineering process Methods 0.000 description 12
- 239000000243 solution Substances 0.000 description 12
- 239000002253 acid Substances 0.000 description 9
- 238000004140 cleaning Methods 0.000 description 9
- 235000011121 sodium hydroxide Nutrition 0.000 description 8
- 230000007797 corrosion Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 6
- 230000035939 shock Effects 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid group Chemical class S(O)(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000003112 inhibitor Substances 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 241001074085 Scophthalmus aquosus Species 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000010970 precious metal Substances 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 238000011536 re-plating Methods 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000008399 tap water Substances 0.000 description 2
- 235000020679 tap water Nutrition 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical class C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- BQJTUDIVKSVBDU-UHFFFAOYSA-L copper;sulfuric acid;sulfate Chemical compound [Cu+2].OS(O)(=O)=O.[O-]S([O-])(=O)=O BQJTUDIVKSVBDU-UHFFFAOYSA-L 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a kind of methods of circuit board selective electroplating conductive hole, include the following steps：1) anti-corrosion protective layer is covered in two plate faces of copper coated foil plate；2) conductive hole datum hole is bored；3) conductive layer is formed in datum hole inner surface；4) by the conductive layer in datum hole inner surface copper facing, 5) remove anti-corrosion protective layer.The method of the present invention not only can greatly save copper and chemicals, and environmental pollution is small, and the conductive hole of circuit board will not form the annular copper bound of protrusion, need not grind via hole hole edge, circuit board high yield rate.
Description
[technical field]
The present invention relates to process for manufacturing circuit board more particularly to a kind of methods of circuit board selective electroplating conductive hole.
[background technology]
The work of hole metallization and circuit patterns moulding process, double-sided multi-layer and flexible circuit board is connected in conventional print-circuit board
Skill is：Copper-clad plate sawing sheet → CNC drillings → surface nog plate (surface copper foil corrosion inhibitor) → circuit board chemical plating hole metallization → circuit
Panel plating copper or electroplating surface thickness copper → surface nog plate → printing photosensitive-ink or patch light-sensitive surface → circuit patterns film exposure
→ figure development → plate face oil removing → pattern plating copper → graphic plating tin → circuit patterns striping → circuit board etching → circuit
Tin is moved back in plate plate face and hole or protection photosensitive dry film → nog plate cleaning of decorporate plate face circuit and hole face is transferred to printing solder mask.
Following disadvantage present in traditional circuit-board production Technology：
(1) in traditional circuit-board production process：In order to which the copper in via hole thickeies, on the circuit board by electroless copper plating
The copper metal coating in hole in order to make the via hole on circuit board reaches 18 μm~25 μm copper thickness of certain thickness, Gu to copper-clad plate
When being electroplated on 12 μm~36 μm copper thickness copper foils of native copper foil on operation block or circuit board pattern surface and via hole is electric again together simultaneously
The layers of copper of the part of plated hole copper and part beyond hole copper, the surface area of via-hole of circuit board is approximately board surface area
10%-20%, because of the technical barrier that can not solve that via hole is only electroplated without plating circuit plate face in traditional handicraft, so making hole
Copper reaches certain hole copper thickness to copper facing again on copper foil of copper-clad plate, and circuit board lateral erosion when circuitous pattern etches is caused to lose
The problems such as not clean, via hole hole copper is by eating off, Kong Wutong is carved, the quality of circuit board is influenced, causes the waste of copper resource.
(2) in traditional circuit board production technology, when making accurate fine rule road, reach one for the hole copper thickness of via hole
Fixed copper is thick, and first that the copper foil corrosion inhibitor on copper-clad plate surface is thin by corrosion inhibitor line, circuit board is the requirement for reaching hole copper after corrosion inhibitor
Thickness, the via hole after electroless copper plating are electroplated together with circuit board surface, then re-plating on the copper foil circuit board that corrosion inhibitor is crossed
One layer of copper is so copper resource waste is higher, and difficulty is high when making accurate fine rule road, tedious process.
(3) traditional circuit board production technology production link is more.It is also needed when with photosensitive circuit oil circuitous pattern plus plating is pure
Tin protective layer, and also tin layers are returned to the protective layer used nitric acid type tin stripping liquid of the pure tin of plating after etching circuitous pattern,
Precious metal is wasted again because using strong corrosion nitric acid type tin stripping liquid, increases wastewater discharge, and cause environmental pollution.
