CN101521991B - Manufacturing method of circuit board with selectively plated copper and tin - Google Patents
Manufacturing method of circuit board with selectively plated copper and tin Download PDFInfo
- Publication number
- CN101521991B CN101521991B CN2009103015116A CN200910301511A CN101521991B CN 101521991 B CN101521991 B CN 101521991B CN 2009103015116 A CN2009103015116 A CN 2009103015116A CN 200910301511 A CN200910301511 A CN 200910301511A CN 101521991 B CN101521991 B CN 101521991B
- Authority
- CN
- China
- Prior art keywords
- tin
- copper
- film
- coating
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The invention relates to a manufacturing method of a circuit board with selectively plated copper and tin, comprising the following steps: coating a plating-resistant cover film on a copper precipitatThe invention relates to a manufacturing method of a circuit board with selectively plated copper and tin, comprising the following steps: coating a plating-resistant cover film on a copper precipitation circuit board or a circuit board plated with copper at first time, and then bonding positive sheets of all metal holes and hole rings, which are contained in circuit diagrams, on the plating-resision circuit board or a circuit board plated with copper at first time, and then bonding positive sheets of all metal holes and hole rings, which are contained in circuit diagrams, on the plating-resistant cover film to form a primary circuit after exposure and development; plating copper and tin on the hole walls of all the metal holes and the hole rings and then carrying out film de-coating; coattant cover film to form a primary circuit after exposure and development; plating copper and tin on the hole walls of all the metal holes and the hole rings and then carrying out film de-coating; coating a corrosion-resistant cover film on the de-coated circuit board, and then bonding negative sheets of the circuit diagrams on the corrosion-resistant cover film to form a secondary circuit after exing a corrosion-resistant cover film on the de-coated circuit board, and then bonding negative sheets of the circuit diagrams on the corrosion-resistant cover film to form a secondary circuit after exposure and development; etching the circuit diagrams and then carrying out film de-coating and tin de-coating; and manufacturing a circuit board product after welding prevention, exposure, developmentposure and development; etching the circuit diagrams and then carrying out film de-coating and tin de-coating; and manufacturing a circuit board product after welding prevention, exposure, development, element mark printing, tin spraying, anti-oxidation process or turmeric and outline process. The invention selectively plates copper and tin, thereby greatly reducing the amount of copper and tin to, element mark printing, tin spraying, anti-oxidation process or turmeric and outline process. The invention selectively plates copper and tin, thereby greatly reducing the amount of copper and tin togreatly reduce the environmental pollution from tin de-coating process, effectively saving the copper, tin, water, electricity, chemical materials, energy charges and manpower and effectively reducin greatly reduce the environmental pollution from tin de-coating process, effectively saving the copper, tin, water, electricity, chemical materials, energy charges and manpower and effectively reducing the production costs for enterprises.g the production costs for enterprises.
Description
[technical field]
The present invention relates to printed substrate (PCB), particularly relate to a kind of on printed substrate electrotinning and move back tin selectively, can reduce copper, tin significantly and be subjected to that surfacing is long-pending to be reached about 90%, thereby can effectively save the manufacture method of the wiring board of noble metal dosages such as copper, tin.
[background technology]
As everyone knows, printed substrate (PCB) is as the basic material of electronics industry and used widely.For a short time, arrive computer greatly to electronic watch, calculator, PC, communication apparatus, Medical Devices and space flight or military industry equipment, as long as electronic devices and components such as integrated circuit are arranged, the electric interconnection between them all will be used PCB.Printed substrate is by forming in that the conductive pattern that is electrically connected between the electronic devices and components is set on the insulating substrate, and its manufacturing process is comparatively complicated.In the making of traditional printing wiring board; for electrodeposited coating and the not etched liquid medicine destruction of hole coating of protecting useful figure needs electrotinning; but electrotinning is not finally stayed on the PCB as live part; it is a kind of intermediate carrier; after etching is finished, moved back tin liquid medicine as the temporary protection layer and returned, and contained HNO
3Deng the tin stripping liquid of highly acid corrosive substance aborning to the workman and environment causes and big harm and pollution.On the other hand, in the manufacture craft of traditional printing wiring board, all need electroplate all conductive patterns of wiring board.And in fact in the conductive pattern of printed substrate, its main plating area only limits to welding and metal aperture position, i.e. alleged pad position usually.This shows that traditional handicraft not only exists serious environmental to pollute, and also causes the waste of a large amount of noble metals and water, electricity, chemical material simultaneously, has increased the production cost of enterprise greatly.