(4) traditional circuit board production technology is especially when needing the layer of precious metal such as gold-plated, nickel tin on to circuit board, tradition
Technique is to plate layer of precious metal on full circuit board circuit patterns and conducting hole surface, also rotten again after especially tin plating etching protection layer
Eating away or board circuit pattern surface and via hole surface gold-plating, nickel do etch protection layer, cause noble metal and chemistry
The significant wastage of drug pollutes environment.The shortcomings that in order to overcome traditional circuit board production technology, patent of invention
200710073024.X disclosing a kind of printed circuit board mask hole electroplating molding process, include the following steps：(1) selection is led
The copper-clad plate block or circuit board that through-hole has metallized；(2) photosensitive-ink or patch photosensitive dry film are printed, and photosensitive-ink is made to dry；
(3) the via hole hole position painted with light or welding position or the circuit part part film to be thickeied, contraposition exposure；(4) develop
Via hole hole position or welding position after exposing exposed light admittedly or the circuit part part required vacancy or welding position to be thickeied；
(5) into line mask plated hole, until required thickness；(6) ink or photosensitive dry film covered on surface are removed, via hole hole position or welding are obtained
Position or the circuit part part copper-clad plate block or circuit board to be thickeied.The patent of invention uses selective electroplating conductive hole, can pole
Big saving copper, other metals and chemicals, it is low in the pollution of the environment.
The shortcomings that patent of invention disclosed method is：At via hole mask hole electroplating hole, the hole edge of via hole is high
In the circuit copper face of circuit board, need with grinder grind conducting hole edge protrusion annular copper bound, due to copper-clad plate thickness simultaneously
Uneven, thickness deviation is easy to grind in the circuit of circuit board thicker portion 10% or so when grinding conductive hole edge
Fall, reduces circuit board yield rate.
[invention content]
The technical problem to be solved in the present invention is to provide the annular copper bound that a kind of conductive hole of circuit board will not form protrusion,
Via hole hole edge, the plated hole method of the circuit board selective electroplating conductive hole of circuit board high yield rate need not be ground.
In order to solve the above-mentioned technical problem, the technical solution adopted by the present invention is that a kind of circuit board selective electroplating is conductive
The method in hole, includes the following steps：
101) anti-corrosion protective layer is covered in two plate faces of copper coated foil plate；
102) conductive hole datum hole is bored；
103) conductive layer is formed in datum hole inner surface；
104) by the conductive layer in datum hole inner surface copper facing, the electroplating surfaces with tin of copper in hole；
105) anti-corrosion protective layer is removed.
The method of above-described circuit board selective electroplating conductive hole, the anti-corrosion protective layer includes resist ink
Layer and the polyester film pasted on resist ink layer, the conductive layer is Organic Conductive Films；Polyester film is in step
103) it removes later, resist ink layer removes later in step 104), is etched, has etched after the removal of resist ink layer
At rear removal tin coating.
The method of above-described circuit board selective electroplating conductive hole, the anti-corrosion protective layer are anti-Organic Conductive Films
The ink layer of liquid medicine, anti-plate liquid medicine, the conductive layer are Organic Conductive Films；Anti- Organic Conductive Films liquid medicine, anti-plate liquid medicine
Ink layer removed later with sodium hydrate aqueous solution in step 104)；It is etched, is removed on plate after anti-corrosion protective layer removal
Extra copper removes tin coating after the completion of etching.
The method of above-described circuit board selective electroplating conductive hole, including de-smear step, the removal of de-smear step
Glue residue in multilayer copper-clad foil plate datum hole；De-smear step is completed between step 102) and step 103).
The method of above-described circuit board selective electroplating conductive hole includes being printed in plate face before step 101)
Photosensitive material, required for being formed after exposure, development the step of conductive pattern；It include the step of stripping photosensitive material after the completion of etching
Suddenly.
The method of above-described circuit board selective electroplating conductive hole includes boring location hole and side before step 101)
The step of to hole.
It is fixed with brill to bore conductive hole datum hole in step 102) for the method for above-described circuit board selective electroplating conductive hole
Position hole, direction hole are carried out at the same time.
The method of above-described circuit board selective electroplating conductive hole, the anti-corrosion protective layer are anti-Organic Conductive Films
The peelable glue of liquid medicine, anti-plate liquid medicine, the conductive layer are Organic Conductive Films；Anti- Organic Conductive Films liquid medicine, anti-plate liquid medicine
Peelable glue removed later in step 104)；Again to plate face dip-coating photosensitive material after the removal of anti-corrosion protective layer, photosensitive material exposure,
Conductive pattern required for being formed after development；Then, copper extra on etched plate removes tin coating and photosensitive material again after the completion of etching
Material.
The method of above-described circuit board selective electroplating conductive hole, the anti-corrosion protective layer are pasted in plate face
Polyester film, the adhesive of polyester film is silicone rubber adhesive, and the conductive layer is Organic Conductive Films；Polyester film exists
Step 103) removes later, and resist ink layer removes later in step 104).