[summary of the invention]
The present invention is intended to address the above problem, and provide a kind of selective plated copper, tin, be subjected to the long-pending and copper of surfacing, tin consumption with minimizing, reach the minimizing environmental pollution, effectively save metal and water, electricity and chemical material, the manufacture method of the selective plated copper of minimizing enterprise production cost, the wiring board of tin.
For achieving the above object, the invention provides the manufacture method of the wiring board of a kind of selective plated copper, tin, this method is included in boring in the copper-clad plate, heavy copper or copper facing for the first time, it is characterized in that it also comprises the steps:
A, on the wiring board after heavy copper or the copper facing for the first time, apply one deck anti-plate coverlay, to contain all metal aperture in the line pattern of customer requirements and the positive of orifice ring then is attached on the coverlay, form a circuit through exposure with after developing, expose the hole wall and the orifice ring of all metal aperture in the line pattern;
B, line pattern checked after, electro-coppering on the hole wall of all metal aperture and orifice ring, tin strip coverlay then selectively;
Apply the anti-etching coverlay of one deck on c, the wiring board after moving back film, the negative film that will contain the subscriber's line figure then is attached on the anti-etching coverlay, forms secondary line through exposure with after developing, and exposes the copper face of all logicalnot circuit visuals;
D, line pattern is advanced to check after etching, logicalnot circuit is partly removed, and the reserved line part is moved back film then, moved back tin and erosion inspection;
E, to the wiring board after the erosion inspection through welding resistance, exposure, development, printed element symbol and spray tin or carry out anti-oxidation processing or turmeric, form the wiring board finished product.
Among the step a, described anti-plate coverlay is wet film, dirty oil film, UV circuit oil film or dry film, and described positive is the sensitization positive that only contains all metal aperture and orifice ring or the needed part of product.
Among the step b, electrotinning only carries out at the hole wall and the orifice ring position of metal aperture.
Among the step c, anti-etching coverlay is wet film, dirty oil film, blue oil film or dry film, and described negative film is the sensitization negative film that contains all subscriber's line figures.
Contribution of the present invention is that it has effectively overcome a large amount of significant deficiency of electroplating provisional intermediate carrier tin and moving back tin of the need of always having continued to use since the printed substrate manufacture craft midium or long term.The present invention is subjected to the long-pending minimizing about 90% of surfacing by electroplating selectively, can making, thereby can save a large amount of plating with copper, tin metal material and water, electricity and chemical material, can effectively realize cleaner production, reduces and pollutes, and reduce production costs.Because the widespread production and the use of wiring board are used the present invention all PCB manufacturing enterprises are benefited, and be of value to the improvement and the protection of biological environment greatly, thereby have great economy and social effect.
[description of drawings]
Fig. 1 is the conspectus that method of the present invention is made.
Fig. 2 is the secondary line schematic diagram that method of the present invention is made, and wherein, Fig. 2 A is the top line schematic diagram, and Fig. 2 B is the wiring underlayer schematic diagram.
[embodiment]
The following example is further explanation of the present invention and explanation, and the present invention is not constituted any limitation.
The manufacture method of the wiring board of selective plated copper of the present invention, tin (is example with the double sided board), step is as follows:
At first through cut and the copper-clad plate of roasting plate on by the program boring of customer requirements establishment, then to boring sink copper or the first time copper plating treatment so that the circuit turn-on on copper-clad plate two sides, this step and conventional method are similar.
Main points of the present invention are, line pattern is carried out electro-coppering selectively, tin, and to replace large-area electroplating copper, tin in the circuit board, concrete steps are:
One, behind the heavy copper or once electroplated once on the wiring board of thin copper and apply one deck anti-plate coverlay, specifically, this anti-plate coverlay is wet film (being liquid photosensitive printing ink), dirty oil film, UV circuit oil film or dry film (being the dryness photosensitive film), they all have matured product can supply to select for use, in this example, the anti-plate coverlay is a wet film.