The method of circuit board selective electroplating conductive hole of the present invention not only can greatly save copper and chemicals, environment
Pollution is few, and the conductive hole of circuit board will not form the annular copper bound of protrusion, need not grind via hole hole edge, circuit board at
Product rate is high.
[description of the drawings]
The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
Fig. 1 is that the embodiment of the method 1 of circuit board selective electroplating conductive hole of the present invention bores the signal in direction hole and location hole
Figure.
Fig. 2 is that the embodiment of the method 1 of circuit board selective electroplating conductive hole of the present invention forms the schematic diagram of conductive pattern.
Fig. 3 is the 1 printing quick-drying resist ink of embodiment of the method for circuit board selective electroplating conductive hole of the present invention
Schematic diagram.
Fig. 4 is that the embodiment of the method 1 of circuit board selective electroplating conductive hole of the present invention pastes the schematic diagram of polyester film.
Fig. 5 is that the embodiment of the method 1 of circuit board selective electroplating conductive hole of the present invention bores the schematic diagram of conductive hole datum hole.
Fig. 6 is that the 1 datum hole inner surface of embodiment of the method for circuit board selective electroplating conductive hole of the present invention forms organic conductive
The schematic diagram of film.
Fig. 7 is the embodiment of the method 1 of circuit board selective electroplating conductive hole of the present invention, datum hole copper facing, tin plating schematic diagram.
Fig. 8 is that the embodiment of the method 1 of circuit board selective electroplating conductive hole of the present invention removes the schematic diagram of polyester film.
Fig. 9 is that the embodiment of the method 1 of circuit board selective electroplating conductive hole of the present invention strips the signal of resist ink layer
Figure.
Figure 10 is that the etching of embodiment of the method 1 of circuit board selective electroplating conductive hole of the present invention retreats showing except photosensitive material
It is intended to.
[specific implementation mode]
Embodiment 1：
Two-sided copper foil covered board production technology, after forming conducting circuit pattern using plate face, coating anti-plate layer, organic conductive
Film protective layer, steps are as follows：
1) two-sided copper foil covered board for choosing 1.6MM copper thickness H/H, is cut into 210 × 120mm；
2) borehole data is chosen, location hole and direction hole (the primary drilling) of 3.175mm are bored；Location hole will be for that will cover copper foil
Plate is fixed on drilling machine table top, will not be moved with copper coated foil plate when guarantee drilling, positioning；Direction hole is product in follow-up process
It identifies that direction is used, sees Fig. 1；
3) photosensitive material is printed after plate face cleaning, in an oven 75 DEG C of baking 40min；
4) it exposes, form the required conductive pattern of circuit design and 120 DEG C of roasting 0.5H after development, see Fig. 2；
5) on the two-sided copper foil covered board for forming conductive pattern, the quick-drying resist ink of one layer of about 15 μ m-thick is printed,
See Fig. 3；
6) a strata ester film (PET film+acrylic acid series glue, to protect anti-electricity is pasted on quick-drying resist ink layer
Plating ink is not corroded by Organic Conductive Films liquid medicine), protection Organic Conductive Films liquid medicine corrodes resist ink layer, sees Fig. 4；
7) it is needing to make position drilling (the secondary brill that conductive layer conducts set by component side and the back side by circuit design
Hole drills out the datum hole of conductive hole), see Fig. 5；
8) organic conductive layers are formed in datum hole.Organic Conductive Films horizontal production line is crossed, conduction is formed in datum hole inner surface
Layer, is shown in Fig. 6；
Organic Conductive Films process flow is：Whole hole → oxidation → catalysis；Operating condition and parameter are controlled by table 1, are obtained
To Organic Conductive Films, organic conductive thicknesses of layers about 140nm.
1 Organic Conductive Films operating condition of table
Organic Conductive Films liquid medicine uses the Organic Conductive Films film forming agent of Zhuhai Si Meite Electron Material Co., Ltd.
9) polyester film is thrown off, the copper facing in acid copper plating cylinder, and hole copper is electroplated onto 20-25 μm and in the table of hole copper
Face is tin plating (resist layer), sees Fig. 7 and Fig. 8；
10) copper facing operating condition is shown in Table 2
2 electro-coppering formula of table and operating condition
| Copper sulphate | Sulfuric acid | Current density | Time |
| 70G/L | 190G/L | 1.8-2ASD | 60min |
11) in the 1-3% sodium hydroxide solutions under normal temperature state, 10-15 seconds stripping resist ink layers are impregnated, originally
Water is rinsed well, sees Fig. 9；
12) extra copper is etched in alkaline copper chloride etching solution, is moved back in tin liquid medicine after acidity and is moved back tin, sees Fig. 9；
13) in the sodium hydroxide solution of 3-5%, photosensitive material is stripped, required double-sided PCB is obtained, sees Figure 10；
14) conductive on off test, no non-conductive phenomenon of via, 100% coincident circuit design requirement are done；
15) thermal shock test and high/low temperature test are done.
Embodiment 2
Two-sided copper foil covered board production technology coats anti-Organic Conductive Films, anti-electricity after forming conducting circuit pattern using plate face
Peelable glue is plated, steps are as follows：
1) two-sided copper foil covered board for choosing 1.6mm copper thickness H/H, is cut into 210 × 120mm；
2) borehole data is chosen, location hole and direction hole (the primary drilling) of 3.175mm are bored；
3) photosensitive material is printed after plate face cleaning, in an oven 75 DEG C of baking 40min；
4) it exposes, form the required conductive pattern of circuit design after development and bake 0.5H under the conditions of 120 DEG C；
5) on the two-sided copper foil covered board for forming conductive pattern, the anti-Organic Conductive Films liquid medicine of one layer of about 15 μ m-thick of printing,
The peelable glue of anti-plate liquid medicine, with 120 DEG C of roasting 0.5H；The performance need of anti-Organic Conductive Films anti-plate liquid medicine, anti-plate peelable glue
It is resistant to the corrosion of Organic Conductive Films liquid medicine (85 DEG C), the erosion of acid electroplating liquid medicine can be kept out, if Shenzhen Ke Shida companies provide,
The trade mark is the peelable glue of COS-KB010.Shenzhen Ke Shida CompanyAddress is the tenth work of the Shenzhen light new district communities Gongming Tian Liao
2, industry area, 9 buildings areas A.
6) it is needing to make position drilling (the secondary brill that conductive layer conducts set by component side and the back side by circuit design
Hole)；
7) organic conductive layers are formed in datum hole.Organic Conductive Films horizontal production line is crossed, conduction is formed in datum hole inner surface
Layer, the step 8) of process such as embodiment 1；
8) hole copper is thickeied to 20-25 μm, and at the electroplating surfaces with tin of hole copper (resist layer) in acid copper plating cylinder；
9) peelable glue of anti-Organic Conductive Films liquid medicine, anti-plate liquid medicine is removed；
10) extra copper is etched in alkaline copper chloride etching solution, is moved back in tin liquid medicine after acidity and is moved back tin；
11) in the sodium hydroxide solution of 3-5%, photosensitive material is stripped, required double-sided PCB is obtained；
12) conductive on off test, no non-conductive phenomenon of via, 100% coincident circuit design requirement are done；
13) thermal shock test and high/low temperature test are done.
Embodiment 3
Multilayer copper-clad foil board production technology coats the anti-electricity of anti-Organic Conductive Films after forming conducting circuit pattern using plate face
Peelable glue is plated, steps are as follows：
1) two-sided copper foil covered board for choosing 1.6MM copper thickness H/H, is cut into 210 × 120mm；
2) borehole data is chosen, location hole and direction hole (the primary drilling) 1 of 3.175mm are bored；
3) photosensitive material is printed after plate face cleaning, in an oven 75 DEG C of baking 40min；
4) it exposes, form the required inner layer conductive figure of circuit design after development and bake 0.5H under the conditions of 120 DEG C；
5) etch, move back film after obtain required inner layer conductive figure；
6) multilayer copper-clad foil plate is pressed into according to design scheme；
7) the required conductive pattern of circuit design is formed after coating photosensitive material, exposure, development and under the conditions of 120 DEG C
Roasting 0.5H；
8) on the two-sided copper foil covered board for forming conductive pattern, the anti-Organic Conductive Films liquid medicine of one layer of about 15 μ m-thick of printing,
The peelable glue of anti-plate liquid medicine, with 120 DEG C of roasting 0.5H；It is needing to make conductive layer set by component side and the back side by circuit design
The position drilling (secondary drilling) conducted；
9) de-smear flow is walked, the dirty (heat generated when boring nozzle high speed rotation when drilling is bored in the hole that removal is formed when drilling
The spot that amount generates resin or glass fibre fusing)；
De-smear parameter is shown in Table 3：
(sweller, adhesive remover, neutralizer are provided by Zhuhai Si Meite Electron Material Co., Ltd)
10) Organic Conductive Films horizontal production line is crossed, the through-hole that need to be conducted is made to form conductive layer, process such as embodiment 1
Step 8)；
11) hole copper is thickeied to 20-25 μm, and at the electroplating surfaces with tin of hole copper (resist layer) in acid copper plating cylinder；
12) peelable glue of anti-Organic Conductive Films liquid medicine, anti-plate liquid medicine is removed；
13) extra copper is etched in alkaline copper chloride etching solution, is moved back in tin liquid medicine after acidity and is moved back tin；
14) in the sodium hydroxide solution of 3-5%, photosensitive material is stripped, required double-sided PCB is obtained；
15) conductive on off test, no non-conductive phenomenon of via, 100% coincident circuit design requirement are done；
16) thermal shock test and high/low temperature test are done.