After applying wet film, the positive of making is attached on the wet film, this positive is all metal aperture of the line pattern that only contains customer requirements and the sensitization positive of metal aperture pad.The wiring board that posts positive is circuit of formation after exposure and development treatment, manifests the copper face of all metal aperture of line pattern, this circuit as shown in Figure 1, as seen from Figure 1, all areas that need electroplate only account for about 10% of whole line pattern.
Two, line pattern is checked after, to the hole wall of all metal aperture of manifesting line pattern and orifice ring electro-coppering, tin, wherein copper is as the structure part of hole coating, tin is then as resist layer, the protection electrodeposited coating is not etched.With NAOH solution coverlay is stripped behind electro-coppering, the tin.Owing to be subjected to that surfacing is long-pending to have reduced 90%, therefore significantly reduced the consumption of copper, tin.
Three, the anti-etching coverlay of all standing one deck on the wiring board after moving back film, slightly different with the anti-plate coverlay in the step 1 is, and this coverlay can be wet film, dirty oil film, blue oil film or dry film, and in this example, anti-etching coverlay is a wet film.Then the negative film of making is attached on the wet film, described negative film is the sensitization negative film that contains all subscriber's line figures.The wiring board that posts negative film forms secondary line through exposure with after developing, and manifests the copper face of all logicalnot circuit visuals, and this secondary line is shown in Fig. 2 A, 2B, and wherein Fig. 2 A is a top line, and Fig. 2 B is a wiring underlayer.
Four, circuit is checked the back with conventional engraving method etching, the logicalnot circuit part, promptly the copper of non-conductor part dissolves away, and the reserved line part is moved back film then and moved back tin.
Five, only make wiring board finished product through the welding resistance of routine, exposure, development, printed element symbol (or select corresponding operation according to product requirement), spray tin, anti-oxidation processing (OSP) or steps such as turmeric and sharp processing at the electro-coppering of metal aperture position, tin.
Claims (6)
1. the manufacture method of the wiring board of a selective plated copper, tin is characterized in that this method comprises the steps:
A, on the wiring board after heavy copper or the copper facing for the first time, apply one deck anti-plate coverlay, to contain all metal aperture in the line pattern of customer requirements and the positive of orifice ring then is attached on the coverlay, form a circuit through exposure with after developing, expose the hole wall and the orifice ring of all metal aperture in the line pattern;
B, line pattern checked after, electro-coppering on the hole wall of all metal aperture and orifice ring, tin strip coverlay then selectively;
Apply the anti-etching coverlay of one deck on c, the wiring board after moving back film, the negative film that will contain the subscriber's line figure then is attached on the anti-etching coverlay, forms secondary line through exposure with after developing, and exposes the copper face of all logicalnot circuit visuals;
D, line pattern is advanced to check after etching, logicalnot circuit is partly removed, and the reserved line part is moved back film then, moved back tin and erosion inspection;
E, to the wiring board after the erosion inspection through welding resistance, exposure, development, printed element symbol and spray tin or carry out anti-oxidation processing or turmeric, form the wiring board finished product.
2. the method for claim 1 is characterized in that, in the step (a), described anti-plate coverlay is wet film, dirty oil film, UV circuit oil film or dry film.
3. the method for claim 1 is characterized in that, in the step (a), described positive is the sensitization positive that only contains all metal aperture and orifice ring or the needed part of product.
4. the method for claim 1 is characterized in that, in the step (b), electrotinning only carries out at the hole wall and the orifice ring position of metal aperture.
5. the method for claim 1 is characterized in that, in the step (c), anti-etching coverlay is wet film, dirty oil film, blue oil film or dry film.