Embodiment 4
Two-sided copper foil covered board production technology is directly coated with anti-plate material, then completes follow-up process, step using relief method
It is as follows：
1) two-sided copper foil covered board for choosing 5 1.6MM copper thickness H/H, is cut into 210 × 120mm；
A) plate face cleaning after be coated with anti-Organic Conductive Films liquid medicine, anti-plate liquid medicine peelable glue (Shenzhen Ke Shida companies provide,
The trade mark be COS-KB010 peelable glue, anti-Organic Conductive Films liquid medicine, anti-plate liquid medicine peelable glue thickness control within 20 μm,
120 DEG C of baking 40min in an oven；
2) borehole data is chosen, location hole, direction hole are disposably drilled and needs conductive through-hole；
3) Organic Conductive Films horizontal production line is crossed, the through-hole that need to be conducted is made to form conductive layer；
4) hole copper is electroplated onto 20-25 μm in acid copper plating cylinder；
5) peelable glue of anti-Organic Conductive Films liquid medicine, anti-plate liquid medicine is removed, base material copper face is exposed；
6) through the cleaning of 3-5% dilute sulfuric acids and mechanical nog plate, (dilute sulfuric acid is the oxide for removing base material copper face；Mechanical nog plate
One effect is the deep layer oxidation for removing base material copper face, impression of the hand etc., and second effect is roughening base material copper face, increases base material copper
Surface area, improve the adhesive force of photosensitive material, mechanical nog plate polish-brush wheel material is the soft brush of nylon of the abrasive materials such as silicon carbide-containing)；
Dip-coating photosensitive material (such as UV-6602 of Shenzhen Shen Lejian Chemical Co., Ltd.s), thickness control is at 15 μm or so；In an oven
120 DEG C of baking 40min；
7) it exposes, form the required conductive pattern of circuit design after development and bake 0.5H under the conditions of 120 DEG C；
8) extra copper is etched in acid copper chloride etching liquid；
9) in the 1-3% sodium hydroxide solutions under 50 DEG C of states, 30 seconds stripping photosensitive material layers are impregnated, tap water rinses
Totally；Obtain required double-sided PCB；
10) conductive on off test, no non-conductive phenomenon of via, 100% coincident circuit design requirement are done；
11) thermal shock test and high/low temperature test are done.
Embodiment 5
Flexible copper clad foil board production technology is directly coated with anti-plate material, then completes follow-up process, step using relief method
It is as follows：
1) the flexible copper clad foil plate for choosing 5 0.05mm copper thickness H/H, is cut into 250 × 120mm；
2) plate face cleaning after be coated with anti-Organic Conductive Films liquid medicine, anti-plate liquid medicine peelable glue (Shenzhen Ke Shida companies provide,
Brand COS-KB010), anti-Organic Conductive Films liquid medicine, anti-plate liquid medicine peelable glue thickness control have within 15 μm, in an oven
120 DEG C of baking 40min；
3) borehole data is chosen, location hole, direction hole are disposably drilled and needs conductive through-hole；
4) Organic Conductive Films horizontal production line is crossed, the through-hole that need to be conducted is made to form conductive layer；
5) hole copper is electroplated onto 20-25 μm in acid copper plating cylinder；
6) peelable glue of anti-Organic Conductive Films liquid medicine, anti-plate liquid medicine is removed, base material copper face is exposed；
7) through the cleaning of 3-5% dilute sulfuric acids and mechanical nog plate, (dilute sulfuric acid is the oxide for removing base material copper face；Mechanical nog plate
One effect is the deep layer oxidation for removing base material copper face, impression of the hand etc., and second effect is roughening base material copper face, increases base material copper
Surface area, improve the adhesive force of photosensitive material, mechanical nog plate polish-brush wheel material is the soft brush of nylon of the abrasive materials such as silicon carbide-containing)；
Dip-coating photosensitive material (such as UV-6602 of Shenzhen Shen Lejian Chemical Co., Ltd.s), thickness control is at 15 μm or so；In an oven
120 DEG C of baking 40min；
8) it exposes, form the required conductive pattern of circuit design after development and bake 0.5H under the conditions of 120 DEG C；
9) extra copper is etched in acid copper chloride etching liquid；
10) in the 1-3% sodium hydroxide solutions under 50 DEG C of states, 30 seconds stripping photosensitive material layers, tap water punching are impregnated
Wash clean；Obtain required double-sided PCB；
11) conductive on off test, no non-conductive phenomenon of via, 100% coincident circuit design requirement are done；
12) thermal shock test and high/low temperature test are done.
Embodiment 6
Two-sided copper foil covered board production technology, after forming conducting circuit pattern using plate face, polyester film is pasted, step is such as
Under：
1) two-sided copper foil covered board for choosing 1.6mm copper thickness H/H, is cut into 210 × 120mm；
2) borehole data is chosen, location hole and direction hole (the primary drilling) of 3.175mm are bored；
3) photosensitive-ink is printed after plate face cleaning, in an oven 75 DEG C of baking 40min；
4) it exposes, form the required conductive pattern of circuit design after development and bake 0.5H under the conditions of 120 DEG C；
5) on the two-sided copper foil covered board for forming conductive pattern, polyester film (PET film+silicone rubber adhesive, to protect is pasted
Shield conductive pattern ink is not corroded by Organic Conductive Films liquid medicine)；
6) it is needing to make position drilling (the secondary brill that conductive layer conducts set by component side and the back side by circuit design
Hole)；
7) organic conductive layers are formed in datum hole.Organic Conductive Films horizontal production line is crossed, conduction is formed in datum hole inner surface
Layer, the step 8) of process such as embodiment 1；
8) hole copper is thickeied to 20-25 μm, and at the electroplating surfaces with tin of hole copper (resist layer) in acid copper plating cylinder；
9) polyester film is removed；
10) extra copper is etched in alkaline copper chloride etching solution, is moved back in tin liquid medicine after acidity and is moved back tin；
11) in the sodium hydroxide solution of 3-5%, photosensitive-ink is stripped, required double-sided PCB is obtained；
12) conductive on off test, no non-conductive phenomenon of via, 100% coincident circuit design requirement are done；
13) thermal shock test and high/low temperature test are done.
The method of the printed circuit board selective electroplating conductive hole of above example of the present invention is not bore covering for via hole
Pattern transfer is first passed through on copper foil plate, produces board circuit figure, then bore via hole and hole in piece part, then crosses organic conductive
Film makes non-conduction hole form the re-plating forming of energization hole, or the copper coated foil plate surface to not drilling covers one layer of anti-organic conductive
Film, anti-plate liquid medicine peelable glue, bore via hole afterwards, so that non-conduction hole is formed energization hole and electro-coppering after Organic Conductive Films, so
After do pattern transfer, above example of the present invention is when being electroplated via hole hole copper, because to the native copper foil no longer electro-coppering on plate,
The thru-hole electroplating for needing certain copper thickness is thickeied, above example of the present invention maintains the copper thickness uniformity of native copper foil, makes
It is not influenced by the factor of copper electroplating layer became uneven when precision thin circuit board, makes accurate fine rule road and be easier, circuit essence
Accuracy higher, make circuitous pattern when it is small by etch effects factor, reduce and scrapped caused by etching factor, reduce at this section
About raw material.For above example of the present invention when to copper coated foil plate thru-hole electroplating, the total surface area of copper coated foil plate via hole is about
It is the 10%--20% of board surface area, is more easy to make hole copper thickness when thru-hole electroplating to reach the hole copper thickness of needs, this
The phosphor-copper consumed when the copper plating of invention above example via hole hole also only shows technique copper coated foil plate plate face or plating circuit figure
15%--20% when type and via hole, above example of the present invention can save a large amount of electric energy, can save nearly 85% or so
Plating phosphor-copper and electricity consumption reduce production cost, meet circular economy production feature conducive to environmental protection.
What is more important, above example of the present invention aperture copper and plate face when copper coated foil plate via hole is directly electroplated
Copper is equally smooth, will not form the annular copper bound of protrusion at the both ends of conductive hole, need not grind conductive hole hole edge, circuit board
Yield rate greatly improves.
Claims (7)
1. a kind of method of circuit board selective electroplating conductive hole, which is characterized in that include the following steps：
101) anti-corrosion protective layer is covered in two plate faces of copper coated foil plate, the anti-corrosion protective layer is the anti-organic conductive of coating
The peelable glue of film liquid medicine, anti-plate liquid medicine；
102) conductive hole datum hole is bored；
103) conductive layer is formed in the datum hole inner surface that need to be conducted, the conductive layer is Organic Conductive Films；
104) by the conductive layer in datum hole inner surface copper facing；
105) anti-corrosion protective layer is removed, that is, remove the peelable glue of anti-Organic Conductive Films liquid medicine, anti-plate liquid medicine；
It also includes the steps that separately the setting photosensitive material in plate face, and exposes, forms the step of conductive pattern after development.