6. the method for claim 1 is characterized in that, in the step (c), described negative film is the sensitization negative film that contains all subscriber's line figures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009103015116A CN101521991B (en) | 2009-04-13 | 2009-04-13 | Manufacturing method of circuit board with selectively plated copper and tin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009103015116A CN101521991B (en) | 2009-04-13 | 2009-04-13 | Manufacturing method of circuit board with selectively plated copper and tin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101521991A CN101521991A (en) | 2009-09-02 |
| CN101521991B true CN101521991B (en) | 2011-04-06 |
Family
ID=41082291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009103015116A Expired - Fee Related CN101521991B (en) | 2009-04-13 | 2009-04-13 | Manufacturing method of circuit board with selectively plated copper and tin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101521991B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102291941B (en) * | 2011-06-23 | 2013-05-22 | 深南电路有限公司 | Method for processing lines of thick copper plate |
| CN102510549A (en) * | 2011-11-01 | 2012-06-20 | 上海思萌特电子科技有限公司 | Minitype digital programmable audio processing chip module and routing method |
| KR101340872B1 (en) * | 2013-07-05 | 2013-12-12 | 주식회사 에스아이 플렉스 | Composite coating shielding method using ink detachment type |
| CN103796433B (en) * | 2014-01-16 | 2017-02-15 | 广州兴森快捷电路科技有限公司 | Manufacturing method of circuit board mixed surface process |
| CN104076905B (en) * | 2014-06-30 | 2017-03-15 | 北京百度网讯科技有限公司 | Data center apparatus and its manufacture method and corrosion resistance verification method |
| CN108712824A (en) * | 2018-06-04 | 2018-10-26 | 南通海舟电子科技有限公司 | The two-sided anti-oxidation PCB circuit board production technology of high-performance |
| CN111458328B (en) * | 2020-04-26 | 2021-03-19 | 电子科技大学 | Method for detecting distribution of residual copper layer of printed circuit board |
-
2009
- 2009-04-13 CN CN2009103015116A patent/CN101521991B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101521991A (en) | 2009-09-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101521991B (en) | Manufacturing method of circuit board with selectively plated copper and tin | |
| CN104105361B (en) | A kind of method of circuit board selective electroplating conductive hole | |
| CN101702869B (en) | Method for directly producing circuit boards from insulated substrate without cladding copper | |
| CN100531527C (en) | Printed circuit board mask hole electroplating molding process | |
| CN101267713B (en) | Making method of electric nickel and golden circuit board for saving nickel and gold dosage | |
| CN101835351B (en) | Manufacture process of sectional golden finger | |
| CN102510671B (en) | A kind of method of producing anti-corrosion pattern in production of printed circuit board | |
| CN101951728B (en) | Production method for replacing flexible circuit board with rigid circuit board | |
| CN103079350B (en) | Method for processing patterns in blind slot of printed circuit board | |
| CN108617104A (en) | The production method that the local figure copper thickness of printed circuit board thickeies | |
| CN106255349A (en) | The manufacture method of a kind of PCB and PCB | |
| CN103209546A (en) | Method for making line in direct negative etching way | |
| CN101489355B (en) | Manufacturing method of circuit board without tin plating and tin removing | |
| CN107683029B (en) | Negative PCB tin spraying process | |
| CN101699931A (en) | Method for manufacturing high-heat conduction ceramic circuit board | |
| CN101699932B (en) | Method for producing high thermal conductivity ceramic circuit board | |
| CN101699935B (en) | Method for producing locatable high heat conduction ceramic circuit board | |
| KR20120116297A (en) | Manufacturing method of flexible printed circuit board using polyimide ink and polyimide sheet | |
| CN105282985A (en) | Circuit board single-sided local gold plating method and circuit board | |
| CN105682376B (en) | A kind of thickness copper high aspect ratio small-bore mainboard manufacture craft | |
| CN105792533A (en) | Manufacturing method of PCB and PCB | |
| CN104105344A (en) | Method for protecting step slot, metal plating method for substrate of circuit board and circuit board | |
| CN101699936B (en) | Production method of bright-copper-face high-heat-conductivity ceramic circuit board capable of locating | |
| KR100852406B1 (en) | a PCB manufacturing method | |
| CN106211600B (en) | The production method that the LED printed wiring board of copper etching area can be saved |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PP01 | Preservation of patent right |
Effective date of registration: 20110801 Granted publication date: 20110406 |
|
| PD01 | Discharge of preservation of patent |
Date of cancellation: 20120201 Granted publication date: 20110406 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110406 Termination date: 20150413 |
|
| EXPY | Termination of patent right or utility model |