2. the method for circuit board selective electroplating conductive hole according to claim 1, which is characterized in that walked including de-smear
Suddenly, the glue residue in de-smear step removal multilayer copper-clad foil plate datum hole；De-smear step is between step 102) and step 103)
It completes.
3. the method for circuit board selective electroplating conductive hole according to claim 1, which is characterized in that step 101) it
Before include that photosensitive material is printed in plate face, exposure, development after formed required for conductive pattern the step of；After step 104)
The step of being included in hole copper electroplating surfaces with tin is etched after anti-corrosion protective layer removal, copper extra on plate is removed, after the completion of etching
Remove tin coating and photosensitive material.
4. the method for circuit board selective electroplating conductive hole according to claim 1, which is characterized in that step 101) it
Preceding includes the steps that boring location hole and direction hole.
5. the method for circuit board selective electroplating conductive hole according to claim 1, which is characterized in that in step 102)
It bores conductive hole datum hole and bores location hole, direction hole is carried out at the same time.
6. the method for circuit board selective electroplating conductive hole according to claim 1, which is characterized in that anti-corrosion protective layer is gone
Again to plate face dip-coating photosensitive material after removing, conductive pattern required for being formed after photosensitive material exposure, development；Then, on etched plate
Extra copper removes photosensitive material again after the completion of etching.
7. the method for circuit board selective electroplating conductive hole according to claim 1, which is characterized in that the anti-corrosion guarantor
Sheath is the polyester film pasted in plate face, and the adhesive of polyester film is silicone rubber adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410190917.2A CN104105361B (en) | 2014-05-07 | 2014-05-07 | A kind of method of circuit board selective electroplating conductive hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410190917.2A CN104105361B (en) | 2014-05-07 | 2014-05-07 | A kind of method of circuit board selective electroplating conductive hole |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104105361A CN104105361A (en) | 2014-10-15 |
| CN104105361B true CN104105361B (en) | 2018-08-31 |
Family
ID=51673045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410190917.2A Active CN104105361B (en) | 2014-05-07 | 2014-05-07 | A kind of method of circuit board selective electroplating conductive hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104105361B (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211631B (en) * | 2016-09-13 | 2018-10-12 | 电子科技大学 | A kind of production method of the enhanced printed circuit board inner figure of laminating surface binding force |
| CN107170679B (en) * | 2017-05-19 | 2020-02-07 | 京东方科技集团股份有限公司 | Manufacturing method of conductive pattern, conductive pattern and display substrate |
| CN107708335A (en) * | 2017-11-07 | 2018-02-16 | 竞华电子(深圳)有限公司 | A kind of circuit manufacturing method of multi-layer PCB board |
| CN108541139B (en) * | 2018-03-31 | 2020-04-17 | 深圳市实锐泰科技有限公司 | PCB (printed circuit board) via hole manufacturing method and PCB |
| CN109056015A (en) * | 2018-10-19 | 2018-12-21 | 莆田市涵江区依吨多层电路有限公司 | The mechanical blind brill pattern plating jet apparatus of smart home printed circuit board and its method |
| CN110430697B (en) * | 2019-08-29 | 2021-07-13 | 江苏上达电子有限公司 | Manufacturing method of novel multi-layer fine circuit board |
| CN110446372B (en) * | 2019-08-29 | 2021-07-27 | 江苏上达电子有限公司 | Manufacturing method of improved multi-layer fine circuit board |
| CN110545634A (en) * | 2019-08-29 | 2019-12-06 | 江苏上达电子有限公司 | Manufacturing method of multilayer fine circuit board with circuit being firstly made and then plated with hole copper |
| CN112739020A (en) * | 2020-12-15 | 2021-04-30 | 广德宝达精密电路有限公司 | Method for manufacturing gold-plated circuit board |
| CN112788853A (en) * | 2021-01-09 | 2021-05-11 | 勤基电路板（深圳）有限公司 | Production process of circuit board for increasing area of through hole pad and circuit board |
| CN114980497A (en) * | 2021-02-20 | 2022-08-30 | 嘉联益电子(昆山)有限公司 | Method for manufacturing circuit board circuit structure with through hole and manufactured circuit board circuit structure with through hole |
| CN114980569A (en) * | 2021-02-20 | 2022-08-30 | 嘉联益电子(昆山)有限公司 | Method for manufacturing circuit board circuit structure with through hole and manufactured circuit board circuit structure with through hole |
| CN114980567B (en) * | 2021-02-20 | 2024-03-19 | 嘉联益电子(昆山)有限公司 | Manufacturing method of circuit board line structure with through holes and manufactured circuit board line structure with through holes |
| CN113056117B (en) * | 2021-03-15 | 2022-07-29 | 德中（天津）技术发展股份有限公司 | Method for metalizing and electroplating hole wall only |
| CN113133224B (en) * | 2021-04-07 | 2022-07-08 | 威海世一电子有限公司 | FPCB plate via hole selective plating process |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0071375A2 (en) * | 1981-07-25 | 1983-02-09 | Kazuo Kay | Method for manufacturing a circuit board with a through hole |
| US6039889A (en) * | 1999-01-12 | 2000-03-21 | Fujitsu Limited | Process flows for formation of fine structure layer pairs on flexible films |
| CN1925725A (en) * | 2005-09-02 | 2007-03-07 | 日本梅克特隆株式会社 | Method for manufacturing circuit substrate |
| CN101232782A (en) * | 2007-01-23 | 2008-07-30 | 李东明 | Printed circuit board mask hole electroplating molding process |
-
2014
- 2014-05-07 CN CN201410190917.2A patent/CN104105361B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0071375A2 (en) * | 1981-07-25 | 1983-02-09 | Kazuo Kay | Method for manufacturing a circuit board with a through hole |
| US6039889A (en) * | 1999-01-12 | 2000-03-21 | Fujitsu Limited | Process flows for formation of fine structure layer pairs on flexible films |
| CN1925725A (en) * | 2005-09-02 | 2007-03-07 | 日本梅克特隆株式会社 | Method for manufacturing circuit substrate |
| CN101232782A (en) * | 2007-01-23 | 2008-07-30 | 李东明 | Printed circuit board mask hole electroplating molding process |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104105361A (en) | 2014-10-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104105361B (en) | A kind of method of circuit board selective electroplating conductive hole | |
| CN100531527C (en) | Printed circuit board mask hole electroplating molding process | |
| CN101951728B (en) | Production method for replacing flexible circuit board with rigid circuit board | |
| CN100546439C (en) | Electroplating technique for thickening mask hole cuprum of printed circuit board | |
| CN101695218B (en) | Method for manufacturing printed circuit board with half-edge hole | |
| CN101702869B (en) | Method for directly producing circuit boards from insulated substrate without cladding copper | |
| CN102510671B (en) | A kind of method of producing anti-corrosion pattern in production of printed circuit board | |
| WO2008034312A1 (en) | Fabrication method of a printed circuit board | |
| CN103140059B (en) | There is the working method of the multilayer circuit board of blind hole | |
| CN102154668A (en) | Mask electroplating process for printed circuit board | |
| CN103687312A (en) | Gold-plated circuit board manufacturing method | |
| CN106993378A (en) | A kind of pcb board selective surface handling process | |
| CN101521991B (en) | Manufacturing method of circuit board with selectively plated copper and tin | |
| CN109788635A (en) | A kind of novel processing method of printed circuit board | |
| CN103208401B (en) | Circuit protection device and manufacturing method thereof | |
| CN101699932B (en) | Method for producing high thermal conductivity ceramic circuit board | |
| CN115038234A (en) | Manufacturing method of flexible circuit board | |
| CN101699935B (en) | Method for producing locatable high heat conduction ceramic circuit board | |
| CN103917052B (en) | A kind of method of use laser direct structuring technique processing circuit board | |
| CN105704947A (en) | Forming process of burr-free printed circuit board (PCB) | |
| CN101489355B (en) | Manufacturing method of circuit board without tin plating and tin removing | |
| CN101699936B (en) | Production method of bright-copper-face high-heat-conductivity ceramic circuit board capable of locating | |
| CN101699933B (en) | Production method of bright-copper-face high-heat-conductivity ceramic circuit board | |
| CN101699934B (en) | Method for producing conductive high heat conduction ceramic circuit board | |
| CN113677101A (en) | Manufacturing method of PCB (printed circuit board) with ultrathin glass substrate and manufacturing method of multilayer PCB |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: No. 9, Xinfa 2nd Road, Xinqiao community, Xinqiao street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Dinghua Xintai Technology Co.,Ltd. Address before: 518000 building 7, row 3, Xinqiao Xinfa Industrial Zone, Shajing Town, Bao'an District, Shenzhen City, Guangdong Province Patentee before: ACCELERATED PRINTED CIRCUIT BOARD Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240123 Address after: 344000 Hedong Industrial Park, Nancheng County, Fuzhou City, Jiangxi Province Patentee after: Jiangxi Dinghua Xintai Technology Co.,Ltd. Country or region after: China Address before: No. 9, Xinfa 2nd Road, Xinqiao community, Xinqiao street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Dinghua Xintai Technology Co.,Ltd. Country or region before: China |
|
| TR01 | Transfer of patent right |